General test system for discrete semiconductor device
By designing a general-purpose testing system for discrete semiconductor devices, the problems of long testing time and high cost in existing technologies have been solved. This system enables efficient and automated testing of semiconductor devices with various packaging forms, reducing costs and improving production efficiency.
Patent Information
- Application Number
- CN202520260758.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-19
- Publication Date
- 2025-11-21
- Estimated Expiration
- 2035-02-19
AI Technical Summary
In the existing technology, each type of semiconductor discrete device requires the design of its own test system, which results in long testing time, low efficiency and high cost.
Design a general-purpose test system for semiconductor discrete devices, including a general-purpose test board for semiconductor discrete devices, a test bench, a PC and a power supply. Through standardized design, it realizes automatic testing of semiconductor devices with various package forms. The test socket is selected by switches and short circuits, and automatic testing is carried out in combination with PC software control.
It enables efficient testing of semiconductor devices in various packaging forms, reduces costs, improves production efficiency and market competitiveness, and simplifies operating procedures.
Smart Images
Figure CN223582078U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The embodiment of the present disclosure relates to the technical field of component testing, in particular to a general testing system for semiconductor discrete components. BACKGROUND
[0002] In the field of electronic communication, semiconductor discrete components are widely used. However, since semiconductor discrete components include diodes, triodes, field effect tubes and other types, and various components have different packaging forms, a large amount of time and cost is generated in the design of semiconductor discrete component testing fixtures.
[0003] The present application realizes "one board multiple tests" through the general testing fixture for semiconductor discrete components, which can complete the testing of various types of semiconductor components and various packaging through a general board, avoids the time and cost generated by designing multiple fixtures, and improves work efficiency. CONTENT OF THE INVENTION
[0004] In order to avoid the shortcomings of the prior art, the present application provides a general testing system for semiconductor discrete components to solve the technical problems of long testing time, low testing efficiency and high cost caused by the need to design a testing system for each different type of semiconductor discrete component in the prior art.
[0005] According to the embodiment of the present disclosure, a general testing system for semiconductor discrete components is provided, which comprises a general testing board for semiconductor discrete components, a testing table, a PC and a power supply; the general testing board for semiconductor discrete components is electrically connected with the testing table; the testing table is electrically connected with the PC and the power supply respectively; and the PC is electrically connected with the power supply.
[0006] Optionally, the general testing board for semiconductor discrete components comprises a plurality of test seats of different models, a plurality of switches, a plurality of short-circuit lines, an interface 4, an interface 5 and an interface 6; each model of test seat is electrically connected with its corresponding switch, each switch is electrically connected with its corresponding short-circuit line, and the switch corresponding to each model of test seat is electrically connected with at least one of the interface 4, the interface 5 and the interface 6 of the general testing board for semiconductor discrete components, and at least one of the interfaces of the general testing board for semiconductor discrete components is electrically connected with the testing table.
[0007] Optionally, the model of the test seat comprises at least one of the following: test seat DO-214, test seat TO220 and test seat SOT23.
[0008] Optionally, the test platform comprises an interface 1, an interface 2, an interface 3, the interface 1 of the test platform is electrically connected with the semiconductor discrete device universal test board 4, the interface 2 of the test platform is electrically connected with the semiconductor discrete device universal test board 5, and the interface 3 of the test platform is electrically connected with the semiconductor discrete device universal test board 6.
[0009] Optionally, the semiconductor discrete device universal test board has a size of 20mm*10mm*1.6mm.
[0010] Optionally, the power supply has a voltage range of -2000V~+2000V and a current range of -200A~+200A.
[0011] The technical scheme provided by the embodiments of the present disclosure can have the following beneficial effects:
[0012] (1) Wide application range: the semiconductor discrete device universal test system is suitable for testing various types of semiconductor devices with various packaging, improving production efficiency and economic benefits;
[0013] (2) Low cost: due to the standardized design, the manufacturing cost of the semiconductor discrete device universal test system is relatively low, reducing the cost and increasing the market competitiveness;
[0014] (3) Simple operation: the design of the semiconductor discrete device universal test system makes the operation simple, saving time and labor cost and improving the test efficiency. BRIEF DESCRIPTION OF DRAWINGS
[0015] The drawings incorporated herein and constituting a part of the specification illustrate embodiments consistent with the present disclosure and, together with the specification, serve to explain the principles of the present disclosure. Obviously, the drawings in the following description are only some embodiments of the present disclosure, and other drawings can be obtained by those skilled in the art without creative labor on the basis of these drawings.
