Semiconductor chip manufacturing vacuum device

Abstract

The utility model discloses a semiconductor chip manufacturing vacuum device comprising a sealing box, and one side of the sealing box is provided with a vibration damping assembly. The vibration reduction assembly comprises a base, a top plate is fixedly connected to the top of the sliding rod, a movable plate is slidably connected to the outer wall of the sliding rod, a lower spring is fixedly connected between the bottom of the movable plate and the base, and an upper spring is fixedly connected between the top of the movable plate and the top plate. And one end of the rubber hose is fixedly connected with one side of the sealing box. The utility model relates to the technical field of chip processing. According to the semiconductor chip manufacturing vacuum device, when a vacuum pump operates to generate vibration, a movable plate is promoted to slide up and down, and when the movable plate moves downwards, the movable plate compresses a lower spring and stretches an upper spring; in this way, in the vertical sliding process of the movable plate, friction is generated between the inner wall of the movable plate and the sliding rods, kinetic energy generated by vibration of the vacuum pump is gradually offset, and the vibration reduction effect is achieved.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip processing technical field, concretely is a kind of semiconductor chip manufacturing vacuum device. BACKGROUND

[0002] In the semiconductor chip manufacturing process, oxygen, water vapor, dust and other impurities in the air can seriously affect the performance and quality of chips. Vacuum equipment can extract the gas in the closed space, create a highly pure vacuum environment, greatly reduce the collision of gas molecules, reduce the interference of these impurities on the manufacturing process, thereby improving the yield of chips. For example, in the process of photoetching, if there are gas molecules interference, it will affect the propagation and illumination accuracy of light, and this situation can be avoided in a vacuum environment.

[0003] The commonly used equipment for forming a vacuum environment needs to use a vacuum pump. The vacuum pump is a device or equipment that uses mechanical, physical, chemical or physical-chemical methods to extract air from a container to obtain a vacuum. In simple terms, the vacuum pump is a device that uses various methods to improve, create and maintain a vacuum in a closed space, but the vacuum pump will produce vibration during operation, which will affect the sealing box connected thereto and will affect the processing, which needs to be further improved.

[0004] Therefore, the utility model provides a kind of semiconductor chip manufacturing vacuum device to solve the above problems. UTILITY MODEL CONTENTS

[0005] In view of the deficiencies of the prior art, the utility model provides a kind of semiconductor chip manufacturing vacuum device, which solves the above problems.

[0006] To achieve the above purpose, the utility model is implemented by the following technical solutions: a kind of semiconductor chip manufacturing vacuum device, including sealed box, the side of the sealed box is provided with damping component;The inside of the sealed box is provided with mobile adjusting assembly;The damping component includes base, the top of the base is fixedly connected with slide rod, the top of the slide rod is fixedly connected with top plate, the outer wall of the slide rod is slidably connected with movable plate, the bottom of the movable plate is fixedly connected with lower spring between base, the top of the movable plate is fixedly connected with upper spring between top plate, the top of the movable plate is fixedly installed with vacuum pump, the interface one end of the vacuum pump is fixedly connected with rubber hose, the one end of the rubber hose is fixedly connected with the side of the sealed box.

[0007] Further, the inside of the base is fixedly connected with air cylinder, and the bottom of the sidewall of the air cylinder is provided with air hole.

[0008] By adopting the above technical scheme, other components are installed, and the air pressure is relieved through the air hole.

[0009] Further, the inner wall of the air cylinder is slidingly connected with a piston sliding block, the top of the piston sliding block is fixedly connected with a piston rod, and one end of the piston rod is fixedly connected with the bottom of the movable plate.

[0010] By adopting the above technical scheme, the movable plate is assisted to support and reduce vibration.

[0011] Further, the movement adjusting assembly comprises a screw rod, the outer wall of the screw rod is threadedly connected with a center nut block, and the top of the center nut block is fixedly connected with a placement plate.

[0012] By adopting the above technical scheme, the placement plate is used for placing the chip for processing.

[0013] Further, the inner wall of the sealing box is fixedly connected with a limiting rod, the outer wall of the limiting rod is slidingly connected with a side edge auxiliary block, and the top of the side edge auxiliary block is fixedly connected with the placement plate.

[0014] By adopting the above technical scheme, the limiting rod is used for limiting the rotation of the placement plate and the nut block.

[0015] Further, the movement adjusting assembly further comprises a servo motor, and the output shaft of the servo motor is fixedly connected with one end of the screw rod.

[0016] By adopting the above technical scheme, power is provided to drive the screw rod to rotate.

