Optocoupler packaging structure

Abstract

The utility model relates to the technical field of semiconductor packaging, in particular to an optocoupler packaging structure. The optocoupler packaging structure at least comprises a first lead frame which is provided with a first edge area; the first edge area is provided with a first fixing glue point; the second lead frame is arranged opposite to the first lead frame, and the second lead frame is provided with a second edge area; the second edge area is provided with a second fixing glue point, and the first edge area and the second edge area are oppositely arranged at an interval; the connecting glue point is provided with a first end part and a second end part, and the first end part and the second end part are respectively connected with the first fixed glue point and the second fixed glue point, so that the first fixed glue point, the connecting glue point and the second fixed glue point are integrally connected to form a glue point assembly. The different lead frames in the optocoupler packaging structure are connected through the glue point combination body formed by multiple times of glue dispensing, the consumption of glue materials can be reduced, and meanwhile the connection strength between the different lead frames can be ensured.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor packaging, especially relates to a photo-coupler packaging structure. BACKGROUND

[0002] Optical coupler (optical coupler or photo coupler, also known as optical coupling, optical isolator and photoelectric isolator, photo-coupler) is a group of devices that use light (including visible light, infrared, etc.) as a medium to transmit electrical signals. Its function is to isolate the input circuit and the output circuit at ordinary times, and to make the electrical signal pass through the isolation layer when needed. The optical coupler generally consists of a photoelectric emission end, a photoelectric receiving end, an output signal amplification and shaping circuit unit, and a driving conversion circuit unit.

[0003] The stacked crystal type (stacked type) photo-coupler is a planar one-time plastic package. Referring to Figure 1A and Figure 1B Generally, the stacked crystal type photo-coupler uses a transparent plastic connecting block to connect the input and output ends, reducing the soldering defects caused by the shaking of the support in the process. The use of insulating connecting blocks for stacked crystal type photo-coupler packaging has high connection cost, and the insulating connecting blocks are easily impacted during production, causing the connecting block to break, thereby losing the function of supporting the lead frames at both ends of the insulating connecting block.

[0004] It should be noted that the information disclosed in this background section is only intended to increase the understanding of the overall background of the present utility model, and should not be considered as acknowledging or implying in any form that the information constitutes prior art known to those skilled in the art. CONTENT OF THE UTILITY MODEL

[0005] To solve the above-mentioned problems in the prior art, the utility model provides a photo-coupler packaging structure, which solves the problems of high cost and easy breakage of the insulating connecting block in the photo-coupler packaging structure of the prior art.

[0006] To achieve at least one of the advantages or other advantages, the utility model provides a photo-coupler packaging structure, which at least includes: a first lead frame having a first edge region; the first edge region is provided with a first fixed glue point; a second lead frame is arranged opposite to the first lead frame, and the second lead frame has a second edge region; the second edge region is provided with a second fixed glue point, and the first edge region and the second edge region are arranged in opposite intervals; and a connecting glue point has a first end and a second end, and the first end and the second end are connected with the first fixed glue point and the second fixed glue point respectively, so that the first fixed glue point, the connecting glue point and the second fixed glue point are integrally connected to form a glue point combination.

[0007] In some embodiments, the first fixed glue point is larger than the first end, and the second fixed glue point is larger than the second end.

[0008] In some embodiments, the first fixed glue point and the second fixed glue point are both groove-shaped structures.

[0009] In some embodiments, the first fixed glue point and the second fixed glue point are respectively provided with glue flow channels.

[0010] In some embodiments, an insulation gap is formed between the first edge region and the second edge region, and the width of the connection glue point is equal to the width of the insulation gap.

[0011] In some embodiments, the material of the glue point combination is insulation glue.

[0012] The optical coupling packaging structure provided by the utility model has at least the following advantages compared with the existing stacked crystal optical coupling packaging structure:

[0013] 1. In the optical coupling packaging structure, the lead frames of the input end and the output end are connected through the glue point combination composed of the first fixed glue point, the second fixed glue point and the connection glue point on different lead frames, which not only reduces the consumption of glue material and the manufacturing cost, but also meets the requirement of connection strength.

