Cleaning and gluing mechanism and laser processing equipment

Abstract

The utility model discloses a cleaning and gluing mechanism and laser processing equipment. The cleaning and gluing mechanism comprises a cleaning and coating barrel, a rotating platform, a cleaning swing arm and a coating swing arm, the rotating platform is rotatably arranged in the cleaning and coating barrel, and the rotating platform can drive the wafer to rotate at a high speed. The cleaning swing arm is arranged in the cleaning coating barrel in a swing mode and provided with a first water outlet, and the first water outlet is used for being arranged towards the rotating platform so as to spray water to the wafer in the swing process; the coating swing arm is arranged in the cleaning and coating barrel in a swing mode and provided with a gluing opening, and the gluing opening is used for being arranged towards the rotating platform so as to glue the wafer in the swing process. According to the utility model, in the cleaning process, the coating swing arm drives the gluing opening to swing to the position avoiding the wafer, so that the situation of glue dripping is avoided, and the cleanliness of the wafer is ensured; in the gluing process, the cleaning swing arm drives the first water outlet to swing to the position avoiding the wafer, the situation of water dripping is avoided, and the coating uniformity of the protection liquid is guaranteed.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer processing technical field more specifically, relate to a kind of cleaning and gluing mechanism and laser processing equipment. BACKGROUND

[0002] Before the surface cutting of wafer, it needs to be cleaned first. After cleaning, a layer of protective liquid (usually cutting glue) needs to be coated on the clean wafer surface. Therefore, the cleaning and coating mechanism of wafer emerges as the times require. However, the cleaning and coating mechanism in the prior art has a problem: because the arrangement position of the water outlet for cleaning and the glue outlet for coating glue is close, the glue dripping problem of the glue outlet during cleaning will affect the cleanliness of the wafer, and the dripping problem of the water outlet will also interfere with the uniformity of the glue coating on the wafer.

[0003] Therefore, how to ensure the cleanliness of wafer cleaning and the uniformity of glue coating has become a technical problem to be solved by the technical personnel in the field. UTILITY MODEL CONTENT

[0004] Therefore, the purpose of the utility model is to provide a cleaning and gluing mechanism to avoid the mutual influence of the water outlet and the glue outlet causing pollution, and thus ensure the cleanliness of wafer cleaning and the uniformity of glue coating.

[0005] Another purpose of the utility model is to provide a laser processing equipment comprising the above cleaning and gluing mechanism.

[0006] To achieve the above purpose, the utility model provides the following technical scheme:

[0007] A cleaning and gluing mechanism comprises:

[0008] A cleaning and coating barrel has an opening for the entry and exit of wafers.

[0009] A rotating platform is rotatably arranged in the cleaning and coating barrel and is used to drive the rotation of the wafer.

[0010] A cleaning swing arm is swingably arranged in the cleaning and coating barrel and is provided with a first water outlet, which is arranged towards the rotating platform.

[0011] A coating swing arm is swingably arranged in the cleaning and coating barrel and is provided with a glue outlet, which is arranged towards the rotating platform.

[0012] Optionally, in the cleaning and coating mechanism, the cleaning swing arm comprises a first motor, a first connecting shaft and a first swing arm shaft, the first motor is arranged outside the cleaning and coating barrel, the first swing arm shaft is arranged inside the cleaning and coating barrel, the first water outlet is arranged on the first swing arm shaft, and the first connecting shaft is drivingly connected between the first motor and the first swing arm shaft; and / or,

[0013] the coating swing arm comprises a second motor, a second connecting shaft and a second swing arm shaft, the second motor is arranged outside the cleaning and coating barrel, the second swing arm shaft is arranged inside the cleaning and coating barrel, the coating outlet is arranged on the second swing arm shaft, and the second connecting shaft is drivingly connected between the second motor and the second swing arm shaft.

[0014] Optionally, in the cleaning and coating mechanism, the side wall of the cleaning and coating barrel is outwardly provided with a first avoiding space and a second avoiding space, the first avoiding space is used for accommodating the swing part of the cleaning swing arm, and the second avoiding space is used for accommodating the swing part of the coating swing arm.

