High-precision Chuck sucker for semiconductor detection

Abstract

The utility model relates to the technical field of suckers, and discloses a high-precision Chuck sucker for semiconductor detection, which comprises a telescopic mechanism, the bottom of the telescopic mechanism is fixedly connected with a buffer mechanism, and the bottom of the buffer mechanism is fixedly connected with a main body mechanism. According to the multi-direction suction cup device, the telescopic mechanism is arranged, so that the telescopic mechanism allows the height of the suction cup to be adjusted in multiple directions, it is ensured that the suction cup is placed accurately, and meanwhile the adaptability under various operation conditions is ensured; vibration caused by collision or sudden impact can be effectively absorbed, the suction cup is protected against damage, the service life of equipment is prolonged, the stability of the whole device is enhanced through the combined design of the stabilizing disc and the stabilizing ring, stability can be kept even in high-speed movement, the deviation risk is reduced, the built-in suction cup can provide uniform and strong adsorption force, and the service life of the equipment is prolonged. And firm fixation of the suction cup in the detection process is ensured, so that the safety of the device is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to sucking disc technical field especially, it relates to a high accuracy Chuck sucking disc for semiconductor detection. BACKGROUND

[0002] In semiconductor manufacturing and detection process, Chuck sucking disc as a kind of key clamping tool, mainly used for stable adsorption wafer, so that it remains fixed in detection, etching, lithography and other processes.In with the continuous progress of integrated circuit technology, chip size is smaller and smaller, more and more complex, which puts forward higher requirements to the precision, stability and adsorption force of Chuck sucking disc.

[0003] According to the disclosed patent with the publication number CN211337921U, the utility model discloses a kind of high-precision buffer sucking disc device, including sucking disc device fixed seat, sucking plate, sucking disc and buffer assembly, sucking plate has oppositely arranged upper surface and lower surface, sucking disc is installed in the lower surface of sucking plate, buffer assembly is set on the upper surface of sucking plate and supports sucking disc device fixed seat;High-precision buffer sucking disc device further includes guide assembly, guide assembly includes guide sleeve and guide rod, guide sleeve is installed in sucking disc device fixed seat, guide rod is fixed to sucking plate at one end, and the other end extends into guide sleeve, ball sleeve is assembled between guide rod and guide sleeve, the inner surface and outer surface of ball sleeve are all provided with a plurality of balls.The high-precision buffer sucking disc device of the utility model, by adding a ball sleeve with ball on both sides between guide sleeve and guide rod, when taking and placing material, contact with guide sleeve and guide rod by ball rolling, reduce friction, improve precision.The utility model has simple structure and high precision, but still has the following problems:

[0004] The balls of the device can be gradually worn out under pressure for a long time, affecting the smoothness and precision of movement, and the state of the balls needs to be checked regularly and replaced if necessary.In the semiconductor production environment, dust particles can invade the inside and outside of the ball sleeve, increase the friction coefficient, and even jam the balls, affecting normal operation. UTILITY MODEL CONTENT

[0005] To solve the above technical problems, the utility model provides a kind of high accuracy Chuck sucking disc for semiconductor detection.

[0006] The utility model adopts the following technical scheme: a kind of high accuracy Chuck sucking disc for semiconductor detection, including telescopic mechanism, the bottom of telescopic mechanism is fixedly connected with buffer mechanism, the bottom of buffer mechanism is fixedly connected with main body mechanism;

[0007] The telescopic mechanism comprises a first telescopic block, one side of the first telescopic block is sleeved with a second telescopic block, the surfaces of the first telescopic block and the second telescopic block are respectively sleeved with a first telescopic ring and a second telescopic ring, one side of the first telescopic ring is fixedly connected with a first supporting block, one side of the first supporting block is sleeved with a second supporting block.

[0008] Through the above technical scheme, by setting the telescopic mechanism, the height of the suction cup can be adjusted in multiple directions, ensuring accurate placement of the suction cup and ensuring adaptability under various working conditions.

[0009] As a further improvement of the above scheme, the top of the first telescopic block and the second telescopic block is provided with a through hole, the top of the first telescopic ring and the second telescopic ring is provided with a through hole, the through hole is provided with a fixing bolt, one side of the first telescopic block and the second telescopic block is fixedly connected with a fixing block.

[0010] As a further improvement of the above scheme, the buffer mechanism comprises a first buffer ring, the top of the first buffer ring is fixedly connected with a pad, the top of the pad is fixedly connected with a first buffer shaft, the top of the first buffer shaft is sleeved with a second buffer shaft, the top of the second buffer shaft is fixedly connected with a second buffer ring.

