Chip conveying device and gene detection equipment

Abstract

The utility model provides a chip conveying device, which comprises a fixed support, a first conveying belt, a second conveying belt and a driving device, and is characterized in that the fixed support comprises a top plate and a side plate which are connected with each other; the first conveying mechanism is movably connected to the first surface; the second conveying mechanism is movably connected to the side, away from the top plate, of the first conveying mechanism, and the surface, away from the first conveying mechanism, of the second conveying mechanism is used for bearing chips; the driving mechanism is fixedly connected to the second surface and movably connected to the side plate, and the driving mechanism is used for driving the first conveying mechanism to move relative to the top plate in the first direction and driving the second conveying mechanism to move relative to the first conveying mechanism in the first direction. And the chip conveying device is used for conveying the chip in the first direction. The utility model further provides gene detection equipment.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chip conveying, and in particular to a chip conveying device and a gene detection apparatus comprising the same. BACKGROUND

[0002] A sequencer usually comprises a conveying mechanism for conveying a sequencing chip. The conventional conveying mechanism occupies a large space, which is not conducive to miniaturization of the sequencer. CONTENT

[0003] The present application provides a chip conveying device in the first aspect, comprising: a fixed support; a first conveying mechanism movably connected to the fixed support; a second conveying mechanism movably connected to the first conveying mechanism, the second conveying mechanism being configured to carry a chip; and a driving mechanism mounted on the fixed support, the driving mechanism being configured to drive the first conveying mechanism to move relative to the fixed support in a first direction and to drive the second conveying mechanism to move relative to the first conveying mechanism in the first direction, so as to convey the chip in the first direction.

[0004] In at least one embodiment of the present application, the driving mechanism comprises a driving assembly and a telescopic assembly; the driving assembly is fixedly connected to the fixed support, the telescopic assembly is fixedly connected to the driving assembly and the second conveying mechanism, and is movably connected to the fixed support; the driving assembly is configured to drive the telescopic assembly to extend or retract in the first direction, so as to drive the first conveying mechanism and the second conveying mechanism to move in the first direction.

[0005] In at least one embodiment of the present application, the driving assembly comprises a motor and a threaded rod, the motor is fixedly connected to the fixed support, one end of the threaded rod is rotatably connected to the motor, and the other end is fixedly connected to the telescopic assembly; the motor drives the threaded rod to move linearly in the first direction to drive the telescopic assembly to extend or retract in the first direction.

[0006] In at least one embodiment of the present application, the fixed support is formed with a first sliding groove extending in the first direction; the telescopic assembly has a connecting end and a positioning end, the connecting end is slidably connected in the first sliding groove, the connecting end is fixedly connected to the second conveying mechanism, and the telescopic assembly slides in the first sliding groove under the driving of the driving assembly, so that the connecting end drives the first conveying mechanism and the second conveying mechanism to move.

[0007] In at least one embodiment of the present application, the fixed support is formed with two second sliding grooves extending along a second direction, the first direction being perpendicular to the second direction, and the first sliding groove being located between the two second sliding grooves; the telescopic assembly is further slidingly connected to the two second sliding grooves, and the telescopic assembly slides in the first sliding groove and the two second sliding grooves simultaneously during the telescopic process.

[0008] In at least one embodiment of the present application, the telescopic assembly comprises a plurality of first connecting rods connected in sequence at the head and tail and a plurality of second connecting rods connected in sequence at the head and tail, the plurality of first connecting rods and the plurality of second connecting rods correspond to each other one by one, and each corresponding first connecting rod and second connecting rod are rotatably connected at a length center node; the telescopic assembly further comprises a plurality of sliding rods, each sliding rod being connected to a center node, the plurality of sliding rods being slidingly connected to the first sliding groove, and at least one sliding rod being connected to the driving assembly through the first sliding groove; during the telescopic process of the telescopic assembly, the plurality of sliding rods slide in the first sliding groove, and each first connecting rod and each second connecting rod rotate around the center node.

[0009] In at least one embodiment of the present application, the fixed support further comprises a first photoelectric sensor and a second photoelectric sensor, the first photoelectric sensor and the second photoelectric sensor being spaced apart along the first direction; the first conveying mechanism comprises a baffle protruding towards the fixed support; the chip conveying device has a retracted state and an extended state, when the chip conveying device is in the retracted state, the baffle is located between the light emitting end and the light receiving end of the first photoelectric sensor; when the chip conveying device is in the extended state, the baffle is located between the light emitting end and the light receiving end of the second photoelectric sensor.

