An insulating encapsulation structure and its connection encapsulation method for a probe temperature sensor.

Abstract

This invention discloses an insulating encapsulation structure and connection method for a probe temperature sensor, relating to the field of temperature sensor technology. The insulating connection bracket has an outer insulating and thermally conductive protective layer, and contains insulating adhesive and a temperature-sensing component. The specific implementation is as follows: an insulating layer assembly, a built-in snap-fit ​​structure within the insulating connection bracket, and an eccentric cavity for housing the temperature-sensing component. A thermistor glass body is used as the insulator. In the insulation process, direct contact between the glass body and the inner wall of the bracket reduces one useless insulating layer. The cavity formed by the end of the insulating connection bracket and the insulating layer assembly houses the temperature-sensing component. The cavity contains a clearance structure for the thermistor pins and multiple layers of insulation between the pins and the conductive copper wires. A fluid insulating adhesive is used, and then the insulating connection is cured. Finally, the encapsulation is placed inside a metal shell containing insulating adhesive and cured, thus forming multiple layers of effective insulation and sufficient safe insulation thickness between the thermistor conductive pins and the metal shell.

Description

Technical Field

[0001] This invention relates to the field of temperature sensor technology, specifically to an insulating encapsulation structure and splicing encapsulation method for a probe temperature sensor. Background Technology

[0002] A temperature sensor is a sensor that can sense temperature and convert it into a usable output signal. Temperature sensors are the core component of temperature measuring instruments and come in a wide variety. They can be broadly classified into two categories based on the measurement method: contact and non-contact. Based on the sensor materials and electronic component characteristics, they are further divided into resistance temperature detectors (RTDs) and thermocouples.

[0003] Currently, temperature sensor probes in commonly used smart home appliances for cooking often use metal casings as containers. To ensure accurate temperature measurement, the inner opening of the metal casing is typically very small, and insulation processes such as built-in thermistors, heat shrink tubing, or encapsulation are employed. However, achieving sufficient insulation strength through epoxy resin potting and curing is challenging. When the metal casing of an internal temperature sensor needs to be exposed, grounding protection is required in areas accessible to human hands to meet safety regulations. With the advancement of technology and productivity, triple insulation has become a cost-reduction solution for many products. This involves a technological upgrade without altering the original product's appearance, structure, or size, thereby reducing costs. Triple insulation should consist of three different materials, insulated in different ways to achieve the triple insulation effect. Thermistors rely on temperature changes to generate resistance changes in the crystal, which are transmitted through pins and soldered copper wires to the control board chip of small household appliances to receive signals, process, and control the heating effect of food. If there are multiple insulating layers between the thermistor glass body, it will inevitably affect the delay in heat conduction. The greater the thickness of the thermistor crystal and the temperature-sensing casing, the greater the stepped temperature difference, which will inevitably affect the temperature measurement accuracy of the sensor and fail to meet the usage requirements. Summary of the Invention

[0004] To achieve the above objectives, the present invention provides the following technical solution: an insulating encapsulation structure and a splicing encapsulation method for a probe temperature sensor, wherein an insulating thermally conductive protective layer is provided outside the insulating splicing bracket, and an insulating body composed of insulating adhesive, a thermistor, and a cavity is provided inside the insulating splicing bracket.

[0005] A temperature sensing component for detecting ambient temperature, the temperature sensing component includes a thermistor body and a thermistor pin disposed inside the thermistor body, one end of the thermistor pin is bent into a U-shape and inserted into a bracket structure to force the thermistor glass body to be tightly attached to the insulating connector bracket.

[0006] An insulating connector bracket is used to assist in encapsulating the temperature sensing component. The interior of the insulating connector bracket is provided with a bracket structure one and a bracket structure two. The joint surface of bracket structure one and bracket structure two forms a locking structure. The temperature sensing component is disposed inside the insulating connector bracket. The bottom of the thermistor body penetrates through bracket structure one and contacts the top of bracket structure two, limiting the range of motion of the thermistor body on the locking structure surface. The thermistor pins and the insulating connector bracket form four clearance structures. After potting, a reliable basic insulator is formed.

