Liquid cooling server integrated with booster pump

Abstract

The utility model provides a liquid cooling server integrated with a booster pump. The liquid cooling server comprises a server case; a cooling liquid inlet pipe; a coolant outlet pipe; a communicating pipeline; the power supply module is a power supply assembly with a first cooling loop; the server main body module comprises a server main body assembly with a second cooling loop and a temperature detection assembly; the cooling liquid inlet pipe, the cooling liquid outlet pipe and the communicating pipeline penetrate through the side face of the server case. The power supply module and the server main body module are arranged in the server case; the cooling liquid inlet pipe is communicated with the power supply module, the communicating pipeline, the server main body module and the cooling liquid outlet pipe to form a cooling loop; a booster pump is connected in series in the cooling loop, and the booster pump is started when the server main body module is at high temperature. According to the utility model, the booster pump is connected in series in the cooling loop of the liquid cooling server, so that the flow of the liquid cooling server can be independently increased, and the problem that the heating power of the independent liquid cooling server exceeds the constant heat dissipation capability is effectively solved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a server technical field more specifically, it relates to a kind of liquid cooling server of integrated booster pump. BACKGROUND

[0002] "Artificial intelligence field AIGC" "ChatGPT" "data special zone" "eastern data western algorithm" "data center", it can be said that the hottest concept in recent years, under the power of calculation, it will bring data center single machine power density and energy consumption rise, traditional air cooling has not been able to meet the growing heat dissipation demand, and the importance of liquid cooling technology is further highlighted.

[0003] The application of liquid cooling technology in server becomes one of the preferred methods. Liquid cooling server, as the name implies, means that liquid is injected into the server as coolant, and the heat generated during server operation is removed by liquid flow, so as to achieve the purpose of cooling. Compared with traditional air-cooled servers, liquid-cooled servers have higher heat dissipation efficiency, lower power consumption and smaller noise pollution.

[0004] In the prior art, multiple liquid cooling server units are configured in a server rack. In order to meet the cooling demand of a single liquid cooling server, the inlet and outlet cooling liquid pipes are directly connected to the liquid distributor, and the cooling liquid is distributed to each liquid cooling server unit. Since the pipe flow is constant, it cannot increase the flow of a certain liquid cooling server, so when the liquid cooling server CPU overclocking power suddenly exceeds the constant cooling capacity of the liquid cooling server, the problem of high temperature drop or burning of the server CPU chip will occur. On the other hand, in the prior art, the cooling liquid is pumped to each liquid cooling server by a circulating pump. When the main pipe circulating pump fails, the liquid cooling server cannot be provided with cooling liquid, and the liquid cooling server will inevitably have the problem of drop or burning of the server CPU chip. Utility model content

[0005] The purpose of the present application is a liquid cooling server integrated with a booster pump. The liquid cooling server can effectively solve the problem of power exceeding constant cooling capacity caused by individual overclocking of the liquid cooling server. When extreme conditions occur, such as failure of the main pipe circulating pump and sudden interruption of the liquid cooling server cooling liquid flow, the liquid cooling server controller detects the rapid temperature rise of the CPU chip, and the booster pump is started to maintain the minimum basic flow required by the liquid cooling server, ensuring that the server does not drop, and at the same time, the standby circulating pump system can be started to gain buffer time.

[0006] The technical solution adopted by the present application is as follows:

[0007] A liquid cooling server integrated with a booster pump, comprising:

[0008] Server case;

[0009] Cooling liquid inlet pipe;

[0010] cooling liquid outlet pipe;

[0011] communication pipeline;

[0012] a power module, which is a power assembly with a first cooling loop;

[0013] a server main module, which comprises a server main assembly with a second cooling loop, a temperature detection assembly;

[0014] the cooling liquid inlet pipe, the cooling liquid outlet pipe and the communication pipeline pass through the side of the server case and are arranged outside the same side of the server case;

[0015] the power module and the server main module are arranged inside the server case, the cooling liquid inlet pipe is connected with the inlet of the first cooling loop, the outlet of the first cooling loop is connected with the inlet of the second cooling loop through the communication pipeline, and the outlet of the second cooling loop is connected with the cooling liquid outlet pipe;

[0016] the cooling liquid inlet pipe is connected with the power module, the communication pipeline, the server main module and the cooling liquid outlet pipe to form a cooling loop;

[0017] a booster pump is connected in series in the cooling loop, the booster pump is started when the temperature detection assembly detects high temperature of the server main module, and the booster pump is in a shutdown state during normal operation of the server main module.

