Semiconductor packaging test platform suitable for various specifications

Abstract

The utility model relates to the field of semiconductor packaging, and discloses a semiconductor packaging test platform suitable for various specifications, which comprises a bottom plate, the upper end face of the bottom plate is fixedly connected with a placement structure, the upper end face of the placement structure is provided with an adjusting structure, and an inner cavity of an installation structure is slidably connected with a buffer structure. Transmission structures are fixedly connected to the left side and the right side between the two buffering structures correspondingly, clamping structures are arranged at the ends, away from the buffering structures, of the transmission structures, and the buffering structures and the transmission structures are installed and placed through an installation frame in the using process through installation structures on the placing structure, so that sliding blocks slide mutually; therefore, the semiconductors between the clamping structures are replaced, workers can place and fix the semiconductors of different specifications and sizes conveniently in the use process, the purpose that overrun acting force is transmitted and stored when the semiconductors are clamped through the buffer structures and the transmission structures is achieved, and the situation that the semiconductors are damaged due to the fact that extrusion force is too large during mechanical fixing is avoided. And the semiconductor is damaged.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of semiconductor packaging, concretely to a semiconductor packaging test platform suitable for various specifications. BACKGROUND

[0002] Semiconductor refers to the conductivity between conductor and insulator at room temperature, and semiconductor is applied in the fields of integrated circuit, consumer electronics, communication system, photovoltaic power generation, illumination, high-power power conversion, etc.

[0003] Through the retrieval, the utility model discloses a kind of semiconductor packaging test platform suitable for adaptation of various specifications, including horizontal groove plate and detection table, the right side of detection table is fixedly connected with the left side of horizontal groove plate, the left side of horizontal groove plate top is equipped with positioning groove, the inner wall of horizontal groove plate is fixedly connected with the replacement component for semiconductor packaging, the surface of replacement component is fixedly connected with positioning assembly, positioning assembly includes guide rod fixedly connected with the inner wall side of replacement component, the utility model relates to semiconductor packaging technical field.The semiconductor packaging test platform suitable for adaptation of various specifications, by the setting of positioning assembly, device can be loaded semiconductor by adaptation frame, adaptation frame can be freely detached from tray, so test platform can adapt various different specifications semiconductor, and adopt carousel detection, multiple trays and adaptation frames can be prepared at a time, avoid a lot of time consumption in semiconductor equipment is taken and placed.

[0004] The existing device has the following problems when in use: when clamping and fixing the semiconductor, the motor is usually used to automatically adjust to improve work efficiency, at this time, due to the delay of personnel operation, the extrusion force is too large when the mechanical fixing is performed, which causes damage to the semiconductor, and the existing device has a simple structure, when detecting the reverse side of the semiconductor, personnel need to manually disassemble, reverse and reposition, thereby affecting the work efficiency of personnel. UTILITY MODEL CONTENTS

[0005] The utility model aims at providing a semiconductor packaging test platform suitable for various specifications, to solve the problem of inconvenient adjustment of safety protection range according to different use scenarios and use requirements in the above background technology.

[0006] To achieve the above object, the utility model provides the following technical scheme: A kind of semiconductor package test platform suitable for multiple specifications, including bottom plate, the upper end surface of the bottom plate is fixedly connected with placing structure, placing structure upper end surface is provided with adjusting structure, placing structure upper end surface inner chamber is provided with mounting structure, mounting structure inner chamber is slidably connected with buffer structure, two the buffer structure between left and right sides is fixedly connected with transmission structure respectively, transmission structure is provided with clamping structure away from buffer structure one end;The placing structure includes the placing block fixedly connected on the upper end surface of bottom plate, the upper end surface of placing block is symmetrically provided with sliding slot along center line, the right side of the upper end surface of bottom plate is fixedly connected with drive motor, adjusting structure is provided in the inner chamber of sliding slot.

[0007] Preferably, the adjusting structure includes a pulley rotatably connected to the left end surface of the placing block along the center line, two pulleys are drivingly connected by a belt, a rotating rod is rotatably connected in the inner chamber of the sliding slot, two rotating rods are fixedly connected with the pulleys by penetrating the placing block at the left end surface, the right end surface of the rotating rod is fixedly connected with the output end of the drive motor by penetrating the placing block at the front, two sliding slots are symmetrically provided with two threads with opposite directions on the outer surface.