[0007] An insulating layer assembly is used to insulate the temperature sensing component and the insulating connector bracket. The insulating layer assembly includes an insulating layer one, an insulating layer two, and an insulating layer three, which are sleeved on the thermistor pins. The insulating layers overlap reliably and are sealed with insulating adhesive.

[0008] A metal housing for encapsulating the assembled temperature-sensing component, insulating connector bracket, and insulating sheath assembly; and insulating adhesive.

[0009] The two sides of the U-shaped portion of the thermistor pin and the interior of the insulating connector bracket respectively form an air-avoidance structure one and an air-avoidance structure two, which are located above the bracket structure one. The two ends of the thermistor pin and the interior of the insulating connector bracket respectively form an air-avoidance structure three and an air-avoidance structure four, which are located below the bracket structure two.

[0010] As a preferred embodiment of the present invention, the thermistor body is provided with a thermistor crystal core connected to the thermistor pins inside, and conductive copper wires are connected to both ends of the thermistor pins. An insulating layer two is sleeved on the outside of the conductive copper wires, and the insulating layer two is sleeved inside the insulating layer one.

[0011] As a preferred embodiment of the present invention, the interior of the support structure consists of two mating circular cavities, one of which has a smaller diameter than the other.

[0012] The bottom of the thermistor body is fitted into a larger diameter circular cavity, and one end of the thermistor lead, which is bent into a U-shape, passes through a smaller diameter circular cavity.

[0013] In a preferred embodiment of the present invention, the larger diameter cavity is located close to the inner wall of the insulating connector bracket, and the thermistor body is eccentrically positioned inside the larger diameter cavity, so that the surface of the thermistor body fits against the inner wall of the insulating connector bracket.

[0014] As a preferred embodiment of the present invention, the top of the second support structure is fitted to the bottom of the first support structure, and the interior of the second support structure is a long strip-shaped cavity, the width of which is the same as the diameter of the smaller circular cavity.

[0015] As a preferred embodiment of the present invention, the insulating skin is disposed inside the metal shell, and the interior of the metal shell and the interior of the insulating splice bracket are both filled with insulating adhesive.

[0016] An uncontrollable insulating layer is formed between the interior of the metal shell and the third insulating layer. The section of the third insulating layer located at the bottom of the insulating connector is a constricted section, and the diameter of the constricted section is smaller than the diameter of the third insulating layer.

[0017] As a preferred embodiment of the present invention, the bottom ends of both conductive copper wires extend to the bottom of the metal casing, and the bottom ends of insulating layer one, insulating layer two, and insulating layer three all extend to the bottom of the metal casing.

[0018] As a preferred embodiment of the present invention, the first insulating layer is a high-temperature fluorine shrink tubing, the third insulating layer is a heat shrink tubing, and the insulating splice bracket is made of ceramic material.

[0019] A method for connecting an insulating splice package structure of a probe temperature sensor includes the following steps:

[0020] S1. When installing the temperature sensing component, first pass the two conductive copper wires with insulating layer 2 through the bottom of the insulating connector bracket, through the avoidance structure 2 and avoidance structure 1, and extend to the upper port of the insulating connector bracket. Then, insert the two insulating layers 1 respectively, and then weld them to the pins of the two thermistors.

[0021] S2. When installing the temperature sensing component, push the two insulating layers one onto the thermistor pins, heat and shrink them to connect, pull the insulating layers one down so that the thermistor body passes through the bracket structure one and is supported on the bracket structure two, and use the locking structure to limit and shape it up, down, left and right.

[0022] S3. After the temperature sensing component is assembled with the insulating connector bracket, an insulating layer three is fitted over the outside of the insulating connector bracket. The shrink sleeve further shrinks and fixes the insulating layers one and two, thereby limiting the left-right and up-down position and distance of the temperature sensing component within the insulating connector bracket. After injecting insulating glue into the assembled insulating connector bracket and curing the insulating sealant, it is pushed into the interior of the metal shell. The insulating glue inside the metal shell then cures to achieve the sealing of the insulating connector bracket.

