Packaging structure of temperature and pressure sensor

Abstract

The utility model discloses a packaging structure of a temperature and pressure sensor, which comprises a sensor shell, a ceramic core body is arranged in the sensor shell, a fluid channel is arranged in the sensor shell, and a pressure sensing surface of the ceramic core body is opposite to the fluid channel; the ceramic core body is further electrically connected with a thermistor, the thermistor extends out of the fluid channel and is sleeved with a heat conduction sleeve, and heat conduction filler is arranged in a gap between the thermistor and the heat conduction sleeve. A positioning frame is arranged on the pressure sensing surface of the ceramic core body and comprises an insertion column part; one end of the heat-conducting sleeve is opened and the other end is closed; the insertion column part is inserted into the opening end of the heat conduction sleeve, so that an inner cavity of the heat conduction sleeve forms a sealed cavity; the closed end of the heat-conducting sleeve extends out of the fluid channel, and the thermistor is correspondingly arranged at the closed end of the heat-conducting sleeve. The temperature response time of the sensor can be shortened, and the failure risk of the thermistor can be reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of temperature and pressure sensor, especially relates to a packaging structure of temperature and pressure sensor. BACKGROUND

[0002] The response time of the traditional automobile temperature and pressure sensor is long, and it is difficult to meet market demand. Although the NTC exposed temperature and pressure sensor can solve the response time problem, the thermistor is exposed outside, the thermistor is easily corroded by refrigerant, and the thermistor can also be damaged by metal impurities in the pipeline, so that the exposed thermistor has the risk of failure. SUMMARY

[0003] The utility model discloses a packaging structure of temperature and pressure sensor, which can shorten the temperature response time of the sensor and reduce the failure risk of the thermistor.

[0004] Technical scheme: in order to realize the above-mentioned purpose, the utility model discloses a packaging structure of temperature and pressure sensor, which comprises a sensor shell, a ceramic core body is installed in the sensor shell, a fluid channel is arranged in the sensor shell, and the pressure sensing surface of the ceramic core body is opposite to the fluid channel. The ceramic core body is also electrically connected with the thermistor, the thermistor extends out of the fluid channel, a heat conduction sleeve is arranged outside the thermistor, and a heat conduction filler is arranged in the gap between the thermistor and the heat conduction sleeve.

[0005] Further, the pressure sensing surface of the ceramic core body is provided with a positioning frame, and the positioning frame comprises a plug column part. One end of the heat conduction sleeve is open, and the other end is closed. The plug column part is inserted into the open end of the heat conduction sleeve, so that the inner cavity of the heat conduction sleeve forms a sealed cavity. The closed end of the heat conduction sleeve extends out of the fluid channel, and the thermistor is correspondingly arranged at the sealed end of the heat conduction sleeve.

[0006] Further, two lead wires are arranged in the positioning frame, one end of the lead wire is connected with the thermistor, and the other end of the lead wire is connected with the resistance lead on the ceramic core body.

[0007] Further, the positioning frame further comprises a disc-shaped part, one side of the disc-shaped part is provided with an annular contact edge, the disc-shaped part is connected with the pressure sensing surface of the ceramic core body through the annular contact edge, and a flow gap is arranged on the annular contact edge.

[0008] Further, the annular contact edge encloses a groove space, and a through hole is formed in the disc-shaped part, and one end of the through hole is communicated with the pressure sensing groove.

[0009] Further, the outer wall of the heat conduction sleeve is spaced apart from the inner wall of the fluid channel.

[0010] Further, the heat conduction sleeve is a metal pipe.

[0011] Furthermore, the thermally conductive filler is a thermally conductive adhesive.

[0012] Beneficial effects: The packaging structure of the temperature and pressure sensor of this utility model has a thermistor extending out of the fluid channel to shorten the temperature response time of the sensor; the thermistor is sleeved in a metal tube, and there is thermally conductive adhesive in the gap between the thermistor and the metal tube. The metal tube can protect the thermistor and make the thermistor less prone to failure. Attached Figure Description

[0013] Appendix Fig. 1 This is a cross-sectional view of a temperature and pressure sensor.