[0010] In at least one embodiment of the present application, the fixed support further comprises a top plate and a first limiting block, the top plate having a first surface, the first photoelectric sensor, the second photoelectric sensor and the first limiting block being located on the first surface, and the first photoelectric sensor being located between the first limiting block and the second photoelectric sensor, in the direction perpendicular to the first surface, the height of the first limiting block being greater than the vertical distance between the first surface and the second conveying mechanism.

[0011] In at least one embodiment of the present application, the first conveying mechanism comprises a first mounting plate movably connected to the top plate and a second limiting block fixedly connected to a surface of the first mounting plate away from the top plate; the second conveying mechanism comprises a second mounting plate movably connected to the first mounting plate and a third limiting block fixedly connected to a surface of the second mounting plate toward the first mounting plate; in a direction perpendicular to the first surface, the sum of the heights of the second limiting block and the third limiting block is greater than the vertical distance between the first mounting plate and the second mounting plate.

[0012] The second aspect of the present application provides a gene detection device, comprising: a housing, which is provided with a chip passage; a chip conveying device according to any one of the above embodiments, at least part of which is located in the housing, and the first conveying mechanism and the second conveying mechanism can make at least part of the second conveying mechanism convey the chip outside the housing into the housing through the chip passage by displacement in the first direction; and an optical detection system located in the housing, which is used for optical detection of the chip.

[0013] The chip conveying device and the gene detection device described above, the chip conveying device comprises a fixed support, a first conveying mechanism, a second conveying mechanism and a driving mechanism, the driving mechanism can drive the first conveying mechanism to translate relative to the fixed support, and can drive the second conveying mechanism to displace relative to the first conveying mechanism in the same direction, so that the chip conveying device as a whole has two telescopic amounts, therefore the chip conveying device of the embodiment of the present application can realize contraction by displacement of the first conveying mechanism and the second conveying mechanism to reduce the occupied space, and realize expansion by displacement of the first conveying mechanism and the second conveying mechanism to improve the conveying distance of the chip. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 It is a perspective view of the chip conveying device of the embodiment of the present application in the contracted state.

[0015] Figure 2 It is a perspective view of the chip conveying device of the embodiment of the present application in the contracted state. Figure 1 It is a perspective view of the fixed support in the contracted state.

[0016] Figure 3 It is a perspective view of the chip conveying device of the embodiment of the present application in the contracted state. Figure 1 It is a sectional view along line III-III.

[0017] Figure 4 It is a perspective view of the chip conveying device of the embodiment of the present application in the expanded state.

[0018] Figure 5 It is a perspective view of the chip conveying device of the embodiment of the present application in the expanded state.

[0019] Figure 6 It is a perspective view of the chip conveying device of the embodiment of the present application in the expanded state.Figure 1 Sectional view along line VI-VI.

[0020] Figure 7 For Figure 4 Sectional view along line VII-VII.

[0021] Figure 8 For Figure 1 Partial structural schematic diagram of the chip conveying device.

[0022] Figure 9 Structural schematic diagram of the second side plate and the telescopic assembly.

[0023] Figure 10 Another perspective view of the chip conveying device in the stretched state.

[0024] Figure 11 Structural schematic diagram of the gene detection equipment.

[0025] Main element symbol explanation

[0026] Chip conveying device: 1;

[0027] Fixing support: 10;

[0028] Top plate: 11;

[0029] First surface: 111;

[0030] Second surface: 112;

[0031] First side plate: 12;

[0032] Second side plate: 13;

[0033] First side: 131;

[0034] Second side: 132;

[0035] First sliding groove: 133;

[0036] Second sliding groove: 134;

[0037] First sliding rail: 141;

[0038] Second sliding rail: 142;

[0039] First limiting block: 15;

[0040] First photoelectric sensor: 16;

[0041] Second photoelectric sensor: 17;

[0042] Telescopic sliding rail: 18;

[0043] First conveying mechanism: 20;

[0044] First mounting plate: 21;

[0045] First mounting surface: 211;

[0046] Second mounting surface: 212;

[0047] Mounting opening: 213;

[0048] First sliding block: 22;

[0049] Second sliding block: 23;

[0050] Third sliding rail: 24;