[0023] As a preferred technical solution of the present invention, in step S3, after the insulating layer three is fitted onto the insulating splice bracket, a shrinkable insulating sleeve needs to be fitted onto the surface of the insulating layer three at the bottom end of the insulating splice bracket to limit the insulating layer one, insulating layer two, and insulating layer three. The shrinkable insulating sleeve is concentrically arranged with the closing part.

[0024] Compared with the prior art, the present invention provides an insulating bonding package structure for a probe temperature sensor and its bonding method, which has the following advantages:

[0025] In summary, the insulating bonding structure and bonding method of this probe temperature sensor, through the placement of an insulating skin assembly, an insulating bonding bracket, and a temperature sensing component within a metal casing, differs from conventional temperature sensors. This device utilizes insulating adhesive and a thermistor body, with the insulating adhesive serving as an auxiliary filler for bonding. It alters the traditional three-layer insulation process and structure, allowing direct contact between the thermistor body and the inner wall of the insulating bonding bracket, reducing one useless insulation layer. The insulating bonding bracket and the insulating skin assembly form a container to hold the fluid insulating adhesive, the temperature sensing component, and multiple overlapping insulating skin layers, which are then cured. This device allows for precise control of the insulation shape after curing, eliminates invalid tolerances between the insulator and insulation layer, and solves the problem of abnormally large and irregular insulation structures caused by inadequate adhesion between insulation layers. This design perfectly meets the production requirements for multi-layered reinforced insulation within the extremely small diameter of the inner cavity of the metal casing. An uncontrollable insulation layer is formed between the interior of the metal casing and the third insulating layer. The insulating connector bracket and the inner and outer surfaces of the third insulating layer are all precisely controllable in size. The inner cavity of the metal casing is also precisely controllable in size. This allows for ultra-thin control of the thickness of the ineffective insulation layer, reducing the delay in temperature conduction caused by the ineffective insulation layer and minimizing the stepped temperature error caused by the thickness of the insulation layer on the measured heat source and the temperature sensing crystal. The insulating connector bracket is made of ceramic material, giving the temperature sensor high conductivity, high insulation, high protection, high temperature resistance, increased product sensitivity, temperature measurement consistency, and reliable insulation safety. The insulating encapsulation allows for excellent control and detection even when not placed inside the metal casing, thereby reducing process difficulty and production costs, and providing high temperature measurement accuracy. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the insulating encapsulation structure and splicing encapsulation method of a probe temperature sensor proposed in this invention;

[0027] Figure 2 This is a cross-sectional view of the main structure of a thermistor, which is an insulating encapsulation structure and a splicing encapsulation method for a probe temperature sensor proposed in this invention.

[0028] Figure 3This is a cross-sectional view of the insulating layer one and the insulating layer two of the insulating encapsulation structure and splicing encapsulation method of the probe temperature sensor proposed in this invention.

[0029] Figure 4 This is a cross-sectional view of the insulating connection bracket structure of the insulating encapsulation structure and connection encapsulation method of the probe temperature sensor proposed in this invention.

[0030] Figure 5 This is a thermally exposed view of the insulating encapsulation structure and splicing encapsulation method for a probe temperature sensor proposed in this invention.

[0031] Figure 6 This is a cross-sectional view of the insulating layer one and insulating layer three of the insulating encapsulation structure and splicing encapsulation method of the probe temperature sensor proposed in this invention.

[0032] Figure 7 This is a top sectional view of the insulating connection bracket and the main structure of the thermistor, which are part of the insulating encapsulation structure and connection encapsulation method of the probe temperature sensor proposed in this invention.

[0033] Figure 8 This is a schematic diagram illustrating the usage state of the insulating encapsulation structure and splicing encapsulation method of the probe temperature sensor proposed in this invention.