[0016] Figure 1 A schematic diagram of a semiconductor discrete device universal test system in an exemplary embodiment of the present disclosure is shown. DETAILED DESCRIPTION
[0017] Example implementations will now be described more fully with reference to the accompanying drawings. Example implementations, however, can be implemented in many different forms and should not be construed as limited to the examples set forth herein; rather, these implementations are provided so that this disclosure will be thorough and complete, and will fully convey the gist of the example implementations to those skilled in the art. The described features, structures, or characteristics can be combined in one or more implementations.
[0018] In addition, the accompanying drawings are only schematic and are non-limiting, each identical, or similar components that are illustrated in the figures are thus meant to be identical or similar unless otherwise specified, and the like are meant to be identical or similar unless otherwise specified, and the like are meant to be identical or similar unless otherwise specified. Some embodiments are shown exaggerated in the drawings for clarity.
[0019] In the present example embodiment, a semiconductor discrete device universal test system is provided first. Referring to Figure 1 the semiconductor discrete device universal test system can include a semiconductor discrete device universal test board, a test bench, a PC and a power supply, the semiconductor discrete device universal test board is electrically connected with the test bench, the test bench is electrically connected with the PC and the power supply respectively, and the PC is electrically connected with the power supply.
[0020] Specifically, a schematic diagram of a semiconductor discrete device universal test system is shown in Figure 1 the semiconductor discrete device universal test system includes a semiconductor discrete device universal test board, a test bench, a PC and a power supply. Since the semiconductor discrete device universal test board is connected with the automatic test equipment (test bench) in a plug-in manner, in order to prevent the semiconductor discrete device universal test board from being repeatedly plugged in for a long time and causing damage to the plug-in contact surface, the material of the semiconductor discrete device universal test board is selected as hard gold. In the semiconductor discrete device universal test board, the selection of devices in each test seat is completed through switches, and the switches are realized through their corresponding short-circuit lines.
[0021] In the following, the Figure 1 each part of the semiconductor discrete device universal test system in the present example embodiment will be described in more detail.
[0022] In one embodiment, the semiconductor discrete device universal test board includes a plurality of test seats of different models, a plurality of switches, a plurality of short-circuit lines, an interface 4, an interface 5 and an interface 6, each model test seat is electrically connected with its corresponding switch, each switch is electrically connected with its corresponding short-circuit line, the switch corresponding to each model test seat is electrically connected with at least one of the interface 4, the interface 5 and the interface 6 of the semiconductor discrete device universal test board, and at least one interface of the semiconductor discrete device universal test board is electrically connected with the test bench.
[0023] Specifically, the semiconductor discrete device universal test board includes a plurality of test seats of different models, each model test seat is electrically connected with its corresponding switch, the switch of each model test seat is electrically connected with its corresponding short-circuit line, the switch of each model test seat is electrically connected with its corresponding interface, and the interface corresponding to the switch of each model test seat is electrically connected with the interface of the test bench corresponding thereto.
[0024] In one embodiment, the test socket model includes at least one of the following: test socket DO-214, test socket TO220, and test socket SOT23.
[0025] Specifically, select an appropriate aging test socket based on the type and packaging of commonly used discrete semiconductor devices. For example, diodes are packaged in DO-214, transistors in TO220, and field-effect transistors in SOT23.
[0026] In one embodiment, the test bench includes interface 1, interface 2, and interface 3. Interface 1 of the test bench is electrically connected to a general-purpose semiconductor discrete device test board 4, interface 2 of the test bench is electrically connected to a general-purpose semiconductor discrete device test board 5, and interface 3 of the test bench is electrically connected to a general-purpose semiconductor discrete device test board 6.