[0015] Optionally, in the cleaning and coating mechanism, a jacking assembly is further arranged, the jacking assembly is connected with the rotating platform and is used for driving the rotating platform to ascend and descend between the bottom of the cleaning and coating barrel and the opening, so as to transport the wafer.

[0016] When the swing part of the cleaning swing arm and the swing part of the coating swing arm swing into the first avoiding space and the second avoiding space respectively, the cleaning swing arm and the coating swing arm are arranged in a staggered manner along the direction from the bottom of the cleaning and coating barrel to the opening, so as to avoid the ascending and descending action of the rotating platform in the cleaning and coating barrel.

[0017] Optionally, in the cleaning and coating mechanism, the first water outlet is provided with an atomizing nozzle, the atomizing nozzle is provided with a first interface, a second interface and a spraying outlet, the first interface is communicated with a water inlet pipeline through the first water outlet, the second interface is communicated with an air inlet pipeline, the spraying outlet is communicated with the first interface and the second interface and is arranged towards the rotating platform.

[0018] Optionally, in the cleaning and coating mechanism, the wafer is supported by a support, the cleaning swing arm is provided with a second water outlet, and the second water outlet is arranged towards the support; and / or,

[0019] the coating swing arm is provided with a third water outlet, and the third water outlet is arranged towards the coating outlet.

[0020] Optionally, in the cleaning and coating mechanism, the cleaning and coating barrel comprises a bottom plate and a side wall, the bottom plate and the side wall are sealingly connected, the rotating platform is arranged on the bottom plate, and a water leakage detection sensor is arranged on the bottom plate.

[0021] Optionally, in the cleaning and coating mechanism, a water blocking roller blind is further arranged, the water blocking roller blind has a water blocking state and a storage state.

[0022] When the water blocking roller blind is in the water blocking state, the water blocking roller blind blocks the opening of the cleaning and coating barrel, and when the water blocking roller blind is in the storage state, the water blocking roller blind avoids the opening of the cleaning and coating barrel.

[0023] Optionally, in the cleaning and coating mechanism, the cleaning and coating barrel is arranged on a support assembly, and the support assembly comprises:

[0024] a base, a first damping component is arranged on a first side of the base;

[0025] a support frame is arranged on a second side of the base, the cleaning and coating barrel is arranged on the support frame, and a second damping component is arranged between the cleaning and coating barrel and the support frame.

[0026] A laser processing device comprises the cleaning and coating mechanism.

[0027] The cleaning and coating mechanism comprises a cleaning and coating barrel, a rotating platform, a cleaning swing arm and a coating swing arm. The cleaning and coating barrel has an opening for the wafer to enter and exit. The rotating platform is rotatably arranged in the cleaning and coating barrel. The wafer is placed on the rotating platform. The rotating platform can drive the wafer to rotate at a high speed, so that the water on the wafer can be quickly spun dry, and the protective liquid on the wafer can be uniformly distributed. The cleaning swing arm is swingably arranged in the cleaning and coating barrel and is provided with a first water outlet. The first water outlet is arranged towards the rotating platform, so as to spray water to the wafer during the swing. The coating swing arm is swingably arranged in the cleaning and coating barrel and is provided with a coating outlet. The coating outlet is arranged towards the rotating platform, so as to coat glue on the wafer during the swing. After the wafer enters the cleaning and coating barrel and is placed on the rotating platform, the cleaning swing arm swings to the upper side of the wafer on the rotating platform, and the first water outlet sprays water to the wafer for cleaning. The swing of the cleaning swing arm can realize cleaning of different positions of the wafer. After the cleaning is completed, the rotating platform drives the wafer to rotate, so that the wafer can be quickly spun dry. After the spinning is completed, the cleaning swing arm swings to a position which does not affect the swing of the coating swing arm. Meanwhile, the coating swing arm swings to the upper side of the wafer on the rotating platform, and the coating outlet coats glue on the wafer. During the coating process, the rotating platform continuously drives the wafer to rotate, so as to ensure uniform coating of the protective liquid under the action of centrifugal force. The splashed water and protective liquid during the cleaning and coating processes are collected by the cleaning and coating barrel.