[0034] In the diagram: 1. Temperature sensing component; 11. Thermistor body; 12. Thermistor crystal; 13. Thermistor pins; 14. Conductive copper wire; 2. Insulating connector bracket; 21. Bracket structure one; 22. Bracket structure two; 23. Clearance structure one; 24. Clearance structure two; 25. Clearance structure three; 26. Clearance structure four; 3. Insulating skin assembly; 31. Insulating skin one; 32. Insulating skin two; 33. Insulating skin three; 34. Closure section; 4. Metal outer shell; 41. Uncontrollable insulating layer; 5. Shrinkable insulating sleeve. Detailed Implementation

[0035] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0036] Please see Figure 1-8 An insulating encapsulation structure for a probe temperature sensor, wherein an insulating and thermally conductive protective layer 3 is provided outside the insulating connector bracket 2, and multiple clearance cavities, eccentric circles, concentric circles, and insulating adhesive form a basic insulator 1. The specific implementation is as follows:

[0037] Temperature sensing component 1 is used to detect ambient temperature. The temperature sensing component 1 includes a thermistor body 11 and a thermistor pin 13 disposed inside the thermistor body 11. One end of the thermistor pin 13 is bent into a U-shape and inserted into the bracket structure 21 to force the thermistor glass body 11 to be tightly attached to the insulating connector bracket 2.

[0038] An insulating connector bracket 2 is used to assist in encapsulating the temperature sensing component 1. Inside the insulating connector bracket 2, a first bracket structure 21 and a second bracket structure 22 are arranged in sequence. The joint surfaces of the first bracket structure 21 and the second bracket structure 22 form a locking structure. The temperature sensor component 1 is disposed inside the insulating connector bracket 2. The bottom of the thermistor body 11 penetrates the first bracket structure 21 and contacts the top of the second bracket structure 22, limiting the range of motion of the thermistor on the locking structure surface. The thermistor pins 13 and the insulating connector bracket 2 form four clearance structures. After potting, a reliable basic insulator 1 is formed.

[0039] Insulating layer assembly 3 is used to insulate the temperature sensing component 1 and the insulating connector 2. The insulating layer assembly 3 includes insulating layer 1 31, insulating layer 2 32 and insulating layer 33 sleeved on the thermistor pin 13. The insulating layers overlap and are reliably connected by insulating glue for sealing and insulation.

[0040] The metal casing 4 is used to encapsulate the assembled temperature sensing component 1, insulating connector bracket 2, and insulating skin component 3. A first-stage clearance structure 23 and a second-stage clearance structure 24 are formed between the two sides of the U-shaped portion of the thermistor pin 13 and the interior of the insulating connector bracket 2, respectively. The first-stage clearance structure 23 and the second-stage clearance structure 24 are located above the first-stage bracket structure 21. A third-stage clearance structure 25 and a fourth-stage clearance structure 26 are formed between the two ends of the thermistor pin 13 and the interior of the insulating connector bracket 2, respectively. The third-stage clearance structure 25 and the fourth-stage clearance structure 26 are located below the second-stage bracket structure 22. This device uses a commercially available diode thermistor, two-ended energized pins, and a middle glass-encapsulated crystal structure to form the temperature sensing component 1. It has high versatility, solves product circulation restrictions, reduces product manufacturing material costs, and is more convenient to use.

[0041] As a specific technical solution in this embodiment, the thermistor body 11 is provided with a thermistor crystal 12 connected to the thermistor pin 13 inside. Both ends of the thermistor pin 13 are connected to conductive copper wires 14. The conductive copper wires 14 are covered with an insulating layer 2 32. The insulating layer 2 32 is covered inside the insulating layer 1 31. The insulating layer 2 32 provides insulation protection for the conductive copper wires 14. The top end of the insulating layer 1 31 is covered on the thermistor pin 13, and the bottom end is covered with the insulating layer 2 32, which further ensures the stability of the temperature sensor.