[0027] Specifically, the general-purpose semiconductor discrete device test board 4 is electrically connected to interface 1 of the test bench, the general-purpose semiconductor discrete device test board 5 is electrically connected to interface 2 of the test bench, and the general-purpose semiconductor discrete device test board 6 is electrically connected to interface 3 of the test bench.
[0028] For example, taking a TO220 packaged transistor as an example, such as Figure 1 As shown, based on the device's package type, namely TO220 package, the device is placed in the corresponding TO220 package test socket. Switches S1, S2, and S3 are closed via short circuits, while all other switches are open. At this time, interfaces 4, 5, and 6 on the general-purpose semiconductor discrete device test board are only connected to the TO220 package test socket, meaning the three interfaces are only connected to the transistor under test and are disconnected from other test sockets. The general-purpose semiconductor discrete device test board is then inserted into interfaces 1, 2, and 3 of the test bench via interfaces 4, 5, and 6, connecting the device under test to the automatic test equipment. The definitions of interfaces 1, 2, and 3 are controlled and set via PC software, including the selection of PNP and NPN types. For testing other types of semiconductor discrete devices, simply place the device in the corresponding package test socket, close and open the corresponding switches via short circuits, and set the parameters via PC to complete the automatic testing of the device.
[0029] In one embodiment, the dimensions of the general-purpose test board for semiconductor discrete devices are 20mm × 10mm × 1.6mm.
[0030] In one embodiment, the voltage range of the power supply is -2000V to +2000V, and the current range of the power supply is -200A to +200A.
[0031] In the embodiment, when the semiconductor discrete device general test system tests any type of semiconductor discrete device, only the semiconductor discrete device to be tested is placed in the corresponding test seat, the short circuit line corresponding to the semiconductor discrete device to be tested is closed and the switches corresponding to other test seats are opened, and the PC sets the test type of the semiconductor discrete device to be tested, so that the automatic test of any type of semiconductor discrete device can be completed.
[0032] It should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like in the above description indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the embodiments of the present disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the embodiments of the present disclosure.
[0033] In the embodiments of the present disclosure, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connecting", "fixing" and the like should be understood in a broad sense, for example, can be fixed connection, can also be detachable connection, or integral; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium; can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meanings of the above terms in the present disclosure can be understood according to the specific circumstances.
[0034] In the description of the present specification, the description referring to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present disclosure. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in the present specification.
[0035] Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the features disclosed herein. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.
Claims
1. A universal test system for semiconductor discrete devices, characterized by, The system comprises a shell, a semiconductor discrete device universal test board, a test table, a PC and a power supply; The semiconductor discrete device universal test board is electrically connected with the test table; The test table is electrically connected with the PC and the power supply respectively; The PC is electrically connected with the power supply.
2. The universal testing system for semiconductor discrete devices according to claim 1, wherein The semiconductor discrete device universal test board comprises a plurality of test seats of different models, a plurality of switches, a plurality of short-circuit lines, an interface 4, an interface 5 and an interface 6, each model test seat is electrically connected with its corresponding switch, each switch is electrically connected with its corresponding short-circuit line, the switch corresponding to each model test seat is electrically connected with at least one interface of the semiconductor discrete device universal test board, and the at least one interface of the semiconductor discrete device universal test board is electrically connected with the test table.
3. The universal testing system for semiconductor discrete devices according to claim 2, wherein The model of the test seat comprises at least one of a test seat DO-214, a test seat TO220 and a test seat SOT23.
4. The universal testing system for semiconductor discrete devices according to claim 3, wherein The test table comprises an interface 1, an interface 2 and an interface 3, the interface 1 of the test table is electrically connected with the semiconductor discrete device universal test board 4, the interface 2 of the test table is electrically connected with the semiconductor discrete device universal test board 5, and the interface 3 of the test table is electrically connected with the semiconductor discrete device universal test board 6.
5. The universal testing system for semiconductor discrete devices according to claim 4, wherein The size of the semiconductor discrete device universal test board is 20mm×10mm×1.6mm.
6. The universal testing system for semiconductor discrete devices according to claim 1, wherein The voltage range of the power supply is -2000V~+2000V, and the current range of the power supply is -200A~+200A.