[0051] Fourth sliding rail: 25;

[0052] Baffle: 26;

[0053] Second limiting block: 27;

[0054] Fourth limiting block: 28;

[0055] Second conveying mechanism: 30;

[0056] Second mounting plate: 31;

[0057] Third mounting surface: 311;

[0058] Fourth mounting surface: 312;

[0059] Chip mounting position: 3121;

[0060] Third sliding block: 32;

[0061] Fourth sliding block: 33;

[0062] Third limiting block: 34;

[0063] Connecting plate: 35;

[0064] Driving mechanism: 40;

[0065] Driving assembly: 41;

[0066] Motor: 411;

[0067] Threaded rod: 412;

[0068] Connecting block: 413;

[0069] Telescopic assembly: 42;

[0070] Center node: 420;

[0071] First connecting rod: 421;

[0072] Second connecting rod: 422;

[0073] Positioning end: 423;

[0074] Connecting end: 424;

[0075] Slide rod: 425;

[0076] First direction: X;

[0077] Second direction: Y;

[0078] Height: h1;

[0079] Distance: d1, d2;

[0080] Gene detection device: 100;

[0081] Housing: 2;

[0082] Chip channel: 201;

[0083] Optical detection system: 3;

[0084] Chip: 200.

[0085] The following specific embodiments will further illustrate the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0086] The chip conveying device provided by the present application is applied in a gene detection device. The gene detection device is used for gene detection of a chip. The chip conveying device can convey the chip placed by a user into the housing of the gene detection device through a telescopic process for subsequent gene detection. The chip conveying device of the present application has a two-segment contraction amount. On the basis of ensuring a large contraction amount, it is also beneficial to save space and facilitate the overall miniaturization of the gene detection device.

[0087] Please refer to Figure 1In the embodiment of the present application, the chip conveying device 1 comprises a fixed support 10, a first conveying mechanism 20, a second conveying mechanism 30 and a driving mechanism 40. The first conveying mechanism 20, the second conveying mechanism 30 and the driving mechanism 40 are respectively connected to the fixed support 10, the fixed support 10 is used for supporting the first conveying mechanism 20, the second conveying mechanism 30 and the driving mechanism 40, and is used for positioning the relative position relationship between the first conveying mechanism 20, the second conveying mechanism 30 and the driving mechanism 40. The driving mechanism 40 is used for driving the first conveying mechanism 20 and the second conveying mechanism 30 to displace relative to the fixed support 10 respectively, and is also used for driving the second conveying mechanism 30 to displace relative to the first conveying mechanism 20. In the embodiment, the first conveying mechanism 20 and the second conveying mechanism 30 are stacked on the fixed support 10 in sequence, the first conveying mechanism 20 is located between the fixed support 10 and the second conveying mechanism 30, and the side of the second conveying mechanism 30 away from the first conveying mechanism 20 is used for carrying the chip to be conveyed.

[0088] The first conveying mechanism 20 and the second conveying mechanism 30 can displace along the linear direction respectively, and the displacement directions are consistent. By setting the first conveying mechanism 20 and the second conveying mechanism 30 to displace along the same linear direction respectively, the chip conveying device 1 as a whole has two telescopic amounts. Therefore, the chip conveying device 1 of the embodiment of the present application can reduce the occupied space by telescoping the first conveying mechanism 20 and the second conveying mechanism 30, and can increase the conveying distance of the chip by extending the first conveying mechanism 20 and the second conveying mechanism 30.

[0089] Please refer to Figure 1 and Figure 2 In the embodiment, the fixed support 10 comprises a top plate 11 and two side plates arranged oppositely, the two side plates are respectively a first side plate 12 and a second side plate 13. The top plate 11 has a first surface 111 and a second surface 112 arranged oppositely and spaced apart, the first side plate 12 and the second side plate 13 are respectively connected to the second surface 112 perpendicularly and arranged oppositely. The first conveying mechanism 20 and the second conveying mechanism 30 are installed on the first surface 111. The first side plate 12 and the second side plate 13 support the top plate 11, the first conveying mechanism 20, the second conveying mechanism 30 and the driving mechanism 40.