[0008] Preferably, the mounting structure includes a sliding block symmetrically slidably connected in the inner chamber of the sliding slot, the rotating rod penetrates the sliding block and is threadedly connected, a placing plate is fixedly connected to the upper end surface of the rotating rod, mounting racks are fixedly connected to the left and right sides between the two placing plates, and buffer structures are fixedly connected in the inner chambers of the mounting racks.

[0009] Preferably, the buffer structure includes a sliding rod fixedly connected to the inner chamber of the mounting rack along the center line, the sliding rod is symmetrically slidably connected with mounting sliding blocks on the outer surface, buffer springs are drivingly connected between the two mounting sliding blocks, the buffer springs are movably sleeved on the outer surface of the sliding rod at the middle part, and transmission structures are fixedly connected to one end of the mounting sliding blocks away from the placing plates.

[0010] Preferably, the transmission structure includes a rotating frame fixedly connected to one end of the mounting sliding blocks away from the placing plates, one end of a transmission rod is rotatably connected in the inner chamber of the rotating frame, a connecting structure is rotatably connected between the two transmission rods away from the rotating frame, clamping structures are provided on the middle part of the left and right end surfaces between the two connecting structures, the connecting structure includes a connecting frame rotatably connected between the two transmission rods away from the rotating frame, and a connecting plate is fixedly connected to one end of the connecting frame away from the transmission rod.

[0011] Preferably, the clamping structure includes a rotating shaft rotatably connected between the two connecting plates, extrusion discs are fixedly connected to the left and right end surfaces between the two connecting plates, limiting structures are fixedly connected to the left and right end surfaces between the two connecting plates as the center line of the rotating shaft, and a limiting groove is symmetrically provided on the outer surface of the rotating shaft along the center line.

[0012] Preferably, the limiting structure comprises a limiting frame fixed and connected symmetrically between the left and right side end faces of the two connecting plates with the rotating shaft as the center line, a spring is fixedly connected in the inner cavity of the limiting frame, one end of the spring away from the limiting frame is fixedly connected with a limiting sliding block, the limiting sliding block is slidingly connected in the inner cavity of the limiting frame, and the end of the limiting sliding block away from the spring is matched with the limiting groove on the outer surface of the rotating shaft.

[0013] Compared with the prior art, the utility model has the advantages that:

[0014] 1、 the utility model discloses a placing structure on the bottom plate upper end face installs and places the mounting structure in use, and then the rotating direction of the adjusting structure is adjusted through the driving motor, the adjusting structure on the bottom plate upper end face is used in use, and the two sides rotating rods are simultaneously and synchronously rotated through the belt pulley and the belt, and then the spacing between the mounting structures is adjusted through the rotating rod, the mounting structure on the placing structure is used in use, and the buffer structure and the transmission structure are installed and placed through the mounting frame, and then the mutual sliding between the sliding blocks replaces the semiconductor between the clamping structures, so that personnel can conveniently place and fix different specifications and sizes of semiconductors in use, and then the buffer structure and the transmission structure are used to store the over-limit force when clamping the semiconductor, so that the semiconductor is prevented from being damaged due to excessive extrusion force during mechanical fixing.

[0015] 2、 the utility model discloses a buffer structure on the mounting structure, which is used in use to install and place the transmission structure through the mounting sliding block, and then the over-limit (exceeding the limit of the semiconductor) force during clamping and fixing is stored through the buffer spring on the outer surface of the sliding rod, the transmission structure on the buffer structure is used in use to install and place the clamping structure through the connecting structure, and then the over-limit force is transmitted through the transmission rod, the clamping structure on the transmission structure is used in use to clamp and fix the semiconductor through the extrusion disc, and then the semiconductor is conveniently rotated through the rotating shaft, the limiting structure on the clamping structure is used in use to ensure that the clamping mechanism is in a horizontal state after each time of turning over, so that the test quality is improved. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 It is a front view of the utility model;

[0017] Figure 2 It is a rear view of the utility model;

[0018] Figure 3 It is a mounting structure diagram of the utility model mounting structure;

[0019] Figure 4 It is a transmission structure diagram of the utility model mounting structure;

[0020] Figure 5 The mounting structure diagram of the clamping structure is shown.