[0014] Appendix Fig. 2 A schematic diagram of the ceramic core, positioning frame, and thermistor;

[0015] Appendix Fig. 3 This is a schematic diagram of a ring-shaped contact edge. Detailed Implementation

[0016] The present invention will be further described below with reference to the accompanying drawings.

[0017] As attached Figs. 1 to 3 The aforementioned temperature and pressure sensor packaging structure includes a sensor housing 1, a ceramic core 2 installed inside the sensor housing 1, and a fluid channel 3 provided inside the sensor housing 1. (See attached image) Fig. 1 As shown, the lower contour surface of the ceramic core 2 is the pressure-sensing surface. The pressure-sensing surface of the ceramic core 2 is opposite to the fluid channel 3. Fluid can flow from the fluid channel 3 to the pressure-sensing surface of the ceramic core 2, and then the ceramic core 2 detects the pressure of the fluid. A button 15 is provided on the top of the sensor housing 1, and a circuit board is connected to the top of the ceramic core 2. The circuit board is connected to the button 15.

[0018] The ceramic core 2 is also electrically connected to the thermistor 4, enabling the ceramic core 2 to detect temperature. The thermistor 4 extends downwards into the fluid channel 3. Because the thermistor 4 is exposed outside the sensor housing 1, the temperature response time of the sensor can be shortened. A thermally conductive sleeve 5 is fitted over the thermistor 4, and a thermally conductive filler is placed in the gap between the thermistor 4 and the thermally conductive sleeve 5. The thermally conductive sleeve 5 protects the thermistor 4 from corrosion or scratches by impurities, reducing the risk of thermistor 4 failure. Specifically, the thermally conductive sleeve 5 is a metal tube, and the thermally conductive filler is thermally conductive adhesive. The combination of the metal tube and the thermally conductive adhesive has good thermal conductivity, allowing the metal tube to both protect the thermistor 4 and ensure a fast temperature response.

[0019] The outer wall of the heat-conducting sleeve 5 is spaced apart from the inner wall of the fluid channel 3, allowing fluid to pass between the heat-conducting sleeve 5 and the fluid channel 3.

[0020] As attachedFig. 2 As shown in the figure, the pressure sensing surface of the ceramic core 2 is also provided with a positioning frame 6, which positions the heat conducting sleeve 5 and the thermistor 4. The positioning frame 6 comprises a plug column part 7, the extension direction of which is consistent with the extension direction of the fluid channel 3. One end of the heat conducting sleeve 5 is open, and the other end is closed. The plug column part 7 is correspondingly inserted into the open end of the heat conducting sleeve 5, thereby closing the open end of the heat conducting sleeve 5, and the inner cavity of the heat conducting sleeve 5 forms a sealed cavity, in which the thermistor 4 is located. The heat conducting sleeve 5 separates the thermistor 4 from the outside, effectively protecting the thermistor 4. The closed end of the heat conducting sleeve 5 extends out of the fluid channel 3, and the thermistor 4 is correspondingly arranged at the sealed end of the heat conducting sleeve 5. The closed end of the heat conducting sleeve 5 is narrowed as much as possible to reduce the distance between the heat conducting sleeve 5 and the thermistor 4, and to accelerate the temperature response of the thermistor 4. The outer wall of the heat conducting sleeve 5 is spaced apart from the inner wall of the fluid channel 3, so that the fluid can pass between the heat conducting sleeve 5 and the fluid channel 3.

[0021] Two lead wires 8 are arranged in the positioning frame 6, and the lower profile surface of the ceramic core 2 is provided with a resistance pin 9. As shown in the figure, Fig. 2 As shown in the figure, the lower end of the lead wire 8 is connected to the thermistor 4, and the upper end of the lead wire 8 is connected to the resistance pin 9 on the ceramic core 2, so that the ceramic core 2 and the thermistor 4 are electrically connected.