[0042] As a specific technical solution in this embodiment, the support structure 21 has two mating circular cavities inside, one of which has a smaller diameter than the other. The bottom of the thermistor body 11 is fitted into the larger diameter cavity, and one end of the thermistor pin 13, which is bent into a U-shape, passes through the smaller diameter cavity. This device uses the thermistor body 11 to set an eccentric circular structure, which forces the thermistor crystal 12 to be closer to the stainless steel shell and reduces the conduction delay of the intermediate spacer material. The thermistor pin 13 is concentrically circular to create an air-avoiding structure. Then, one end of the thermistor body 11 is bent into a U-shape and set with an eccentric circular structure, which is beneficial to the insulating glue and the thermistor body 11. In the traditional three-layer insulation process structure, a useless insulation layer is reduced. The thermistor body 11 is a large cylinder and the thermistor pin 13 is a small cylinder. The step in the middle would produce air and bubbles if treated with an insulating tube. The device uses fluid insulating glue and then cures the insulation to eliminate air and bubbles, which improves conductivity and safety reliability, thereby reducing the process difficulty and production cost.

[0043] As a specific technical solution in this embodiment, the larger diameter circular cavity is close to the inner wall of the insulating connector bracket 2, and the thermistor body 11 is eccentrically located inside the larger diameter circular cavity, so that the surface of the thermistor body 11 is in contact with the inner wall of the insulating connector bracket 2. Compared with the traditional three-layer insulation process structure, this device reduces one useless insulation layer and improves the temperature measurement sensitivity of the product. See reference. Figure 8 When A is the first heated surface and D is the second heated surface, B is the direct contact surface of the thermistor crystal 12, and C is a single solid thermally conductive material. The principle of heat conduction is as follows: the solid body transfers heat from A through the collision of microscopic particles (molecules) to B through the thermally conductive insulating filler glue (conductivity of 1.0-5.0W / M / K), which is wrapped in a 360-degree bubble-free solid material. Compared with the traditional method, it eliminates three layers of medium and the heat transfer of a single material greatly increases the effectiveness of heat conduction. Materials D and B are ultra-thin materials, and the thickness of D and B is effectively controlled, thereby reducing the error of temperature gradient in temperature transfer and achieving more accurate temperature measurement.

[0044] As a specific technical solution in this embodiment, the top of the second bracket structure 22 is attached to the bottom of the first bracket structure 21. The interior of the second bracket structure 22 is a long strip cavity, and the width of the long strip cavity is the same as the diameter of the smaller circular cavity. The arrangement of the first bracket structure 21 and the second bracket structure 22 ensures the stability of the thermistor body 11, so that the temperature sensing component 1 and the insulating connecting bracket 2 form a whole. When the conductive copper wire 14 is pulled down, the temperature sensing component 1 will not detach from the interior of the insulating connecting bracket 2.

[0045] As a specific technical solution in this embodiment, the insulating layer 33 is sleeved inside the metal shell 4. The interior of the metal shell 4 and the interior of the insulating connector 2 are both filled with insulating glue. An uncontrollable insulating layer is formed between the interior of the metal shell 4 and the insulating layer 33. The insulating connector 2 and the insulating layer 33 are both precisely controllable in size, and the interior dimensions of the metal shell 4 are also precisely controllable. This allows for ultra-thin control of the thickness of the ineffective insulating layer, reduces the delay of temperature conduction caused by the ineffective insulating layer, and minimizes the stepped temperature error caused by the thickness on the heat source and the temperature sensing crystal. This further increases the product's measurement sensitivity, temperature measurement consistency, and the reliability of insulation safety.

[0046] As a specific technical solution in this embodiment, the section of the metal outer shell 4 and the insulating layer 33 located at the bottom of the insulating connector 2 is a tapered section 34, the diameter of which is smaller than the diameter of the insulating layer 33. This makes the bonding and fixing of the metal outer shell 4 and the insulating layer 33 to the insulating connector 2 safer and more reliable, eliminating the risk of the insulating adhesive detaching from the metal outer shell.

