Adhesive tape mold and adhesive tape cutting-off equipment for lead frame

Abstract

The utility model discloses an adhesive tape die and adhesive tape cutting equipment for a lead frame, and relates to the technical field of lead frames, the adhesive tape die comprises an upper die holder and a lower die holder, a stamping part for stamping and cutting an adhesive tape is arranged below the upper die holder, and a heating assembly for heating the lead frame is arranged above the lower die holder. The lead frame can be heated through the heating assembly, the stamping part enables the adhesive tape to make contact with the lead frame, the adhesive tape starts to be softened due to the temperature after making contact with the lead frame, and therefore it can be guaranteed that the adhesive tape can be attached to the lead frame instead of being attached to the stamping part.

Description

TECHNICAL FIELD

[0001] The utility model relates to lead frame technical field especially relates to a tape for lead frame's pasting mould and pasting cut off equipment. BACKGROUND

[0002] Lead frame as the chip carrier of integrated circuit is a kind of key structural member that the electrical connection of chip internal circuit lead-out end and external lead is realized by bonding material, forms electrical circuit, RT adhesive tape is pasted on lead frame before subsequent packaging, RT adhesive tape can prevent resin overflow during packaging, also can avoid some small insulators mutual contact, and in order to paste RT adhesive tape to lead frame, it needs to use pasting mould to automatically paste RT adhesive tape to lead frame, but the pasting mould of present is directly punched and cut RT adhesive tape, then pastes to lead frame, and RT adhesive tape can be pasted on pasting mould instead of lead frame by such. SUMMARY

[0003] The utility model discloses to overcome the above-mentioned situation shortage, aims at providing a kind of technical scheme that can let RT adhesive tape not be pasted on pasting mould.

[0004] To achieve the above object, the utility model provides the following technical scheme: a kind of pasting mould for lead frame, including upper die holder and lower die holder, the upper die holder lower side is equipped with the stamping part of stamping and cutting adhesive tape, the upper side of the lower die holder is equipped with the heating assembly for heating lead frame.

[0005] As a further scheme of the utility model: the stamping part includes cutting plate and the stamping head matched with cutting plate, cutting area is opened on the cutting plate, and the stamping head is connected in cutting area.

[0006] As a further scheme of the utility model: stamping head is equipped with adsorption hole in the inside for the adsorption of stamping head adhesive tape.

[0007] As a further scheme of the utility model: one side of cutting plate is equipped with adhesive tape supply channel for conveying adhesive tape to cutting area.

[0008] As a further scheme of the utility model: the adhesive tape supply channel is multiple, and the adhesive tape supply channel is distributed on the outer circumferential side of cutting plate.

[0009] As a further scheme of the utility model: the stamping head is equipped with multiple adsorption holes, and the adsorption hole is distributed in the position for contacting adhesive tape along the circumference of the stamping head.

[0010] As a further scheme of the present utility model: the heating assembly comprises a lower pressing block and a heating piece arranged below the lower pressing block and heating the lower pressing block, and the lead frame is placed on the lower pressing block.

[0011] As a further scheme of the present utility model: the heating piece is a heating block and a heating rod arranged inside the heating block.

[0012] As a further scheme of the present utility model: a first air cylinder fixing plate is arranged above the upper die holder, a first air cylinder is arranged above the first air cylinder fixing plate, the lower end of the first air cylinder is connected with the upper die holder through the first air cylinder fixing plate, a second air cylinder is arranged below the lower die holder, a second air cylinder fixing plate is arranged between the lower die holder and the second air cylinder, the top end of the second air cylinder is connected with the lower die holder through the second air cylinder fixing plate, and a plurality of die support seats are arranged below the upper die holder, and the lower die holder is arranged between the die support seats.

[0013] A tape cutting device for a lead frame comprises the tape die for a lead frame.

[0014] Compared with the prior art, the present technical scheme has the beneficial effects that the heating assembly can heat the lead frame, the stamping piece can make the adhesive tape contact the lead frame, the adhesive tape starts to soften after contacting the lead frame due to the temperature, so that the adhesive tape can be attached to the lead frame and cannot be attached to the stamping piece.

[0015] The additional aspects and advantages of the present utility model will be partially given in the following description, partially will become obvious from the following description, or will be understood through the practice of the present utility model. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical scheme in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings needed to be used in the embodiment or the prior art description, and obviously, the drawings in the following description are only some embodiments of the present utility model, and for those skilled in the art, other drawings can also be obtained according to these drawings without creative labor.