[0021] In the figure: 1 - bottom plate, 2 - placement structure, 21 - placement block, 22 - sliding groove, 23 - drive motor, 3 - adjustment structure, 31 - pulley, 32 - belt, 33 - rotating rod, 4 - mounting structure, 41 - sliding block, 42 - placement plate, 43 - mounting frame, 5 - buffer structure, 51 - sliding rod, 52 - mounting sliding block, 6 - transmission structure, 61 - rotating frame, 62 - transmission rod, 63 - connecting structure, 631 - connecting frame, 632 - connecting plate, 7 - clamping structure, 71 - rotating shaft, 72 - extrusion disc, 73 - limiting structure, 731 - limiting frame, 732 - spring, 733 - limiting sliding block. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.

[0023] Please refer to Figures 1-5 The utility model provides a kind of semiconductor package test platform technical scheme suitable for multiple specifications: a kind of semiconductor package test platform suitable for multiple specifications, including bottom plate 1, the bottom plate 1 upper end face is fixedly connected with placement structure 2, placement structure 2 upper end face is provided with adjustment structure 3, placement structure 2 upper end face inner chamber is provided with mounting structure 4, mounting structure 4 inner chamber is slidably connected with buffer structure 5, two described buffer structure 5 between left and right sides are respectively fixedly connected with transmission structure 6, transmission structure 6 is provided with clamping structure 7 away from buffer structure 5 one end.

[0024] Further, the placement structure 2 includes placement block 21 fixedly connected on the upper end face of the bottom plate 1, the sliding groove 22 is symmetrically opened on the upper end face of the placement block 21 along the center line, the drive motor 23 is fixedly connected on the right side of the upper end face of the bottom plate 1, the adjustment structure 3 is provided in the inner cavity of the sliding groove 22, the mounting structure 4 is placed by the placement structure 2 on the upper end face of the bottom plate 1 in use, and then the rotating direction of the adjustment structure 3 is adjusted by the drive motor 23, so that the semiconductor of different specifications and sizes is conveniently placed and fixed in use.

[0025] Further, the adjusting structure 3 includes a pulley 31 symmetrically connected to the left end face of the placement block 21 along the center line, two pulleys 31 are drivingly connected with a belt 32, a rotating rod 33 is rotatably connected in the inner cavity of the sliding groove 22, the left end face rotating shafts of the two rotating rods 33 penetrate the placement block 21 and are fixedly connected with the two pulleys 31, respectively, the right end face rotating shaft of the front rotating rod 33 penetrates the placement block 21 and is fixedly connected with the output end of the driving motor 23, two threads in opposite directions are symmetrically formed on the outer surface of the sliding groove 22, through the adjusting structure 3 on the upper end face of the bottom plate 1, in use, the two rotating rods 33 are simultaneously and synchronously rotated by the pulley 31 and the belt 32, and then the distance between the mounting structures 4 is adjusted by the rotating rod 33.

[0026] Further, the mounting structure 4 includes a sliding block 41 symmetrically and slidingly connected in the inner cavity of the sliding groove 22, the rotating rod 33 penetrates the sliding block 41 and is threadedly connected, the upper end face of the rotating rod 33 is fixedly connected with a placement plate 42, the mounting frame 43 is fixedly connected between the two placement plates 42, the buffer structure 5 is fixedly connected in the inner cavity of the mounting frame 43, through the mounting structure 4 on the placement structure 2, in use, the buffer structure 5 and the transmission structure 6 are mounted and placed by the mounting frame 43, and then the mutual sliding between the sliding blocks 41 changes the semiconductor between the clamping structures 7.

[0027] Further, the buffer structure 5 includes a sliding rod 51 fixedly connected in the inner cavity of the mounting frame 43 along the center line, the sliding rod 51 is symmetrically and slidingly connected to the mounting sliding block 52 on the outer surface, the buffer spring is drivingly connected between the two mounting sliding blocks 52, the buffer spring is movably sleeved on the outer surface of the middle part of the sliding rod 51, the transmission structure 6 is fixedly connected to one end of the mounting sliding block 52 away from the placement plate 42, through the buffer structure 5 on the mounting structure 4, in use, the transmission structure 6 is mounted and placed by the mounting sliding block 52, and then the force exceeding the limit of the semiconductor when clamped and fixed is stored by the buffer spring on the outer surface of the sliding rod 51.