[0028] Compared with the prior art, the cleaning and gluing mechanism provided by the utility model can clean and glue the wafer through the cleaning swing arm and the coating swing arm respectively, in the cleaning process, the coating swing arm can drive the gluing opening to swing to the position avoiding the wafer, so that the gluing dripping is avoided, and the cleanliness of wafer cleaning is ensured; in the gluing process, the cleaning swing arm can drive the first water outlet to swing to the position avoiding the wafer, so that the water dripping is avoided, and the uniformity of the protective liquid coating is ensured.

[0029] The laser processing equipment provided by the utility model comprises the cleaning and gluing mechanism, so the same beneficial effects are also possessed, and other structures refer to the prior art, which will not be repeated here. BRIEF DESCRIPTION OF DRAWINGS

[0030] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or the prior art, the drawings needed to be used in the embodiment or the prior art description will be briefly introduced as follows, and obviously, the drawings in the following description are only some embodiments of the utility model, and other drawings can also be obtained according to these drawings without creative labor for those skilled in the art.

[0031] Figure 1 The structure diagram of the cleaning and gluing mechanism disclosed by the embodiment of the utility model Figure 1 ;

[0032] Figure 2 The structure diagram of the cleaning and gluing mechanism disclosed by the embodiment of the utility model Figure 2 ;

[0033] Figure 3 The sectional view of A-A in Figure 2 ;

[0034] Figure 4 The sectional view of B-B in Figure 2 ;

[0035] Figure 5 The structure diagram of the cleaning and gluing mechanism disclosed by the embodiment of the utility model Figure 3 ;

[0036] Figure 6 The sectional view of C-C in Figure 5 ;

[0037] Figure 7 The structure diagram of the cleaning swing arm disclosed by the embodiment of the utility model

[0038] Figure 8 The structure diagram of the coating swing arm disclosed by the embodiment of the utility model

[0039] Figure 9 Structure diagram of the rotating platform Figure 1 ;

[0040] Figure 10 Structure diagram of the rotating platform Figure 2 ;

[0041] Figure 11 Structure diagram of the atomizing nozzle.

[0042] Among them, 100 is a cleaning coating barrel, 101 is a side wall, 102 is a chassis, 110 is a water blocking roller shutter, and 111 is a guide rail;

[0043] 200 is a rotating platform, 210 is a rotating motor, 220 is a lifting motor, and 230 is a lifting guide column;

[0044] 300 is a cleaning swing arm, 310 is a first motor, 320 is a first connecting shaft, 321 is a first water inlet, 330 is a first swing arm shaft, 331 is a first water outlet, 332 is a second water outlet, 340 is an atomizing nozzle, 341 is a first interface, 342 is a second interface, and 343 is a spray outlet;

[0045] 400 is a coating swing arm, 410 is a second motor, 420 is a second connecting shaft, 421 is a second water inlet, 430 is a second swing arm shaft, 431 is a glue coating port, and 432 is a third water outlet;

[0046] 500 is a base, 510 is a support frame, 520 is a first damping component, and 530 is a second damping component. DETAILED DESCRIPTION

[0047] The core of the utility model lies in disclosing a cleaning and gluing mechanism to avoid pollution caused by the mutual influence of the water outlet and the glue coating port 431, thereby ensuring the cleanliness of the wafer cleaning and the uniformity of the glue coating.

[0048] Another core of the utility model lies in disclosing a laser processing equipment comprising the above cleaning and gluing mechanism.

[0049] Hereinafter, embodiments will be described with reference to the accompanying drawings. In addition, the embodiments shown below do not have any limiting effect on the utility model content recited in the claims. In addition, the entire content of the configuration represented in the following embodiments is not limited to being necessary as a solution to the utility model recited in the claims. It should be noted that, for the convenience of description, only the parts related to the utility model are shown in the drawings. In the case of no conflict, the embodiments in the utility model and the features in the embodiments can be combined with each other.