[0014] 2. Compared with a single glue point formed by one-time dispensing, the glue point combination is formed by multiple dispensing, which can prevent the insulation glue from flowing away from the insulation gap between different lead frames when the connection glue point is dispensed, and reduce the adverse effects of glue overflow. DRAWINGS

[0015] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or the prior art, the drawings needed to be used in the embodiment or the prior art description will be briefly introduced below. Obviously, the drawings in the following description are some embodiments of the utility model, and those skilled in the art can also obtain other drawings according to these drawings without creative labor.

[0016] Figure 1A And Figure 1B It is a structural schematic diagram of the existing optical coupling packaging structure.

[0017] Figure 2 It is a sectional structure schematic diagram of an embodiment of the optical coupling packaging structure in the utility model.

[0018] Figure 3 It is Figure 2 It is a top view structure schematic diagram of an embodiment of the optical coupling packaging structure shown in the figure.

[0019] Figure 4 It is Figure 2 It is a structure enlarged schematic diagram of an embodiment of the glue point combination in the optical coupling packaging structure shown in the figure.

[0020] A-insulating connecting block, B-input end support, C-output end support, 100-optocoupler package structure, 200-gel point assembly, 10-first lead frame, 11-first edge region, 12-first fixed gel point, 20-second lead frame, 21-second edge region, 22-second fixed gel point, S-insulating gap, 30-adapter gel point, 31-first end, 32-second end, 200-gel point assembly, 40-light receiving chip, 50-insulating gel, 60-light emitting chip, 70-encapsulation gel. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical scheme and advantages of the embodiments of the present application more clear, the technical scheme in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0022] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "transverse", "upper", "lower", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or component referred to must have a particular orientation, or be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features limited by "first" and "second" can explicitly or implicitly include one or more of the features. In the description of the present application, unless otherwise specified, the meaning of "a plurality of" is two or more. In addition, the term "comprising" and any variation thereof means "at least including".

[0023] In the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounting", "connection" and "connection" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integrally formed connection; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or the communication between two components. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0024] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments. Unless the context clearly indicates otherwise, the singular forms “a” and “an” as used herein are also intended to include the plural. It should also be understood that the terms “comprising” and / or “including” as used herein specify the presence of the stated features, integers, steps, operations, units, and / or components, without excluding the presence or addition of one or more other features, integers, steps, operations, units, components, and / or combinations thereof.

[0025] Please combine Figure 1A and Figure 1B See Figure 2 , Figure 2 This is a side cross-sectional view of one embodiment of the optocoupler packaging structure of this utility model. Figure 3 for Figure 2 The diagram shows a top view of one embodiment of the optocoupler packaging structure. Figure 4 for Figure 2 The diagram shows an enlarged view of an embodiment of the adhesive dot assembly in the optical coupler packaging structure. To achieve at least one or more of the aforementioned advantages, one embodiment of this invention provides an optical coupler packaging structure 100, comprising at least a first lead frame 10, a second lead frame 20, and an adhesive dot assembly 200. The first lead frame 10 and the second lead frame 20 are arranged at relative intervals and are connected and fixed by the adhesive dot assembly 200. Optionally, the material of the adhesive dot assembly 200 is insulating adhesive. Further, the material of the adhesive dot assembly 200 is silicone.

[0026] like Figure 2 As shown, viewed from the outside of the optocoupler packaging structure 100, it includes an encapsulating colloid 70 and a first leadframe 10 and a second leadframe 20 located on both sides of the encapsulating colloid 70. One of the first leadframe 10 and the second leadframe 20 can serve as an input terminal, and the other as an output terminal. The outer shell of the encapsulating colloid 70 is opaque. The encapsulating colloid 70 can be made of a high molecular polymer such as epoxy resin, providing dustproof and waterproof effects.

[0027] Inside the encapsulating colloid 70, the first lead frame 10 and the second lead frame 20 are arranged with a relative gap. On the side facing the second lead frame 20, the first lead frame 10 has a first edge region 11. On the side facing the first lead frame 10, the second lead frame 20 has a second edge region 21. It can be understood that inside the encapsulating colloid 70, the first edge region 11 of the first lead frame 10 and the second edge region 21 of the second lead frame 20 are arranged with a relative gap, and an insulating gap S is formed between the first edge region 11 and the second edge region 21.