[0028] Further, the transmission structure 6 comprises a rotating frame 61 fixedly connected to the installation sliding block 52 away from the placing plate 42, one end of a transmission rod 62 is rotatably connected in the inner cavity of the rotating frame 61, the two transmission rods 62 are rotatably connected at one end away from the rotating frame 61, and the connecting structure 63 is rotatably connected between the two connecting structures 63, the clamping structure 7 is arranged on the middle part of the left and right side end faces of the two connecting structures 63, the connecting structure 63 comprises a connecting frame 631 rotatably connected between the two transmission rods 62 away from the rotating frame 61, and the connecting plate 632 is fixedly connected to one end of the connecting frame 631 away from the transmission rod 62, through the transmission structure 6 on the buffer structure 5, the clamping structure 7 is installed and placed through the connecting structure 63 in use, and then the transmission rod 62 is used for transmitting the over-limit force, and then the buffer structure 5 and the transmission structure 6 are used for transmitting and storing the over-limit force when the semiconductor is clamped, so that the semiconductor is prevented from being damaged due to excessive extrusion force during mechanical fixation.

[0029] Further, the clamping structure 7 comprises a rotating shaft 71 rotatably connected between the two connecting plates 632, the extrusion disc 72 is fixedly connected to the left and right side end faces between the two connecting plates 632, the limiting structure 73 is fixedly connected to the left and right side end faces between the two connecting plates 632 as the center line of the rotating shaft 71, the limiting groove is symmetrically formed on the outer surface of the rotating shaft 71 along the center line, through the clamping structure 7 on the transmission structure 6, the semiconductor is clamped and fixed through the extrusion disc 72 in use, and then the rotating shaft 71 is convenient for personnel to rotate the semiconductor.

[0030] Further, the limiting structure 73 comprises a limiting frame 731 fixedly connected to the left and right side end faces between the two connecting plates 632 as the center line of the rotating shaft 71, the spring 732 is fixedly connected in the inner cavity of the limiting frame 731, the limiting sliding block 733 is fixedly connected to one end of the spring 732 away from the limiting frame 731, the limiting sliding block 733 is slidably connected in the inner cavity of the limiting frame 731, and the limiting sliding block 733 is matched with the limiting groove on the outer surface of the rotating shaft 71 away from the spring 732, through the limiting structure 73 on the clamping structure 7, the horizontal state is ensured after each clamping mechanism is turned over in use, so that the test quality is improved.

[0031] Working principle: when working, the semiconductor is placed above the placing block 21, at this time, the driving motor 23 is started, so that the output end of the driving motor 23 rotates, so that the front rotating rod 33 rotates, and then the front pulley 31 rotates, so that the belt 32 rotates, and then the rear pulley 31 rotates, so that the two rotating rods 33 rotate at the same time, so that the two placing plates 42 on the two sides are close to each other, so that the two extrusion plates 72 on the two sides are close to each other, when the interaction force between the semiconductor and the extrusion plate 72 is too large, the pressure is transmitted to the transmission rod 62 through the connecting structure 63, at this time, the transmission rod 62 rotates towards each other, so that the installation sliding block 52 slides relatively, so that the buffer spring between the two installation sliding blocks 52 is elongated, so as to store the excess interaction force between the conductor and the extrusion plate 72,

[0032] When the semiconductor needs to be reversed, one side of the semiconductor is pressed down, so that the limiting sliding block 733 slides relatively, at this time, the spring 732 is contracted, at this time, the semiconductor rotates 180 O At this time, the spring 732 is elongated, so that the limiting sliding block 733 is close to each other, so that the spring 732 and the outer surface limiting groove of the rotating shaft 71 are engaged with each other, so as to limit and fix the rotating shaft 71 after rotation.

[0033] Finally, it should be noted that the above content is only used to illustrate the technical scheme of the present application, and is not a limitation on the protection scope of the present application. Simple modifications or equivalent replacements of the technical scheme of the present application by ordinary skilled in the art do not deviate from the essence and scope of the technical scheme of the present application.