[0050] In combination withFigures 1-11 The utility model discloses a cleaning and gluing mechanism which comprises a cleaning and coating barrel 100, a rotating platform 200, a cleaning swing arm 300 and a coating swing arm 400. The cleaning and coating barrel 100 has an opening for the wafer to enter and exit. The rotating platform 200 is rotatably arranged in the cleaning and coating barrel 100. The wafer is placed on the rotating platform 200. The rotating platform 200 can drive the wafer to rotate at a high speed so as to quickly spin dry the moisture on the wafer and make the protective liquid on the wafer uniformly distributed. The cleaning swing arm 300 is swingably arranged in the cleaning and coating barrel 100 and is provided with a first water outlet 331. The first water outlet 331 is arranged towards the rotating platform 200 to spray water to the wafer during the swing. The coating swing arm 400 is swingably arranged in the cleaning and coating barrel 100 and is provided with a glue coating port 431. The glue coating port 431 is arranged towards the rotating platform 200 to coat glue on the wafer during the swing.

[0051] After the wafer enters the cleaning and coating barrel 100 and is placed on the rotating platform 200, the cleaning swing arm 300 swings to the upper side of the wafer on the rotating platform 200 and makes the first water outlet 331 spray water to clean the wafer. The swing of the cleaning swing arm 300 can clean different positions of the wafer. After cleaning, the rotating platform 200 drives the wafer to rotate so as to quickly spin dry the wafer. After spin drying, the cleaning swing arm 300 swings to a position which does not affect the swing of the coating swing arm 400. Meanwhile, the coating swing arm 400 swings to the upper side of the wafer on the rotating platform 200 and makes the glue coating port 431 coat glue on the wafer. During the glue coating process, the rotating platform 200 continuously drives the wafer to rotate so as to ensure the uniform coating of the protective liquid under the action of centrifugal force. The splashed water and protective liquid during the cleaning and glue coating processes are collected by the cleaning and coating barrel 100.

[0052] The swing speed of the cleaning swing arm 300 and the water output of the first water outlet 331 can be adjusted to ensure the cleanliness of the wafer cleaning. The swing speed of the coating swing arm 400 and the glue output of the glue coating port 431 can be adjusted to ensure the uniformity of the glue coating. Preferably, the cleaning swing arm 300 and the coating swing arm 400 are symmetrically arranged relative to the axis center of the cleaning and coating barrel 100 to avoid the swing interference of the two.

[0053] Compared with the prior art, the cleaning and gluing mechanism disclosed by the utility model can clean and coat glue on the wafer through the cleaning swing arm 300 and the coating swing arm 400 respectively. During the cleaning process, the coating swing arm 400 can drive the glue coating port 431 to swing to a position which avoids the wafer to avoid the glue dripping and ensure the cleanliness of the wafer cleaning. During the glue coating process, the cleaning swing arm 300 can drive the first water outlet 331 to swing to a position which avoids the wafer to avoid the water dripping and ensure the uniformity of the protective liquid coating.

[0054] In an embodiment, the cleaning swing arm 300 comprises a first motor 310, a first connecting shaft 320 and a first swing arm shaft 330, the first motor 310 is arranged outside the cleaning and coating barrel 100, the first swing arm shaft 330 is arranged inside the cleaning and coating barrel 100, and a first water outlet 331 is arranged on the first swing arm shaft 330, the first connecting shaft 320 is drivingly connected between the first motor 310 and the first swing arm shaft 330, and the first motor 310 can drive the first connecting shaft 320 and the first swing arm shaft 330 to rotate together; the coating swing arm 400 comprises a second motor 410, a second connecting shaft 420 and a second swing arm shaft 430, the second motor 410 is arranged outside the cleaning and coating barrel 100, the second swing arm shaft 430 is arranged inside the cleaning and coating barrel 100, and a glue coating port 431 is arranged on the second swing arm shaft 430, the second connecting shaft 420 is drivingly connected between the second motor 410 and the second swing arm shaft 430, and the second motor 410 can drive the second connecting shaft 420 and the second swing arm shaft 430 to rotate together.

[0055] Specifically, the output end of the first motor 310 is provided with a speed reducer, the speed reducer is drivingly connected with the first connecting shaft 320 through a shaft coupling, the output end of the second motor 410 is provided with a speed reducer, and the speed reducer is drivingly connected with the second connecting shaft 420 through a shaft coupling. The first connecting shaft 320 and the second connecting shaft 420 extend in the vertical direction, and the first swing arm shaft 330 and the second swing arm shaft 430 swing in the horizontal plane.