[0018] As a further improved technical solution of the present application, the booster pump is arranged between the power module and the server main module and is connected with the power module and the server main module through the communication pipeline, the booster pump is arranged outside the server case and is located on the same side of the server case as the cooling liquid inlet pipe, the cooling liquid outlet pipe and the communication pipeline.

[0019] As a further improved technical solution of the present application, the booster pump is a direct-current booster pump with a voltage of 12-36V.

[0020] As a further improved technical solution of the present application, the booster pump is a centrifugal booster pump.

[0021] As a further improved technical solution of the present application, the power module is connected with the server main module through a power supply copper bar.

[0022] As a further improved technical solution of the present application, a protective cover is arranged outside the server case, and the protective cover is located outside the cooling liquid inlet pipe, the cooling liquid outlet pipe, the communication pipeline and the booster pump.

[0023] Compared with the prior art, the application has the following beneficial effects:

[0024] The application provides a liquid-cooled server integrated with a booster pump. A direct-current booster pump is added in a cooling loop of the liquid-cooled server. When the liquid-cooled server detects high temperature of a CPU through a temperature detection assembly, the booster pump is started to increase the flow of the liquid-cooled server. The liquid-cooled server is configured with direct-current booster pumps of different voltages, and the increased flow is also different. The voltage of the booster pump can be 12-36 V, and the minimum flow can be increased by 5%. The head can reach 32 m. The problem that the power exceeds the constant heat dissipation capacity caused by the single overclocking of the liquid-cooled server can be effectively solved. When an extreme situation occurs, for example, the main pipeline circulating pump fails, the liquid-cooled server cooling liquid flow is suddenly interrupted, and the liquid-cooled server controller detects that the CPU chip rapidly heats up, the internal booster pump is started to continue to maintain the minimum basic flow required by the server. The liquid-cooled server automatically reduces the operation power to ensure that the server does not drop, and can give the standby circulating pump system a buffer time to start. During the normal operation of the server, the booster pump is in a shutdown state.

[0025] On the other hand, the booster pump is a centrifugal booster pump, which is connected in series to the cooling loop of the liquid-cooled server. When the booster pump does not work, the influence on the flow of the server cooling liquid is particularly small and can be basically ignored. The reason is that the flow resistance of the centrifugal booster pump is particularly small, and the flow resistance is equivalent to the flow resistance of a Z-shaped equal-diameter elbow. BRIEF DESCRIPTION OF DRAWINGS

[0026] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present disclosure, and therefore should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained without creative labor.

[0027] Figure 1 A perspective structural schematic diagram of a liquid-cooled server integrated with a booster pump is provided for the embodiments of the present disclosure.

[0028] Figure 2 A front view of a liquid-cooled server integrated with a booster pump is provided for the embodiments of the present disclosure.

[0029] Figure 3 An internal structural perspective schematic diagram of a liquid-cooled server integrated with a booster pump is provided for the embodiments of the present disclosure.

[0030] Figure 4 A cooling loop schematic diagram of a liquid-cooled server integrated with a booster pump is provided for the embodiments of the present disclosure.

[0031] 1, server chassis; 2, cooling liquid inlet pipe; 3, cooling liquid outlet pipe; 4, communication pipeline; 5, power module; 6, server main module; 7, booster pump; 8, power supply copper bar; 9, protective cover;

[0032] 61, server main assembly with second cooling circuit; 62, temperature detection assembly. DETAILED DESCRIPTION

[0033] The technical solutions in the embodiments of the present application will be described clearly and completely below in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0034] In the description of the present application, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected", "connected", "provided" should be understood broadly, for example, it can be fixedly connected, or detachably connected, or integrally connected; it can be mechanically connected, or electrically connected; it can be directly connected, or indirectly connected through an intermediate medium, or the internal communication of two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances. The embodiments of the present application will be described below according to the overall structure of the present application.

[0035] In addition, if the description of "first", "second" and the like is involved in the embodiments of the present application, the description of "first", "second" and the like is only for the purpose of description, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features.

[0036] In the prior art, a plurality of liquid-cooled server units are arranged in a server rack. In order to meet the cooling demand of a single liquid-cooled server, the inlet and outlet cooling liquid pipes are directly connected to a liquid distributor, and the cooling liquid is distributed to each liquid-cooled server unit. Since the flow of the pipes is constant, it is not possible to increase the flow of a certain liquid-cooled server alone. Therefore, when the CPU of the liquid-cooled server suddenly exceeds the constant cooling capacity of the liquid cooling, the problem of high temperature disconnection or burning of the server CPU chip will occur. On the other hand, in the prior art, the cooling liquid is pumped to each liquid-cooled server by a circulating pump. When the main pipe circulating pump fails, the liquid-cooled server cannot be provided with cooling liquid, and the problem of disconnection or burning of the server CPU chip will inevitably occur.