[0047] As a specific technical solution in this embodiment, the insulating layer 33 and the insulating splice bracket 2 are tightly fitted and shrunk. The insulating splice bracket 2 is used for curing insulation when the temperature sensing component 1 of the container device and the insulating adhesive fluid are contained. This allows for precise control of the insulation shape after the insulating adhesive is cured, eliminates invalid and harmful tolerances between the insulator and the insulating layer, and solves the problem of abnormally large and irregular insulation structures caused by the inability of the insulating layers to adhere tightly to each other. This device achieves multi-layer reinforced insulation within the extremely small diameter of the inner cavity of the metal shell 4.

[0048] As a specific technical solution in this embodiment, the bottom ends of both conductive copper wires 14 extend to the bottom of the metal casing 4, and the bottom ends of insulating layer 1 31, insulating layer 2 32, and insulating layer 33 also extend to the bottom of the metal casing 4. The arrangement of insulating layer 1 31, insulating layer 2 32, and insulating layer 33, along with the use of intracavity splicing and multi-layer insulating skin and insulating glue for sealing insulation, increases the reliability and electrical strength of the insulation, thereby ensuring the safety of the device.

[0049] As a specific technical solution in this embodiment, the insulating layer 31 is a high-temperature Teflon shrink tubing, the insulating layer 33 is a heat shrink tubing, and the insulating splice bracket 2 is made of ceramic material. Ceramic material can withstand high temperatures, heat shrink tubing solves the stress effect of the product, and high-temperature Teflon shrink tubing has extremely strong wear resistance. It can still work normally when all materials fail at a high temperature of 300 degrees Celsius. The insulating layer 33 between the insulating splice bracket 2 and the metal shell 4 better protects the internal structure of the insulating splice bracket 2 when the metal shell 4 is subjected to external impact, reducing the damage rate and improving the performance of the device.

[0050] A splicing and packaging method for an insulating encapsulation structure of a probe temperature sensor includes the following steps:

[0051] S1. On the temperature sensing component 1, first pass the two conductive copper wires 14 with insulating skin layer 2 32 through the bottom of the insulating connector bracket 2, through the avoidance structure 2 and the avoidance structure 1 and extend to the upper port of the insulating connector bracket 2. Then, insert the two insulating skin layers 1 31 respectively, and then weld them to the two pins 13 of the thermistor.

[0052] S2. After installing the temperature sensing component 1, push the two insulating layers 31 onto the thermistor pins 13, heat and shrink them to connect, pull the insulating layers 31 down so that the thermistor body 11 passes through the bracket structure 21 and is supported on the bracket structure 22, and use the locking structure to limit and shape it up, down, left and right.

[0053] S3. After the temperature sensing component 1 is assembled with the insulating connector bracket 2, an insulating layer 33 is sleeved on the outside of the insulating connector bracket 2. The shrink sleeve 5 shrinks and fixes the insulating layer 1 and the insulating layer 2 again, thereby limiting the left, right, up and down position and distance of the temperature sensing component 1 inside the insulating connector bracket 2. After the assembled insulating connector bracket 2 is injected with insulating glue and cured for insulating encapsulation, it is pushed into the inside of the metal shell 4. The insulating connector bracket 2 is encapsulated by the curing of the insulating glue inside the metal shell 4.

[0054] As a specific technical solution in this embodiment, in step S3, after the insulating layer 33 is fitted onto the insulating splice bracket 2, a shrinkable insulating sleeve 5 needs to be fitted onto the surface of the insulating layer 33 at the bottom end of the insulating splice bracket 2 to limit the insulating layer 1 31, insulating layer 2 32 and insulating layer 33. The shrinkable insulating sleeve 5 is concentrically arranged with the closing part 34 and adopts an inverted assembly method. All fine operations can be completed outside the insulating splice bracket 2, solving the production difficulty and assembly difficulty, and the operation method is simple.