[0056] In combination Figure 7 , the first connecting shaft 320 and the first swing arm shaft 330 can be a pipeline structure in communication with each other, a first water inlet 321 is arranged at one end of the first connecting shaft 320 located outside the cleaning and coating barrel 100, and the first water outlet 331 is in communication with the first swing arm shaft 330, so as to supply water to the first water outlet 331 through the first water inlet 321.

[0057] The wafer is usually placed in the cleaning and coating barrel 100 by a mechanical arm for cleaning and coating, and after the cleaning and coating are completed, the wafer is transferred out of the cleaning and coating barrel 100 by the mechanical arm, therefore, in order to facilitate the transfer and placement of the wafer, in a specific embodiment disclosed by the utility model, the cleaning and coating mechanism further comprises a jacking assembly, the jacking assembly is connected with the rotating platform 200 and is used for driving the rotating platform 200 to ascend and descend between the bottom of the cleaning and coating barrel 100 and the opening, so as to transport the wafer.

[0058] In the process that the wafer is moved to the opening of the cleaning and coating barrel 100 by the mechanical arm, the lifting assembly drives the rotary platform 200 to rise to the opening of the cleaning and coating barrel 100, so that the mechanical arm can directly place the wafer on the rotary platform 200 without needing to extend into the cleaning and coating barrel 100, and then the wafer is driven by the rotary platform 200 to descend to the bottom of the cleaning and coating barrel 100, facilitating the cleaning swing arm 300 and the coating swing arm 400 to spray water and glue on the wafer. After cleaning and gluing, the lifting assembly again lifts the rotary platform 200, so that the wafer is located at the opening of the cleaning and coating barrel 100, facilitating the mechanical arm to directly move the wafer away from the cleaning and coating barrel 100 and to receive the next wafer.

[0059] Specifically, the rotary platform 200 is driven to rotate by the rotary motor 210, and the lifting assembly includes a lifting motor 220 fixed on the support assembly and capable of driving the rotary platform 200 and the rotary motor 210 to jointly lift, in combination with Figure 9 and Figure 10 The rotary platform 200 is connected with a lifting guide column 230, and the lifting guide column 230 is in sliding fit with the support assembly to realize lifting guide.

[0060] In order to avoid the cleaning swing arm 300 and the coating swing arm 400 interfering with the lifting action of the rotary platform 200 or the in-out path of the wafer in the cleaning and coating barrel 100, and also to avoid the cleaning swing arm 300 and the coating swing arm 400 interfering with each other when swinging, the sidewall of the cleaning and coating barrel 100 outwardly protrudes to be provided with a first avoiding space and a second avoiding space, the first avoiding space is used for accommodating the first swing arm shaft 330 (or the swing part of the cleaning swing arm 300), and the second avoiding space is used for accommodating the second swing arm shaft 430 (or the swing part of the coating swing arm 400). In an embodiment, when the first swing arm shaft 330 (or the swing part of the cleaning swing arm 300) and the second swing arm shaft 430 (or the swing part of the coating swing arm 400) swing into the first avoiding space and the second avoiding space respectively, along the direction from the bottom of the cleaning and coating barrel 100 to the opening, the first swing arm shaft 330 (or the swing part of the cleaning swing arm 300) and the second swing arm shaft 430 (or the swing part of the coating swing arm 400) are arranged in dislocation with the rotary platform 200, so as to avoid the lifting action of the rotary platform 200 or the in-out action of the wafer in the cleaning and coating barrel 100.

[0061] It can be understood by those skilled in the art that, if the cleaning and gluing mechanism does not have the lifting assembly, that is, the wafer is directly carried by the mechanical arm extending into the cleaning and coating barrel 100, then the first avoiding space and the second avoiding space are used to avoid the cleaning swing arm 300 and the coating swing arm 400 interfering with the wafer and the mechanical arm.