[0017] Advantages

[0018] The utility model provides a semiconductor chip manufacturing vacuum device. Compared with prior art, the following advantages are provided:

[0019] 1. The semiconductor chip manufacturing vacuum device, when the vacuum pump runs and generates vibration, the movable plate is slid up and down, when the movable plate moves downward, the movable plate compresses the lower spring and stretches the upper spring, if the movable plate moves upward, the upper spring and the lower spring are opposite to the foregoing movement, so that the inner wall of the movable plate rubs with the slide rod during the up and down sliding process, and gradually offsets the kinetic energy generated by the vacuum pump vibration to achieve the effect of vibration reduction; at the same time, the movable plate also presses the piston rod downward, and then drives the piston sliding block to compress the air in the air cylinder and discharge through the air hole, the air also generates certain resistance to the piston sliding block, which can offset part of the vibration, when the piston sliding block moves upward, the air can be filled into the air cylinder again.

[0020] 2. The semiconductor chip manufacturing vacuum device, the placement plate is used for preventing the chip from being processed, the servo motor can be driven to rotate the screw rod, the screw rod can drive the center nut block to move, the limiting rod and the side auxiliary block can limit the center nut block and the placement plate to prevent them from rotating with the screw rod, and the placement plate can move more stably. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed in the description of the embodiments or the prior art will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor on the basis of these drawings.

[0022] Figure 1 is the external structure perspective view of the present application;

[0023] Figure 2 is the structure enlarged view of the present application A;

[0024] Figure 3 is the internal structure view of the sealing box of the present application;

[0025] Figure 4 is the partial structure sectional view of the present application.

[0026] In the figure: 1, sealing box; 2, damping assembly; 21, base; 22, slide rod; 23, lower spring; 24, movable plate; 25, top plate; 26, upper spring; 27, vacuum pump; 28, rubber hose; 29, air cylinder; 210, air hole; 211, piston sliding block; 212, piston rod; 3, moving adjusting assembly; 31, servo motor; 32, limiting rod; 33, screw rod; 34, placement plate; 35, side auxiliary block; 36, center nut block. DETAILED DESCRIPTION

[0027] It should be noted that in the description of the embodiments of the present application, the terms "front, back, left, right, top, bottom" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. The terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integrally connected; it can be directly connected, or indirectly connected through an intermediate medium, or the communication between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0028] The present application will be further described in detail below with the aid of drawings and examples.

[0029] Referring to Figures 1 to 4 The embodiments of the present application provide a kind of semiconductor chip manufacturing vacuum device, including sealed box 1, one side of sealed box 1 is provided with damping component 2;The inside of sealed box 1 is provided with mobile adjustment component 3;Damping component 2 includes base 21, the top of base 21 is fixedly connected with slide rod 22, the top of slide rod 22 is fixedly connected with top plate 25, the outer wall of slide rod 22 is slidably connected with movable plate 24, and the bottom of movable plate 24 is fixedly connected with lower spring 23 between base 21, the top of movable plate 24 is fixedly connected with upper spring 26 between top plate 25, the top of movable plate 24 is fixedly installed with vacuum pump 27, the interface one end of vacuum pump 27 is fixedly connected with rubber hose 28, and one end of rubber hose 28 is fixedly connected with one side of sealed box 1.The inside of base 21 is fixedly connected with air cylinder 29, and air hole 210 is formed in the bottom of the side wall of air cylinder 29.The inner wall of air cylinder 29 is slidably connected with piston sliding block 211, the top of piston sliding block 211 is fixedly connected with piston rod 212, and one end of piston rod 212 is fixedly connected with the bottom of movable plate 24.

[0030] Specific implementation: when vacuum pump 27 runs and generates vibration, it will promote movable plate 24 to slide up and down, when movable plate 24 moves downward, movable plate 24 will compress lower spring 23 and stretch upper spring 26, if movable plate 24 moves upward, upper spring 26 and lower spring 23 are opposite to the above-mentioned movement, so that the inner wall of movable plate 24 will rub with slide rod 22 during sliding up and down, which will gradually offset the kinetic energy generated by the vibration of vacuum pump 27 to achieve the effect of damping;At the same time, movable plate 24 will also press down piston rod 212, which will in turn drive piston sliding block 211 to compress the air in air cylinder 29 to be discharged through air hole 210, and the air will generate a certain resistance to piston sliding block 211, which can offset part of the vibration, when piston sliding block 211 moves upward, the air can be filled into the inside of air cylinder 29 again.

[0031] Referring to Figures 1 to 4 In one aspect of the embodiment, the mobile adjusting assembly 3 comprises a screw rod 33, the outer wall of the screw rod 33 is threadedly connected with a center nut block 36, the top of the center nut block 36 is fixedly connected with a placement plate 34. A limiting rod 32 is fixedly connected between the inner walls of the sealing box 1, the outer wall of the limiting rod 32 is slidingly connected with a side auxiliary block 35, the top of the side auxiliary block 35 is fixedly connected with the placement plate 34. The mobile adjusting assembly 3 further comprises a servo motor 31, the output shaft of the servo motor 31 is fixedly connected with one end of the screw rod 33.