[0028] Optionally, the light coupling package structure 100 in the illustrated embodiment is a flip-chip type package structure. The light receiving chip 40 is arranged above (front side in the figure) the second lead frame 20. An insulating adhesive 50 is arranged in a partial area above the light receiving chip 40. Then, the light emitting chip 60 is arranged above the insulating adhesive 50. In this way, the light receiving chip 40 and the light emitting chip 60 are arranged in a flip-chip type, which can also be referred to as an up-down structure. The material of the insulating adhesive 50 can be silicone. The area of the light receiving chip 40 where no insulating adhesive 50 is arranged can be connected to the second lead frame 20 by gold wires. The light emitting chip 60 can be connected to the first lead frame 10 by gold wires. The first edge area 11 of the first lead frame 10 and the second edge area 21 of the second lead frame 20 are connected and fixed by the glue point assembly 200.

[0029] In combination Figure 2 Referring to Figure 3 and Figure 4 , the glue point assembly 200 can be composed of the first fixing glue point 12, the connecting glue point 30 and the second fixing glue point 22. The first edge area 11 of the first lead frame 10 is provided with the first fixing glue point 12. The second edge area 21 of the second lead frame 20 is provided with the second fixing glue point 22. In the illustrated embodiment, the first fixing glue point 12 is arranged above (front side in the figure) the first lead frame 10. The second fixing glue point 22 is arranged above (front side in the figure) the second lead frame 20.

[0030] In some embodiments, the first fixing glue point 12 and the second fixing glue point 22 are both groove-shaped structures, which are beneficial for accommodating, placing and fixing the glue material. Optionally, the first fixing glue point 12 and the second fixing glue point 22 are recessed groove structures. For example, the recessed groove structure can be rectangular, circular or other irregular shapes. The glue material of the first fixing glue point 12 and the second fixing glue point 22 can be arranged by means of dispensing.

[0031] In other embodiments, the area of the first fixing glue point 12 in the first lead frame 10 is provided with a glue flow channel, which can guide the glue flow and control the glue amount during dispensing, and the dispensing forming effect is good. The area of the second fixing glue point 22 in the second lead frame 20 is provided with a glue flow channel, which can guide the glue flow and control the glue amount during dispensing, and the dispensing forming effect is good.

[0032] The connecting glue point 30 has oppositely arranged first and second end portions 31 and 32. The first and second end portions 31 and 32 are connected to the first and second fixing glue points 12 and 22, respectively, so that the first fixing glue point 12, the connecting glue point 30 and the second fixing glue point 22 are integrally connected to form the glue point assembly 200.

[0033] In a packaging process, the dispensing operation can be performed on the first fixed glue point 12 of the first lead frame 10 and the second fixed glue point 22 of the second lead frame 20 respectively, and then the dispensing operation is performed to form the connecting glue point 30 above the insulation gap S and between the first fixed glue point 12 and the second fixed glue point 22, thereby forming the integrated glue point combination 200, and then the first lead frame 10 and the second lead frame 20 are connected and fixed in the packaging glue 70.

[0034] Referring to Figure 3 As shown in the top view of the optical coupling packaging structure 100, the packaging glue 70 has a rectangular structure with two opposite long sides and short sides, and the first fixed glue point 12, the connecting glue point 30 and the second fixed glue point 22 are arranged in a region adjacent to one long side of the packaging glue 70. In the actual optical coupling packaging structure 100 product, the positions of the first fixed glue point 12, the connecting glue point 30 and the second fixed glue point 22 can be selected and determined according to the structure of the first lead frame 10 and the second lead frame 20, thereby ensuring that the glue point combination 200 has a connection strength that meets the requirements, while reducing the amount of glue material and the manufacturing cost.

[0035] Figure 1A And Figure 1B The connecting blocks between different lead frames need to be prepared in advance before use, such as Figure 1B The connecting block is a rectangular block. In order to ensure that the connecting block has sufficient connection strength, the overall shape of the connecting block is large and the material consumption is high. At the same time, according to the different structures of the lead frames, the shape of the connecting block is not very convenient to adjust according to the needs. Figure 1A And Figure 1B In the present application, the first lead frame 10 and the second lead frame 20 are connected and fixed by the glue point combination 200 in the internal region of the packaging glue 70, the overall consumption of glue material is small, the manufacturing cost is reduced, and the requirements of connection strength can be met. Furthermore, according to the different structures of the lead frames and the different requirements of the connection strength, the amount of glue material of the first fixed glue point 12, the second fixed glue point 22 and the connecting glue point 30 can be adjusted and controlled, which is convenient to use.