[0017] Figure 1 is the structure perspective view of the present utility model;

[0018] Figure 2 is the structure front view of the present utility model;

[0019] Figure 3 is the upper die structure explosion schematic view of the present utility model;

[0020] Figure 4 is the upper die structure explosion section view of the present utility model;

[0021] Figure 5 is the lower die seat structure perspective view of the utility model

[0022] Figure 6 is the cutting plate structure perspective view of the utility model Figure 1

[0023] Figure 7 is the cutting plate structure perspective view of the utility model Figure 2

[0024] The corresponding label in the drawing is explained as follows:

[0025] 1, upper die seat;11, first cylinder;12, stamping part;13, cutting plate;131, cutting area;14, stamping head;15, adsorption hole;16, adhesive tape supply channel;17, die support seat;18, first cylinder fixed plate;2, lower die seat;21, second cylinder;22, second cylinder fixed plate;3, heating assembly;31, lower pressing block;32, heating part;33, heating block;34, heating rod. DETAILED DESCRIPTION

[0026] The technical scheme in the embodiments of the utility model will be described clearly and completely below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all the other embodiments obtained by the ordinary skilled in the art without creative labor fall within the scope of protection of the utility model.

[0027] The embodiment provides a tape cutting device, which comprises a tape die for lead frame as shown in Figures 1 to 7 The tape die for lead frame comprises an upper die seat 1 and a lower die seat 2. The lower die seat 2 is provided with a stamping part 12 for stamping and cutting adhesive tape below the upper die seat 1. The upper die seat 2 is provided with a heating assembly 3 for heating lead frame above the lower die seat 2.

[0028] Specifically, the stamping part 12 comprises a cutting plate 13 and a stamping head 14 matched with the cutting plate 13, the cutting plate 13 is provided with a cutting area 131 at the center opening of the cutting plate 13, the cutting area 131 is used to retain the area of the adhesive tape to be cut, the stamping head 14 penetrates the cutting area 131, the stamping head 14 is internally provided with suction holes 15 for the stamping head 14 to adsorb the adhesive tape, one side of the cutting plate 13 is provided with adhesive tape feeding channels 16 for feeding the adhesive tape to the cutting area 131, the adhesive tape feeding channels 16 are in multiple groups, the adhesive tape feeding channels 16 are distributed on the outer circumferential side of the cutting plate 13, the stamping head 14 is provided with multiple suction holes 15, the suction holes 15 are distributed in the circumferential direction at the positions of the stamping head 14 for contacting the adhesive tape, the heating assembly 3 comprises a pressing block 31 and a heating piece 32 arranged below the pressing block 31 for heating the pressing block 31, the lead frame is placed on the pressing block 31, the heating piece 32 is a heating block 33 and a heating rod 34 arranged inside the heating block 33, the upper die seat 1 is provided with a first cylinder fixing plate 18 above, the first cylinder fixing plate 18 is provided with a first cylinder 11 above, the lower end of the first cylinder 11 penetrates the first cylinder fixing plate 18 and is connected with the upper die seat 1, the cutting area 131 is formed to allow the stamping head 14 to cut the adhesive tape, the suction holes 15 can be connected with an external air source, so that the bottom of the stamping head 14 is in a suction state, so that the cut adhesive tape is adsorbed to the bottom of the stamping head 14, so that the adhesive tape does not displace, the heating piece 32 is the heating rod 34 at the same time, and can also be a heating film or a heating wire and other heating products, the first cylinder 11 as a device that can drive the upper die seat 1 to move can also be a hydraulic cylinder or an electric push rod and other driving devices;

[0029] The specific cutting tape process is that after the adhesive tape moves to the cutting area 131 through the feeding port 16, the first cylinder 11 is started, after the first cylinder 11 is started, the upper die seat 1 is pushed in the direction of the lower die seat 2, the upper die seat 1 moves while carrying the stamping head 14, the stamping head 14 moves while penetrating the cutting area 131, so as to cut the adhesive tape in the cutting area 131, at the same time when the stamping head 14 starts to move, the external vacuum pump starts to work, after the external vacuum pump starts to work, the bottom end of the stamping head 14 is in a vacuum state through the air hole 15, so that the cut adhesive tape is adsorbed to the bottom end of the stamping head 14, so that the adhesive tape on the bottom end of the stamping head 14 does not displace in position during the movement of the stamping head 14, and when the first cylinder 11 is started, the heating rod 34 starts to heat, after the heating rod 34 heats, the heat is transmitted to the lead frame through the pressing block 31, so that the adhesive tape on the stamping head 14 is heated and softened when contacting the lead frame, so as to ensure that the adhesive tape can be well attached to the lead frame.