[0090] The fixed support 10 further comprises a first sliding rail 141 and a second sliding rail 142 fixedly arranged on the first surface 111. The first sliding rail 141 and the second sliding rail 142 are respectively long strip structures, and extend along a first direction X, the first direction X is a linear direction. The first sliding rail 141 and the second sliding rail 142 are arranged parallel to each other with a spacing on the first surface 111, and the two ends are flush with each other. The first conveying mechanism 20 is slidingly connected to the first sliding rail 141 and the second sliding rail 142. The first conveying mechanism 20 translates along the first direction X relative to the fixed support 10 by sliding on the first sliding rail 141 and the second sliding rail 142.

[0091] Referring to Figure 2 In this embodiment, the fixing support 10 further comprises a first limiting block 15, a first photoelectric sensor 16 and a second photoelectric sensor 17 fixedly connected to the first surface 111. The first limiting block 15, the first photoelectric sensor 16 and the second photoelectric sensor 17 are located between the first sliding rail 141 and the second sliding rail 142, and the first limiting block 15, the first photoelectric sensor 16 and the second photoelectric sensor 17 are arranged in the first direction X in sequence, and the first limiting block 15 is arranged closest to the end of the first sliding rail 141 and the second sliding rail 142 (specifically, the end in the retraction direction).

[0092] Referring to Figure 3 The height h1 of the first limiting block 15 is greater than the vertical distance d1 (i.e. the distance in the direction perpendicular to the first surface 111) between the first surface 111 and the second conveying mechanism 30, so as to limit the translation stroke of the first conveying mechanism 20 and the second conveying mechanism 30 when the chip conveying device 1 is retracted, i.e. when the first conveying mechanism 20 and the second conveying mechanism 30 are translated towards the first limiting block 15, so as to limit the retraction degree of the chip conveying device 1 as a whole, and prevent the first conveying mechanism 20 and the second conveying mechanism 30 from sliding out of the first sliding rail 141 and the second sliding rail 142. The first photoelectric sensor 16 and the second photoelectric sensor 17 are used to sense the position state of the first conveying mechanism 20 and the second conveying mechanism 30. Further, the first limiting block 15 can also serve to lock the first conveying mechanism 20 and the second conveying mechanism 30, so as to ensure that the whole machine does not slide randomly and is damaged during conveying and moving. Usually, the first conveying mechanism 20 and the second conveying mechanism 30 are locked on the first limiting block 15 by bolts.

[0093] The chip conveying device 1 of this embodiment has a retracted state as shown in Figure 1 and an extended state as shown in Figure 4 The first photoelectric sensor 16 is used to sense whether the chip conveying device 1 has reached the retracted state to the shortest state, and the second photoelectric sensor 17 is used to sense whether the chip conveying device 1 has reached the extended state.

[0094] Referring to Figure 4 and Figure 5In the embodiment, the first conveying mechanism 20 comprises a first mounting plate 21, a first sliding block 22 and a second sliding block 23. The first mounting plate 21 has a first mounting surface 211 and a second mounting surface 212 oppositely and spacedly arranged, and the first mounting surface 211 faces the top plate 11. The first sliding block 22 and the second sliding block 23 are fixedly and spacedly connected to the first mounting surface 211. The first sliding block 22 is slidingly connected to the first sliding rail 141 and located between the first sliding rail 1412 and the first mounting plate 21. The second sliding block 23 is slidingly connected to the second sliding rail 142 and located between the second sliding rail 142 and the first mounting plate 21.

[0095] In the embodiment, the first conveying mechanism 20 further comprises a third sliding rail 24 and a fourth sliding rail 25 fixedly arranged on the second mounting surface 212. The third sliding rail 24 and the fourth sliding rail 25 are respectively in long strip structure and extend along the first direction X which is a straight direction. The third sliding rail 24 and the fourth sliding rail 25 are parallelly arranged on the second mounting surface 212 and the two ends are flush with each other. The second conveying mechanism 30 is slidingly connected to the third sliding rail 24 and the fourth sliding rail 25. The second conveying mechanism 30 translates along the first direction X relative to the fixed support 10 and the first conveying mechanism 20 respectively by sliding on the third sliding rail 24 and the fourth sliding rail 25.

[0096] In the embodiment, the first mounting plate 21 of the first conveying mechanism 20 is provided with a mounting opening 213 penetrating the first mounting surface 211 and the second mounting surface 212. The mounting opening 213 is located between the third sliding rail 24 and the fourth sliding rail 25. The first conveying mechanism 20 further comprises a baffle 26 located at the mounting opening 213 and fixedly connected to the first mounting surface 211.