Claims

1. A semiconductor package test platform suitable for multiple specifications, comprising a base plate (1), characterized in that: The bottom plate (1) upper end face is fixedly connected with a placing structure (2), the placing structure (2) upper end face is provided with adjusting structure (3), the placing structure (2) upper end face inner cavity is provided with mounting structure (4), mounting structure (4) inner cavity is slidably connected with buffer structure (5), the left and right sides between two buffer structure (5) are fixedly connected with transmission structure (6), transmission structure (6) is away from the one end of buffer structure (5) and is provided with clamping structure (7);The placing structure (2) includes the placing block (21) fixedly connected on the upper end face of the bottom plate (1), the upper end face of the placing block (21) is symmetrically provided with a sliding slot (22) along the center line, the bottom plate (1) upper end face right side front is fixedly connected with drive motor (23), the sliding slot (22) inner cavity is provided with adjusting structure (3).

2. The semiconductor package test platform suitable for multiple specifications according to claim 1, wherein: The adjusting structure (3) includes the belt pulley (31) rotationally connected on the left end face of the placing block (21) along the center line, the surfaces of two belt pulleys (31) are transmissionally connected with a belt (32), the sliding slot (22) inner cavity is rotationally connected with a rotating rod (33), the left end faces of two rotating rods (33) are rotationally connected with two belt pulleys (31) through the rotating shafts penetrating the placing block (21), the right end face of the front rotating rod (33) is fixedly connected with the output end of the drive motor (23) through the rotating shaft penetrating the placing block (21), and two sliding slots (22) are symmetrically provided with two threads with opposite directions on the outer surfaces.

3. The semiconductor package test platform suitable for multiple specifications of claim 1, wherein: The mounting structure (4) includes the sliding block (41) symmetrically slidably connected in the sliding slot (22) inner cavity, the rotating rod (33) penetrates the sliding block (41) and is threadedly connected, the upper end face of the rotating rod (33) is fixedly connected with a placing plate (42), the left and right sides between two placing plates (42) are fixedly connected with a mounting bracket (43), and the mounting bracket (43) inner cavity is fixedly connected with a buffer structure (5).

4. The test platform for semiconductor packages of multiple sizes as recited in claim 1, wherein: The buffer structure (5) includes the sliding rod (51) fixedly connected in the mounting bracket (43) inner cavity along the center line, the sliding rod (51) outer surface is symmetrically slidably connected with a mounting sliding block (52), two mounting sliding blocks (52) are transmissionally connected with a buffer spring, the buffer spring is movably sleeved on the outer surface middle part of the sliding rod (51), and the one end of the mounting sliding block (52) away from the placing plate (42) is fixedly connected with a transmission structure (6).

5. The test platform for semiconductor packages of multiple sizes as recited in claim 1, wherein: The transmission structure (6) includes the rotating frame (61) fixedly connected on the one end of the mounting sliding block (52) away from the placing plate (42), the one end of the transmission rod (62) is rotationally connected in the rotating frame (61) inner cavity, two transmission rods (62) are rotationally connected with a connecting structure (63) on the one end away from the rotating frame (61), the left and right side end surfaces middle parts between two connecting structures (63) are provided with clamping structures (7), and the connecting structure (63) includes the connecting frame (631) rotationally connected between two transmission rods (62) on the one end away from the rotating frame (61), and the one end of the connecting frame (631) away from the transmission rod (62) is fixedly connected with a connecting plate (632).

6. The test platform for semiconductor packages of multiple sizes as recited in claim 1, wherein: The clamping structure (7) comprises rotating shafts (71) which are rotatably connected between two connecting plates (632), both sides of the rotating shafts (71) are fixedly connected with extrusion discs (72), both sides of the connecting plates (632) are fixedly connected with limiting structures (73) which are symmetrically arranged with the rotating shafts (71) as the center line, and the outer surface of the rotating shafts (71) is symmetrically provided with limiting grooves along the center line.

7. The semiconductor package test platform suitable for multiple specifications of claim 6, wherein: The limiting structure (73) comprises limiting frames (731) which are symmetrically fixedly connected between both sides of the connecting plates (632) with the rotating shafts (71) as the center line, the limiting frames (731) are fixedly connected with springs (732) in the inner cavities, one end of the springs (732) away from the limiting frames (731) is fixedly connected with limiting sliding blocks (733), the limiting sliding blocks (733) are slidingly connected in the inner cavities of the limiting frames (731), and one end of the limiting sliding blocks (733) away from the springs (732) is matched with the limiting grooves on the outer surface of the rotating shafts (71).

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