[0036] If the first lead frame 10 and the second lead frame 20 are formed by one-time dispensing of a single glue point, the glue liquid is likely to flow away through the insulation gap S, and the overflowed glue liquid can cause adverse effects in the encapsulation glue body 70. In contrast, in the present application, the glue point combination 200 connected and fixed between the first lead frame 10 and the second lead frame 20 in the internal region of the encapsulation glue body 70 is composed of the first fixed glue point 12, the connecting glue point 30, and the second fixed glue point 22. When dispensing, the first fixed glue point 12 and the second fixed glue point 22 can be formed by dispensing on the first lead frame 10 and the second lead frame 20 respectively, and then the connecting glue point 30 can be formed by dispensing. In this way, the dispensing amount of the connecting glue point 30 can be controlled and adjusted according to the size / shape of the first fixed glue point 12 and the second fixed glue point 22, so as to avoid or reduce the flow of glue liquid from the insulation gap S, and improve the overall effect of the optical coupling package.

[0037] As shown in Figure 3 and Figure 4 In some embodiments, the overlapping region of the connecting glue point 30 with the first lead frame 10 and the second lead frame 20, the first fixed glue point 12 is larger than the first end 31, and the second fixed glue point 22 is larger than the second end 32, so as to reduce the glue material consumption of the connecting glue point 30 at the first end 31 and the second end 32, and at the same time, to ensure that the formed glue point combination 200 reaches the required connection strength.

[0038] In the illustrated embodiment, the first fixed glue point 12 and the outermost edge of the first lead frame 10 towards the second lead frame 20 have a certain spacing in the first edge region 11 of the first lead frame 10; the second fixed glue point 22 and the outermost edge of the second lead frame 20 towards the first lead frame 10 have a certain spacing in the second edge region 21 of the second lead frame 20. In this way, when dispensing the first fixed glue point 12 and the second fixed glue point 22, the glue liquid can be prevented from overflowing into the insulation gap S. Alternatively, the width of the connecting glue point 30 is greater than the width of the insulation gap S. As shown, the first end 31 of the connecting glue point 30 and the outermost edge of the first lead frame 10 towards the second lead frame 20 have a certain spacing, and there is an overlapping part with the end of the first fixed glue point 12 towards the second lead frame 20. The second end 32 of the connecting glue point 30 and the outermost edge of the second lead frame 20 towards the first lead frame 10 have a certain spacing, and there is a part of the overlapping with the end of the second fixed glue point 22 towards the first lead frame 10. It can be understood that, from the top view of the optical coupling package structure 100, the connecting glue point 30 spans the upper region of the first lead frame 10 and the second lead frame 20 spaced apart, so as to fix the first lead frame 10 and the second lead frame 20.

[0039] Finally, it should be noted that: the above embodiments are used to illustrate the technical solutions of the present application, but not limited to them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement to part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. An optocoupler packaging structure, characterized in that, At least including: A first conductor frame has a first edge region; the first edge region is provided with a first fixing adhesive point; The second wire frame is arranged opposite to the first wire frame, and the second wire frame has a second edge region; the second edge region is provided with a second fixing adhesive point, and the first edge region and the second edge region are arranged at intervals relative to each other; as well as The connecting adhesive point has a first end and a second end, the first end and the second end being connected to the first fixing adhesive point and the second fixing adhesive point respectively, so that the first fixing adhesive point, the connecting adhesive point and the second fixing adhesive point are integrally connected to form an adhesive point assembly.

2. The optocoupler packaging structure according to claim 1, characterized in that, The first fixing adhesive point is larger than the first end, and the second fixing adhesive point is larger than the second end.

3. The optocoupler packaging structure according to claim 1, characterized in that, Both the first fixing adhesive point and the second fixing adhesive point are groove-shaped structures.

4. The optocoupler packaging structure according to claim 1, characterized in that, The first and second fixed adhesive points are each provided with adhesive flow channels.

5. The optocoupler packaging structure according to claim 1, characterized in that, An insulating gap is formed between the first edge region and the second edge region, and the width of the connecting adhesive dot is greater than the width of the insulating gap.

6. The optocoupler packaging structure according to claim 1, characterized in that, The material of the adhesive dot assembly is insulating adhesive.

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