[0037] The present disclosure illustrates an integrated booster pump liquid-cooled server structure diagram, as shown in Figures 1-3As shown, the embodiment provides a liquid-cooled server integrated with a booster pump, comprising: a server case 1; a cooling liquid inlet pipe 2; a cooling liquid outlet pipe 3; a communication pipeline 4; a power module 5, which is a power component with a first cooling circuit; a server main body module 6, which comprises a server main body component 61 with a second cooling circuit and a temperature detection component 62; the cooling liquid inlet pipe 2, the cooling liquid outlet pipe 3 and the communication pipeline 4 pass through the side of the server case 1 and are arranged outside the same side of the server case 1; the power module 5 and the server main body module 6 are arranged inside the server case 1, the cooling liquid inlet pipe 2 is connected with the inlet of the first cooling circuit, the outlet of the first cooling circuit is connected with the inlet of the second cooling circuit through the communication pipeline 4, and the outlet of the second cooling circuit is connected with the cooling liquid outlet pipe 3; the cooling liquid inlet pipe 2 is connected with the power module 5, the communication pipeline 4, the server main body module 6 and the cooling liquid outlet pipe 3 to form a cooling circuit; a booster pump 7 is connected in series in the cooling circuit, and the booster pump 7 is started when the temperature detection component 62 detects high temperature of the server main body module 6, and the booster pump 7 is in a shutdown state during normal operation of the server main body module 6.

[0038] In the embodiment of the present disclosure, the flow direction of the cooling liquid in the server is as shown in Figure 4 As shown, the cooling liquid passes through the cooling liquid inlet pipe 2, the power module 5, the communication pipeline 4, the server main body module 6 and the cooling liquid outlet pipe 3 in sequence to form a cooling circuit (the cooling circuit is shown by the dashed line in Figure 4 ), so as to cool the server. In order to meet the cooling demand of the single liquid-cooled server in special cases, the booster pump 7 is connected in series in the cooling circuit. The booster pump can be connected in series at any position in the cooling circuit, and the position of the booster pump can be arranged arbitrarily according to the specific implementation of the liquid-cooled server. When the temperature detection component 62 detects high temperature of the server main body module 6, the booster pump 7 is started to increase the flow of the liquid-cooled server alone, so as to rapidly cool the server main body module 6.

[0039] In particular, when an extreme situation occurs, such as failure of the main pipeline circulating pump, sudden interruption of the cooling liquid flow of the liquid-cooled server, and rapid temperature rise of the server main body module 6 detected by the temperature detection component 62, the internal booster pump 7 is started to continue to maintain the minimum basic flow required for server cooling. The liquid-cooled server automatically reduces the operation power to ensure that the server does not drop off line, and can give the standby circulating pump system a buffer time to start.

[0040] In this embodiment, the power module 5 and the server main body module 6 can be selected according to different actual application conditions, and corresponding cooling circuits can be configured, such as using a liquid cooling plate to cool, the power module can be configured according to different power requirements, the power module and the liquid cooling plate are integrated to form a power assembly with a first cooling circuit, the server main body module 6 includes the main heat generating module of the server, and can be applicable to various different forms of CPUs, such as x86 Intel / AMD CPU, ARM CPU, OAM GPU and chips, and the like, and the above structure is installed on the liquid cooling plate to form a server main body assembly with a second cooling circuit. Since this is not the main content of the utility model, the structure of the power module 5 and the server main body module 6 will not be described here.

[0041] The booster pump 7 can be connected in series at any position in the cooling circuit, for example, the booster pump 7 can be arranged before or after the cooling liquid inlet pipe 2, or before or after the cooling liquid outlet pipe 3, and the position of the booster pump 7 can be arranged as required according to the specific implementation of the liquid cooling server. In this embodiment, considering the convenience of installation of the booster pump 7 and the compactness of the overall structure layout, as shown in FIG. 1, the booster pump 7 is arranged between the power module 5 and the server main body module 6, and is connected to the power module 5 and the server main body module 6 through the communication pipeline 4. Figures 2-3

[0042] In the embodiment of the present disclosure, the booster pump 7 is arranged between the power module 5 and the server main body module 6, and is connected to the power module 5 and the server main body module 6 through the communication pipeline 4, so that the overall structure layout is more uniform, and the communication pipeline 4 is greatly shortened, saving installation cost and being simple and fast to install.