[0055] In summary, the insulating bonding structure and bonding method of this probe temperature sensor, through the arrangement of a temperature sensing component 1, an insulating bonding bracket 2, an insulating skin assembly 3, and a metal shell 4, compared to conventional temperature sensors, utilizes insulating adhesive and a thermistor body 11. The insulating adhesive serves as an auxiliary filler for bonding, changing the traditional three-layer insulation process. This allows the thermistor body 11 to directly contact the inner wall of the insulating bonding bracket 2, reducing a useless and harmful insulation layer. The insulating bonding bracket 2 and the insulating skin assembly 3 form a container to hold the fluid insulating adhesive, the temperature sensing component 1, and multiple overlapping insulating skins, which are then cured. This device allows for precise control of the insulation shape after the insulating adhesive has cured, eliminates ineffective and harmful tolerances between the insulator and the insulation layer, and solves the problem of abnormally large and irregular insulation structures caused by the inability of the insulation layers to adhere tightly. It perfectly meets the production requirements of multi-layer reinforced insulation within the extremely small diameter of the inner cavity of the metal shell 4. An uncontrollable insulating layer is formed between the interior of the metal casing 4 and the insulating layer 33. The insulating connector 2 and the insulating layer 33 are both precisely sized, and the internal cavities of the metal casing 4 are also precisely sized. This allows for ultra-thin control of the thickness of the ineffective insulating layer, reducing the delay in temperature conduction caused by the ineffective insulating layer and minimizing the stepped temperature error caused by its thickness on the heat source and the sensing crystal. The insulating connector 2 is made of ceramic, giving the temperature sensor high conductivity, high insulation, high protection, high temperature resistance, increased product sensitivity, temperature measurement consistency, and reliable insulation safety. This reduces the complexity of the manufacturing process and its production costs.

[0056] It should be noted that, in this document, terms such as "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0057] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An insulating encapsulation structure for a probe temperature sensor, characterized in that: The insulating splice bracket (2) is provided with an insulating skin assembly (3) on the outside. The insulating splice bracket (2) is provided with multiple open structure cavities, eccentric circles, and concentric circles of insulating glue to form a basic insulator. The specific implementation is as follows: Temperature sensing component (1) is used to detect ambient temperature. The temperature sensing component (1) includes a thermistor body (11) and a thermistor pin (13) disposed inside the thermistor body (11). One end of the thermistor pin (13) is bent into a U-shape and inserted into the bracket structure (21) to force the thermistor glass body (11) to be tightly attached to the insulating connector bracket (2). An insulating connector bracket (2) is used to assist in encapsulating the temperature sensing component (1). The interior of the insulating connector bracket (2) is provided with a first bracket structure (21) and a second bracket structure (22). The joint surface of the first bracket structure (21) and the second bracket structure (22) forms a locking structure. The temperature sensing component (1) is disposed inside the insulating connector bracket (2). The bottom of the thermistor body (11) penetrates the first bracket structure (21) and contacts the top of the second bracket structure (22), limiting the range of motion of the thermistor pins (13) and the insulating connector bracket (2) to form four clearance structures. After potting, a reliable basic insulator is formed. An insulating skin assembly (3) is used to insulate the temperature sensing component (1) and the insulating connector bracket (2). The insulating skin assembly (3) includes an insulating skin layer one (31) and an insulating skin layer two (32) sleeved on the thermistor pin (13) and an insulating skin layer three (33) sleeved on the insulating connector bracket (2). The insulating skin layers overlap and are reliably connected to the insulating adhesive for sealing and insulation. A metal casing (4) is used to encapsulate the assembled temperature sensing component (1), insulating connector bracket (2), and insulating sheath assembly (3); The two sides of the U-shaped part of the thermistor pin (13) and the interior of the insulating connector bracket (2) respectively form a first clearance structure (23) and a second clearance structure (24). The first clearance structure (23) and the second clearance structure (24) are located above the first bracket structure (21). The two ends of the thermistor pin (13) and the interior of the insulating connector bracket (2) respectively form a third clearance structure (25) and a fourth clearance structure (26). The third clearance structure (25) and the fourth clearance structure (26) are located below the second bracket structure (22). The interior of the first bracket structure (21) consists of two mating cavities, one of which has a smaller diameter than the other. The bottom of the thermistor body (11) is fitted into the larger diameter cavity, and one end of the thermistor pin (13), which is bent into a U-shape, passes through the smaller diameter cavity. The larger diameter cavity is close to the inner wall of the insulating connector bracket (2), and the thermistor body (11) is located eccentrically inside the larger diameter cavity so that the surface of the thermistor body (11) fits against the inner wall of the insulating connector bracket (2). The top of the second bracket structure (22) fits against the bottom of the first bracket structure (21), and the interior of the second bracket structure (22) is a long strip cavity, the width of which is the same as the diameter of the smaller diameter cavity.