[0011] Through the above technical scheme, the double-layer buffer shaft in the buffer mechanism can effectively absorb the vibration caused by collision or sudden impact, protect the suction cup from damage, prolong the service life of the equipment, and the combination design of the stabilizing disc and the stabilizing ring enhances the stability of the whole device, which can maintain stability even in high-speed motion and reduce the risk of deviation.

[0012] As a further improvement of the above scheme, the bottom of the first buffer ring is fixedly connected with a first connecting disc, the top of the second buffer ring is fixedly connected with a second connecting disc, the top of the second connecting disc is fixedly connected with a protective ring, and the second connecting disc is fixedly connected with the fixing block.

[0013] As a further improvement of the above scheme, the main body mechanism comprises a disc body, the bottom of the disc body is fixedly connected with a stabilizing disc, the bottom of the stabilizing disc is fixedly connected with a stabilizing ring, and the stabilizing ring is provided with a suction cup.

[0014] As a further improvement of the above scheme, the disc body is fixedly connected with the first connecting disc, and the suction cup is fixedly connected with the stabilizing disc.

[0015] Through the above technical scheme, the built-in suction disc can provide uniform and strong adsorption force, ensure firm fixation of the suction disc in the detection process, and quickly and cleanly release without leaving residual marks.

[0016] Compared with the prior art, the utility model has the advantages that:

[0017] The utility model discloses a telescopic mechanism is set up, and the telescopic mechanism allows the height of the suction disc to be adjusted in multiple directions, ensures accurate placement of the suction disc, and guarantees adaptability under various operation conditions, the buffer mechanism is set up, the double -layer buffer shaft in the buffer mechanism can effectively absorb the vibration caused by collision or sudden impact, protects the suction disc and does not receive the damage, prolongs the equipment life, and the combination design of the stabilizing disc and the stabilizing ring enhances the stability of the whole device, can keep stable even in high -speed movement, reduces the risk of deviation, the built -in suction disc can provide uniform and strong adsorption force, ensure firm fixation of the suction disc in the detection process, and quickly and cleanly release without leaving residual marks, through the detachable fixed peg and the segmented buffer structure, the maintenance of the equipment is more simple, the damaged part can be replaced individually, and the maintenance cost is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 It is overall structure schematic diagram of the utility model;

[0019] Figure 2 It is buffer mechanism structure schematic diagram of the utility model;

[0020] Figure 3 It is telescopic mechanism structure schematic diagram of the utility model;

[0021] Figure 4 It is structure main body mechanism schematic diagram of the utility model;

[0022] Figure 5 It is the utility model Figure 2 It is the structure schematic diagram of amplification in A place of the utility model.

[0023] Main symbol explanation:

[0024] 1, telescopic mechanism;101, first telescopic block;102, second telescopic block;103, first telescopic ring;104, second telescopic ring;105, fixed peg;106, fixed block;2, buffer mechanism;201, first buffer ring;202, first buffer shaft;203, second buffer shaft;204, second buffer ring;205, protection ring;3, main body mechanism;301, disc body;302, stabilizing disc;303, stabilizing ring. DETAILED DESCRIPTION

[0025] The utility model will be further described below in combination with the drawings and specific embodiments, and it should be noted that the following described embodiments or technical features can be combined to form new embodiments without conflict.

[0026] Embodiments:

[0027] Please combine Figures 1-5 The utility model discloses a high-precision chuck chuck for semiconductor detection, including telescopic mechanism 1, the bottom fixed connection of telescopic mechanism 1 has the buffer mechanism 2, the bottom fixed connection of buffer mechanism 2 has main part 3 of mechanism 3;

[0028] Telescopic mechanism 1 includes first telescopic block 101, and the side of first telescopic block 101 is sleeved with second telescopic block 102, and the surface of first telescopic block 101 and second telescopic block 102 is sleeved with first telescopic ring 103 and second telescopic ring 104 respectively, and the side of first telescopic ring 103 is fixedly connected with first support block, and the side of first support block is sleeved with second support block.

[0029] The top of first telescopic block 101 and second telescopic block 102 is all set with through -hole, and the top of first telescopic ring 103 and second telescopic ring 104 is all set with through -hole, and is provided with fixed peg 105 at through -hole, and the side of first telescopic block 101 and second telescopic block 102 is fixedly connected with fixed block 106.