[0097] Please refer to Figure 6 , the baffle 26 protrudes from the mounting opening 213 towards the first surface 111. When the chip conveying device 1 is in the retracted state, the baffle 26 is located between the light emitting end 161 and the light receiving end 162 of the first photoelectric sensor 16, blocking the transmission of light signals, and the light receiving end 162 of the first photoelectric sensor 16 cannot detect light signals, indicating that the chip conveying device 1 has arrived at this time.

[0098] Please refer to Figure 7 , when the chip conveying device 1 is in the extended state, the baffle 26 is located between the light emitting end 171 and the light receiving end 172 of the second photoelectric sensor 17, blocking the transmission of light signals, and the light receiving end 172 of the second photoelectric sensor 17 cannot detect light signals, indicating that the chip conveying device 1 has arrived at this time.

[0099] Please refer to Figure 5In the embodiment, the second conveying mechanism 30 comprises a second mounting plate 31, a third sliding block 32 and a fourth sliding block 33. The second mounting plate 31 has a third mounting surface 311 and a fourth mounting surface 312 oppositely and spacedly arranged, the third mounting surface 311 faces the top plate 11, and the fourth mounting surface 312 is formed with a chip mounting position 3121 for accommodating a chip to be conveyed (the chip mounting position 3121 has been placed in the figure). The third sliding block 32 and the fourth sliding block 33 are fixedly and spacedly connected to the third mounting surface 311. The third sliding block 32 is slidingly connected to the third sliding rail 24 and is located between the third sliding rail 24 and the second mounting plate 31. The fourth sliding block 33 is slidingly connected to a track on the fourth sliding rail 25 and is located between the fourth sliding rail 25 and the second mounting plate 31.

[0100] Please refer to Figure 3 and Figure 4 In the embodiment, the first conveying mechanism 20 further comprises a second limiting block 27 and a fourth limiting block 28 fixedly connected to the second mounting surface 212, and the second conveying mechanism 30 further comprises a third limiting block 34 fixedly connected to the third mounting surface 311 (see Figure 3 ). The second limiting block 27 and the fourth limiting block 28 are respectively located at two opposite parallel edges of the second mounting surface 212 and are arranged along the first direction X, and the baffle 26 is located between the second limiting block 27 and the fourth limiting block 28. The sum of the heights of the second limiting block 27 and the third limiting block 34 is greater than the vertical distance d2 between the first mounting plate 21 and the second mounting plate 31, and the sum of the heights of the fourth limiting block 28 and the third limiting block 34 is also greater than the vertical distance d2 between the first mounting plate 21 and the second mounting plate 31. When the chip conveying device 1 is in the contracted state as shown in Figure 3 , the third limiting block 34 abuts against the second limiting block 27 to block the second conveying mechanism 30 from continuing to contract relative to the first conveying mechanism 20. When the chip conveying device 1 is in the stretched state as shown in Figure 4 , the third limiting block 34 abuts against the fourth limiting block 28 to block the second conveying mechanism 30 from continuing to stretch relative to the first conveying mechanism 20. That is, during the translation of the first conveying mechanism 20 and the second conveying mechanism 30, the third limiting block 34 is always located between the second limiting block 27 and the fourth limiting block 28.

[0101] Please refer to Figure 8 The driving mechanism 40 of the embodiment comprises a driving assembly 41 and a telescopic assembly 42. The driving assembly 41 is fixedly connected to the second surface 112 of the top plate 11. The telescopic assembly 42 is movably connected to the second side plate 13, specifically, is mounted on the side of the second side plate 13 away from the first side plate 12. Moreover, one end of the telescopic assembly 42 is connected with the driving assembly 41. The driving assembly 41 is used to drive the telescopic assembly 42 to telescope in the first direction X, so as to drive the first conveying mechanism 20 and the second conveying mechanism 30 to displace along the first direction X.

[0102] In the embodiment, the driving assembly 41 comprises a motor 411, a threaded rod 412 and a connecting block 413. The motor 411 is fixedly connected to the second surface 112 of the top plate 11, and the threaded rod 412 is rotatably connected to the motor 411 at one end and connected to the connecting block 413 at the other end. The second side plate 13 has a first side surface 131 facing the driving assembly 41 and a second side surface 132 facing the telescopic assembly 42. The fixed support 10 further comprises a telescopic slide rail 18 fixedly connected to the first side surface 131. The telescopic slide rail 18 has an overall strip-shaped structure extending along the first direction X and is formed with a track extending along the first direction X. The connecting block 413 is slidably connected to the track of the telescopic slide rail 18 and fixedly connected to the telescopic assembly 42.