2. The insulating encapsulation structure of a probe temperature sensor according to claim 1, characterized in that: The thermistor body (11) is provided with a thermistor crystal (12) connected to the thermistor pin (13) inside. Both ends of the thermistor pin (13) are connected to conductive copper wires (14). The conductive copper wires (14) are covered with an insulating layer two (32), which is placed inside the insulating layer one (31).

3. The insulating encapsulation structure of a probe temperature sensor according to claim 1, characterized in that: The insulating layer three (33) is fitted inside the metal shell (4), and the interior of the metal shell (4) and the interior of the insulating splice bracket (2) are filled with insulating glue; An uncontrollable insulating layer is formed between the interior of the metal shell (4) and the insulating layer three (33). The uncontrollable insulating layer is used to fix the interior of the metal shell (4) and the insulating layer three (33). The section of the insulating layer three (33) located at the bottom of the insulating connector bracket (2) is a closing part (34). The diameter of the closing part (34) is smaller than the diameter of the insulating layer three (33).

4. The insulating encapsulation structure of a probe temperature sensor according to claim 2, characterized in that: The bottom ends of the two conductive copper wires (14) extend to the bottom of the metal casing (4), and the bottom ends of the insulating layer one (31), insulating layer two (32) and insulating layer three (33) also extend to the bottom of the metal casing (4).

5. The insulating encapsulation structure of a probe temperature sensor according to claim 1, characterized in that: The first insulating layer (31) is a high-temperature fluorine shrink tubing, the third insulating layer (33) is a heat shrink tubing, and the insulating splice bracket (2) is made of ceramic material.

6. A splicing and packaging method based on the insulating packaging structure of a probe temperature sensor according to any one of claims 1-5, characterized in that, Includes the following steps: S1. Install the temperature sensing component (1). First, pass the two conductive copper wires (14) with the second insulating layer (32) through the bottom of the insulating connector bracket (2), through the first open structure (23) and the second open structure (24) and extend to the upper port of the insulating connector bracket (2). Then, insert the two first insulating layers (31) and weld them to the two thermistor pins (13). S2. After installing the temperature sensing component (1), push the two insulating layers (31) onto the thermistor pin (13), heat and shrink the connection, pull the insulating layer (31) down so that the thermistor body (11) passes through the bracket structure (21) and is supported on the bracket structure (22), and use the snap-fit ​​structure to limit and shape it in the left and right directions. S3. After the temperature sensing component (1) is assembled with the insulating connector bracket (2), an insulating layer three (33) is sleeved on the outside of the insulating connector bracket (2). Then the insulating sleeve (5) is shrunk and fixed again to the insulating layer one and the insulating layer two, thereby limiting the position and distance of the temperature sensing component (1) in the insulating connector bracket (2). After the assembled insulating connector bracket (2) is injected with insulating glue and cured and sealed, it is pushed into the inside of the metal shell (4). The insulating connector bracket (2) is sealed by the curing of the insulating glue in the metal shell (4).

7. The insulating encapsulation structure and splicing encapsulation method for a probe temperature sensor according to claim 6, characterized in that: In S3, after the insulating layer three (33) is sleeved on the insulating splice bracket (2), a shrinkable insulating sleeve (5) needs to be sleeved on the surface of the insulating layer three (33) at the bottom end of the insulating splice bracket (2) to limit the insulating layer one (31), insulating layer two (32) and insulating layer three (33). The shrinkable insulating sleeve (5) and the closing part (34) are concentrically arranged.

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