[0062] Further optimization scheme, the cleaning and gluing mechanism further comprises an atomizing nozzle 340, the atomizing nozzle 340 is provided with a first interface 341, a second interface 342 and a spray outlet 343, the first interface 341 is communicated with the water inlet pipeline through the first water outlet 331, the second interface 342 is communicated with the air inlet pipeline, the spray outlet 343 is communicated with the first interface 341 and the second interface 342, and is arranged towards the rotating platform 200. The setting of the atomizing nozzle 340 enables the cleaning swing arm 300 to spray pure water, water mist and pure gas, wherein the water spraying mode and the water mist spraying mode can be used for cleaning the wafer, and the air spraying mode can be used in the wafer drying process to shorten the wafer drying time.

[0063] The wafer is supported by a support located in the circumferential direction of the wafer. In the gluing process, the splashed protective liquid will fall on the support. Therefore, in order to facilitate cleaning of the support, a second water outlet 332 is further provided on the cleaning swing arm 300, the second water outlet 332 is communicated with the water inlet pipeline, and the second water outlet 332 is arranged towards the support to clean the support separately after the wafer gluing is completed. Specifically, the wafer can be fixed on the rotating platform 200 by means of vacuum adsorption, jaw clamping support and the like to ensure that the wafer rotates with the rotating platform 200.

[0064] In order to avoid the crystallization of the protective liquid at the glue outlet 431 and affect the normal glue output, a third water outlet 432 is arranged on the coating swing arm 400, the third water outlet 432 is arranged towards the glue outlet 431 to be able to spray water to the glue outlet 431 for cleaning after the gluing is completed.

[0065] In combination Figure 8 , the second connecting shaft 420 and the second swing arm shaft 430 can be pipeline structures in communication with each other, and the second water inlet 421 is arranged at one end of the second connecting shaft 420 located outside the cleaning and coating barrel 100, the second swing arm shaft 430 is communicated with the third water outlet 432 to supply water to the third water outlet 432 through the second water inlet 421.

[0066] In combination Figure 2 , the cleaning and coating barrel 100 comprises a bottom disc 102 and a side wall 101, the bottom disc 102 and the side wall 101 are sealingly connected, the rotating platform 200 is arranged on the bottom disc 102, and a water leakage detection sensor is arranged on the outer wall of the bottom disc 102. In order to improve the waterproof performance, waterproof glue or other waterproof coating can be uniformly coated on the connection position of the bottom disc 102 and the side wall 101 and the inner walls of the two.

[0067] The above-mentioned air inlet pipeline or water inlet pipeline can pass through the side wall 101 and enter the cleaning and coating barrel 100. The water outlet is arranged on the bottom disc 102, and the water outlet is communicated with the drain pipe to discharge waste liquid.

[0068] In order to avoid the cleaning water or protective liquid from being thrown out of the cleaning coating barrel 100 during the cleaning and coating process, the cleaning and coating mechanism further comprises a water blocking curtain 110, which has a water blocking state and a storage state.

[0069] Specifically, the switching of the water blocking curtain 110 between the water blocking state and the storage state can be driven by a motor. Figure 3 In addition, a guide rail 111 can be arranged on the cleaning coating barrel 100 to facilitate the movement of the pull rod along the guide rail 111.

[0070] In addition, the cleaning coating barrel 100 is arranged on a support assembly, which comprises a base 500 and a support frame 510. Figure 2 The first damping component 520 and the second damping component 530 can effectively reduce the vibration during the operation of the cleaning and coating mechanism.

[0071] The laser processing equipment disclosed by the utility model comprises the cleaning and coating mechanism, so it also has the beneficial effects of the cleaning and coating mechanism.

[0072] In the specification and claims of the utility model, the terms "first" and "second" are used to distinguish different objects, not to describe a specific order, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features with "first" and "second" can explicitly or implicitly include one or more features. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion.

[0073] The above description of disclosed embodiments enables one of ordinary skill in the art to make or use the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein can be applied to other embodiments without departing from the spirit or scope of the application. The specific techniques in some embodiments can be combined with other embodiments unless explicitly excluded, either in whole or in part. Accordingly, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A cleaning and adhesive application mechanism, characterized in that, include: The cleaning and coating tank (100) has an opening for wafer entry and exit; A rotating platform (200) is rotatably disposed inside the cleaning and coating tank (100) for driving the wafer to rotate; The cleaning swing arm (300) is swingably disposed inside the cleaning coating tank (100) and is provided with a first water outlet (331), which is arranged toward the rotating platform (200). The coating arm (400) is oscillatingly disposed within the cleaning coating tank (100) and is provided with a coating port (431) which is arranged toward the rotating platform (200).