[0103] Please refer to Figure 9 , the first slide groove 133 is formed in the second side plate 13 and extends along the first direction X through the first side surface 131 and the second side surface 132. The telescopic assembly 42 is slidably connected to the first slide groove 133.

[0104] Please refer to Figure 10 , the second side plate 13 is further formed with two second slide grooves 134. The two second slide grooves are arranged on the two sides of the first slide groove 133 and are spaced apart from each other. Each second slide groove 134 extends along the second direction Y through the first side surface 131 and the second side surface 132, and the second direction Y is perpendicular to the first direction X, and perpendicular to the top plate 11, the first mounting plate 21 and the second mounting plate 31. The two second slide grooves 134 are located at one end of the first slide groove 133 close to the first limiting block 15. The telescopic assembly 42 is movably connected to the two second slide grooves 134, respectively. When the telescopic assembly 42 slides in the first slide groove 133, it also synchronously slides in the two second slide grooves 134.

[0105] In the embodiment, the telescopic assembly 42 comprises a plurality of first connecting rods 421 and a plurality of second connecting rods 422. The number of first connecting rods 421 is the same as that of second connecting rods 422. Each first connecting rod 421 and each second connecting rod 422 are strip-shaped structures of the same shape and size. Each first connecting rod 421 is rotatably connected to the tail of the previous one in sequence, and each second connecting rod 422 is rotatably connected to the tail of the previous one in sequence. The plurality of first connecting rods 421 and the plurality of second connecting rods 422 correspond to each other one by one. Each first connecting rod 421 and each second connecting rod 422 corresponding to each other are rotatably connected at the length center node 420. In this way, the telescopic assembly 42 as a whole forms a structure that can be telescoped along the first direction X. When the telescopic assembly 42 is contracted, the included angle between adjacent first connecting rods 421 and adjacent second connecting rods 422 decreases, and when the telescopic assembly 42 is expanded, the included angle between adjacent first connecting rods 421 and adjacent second connecting rods 422 increases.

[0106] The telescopic assembly 42 has a positioning end 423 and a connecting end 424. A first connecting rod 421 and a second connecting rod 422 at the positioning end 423 are respectively slidably connected to two second sliding grooves 134. The second conveying mechanism 30 further comprises a connecting plate 35 fixedly connected to the side surface of the second mounting plate 31. The connecting end 424 is fixedly connected to the connecting plate 35, so that the telescopic assembly 42 drives the first conveying mechanism 20 to slide.

[0107] Please also refer to Figures 8-10 In the embodiment, the telescopic assembly 42 further comprises a plurality of sliding rods 425. The number of the sliding rods 425 is the same as that of the center nodes 420 and each sliding rod 425 is connected to a corresponding center node 420. One end of each sliding rod 425 is connected to a corresponding center node 420, and the other end is located in the first sliding groove 133. One of the sliding rods 425 is fixedly connected to the connecting block 413. The closer the sliding rod 425 fixedly connected to the connecting block 413 to the positioning end 423, the greater the driving force required by the motor 411. The closer the sliding rod 425 fixedly connected to the connecting block 413 to the connecting end 424, the greater the telescopic amount of the telescopic assembly 42. In the embodiment, the second sliding rod 425 fixedly connected to the connecting block 413 is selected from the positioning end 423.

[0108] The contraction process and the expansion process of the chip conveying device 1 in the embodiment are described below.

[0109] In the contraction process of the chip conveying device 1: the motor 411 drives the threaded rod 412 to move in the first direction X and towards the positioning end 423. The movement of the threaded rod 412 causes the connecting block 413 to drive the sliding rod 425 to slide in the first sliding groove 133 towards the positioning end 423. The sliding of the sliding rod 425 drives the adjacent first connecting rod 421 / second connecting rod 422 to relatively rotate, so that the included angle decreases, that is, the adjacent first connecting rod 421 / second connecting rod 422 are both close to the positioning end 423. In this process, the first connecting rod 421 and the second connecting rod 422 located in one end of the two second sliding grooves 134 gradually slide away from the first sliding groove 133.