[0032] In implementation: the placement plate 34 is used to prevent the chip from being processed, the servo motor 31 is started, the servo motor 31 in turn drives the screw rod 33 to rotate, the screw rod 33 in turn drives the center nut block 36 to move, the limiting rod 32 and the side auxiliary block 35 limit the center nut block 36 and the placement plate 34 from rotating with the screw rod 33, and the movement of the placement plate 34 is more stable.

[0033] In the scheme, all the electrical equipment is powered by an external power supply.

[0034] Working principle: when the vacuum pump 27 operates to generate vibration, the movable plate 24 is driven to slide up and down, when the movable plate 24 moves downward, the movable plate 24 compresses the lower spring 23 and stretches the upper spring 26, if the movable plate 24 moves upward, the upper spring 26 and the lower spring 23 are opposite to the foregoing movement, in this way, the inner wall of the movable plate 24 rubs against the slide rod 22 during the up and down sliding, and gradually offsets the kinetic energy generated by the vibration of the vacuum pump 27 to achieve the effect of vibration reduction; at the same time, the movable plate 24 also presses the piston rod 212 downward, which in turn drives the piston sliding block 211 to compress the air in the air cylinder 29 to be discharged through the air hole 210, the air also generates a certain resistance to the piston sliding block 211 to offset a part of the vibration, when the piston sliding block 211 moves upward, the air can be refilled into the air cylinder 29, the placement plate 34 is used to prevent the chip from being processed, the servo motor 31 is started, the servo motor 31 in turn drives the screw rod 33 to rotate, the screw rod 33 in turn drives the center nut block 36 to move, the limiting rod 32 and the side auxiliary block 35 limit the center nut block 36 and the placement plate 34 from rotating with the screw rod 33, and the movement of the placement plate 34 is more stable.

[0035] It is to be understood that the terminology used herein such as first and second, and the like, is only used to distinguish one entity or action from another entity or action, and does not necessarily require or imply any such actual relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus.

[0036] While the embodiments of the application have been shown and described herein, it is to be understood that the application is not limited to these embodiments and that various changes, modifications, substitutions and alterations can be made thereto without departing from the principles and spirit of the application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A vacuum apparatus for semiconductor chip manufacturing comprising a sealed box (1), characterized in that: One side of the sealed box (1) is provided with a damping assembly (2); the inside of the sealed box (1) is provided with a mobile adjusting assembly (3); the damping assembly (2) comprises a base (21), the top of the base (21) is fixedly connected with a sliding rod (22), the top of the sliding rod (22) is fixedly connected with a top plate (25), the outer wall of the sliding rod (22) is slidably connected with a movable plate (24), the bottom of the movable plate (24) and the base (21) are fixedly connected with a lower spring (23), the top of the movable plate (24) and the top plate (25) are fixedly connected with an upper spring (26), the top of the movable plate (24) is fixedly installed with a vacuum pump (27), one end of the interface of the vacuum pump (27) is fixedly connected with a rubber hose (28), one end of the rubber hose (28) is fixedly connected with the side of the sealed box (1).

2. A vacuum apparatus for semiconductor chip manufacturing according to claim 1, characterized in that: The inside of the base (21) is fixedly connected with an air cylinder (29), and the bottom of the side wall of the air cylinder (29) is provided with a ventilation hole (210).

3. A vacuum apparatus for semiconductor chip manufacturing according to claim 2, wherein: The inner wall of the air cylinder (29) is slidably connected with a piston sliding block (211), the top of the piston sliding block (211) is fixedly connected with a piston rod (212), and one end of the piston rod (212) is fixedly connected with the bottom of the movable plate (24).

4. The vacuum apparatus for semiconductor chip manufacturing as recited in claim 1, wherein: The mobile adjusting assembly (3) comprises a screw rod (33), the outer wall of the screw rod (33) is threadedly connected with a center nut block (36), and the top of the center nut block (36) is fixedly connected with a placing plate (34).

5. The vacuum apparatus for semiconductor chip manufacturing as recited in claim 1, wherein: The inner wall of the sealed box (1) is fixedly connected with a limiting rod (32), the outer wall of the limiting rod (32) is slidably connected with a side auxiliary block (35), and the top of the side auxiliary block (35) is fixedly connected with the placing plate (34).

6. A vacuum apparatus for semiconductor chip manufacturing as defined in claim 1, wherein: The mobile adjusting assembly (3) further comprises a servo motor (31), and the output shaft of the servo motor (31) is fixedly connected with one end of the screw rod (33).

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