[0022] The positioning frame 6 further comprises a disc-shaped part 10, as shown in the figure, Fig. 3 As shown in the figure, the lower end of the disc-shaped part 10 is connected to the plug column part 7, and the upper surface of the disc-shaped part 10 is provided with an annular contact edge 11, which is connected to the pressure sensing surface of the ceramic core 2, and the annular contact edge 11 is provided with a flow-through gap 12. Because the annular contact edge 11 has the flow-through gap 12, the fluid can flow into the space between the pressure sensing surface of the ceramic core 2 and the upper surface of the disc-shaped part 10 through the flow-through gap 12, so that the pressure sensing surface of the ceramic core 2 can normally sense the pressure of the fluid.

[0023] The groove space enclosed by the annular contact edge 11 is a pressure sensing groove 13, and the disc-shaped part 10 is further provided with a through hole 14, one end of which is connected to the pressure sensing groove 13. The fluid can also flow into the pressure sensing groove 13 through the through hole 14, and the pressure of the fluid in the pressure sensing groove 13 is detected by the pressure sensing surface of the ceramic core 2.

[0024] The utility model discloses a sensor, it includes sensor shell 1, ceramic core body 2, heat -sensitive resistance 4 and metal pipe 5, sensor shell 1 is provided with fluid channel 3, ceramic core body 2 is provided with the pressure sensing groove 13, and the pressure sensing groove 13 is provided with the through hole 14, and the through hole 14 is provided with the flow gap 12, and the fluid channel 3 is connected with the pressure sensing groove 13, and the metal pipe 5 is connected with the ceramic core body 2.

[0025] The above is only the preferred embodiment of the utility model, and it should be pointed out that for ordinary skilled person in the art, without departing from the principle of the utility model, a number of improvements and refinements can be made, and these improvements and refinements should be considered as the protection scope of the utility model.

Claims

1. A packaging structure of a temperature and pressure sensor, characterized by: The sensor shell (1) is internally provided with a ceramic core (2), a fluid channel (3) is arranged in the sensor shell (1), and the pressure sensing surface of the ceramic core (2) is opposite to the fluid channel (3); the ceramic core (2) is also electrically connected with a thermistor (4), the thermistor (4) extends out of the fluid channel (3), the thermistor (4) is externally provided with a heat-conducting sleeve (5), and the gap between the thermistor (4) and the heat-conducting sleeve (5) is filled with a heat-conducting filler.

2. The packaging structure of a temperature and pressure sensor according to claim 1, wherein: The pressure sensing surface of the ceramic core (2) is provided with a positioning frame (6), the positioning frame (6) comprises a plug column portion (7); one end of the heat-conducting sleeve (5) is open, and the other end is closed; the plug column portion (7) is inserted into the open end of the heat-conducting sleeve (5), so that the inner cavity of the heat-conducting sleeve (5) forms a sealed cavity; The closed end of the heat-conducting sleeve (5) extends out of the fluid channel (3), and the thermistor (4) is correspondingly arranged at the sealed end of the heat-conducting sleeve (5).

3. The packaging structure of a pyroelectric pressure sensor according to claim 2, wherein: Two lead wires (8) are arranged in the positioning frame (6), one end of the lead wire (8) is connected with the thermistor (4), and the other end of the lead wire (8) is connected with a resistance lead pin (9) on the ceramic core (2).

4. The packaging structure of a temperature and pressure sensor according to claim 2, wherein: The positioning frame (6) further comprises a disc-shaped portion (10), one side of the disc-shaped portion (10) is provided with an annular contact edge (11), the disc-shaped portion (10) is connected with the pressure sensing surface of the ceramic core (2) through the annular contact edge (11), and the annular contact edge (11) is provided with a flow-through gap (12).

5. The packaging structure of a pyroelectric pressure sensor according to claim 4, wherein: The annular contact edge (11) surrounds a groove space, which is a pressure sensing groove (13), and the disc-shaped portion (10) is further provided with a through hole (14), one end of the through hole (14) is connected with the pressure sensing groove (13).

6. The packaging structure of a temperature and pressure sensor according to claim 1, wherein: The outer wall of the heat-conducting sleeve (5) is spaced apart from the inner wall of the fluid channel (3).

7. The packaging structure of a temperature and pressure sensor according to claim 1, wherein: The heat-conducting sleeve (5) is a metal tube.

8. The packaging structure of a temperature and pressure sensor according to claim 1, wherein: The heat-conducting filler is heat-conducting glue.

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