[0030] In some embodiments, two mold fixing bases 16 are arranged below the connecting plate 15, a gap between the connecting plate 15 and the mold fixing base 16 forms a feeding port 17 through which the adhesive tape can pass, the mold fixing base 16 is connected with the lower mold base 2, the lower mold base 2 is provided below with a second air cylinder 21, a second air cylinder fixing plate 22 is arranged between the lower mold base 2 and the second air cylinder 21, the top end of the second air cylinder 21 penetrates through the second air cylinder fixing plate 22 and is connected with the lower mold base 2, the upper mold base 1 is provided with a first supporting rod 18 which supports the first air cylinder fixing plate 18, and the lower mold base 2 is provided with a second supporting rod 23 which supports the second air cylinder fixing plate 21;

[0031] When different lead frame products are replaced, the horizontal height of the pressing block 12 can be adjusted according to the product thickness of the lead frame, at this time the horizontal height of the pressing block 12 is adjusted by the second air cylinder 21 below the lower mold base 2, when the second air cylinder 21 is reversely started, the lower mold base 2 is moved downward, so that the horizontal height of the pressing block 12 is lowered, and when the horizontal height of the pressing block 12 is to be increased, the second air cylinder 21 is positively started, so that the horizontal height of the pressing block 12 is increased, in this way, the horizontal height of the pressing block 12 is adjusted, and the lower mold base 2 can adapt to different lead frames, so that different lead frames do not need to use the lower mold base 2 with corresponding horizontal height.

[0032] It is apparent for those skilled in the art that the present application is not limited to the details of the above exemplary embodiments, but can be implemented in other concrete forms without departing from the spirit or essential characteristics of the present application. Therefore, the embodiments should be considered in all aspects as exemplary and non-restrictive, and the scope of the present application is defined by the appended claims rather than the above description, and all changes falling within the meaning and range of equivalent elements of the claims are intended to be embraced in the present application. Any reference signs in the claims should not be considered as limiting the claims involved.

Claims

1. A tape-attaching mold for a lead frame, characterized by, The tape feeding channel (16) is multiple groups, and the tape feeding channel (16) is distributed on the outer circumferential side of the cutting plate (13).

2. The tape-attaching die for a lead frame according to claim 1, wherein The punching head (14) is provided with a plurality of adsorption holes (15), and the plurality of adsorption holes (15) are distributed in a circumferential direction at positions of the punching head (14) for contacting the tape.

3. The tape bonding mold for a lead frame according to claim 1, wherein The heating element (32) is a heating block (33) and a heating rod (34) arranged inside the heating block (33).

4. The tape bonding mold for a lead frame according to claim 1, wherein The upper die holder (1) is provided with a first cylinder fixing plate (18) above, the first cylinder fixing plate (18) is provided with a first cylinder (11) above, the lower end of the first cylinder (11) is connected with the upper die holder (1) through the first cylinder fixing plate (18), the lower end of the second cylinder (21) is connected with the lower die holder (2) through the second cylinder fixing plate (22), and the lower die holder (2) is located between the plurality of die supporting seats (17).

5. The tape bonding mold for a lead frame according to claim 1, wherein The tape feeding channel (16) is multiple groups, and the tape feeding channel (16) is distributed on the outer circumferential side of the cutting plate (13).

6. A tape cutting apparatus characterized by comprising: The punching head (14) is provided with a plurality of adsorption holes (15), and the plurality of adsorption holes (15) are distributed in a circumferential direction at positions of the punching head (14) for contacting the tape. The heating element (32) is a heating block (33) and a heating rod (34) arranged inside the heating block (33). The upper die holder (1) is provided with a first cylinder fixing plate (18) above, the first cylinder fixing plate (18) is provided with a first cylinder (11) above, the lower end of the first cylinder (11) is connected with the upper die holder (1) through the first cylinder fixing plate (18), the lower end of the second cylinder (21) is connected with the lower die holder (2) through the second cylinder fixing plate (22), and the lower die holder (2) is located between the plurality of die supporting seats (17). The tape feeding channel (16) is multiple groups, and the tape feeding channel (16) is distributed on the outer circumferential side of the cutting plate (13). The punching head (14) is provided with a plurality of adsorption holes (15), and the plurality of adsorption holes (15) are distributed in a circumferential direction at positions of the punching head (14) for contacting the tape. The heating element (32) is a heating block (33) and a heating rod (34) arranged inside the heating block (33). The upper die holder (1) is provided with a first cylinder fixing plate (18) above, the first cylinder fixing plate (18) is provided with a first cylinder (11) above, the lower end of the first cylinder (11) is connected with the upper die holder (1) through the first cylinder fixing plate (18), the lower end of the second cylinder (21) is connected with the lower die holder (2) through the second cylinder fixing plate (22), and the lower die holder (2) is located between the plurality of die supporting seats (17). The tape feeding channel (16) is multiple groups, and the tape feeding channel (16) is distributed on the outer circumferential side of the cutting plate (13). The punching head (14) is provided with a plurality of adsorption holes (15), and the plurality of adsorption holes (15) are distributed in a circumferential direction at positions of the punching head (14) for contacting the tape. The heating element (32) is a heating block (33) and a heating rod (34) arranged inside the heating block (33). The upper die holder (1) is provided with a first cylinder fixing plate (18) above, the first cylinder fixing plate (18) is provided with a first cylinder (11) above, the lower end of the first cylinder (11) is connected with the upper die holder (1) through the first cylinder fixing plate (18), the lower end of the second cylinder (21) is connected with the lower die holder (2) through the second cylinder fixing plate (22), and the lower die holder (2) is located between the plurality of die supporting seats (17).

Images