[0110] In the above process, the second conveying mechanism 30 relatively translates with respect to the fixed support 10 and the first conveying mechanism 20, and the fixed support 10 and the first conveying mechanism 20 remain stationary until the third limiting block 34 abuts against the second limiting block 27. Then, the second conveying mechanism 30 drives the first conveying mechanism 20 to synchronously translate with respect to the fixed support 10 under the drive of the driving mechanism 40 until the first photoelectric sensor 16 detects that the chip conveying device 1 is contracted in place. At this time, the first connecting rod 421 and the second connecting rod 422 located in one end of the two second sliding grooves 134 slide to the end of the second sliding groove 134.

[0111] During the extension of the chip conveying device 1, the motor 411 drives the threaded rod 412 to move in the first direction X and towards the connecting end 424, and the movement of the threaded rod 412 causes the connecting block 413 to drive the slide rod 425 to slide in the first sliding groove 133 towards the connecting end 424; the sliding of the slide rod 425 causes the adjacent first connecting rod 421 / second connecting rod 422 to rotate relatively, so that the included angle increases, that is, the adjacent first connecting rod 421 / second connecting rod 422 both extend towards the connecting end 424, and the extension of the telescopic assembly 42 causes the connecting plate 35 fixedly connected to the connecting end 424 to drive the first conveying mechanism 20 and the second conveying mechanism 30 to translate. Specifically, the extension of the telescopic assembly 42 first causes the second conveying mechanism 30 to extend with the connecting end 424, while the first conveying mechanism 20 remains stationary; when the second conveying mechanism 30 moves to a certain position, the third limiting block 34 abuts against the fourth limiting block 28, and the second conveying mechanism 30 can drive the first conveying mechanism 20 to move forward, at which time the first conveying mechanism 20 and the second conveying mechanism 30 extend synchronously relative to the fixed support 10. During the process, the first connecting rod 421 and the second connecting rod 422 located in one end of the two second sliding grooves 134 gradually slide towards the first sliding groove 133, until the second photoelectric sensor 17 detects that the chip conveying device 1 is extended to the position.

[0112] The chip conveying device 1 of the embodiment of the present application comprises a fixed support 10, a first conveying mechanism 20, a second conveying mechanism 30 and a driving mechanism 40. The driving mechanism 40 can drive the first conveying mechanism 20 to translate relative to the fixed support 10, and can drive the second conveying mechanism 30 to displace relative to the first conveying mechanism 20 in the same direction, so that the chip conveying device 1 as a whole has two telescopic amounts. Therefore, the chip conveying device 1 of the embodiment of the present application can reduce the occupied space by contraction, and can increase the conveying distance of the chip by extension.

[0113] Please refer to Figure 11 The embodiment of the present application also provides a gene detection equipment 100 comprising the above chip conveying device 1. The gene detection equipment 100 further comprises a shell 2 and an optical detection system 3. The chip conveying device 1 and the optical detection system 3 are located in the shell 2. A chip passage 201 is formed on the shell 2. When it is necessary to perform optical detection on the chip 200, the second conveying mechanism 30 of the chip conveying device 1 can be controlled to extend out of the shell 2 through the chip passage 201. After the user places the chip 200 to be detected on the second conveying mechanism 30, the chip conveying device 1 is controlled to contract, so as to convey the chip 200 to be detected into the shell 2. A mechanical arm or the like structure can be arranged in the shell 2, so as to move the chip 200 to be detected to a detection station of the optical detection system 3, for the optical detection system 3 to perform an optical detection process.

[0114] The gene detection device 100 may be a gene sequencer or the like. The gene detection device 100 of the embodiments of the present application is advantageous in that it can increase the chip transfer stroke while considering miniaturization of the device by using the chip transfer device 1.

[0115] Those skilled in the art should understand that the above-mentioned embodiments are only used to illustrate but not to limit the present application, and any modification and change made to the above-mentioned embodiments within the spirit and principle of the present application shall fall within the scope of the present application.

Claims

1. A chip transfer apparatus characterized by comprising: The utility model relates to a chip conveying device, comprising: a fixed support; a first conveying mechanism movably connected to the fixed support; a second conveying mechanism movably connected to the first conveying mechanism, the second conveying mechanism being used for carrying chips; and a driving mechanism installed on the fixed support, the driving mechanism being used for driving the first conveying mechanism to move in a first direction relative to the fixed support and driving the second conveying mechanism to move in the first direction relative to the first conveying mechanism to convey the chips in the first direction.