[0043] Through the arrangement of the booster pump 7, the flow of the liquid cooling server can be increased alone, the liquid cooling server is configured with a direct current booster pump with different voltages, and the increased flow is also different. In this embodiment, the booster pump is a direct current booster pump with a voltage of 12-36V, which can increase the flow by at least 5% and the lift can reach 32 meters, which can effectively solve the problem that the power exceeds the constant heat dissipation capacity caused by the single overclocking of a liquid cooling server.

[0044] In order to ensure the stability of the cooling liquid supply in special cases, the booster pump 7 is a centrifugal booster pump, which is connected in series to the cooling circuit of the liquid cooling server. When the booster pump 7 does not work, the influence on the flow of the server cooling liquid is very small and can be ignored. The reason is that the flow resistance of the centrifugal booster pump itself is very small, and the flow resistance is equivalent to the flow resistance of a Z-shaped equal-diameter elbow.

[0045] ​The power module 5 can supply power to the server body module 6. A conventional server uses a wiring harness connection or direct board-to-board connection. In the present embodiment, because the liquid-cooled server body module has a large current and high power consumption, in the present embodiment, the power supply copper bar 8 is connected to the server body module 6.

[0046] As shown in Figures 1-3 To protect the booster pump 7 and the cooling liquid inlet pipe 2, the cooling liquid outlet pipe 3, and the communication pipeline 4, the present embodiment is provided with a protective cover 9 outside the server case 1. The protective cover 9 is located outside the cooling liquid inlet pipe 2, the cooling liquid outlet pipe 3, the communication pipeline 4, and the booster pump 7.

[0047] Although various embodiments of the present application are described with reference to the example of the liquid-cooled server with an integrated booster pump in the various drawings, it should be understood that embodiments within the scope of the present application can be applied to other experimental reagent bottles and the like with similar structures and / or functions.

[0048] The foregoing description has given many features and advantages of the present application, including various alternative embodiments, as well as structural and functional details of the devices and methods. It is intended that the description be exemplary, and not exhaustive or limiting.

[0049] It will be apparent to those skilled in the art that various modifications can be made to the embodiments expressed by the terms of the appended claims, particularly in regard to the structural and functional details thereof, including the combination of elements, the arrangement of parts, the structural and functional details of the devices and methods, and the assembly of the devices and methods, within the scope of the appended claims. It is intended that all such modifications come within the spirit and scope of the claims.

Claims

1. An integrated liquid-cooled server with a boost pump, comprising: The utility model relates to a kind of server cooling system, including: Server chassis (1); Cooling liquid inlet pipe (2); Cooling liquid outlet pipe (3); Communication pipeline (4); Power module (5), the power module is power component with first cooling circuit; Server main module (6), the server main module (6) includes server main component (61) with second cooling circuit, temperature detection component (62); The cooling liquid inlet pipe (2), cooling liquid outlet pipe (3), communication pipeline (4) are through the side of server chassis (1), and are arranged on the outside of the same side of the server chassis (1); The power module (5) and server main module (6) are arranged in the inside of server chassis (1), the cooling liquid inlet pipe (2) is connected with the import of first cooling circuit, the outlet of first cooling circuit is connected with the import of second cooling circuit by communication pipeline (4), and the outlet of second cooling circuit is connected with cooling liquid outlet pipe (3); The cooling liquid inlet pipe (2) is connected with power module (5), communication pipeline (4), server main module (6), cooling liquid outlet pipe (3) and forms cooling circuit in communication; Boost pump (7) is connected in series in the cooling circuit, when temperature detection component (62) detects that server main module (6) is high temperature, start boost pump (7), during the normal operation of the server main module (6), boost pump (7) is in shutdown state.

2. The liquid-cooled server integrated with a boost pump according to claim 1, wherein, The boost pump (7) is arranged between the power module (5) and server main module (6), and is connected with power module (5) and server main module (6) respectively by communication pipeline (4), and the boost pump (7) is arranged on the outside of server chassis (1), and is located on the same side of the server chassis (1) with the cooling liquid inlet pipe (2), cooling liquid outlet pipe (3) and communication pipeline (4).

3. The liquid-cooled server integrated with a boost pump according to claim 1, wherein, The boost pump (7) is direct-current boost pump, and voltage is 12-36V.

4. The liquid-cooled server integrated with a boost pump according to claim 3, wherein, The boost pump (7) is centrifugal boost pump.

5. The liquid-cooled server integrated with a boost pump according to claim 1, wherein, The power module (5) is connected with the server main module (6) by power supply copper bar (8).

6. The liquid-cooled server integrated with a boost pump of claim 1, wherein, Protective cover (9) is arranged on the outside of the server chassis (1), and the protective cover (9) is located on the outside of the cooling liquid inlet pipe (2), cooling liquid outlet pipe (3), communication pipeline (4) and boost pump (7).

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