2. The cleaning and coating mechanism as described in claim 1, characterized in that, The cleaning swing arm (300) includes a first motor (310), a first connecting shaft (320), and a first swing arm shaft (330). The first motor (310) is disposed outside the cleaning coating tank (100), the first swing arm shaft (330) is disposed inside the cleaning coating tank (100), and the first water outlet (331) is disposed on the first swing arm shaft (330). The first connecting shaft (320) is drivingly connected between the first motor (310) and the first swing arm shaft (330); and / or, The coating swing arm (400) includes a second motor (410), a second connecting shaft (420), and a second swing arm shaft (430). The second motor (410) is located outside the cleaning coating tank (100), and the second swing arm shaft (430) is located inside the cleaning coating tank (100). The glue applicator (431) is located on the second swing arm shaft (430), and the second connecting shaft (420) is connected between the second motor (410) and the second swing arm shaft (430).

3. The cleaning and coating mechanism as described in claim 1, characterized in that, The cleaning and coating tank (100) has a first clearance space and a second clearance space protruding outward on its side wall. The first clearance space is used to accommodate the swinging part of the cleaning swing arm (300), and the second clearance space is used to accommodate the swinging part of the coating swing arm (400).

4. The cleaning and coating mechanism as described in claim 3, characterized in that, It also includes a lifting assembly connected to the rotary platform (200) for driving the rotary platform (200) to move up and down between the bottom and the opening of the cleaning and coating tank (100) to transport wafers; When the swinging portion of the cleaning swing arm (300) and the swinging portion of the coating swing arm (400) swing into the first clearance space and the second clearance space respectively, the cleaning swing arm (300) and the coating swing arm (400) are both misaligned with the rotating platform (200) along the bottom of the cleaning coating tank (100) towards the opening, so as to avoid the lifting and lowering action of the rotating platform (200) in the cleaning coating tank (100).

5. The cleaning and coating mechanism as described in claim 1, characterized in that, An atomizing nozzle (340) is provided at the first water outlet (331). The atomizing nozzle (340) is provided with a first interface (341), a second interface (342) and a spray outlet (343). The first interface (341) is connected to the water inlet pipe through the first water outlet (331), the second interface (342) is connected to the air inlet pipe, and the spray outlet (343) is connected to both the first interface (341) and the second interface (342) and is arranged towards the rotating platform (200).

6. The cleaning and coating mechanism as described in claim 1, characterized in that, The wafer is supported by a support member, and the cleaning swing arm (300) is provided with a second water outlet (332), which is arranged toward the support member; and / or, The coating swing arm (400) is provided with a third water outlet (432), which is arranged facing the glue application port (431).

7. The cleaning and coating mechanism as described in claim 1, characterized in that, The cleaning and coating tank (100) includes a chassis (102) and a side wall (101), the chassis (102) and the side wall (101) are sealed together, the rotating platform (200) is disposed on the chassis (102), and a leakage detection sensor is disposed on the chassis (102).

8. The cleaning and coating mechanism as described in claim 1, characterized in that, It also includes a water-blocking roller shutter (110), which has a water-blocking state and a retracted state; When the water-blocking roller shutter (110) is in the water-blocking state, the water-blocking roller shutter (110) blocks the opening of the cleaning and coating tank (100). When the water-blocking roller shutter (110) is in the retracted state, the water-blocking roller shutter (110) avoids the opening of the cleaning and coating tank (100).

9. The cleaning and coating mechanism as described in claim 1, characterized in that, The cleaning and coating tank (100) is mounted on a support assembly, the support assembly comprising: A base (500), wherein a first shock-absorbing component (520) is provided on the first side of the base (500); A support frame (510) is disposed on the second side of the base (500), the cleaning and coating bucket (100) is disposed on the support frame (510), and a second shock-absorbing component (530) is disposed between the support frame (510) and the support frame (510).

10. A laser processing device, characterized in that, Includes the cleaning and coating mechanism as described in any one of claims 1-9.

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