2. The chip transfer apparatus according to claim 1, wherein The driving mechanism comprises a driving assembly and a telescopic assembly; the driving assembly is fixedly connected to the fixed support, and the telescopic assembly is fixedly connected with the driving assembly and the second conveying mechanism and movably connected with the fixed support; The driving assembly is used for driving the telescopic assembly to telescope in the first direction to drive the first conveying mechanism and the second conveying mechanism to move in the first direction.

3. The chip transfer apparatus according to claim 2, wherein The driving assembly comprises a motor and a threaded rod; the motor is fixedly connected to the fixed support, and the threaded rod is rotatably connected to the motor at one end and fixedly connected with the telescopic assembly at the other end; The motor drives the telescopic assembly to telescope in the first direction by driving the threaded rod to move linearly in the first direction.

4. The chip transfer apparatus according to claim 2, wherein The fixed support is formed with a first sliding groove extending in the first direction; The telescopic assembly has a connecting end and a positioning end; the connecting end is slidably connected in the first sliding groove, and the connecting end is fixedly connected with the second conveying mechanism; the telescopic assembly slides in the first sliding groove under the driving of the driving assembly to drive the first conveying mechanism and the second conveying mechanism to move.

5. The chip transfer apparatus according to claim 4, wherein The fixed support is formed with two second sliding grooves extending in a second direction; the first direction is perpendicular to the second direction, and the first sliding groove is located between the two second sliding grooves; The telescopic assembly is also slidably connected in the two second sliding grooves; the telescopic assembly slides in the first sliding groove and the two second sliding grooves simultaneously during the telescoping process.

6. The chip transfer apparatus according to claim 5, wherein The telescopic assembly comprises a plurality of first connecting rods rotatably connected in sequence and a plurality of second connecting rods rotatably connected in sequence; the plurality of first connecting rods correspond to the plurality of second connecting rods one by one, and each corresponding first connecting rod and second connecting rod are rotatably connected at a length center node; The telescopic assembly further comprises a plurality of sliding rods, each sliding rod being connected to a center node; the plurality of sliding rods are slidably connected in the first sliding groove, and at least one sliding rod is connected with the driving assembly through the first sliding groove; During the telescoping process of the telescopic assembly, the plurality of sliding rods slide in the first sliding groove, and each first connecting rod and each second connecting rod rotate around the center node.

7. The chip transfer apparatus according to any one of claims 1 to 6, wherein The fixed support further comprises a first photoelectric sensor and a second photoelectric sensor; the first photoelectric sensor and the second photoelectric sensor are arranged at intervals in the first direction; and the first conveying mechanism comprises a baffle protruding towards the fixed support. The chip conveying device has a contracted state and an extended state; when the chip conveying device is in the contracted state, the baffle is located between the light emitting end and the light receiving end of the first photoelectric sensor; when the chip conveying device is in the extended state, the baffle is located between the light emitting end and the light receiving end of the second photoelectric sensor.

8. The chip transfer apparatus according to claim 7, wherein The fixing support further comprises a top plate and a first limiting block; the top plate has a first surface; the first photoelectric sensor, the second photoelectric sensor and the first limiting block are located on the first surface; the first photoelectric sensor is located between the first limiting block and the second photoelectric sensor; in the direction perpendicular to the first surface, the height of the first limiting block is greater than the vertical distance between the first surface and the second conveying mechanism.

9. The chip transfer apparatus according to claim 8, wherein The first conveying mechanism comprises a first mounting plate movably connected to the top plate and a second limiting block fixedly connected to the surface of the first mounting plate away from the top plate; the second conveying mechanism comprises a second mounting plate movably connected to the first mounting plate and a third limiting block fixedly connected to the surface of the second mounting plate towards the first mounting plate. In the direction perpendicular to the first surface, the sum of the heights of the second limiting block and the third limiting block is greater than the vertical distance between the first mounting plate and the second mounting plate.

10. A gene detection apparatus, characterized by comprising: It comprises: a shell with a chip passage; the chip conveying device according to any one of claims 1-9, at least partially located in the shell; the first conveying mechanism and the second conveying mechanism can make at least part of the second conveying mechanism convey the chip outside the shell into the shell through the chip passage by displacement along the first direction; and an optical detection system located in the shell for optical detection of the chip.

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