[0030] Buffer mechanism 2 includes first buffer ring 201, and the top of first buffer ring 201 is fixedly connected with pad, and the top of pad is fixedly connected with first buffer shaft 202, and the top of first buffer shaft 202 is sleeved with second buffer shaft 203, and the top of second buffer shaft 203 is fixedly connected with second buffer ring 204.

[0031] The bottom of first buffer ring 201 is fixedly connected with first connecting disc, and the top of second buffer ring 204 is fixedly connected with second connecting disc, and the top of second connecting disc is fixedly connected with protection ring 205, and second connecting disc is fixedly connected with fixed block 106.

[0032] Main part 3 includes disc body 301, and the bottom of disc body 301 is fixedly connected with stabilizing disc 302, and the bottom of stabilizing disc 302 is fixedly connected with stabilizing ring 303, and the chuck is arranged in stabilizing ring 303.

[0033] Disc body 301 is fixedly connected with first connecting disc, and the chuck is fixedly connected with stabilizing disc 302.

[0034] The implementation principle of one of the embodiments of the application is that when the semiconductor is placed on the suction cup, the internal vacuum system starts to pump to form a low pressure area, so that the suction cup is tightly attached to the semiconductor to achieve adsorption. At this time, the buffer mechanism 2 is in a pre-compressed state, ready to respond to possible accidental impact. During suction, fine adjustment through the telescopic mechanism 1 can accurately position to the required position. Before placing the semiconductor, the buffer mechanism 2 slowly returns to its original state to prevent sudden release of excessive pressure on the semiconductor and ensure placement. Once an external impact or vibration is encountered, the first buffer ring 201 and the second buffer shaft 203 cooperate with each other to disperse and absorb kinetic energy, preventing transmission to the semiconductor and ensuring that the semiconductor is not harmed. By loosening the fixing bolt 105, the telescopic mechanism 1 can be easily adjusted to change the height of the suction cup and adapt to different working environments.

[0035] The above embodiments are only preferred embodiments of the present application, and cannot be used to limit the scope of protection of the present application. Any non-substantial changes and replacements made by those skilled in the art on the basis of the present application are within the scope of protection of the present application.

Claims

1. A high-precision Chuck chuck for semiconductor testing, characterized in that, Including telescopic mechanism (1), the bottom of telescopic mechanism (1) is fixedly connected with buffer mechanism (2), and the bottom of buffer mechanism (2) is fixedly connected with main body mechanism (3); The telescopic mechanism (1) includes first telescopic block (101), one side of the first telescopic block (101) is sleeved with second telescopic block (102), the surfaces of the first telescopic block (101) and second telescopic block (102) are respectively sleeved with first telescopic ring (103) and second telescopic ring (104), one side of the first telescopic ring (103) is fixedly connected with first support block, and one side of the first support block is sleeved with second support block.

2. The high-precision chuck for semiconductor inspection as claimed in claim 1, wherein: The top of the first telescopic block (101) and second telescopic block (102) is provided with a through hole, the top of the first telescopic ring (103) and second telescopic ring (104) is provided with a through hole, and the through hole is provided with a fixed bolt (105), and one side of the first telescopic block (101) and second telescopic block (102) is fixedly connected with a fixed block (106).

3. The high-precision chuck for semiconductor inspection as claimed in claim 1, wherein: The buffer mechanism (2) includes first buffer ring (201), the top of the first buffer ring (201) is fixedly connected with a pad, the top of the pad is fixedly connected with a first buffer shaft (202), the top of the first buffer shaft (202) is sleeved with a second buffer shaft (203), and the top of the second buffer shaft (203) is fixedly connected with a second buffer ring (204).

4. The high-precision chuck for semiconductor inspection as claimed in claim 3, wherein: The bottom of the first buffer ring (201) is fixedly connected with a first connecting disc, the top of the second buffer ring (204) is fixedly connected with a second connecting disc, the top of the second connecting disc is fixedly connected with a protective ring (205), and the second connecting disc is fixedly connected with the fixed block (106).

5. The high-precision chuck for semiconductor inspection as claimed in claim 1, wherein: The main body mechanism (3) includes disc body (301), the bottom of the disc body (301) is fixedly connected with a stabilizing disc (302), the bottom of the stabilizing disc (302) is fixedly connected with a stabilizing ring (303), and the stabilizing ring (303) is provided with a suction disc.

6. The high-precision chuck for semiconductor inspection as claimed in claim 5, wherein: The disc body (301) is fixedly connected with the first connecting disc, and the suction disc is fixedly connected with the stabilizing disc (302).

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