Liquid cooling power supply module and battery charging and discharging detection equipment

Abstract

The utility model relates to the technical field of battery production equipment, in particular to a liquid cooling power supply module and battery charge and discharge detection equipment, a circuit board is used for supplying power to a probe assembly, a heat dissipation piece comprises a shell, a liquid inlet and a liquid outlet are formed in the shell, a medium flow channel is arranged in the shell, the medium flow channel is communicated between the liquid inlet and the liquid outlet, and the liquid inlet is communicated with the liquid outlet. A cooling medium passes through the medium flow channel; the shell is in heat-conducting connection with the circuit board; the liquid inlet pipe is communicated with the liquid inlet, and one end of the liquid inlet pipe is used for being connected with cooling medium supply equipment so as to transport a cooling medium to the heat dissipation piece; the liquid outlet pipe is communicated with the liquid outlet, and one end of the liquid outlet pipe is used for being connected with cooling medium collecting equipment so as to collect the cooling medium after heat absorption. And heat exchange can be realized between the cooling medium and the circuit board. By means of the design, heat generated by the circuit board can be effectively transmitted to the cooling medium, rapid heat transfer is achieved, the heat conduction effect is better, and the heat conduction efficiency is higher.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of battery production equipment, in particular to a liquid-cooled power module and a battery charge-discharge detection device. BACKGROUND

[0002] The technical field of battery production equipment is an important part of the battery industry, which covers the entire production process of batteries from raw material processing to finished battery assembly. In this process, there are multiple key process links such as capacity distribution and formation, and each link has high requirements for the accuracy, efficiency and automation level of the equipment. With the rapid development of the battery industry, higher standards are required for the performance and reliability of manufacturing equipment, prompting the industry to continuously innovate technology and optimize processes.

[0003] The battery charge-discharge detection device supplies power to the probe assembly through the power module, and the probe assembly can contact and charge-discharge the battery. During the operation of the device, the power module needs to be charged in constant current, constant voltage, constant current and constant voltage, and other charging modes, and the constant current discharging mode will feed the power back to the power grid. A large amount of heat will be released during the operation of the power module, which will increase the surrounding temperature, and the temperature increase will have a significant impact on the operation of the device. CONTENT OF THE UTILITY MODEL

[0004] The application embodiment discloses a liquid-cooled power module and a battery charge-discharge detection device, which can pass cooling medium into the heat dissipation piece, and heat-conducting connect the shell of the heat dissipation piece with the circuit board, so that the cooling medium and the circuit board complete heat exchange, and the cooling medium carries away the heat generated by the circuit board, which has good heat conduction effect and high heat conduction efficiency.

[0005] In order to achieve the above purpose, the application embodiment discloses a liquid-cooled power module, which comprises:

[0006] A circuit board for supplying power to a probe assembly;

[0007] A heat dissipation piece comprising a shell, the shell being provided with an inlet and an outlet, the shell having a medium flow channel therein, the medium flow channel being communicated between the inlet and the outlet, the medium flow channel being used for passing cooling medium, and the shell being heat-conducting connected with the circuit board;

[0008] An inlet pipe communicated with the inlet, one end of the inlet pipe being used for connecting a cooling medium supply device to transport cooling medium to the heat dissipation piece;

[0009] An outlet pipe communicated with the outlet, one end of the outlet pipe being used for connecting a cooling medium collection device to collect the cooling medium after heat absorption.

[0010] As an optional implementation, the circuit board includes at least two, and both of the circuit boards are in thermal contact with the shell.

[0011] As an optional implementation, the shell includes a first surface and a second surface arranged oppositely, and the first surface and the second surface are respectively in thermal contact with two adjacent circuit boards.

[0012] As an optional implementation, the circuit board includes a third surface and a fourth surface arranged oppositely, the third surface includes a connecting area, the shell is in thermal contact with the connecting area, the third surface of the circuit board is provided with a first heat-generating element, and the connecting area is arranged close to the first heat-generating element.

[0013] The circuit board is further provided with a second heat-generating element, the second heat-generating element is arranged on the fourth surface or the connecting area, and when the second heat-generating element is arranged on the fourth surface, the second heat-generating element is positionally corresponding to the connecting area in the thickness direction of the circuit board.

[0014] As an optional implementation, the medium flow channel includes a first straight line segment and a second straight line segment, and a connecting segment communicated between the first straight line segment and the second straight line segment, the first straight line segment is communicated with the liquid inlet, the second straight line segment is communicated with the liquid outlet, one end of the first straight line segment away from the liquid inlet is communicated with one end of the second straight line segment away from the liquid outlet through the connecting segment, the first straight line segment is arranged close to the first surface of the heat dissipation member, and the second straight line segment is arranged close to the second surface of the heat dissipation member.

[0015] As an optional implementation, first heat dissipation members and second heat dissipation members are arranged between two adjacent circuit boards, the first heat dissipation members and the second heat dissipation members are arranged at intervals, the first heat dissipation members are respectively in thermal contact with two adjacent circuit boards, and the second heat dissipation members are respectively in thermal contact with two adjacent circuit boards.

[0016] As an optional implementation, the liquid outlet of the first heat dissipation member is communicated with the liquid inlet of the second heat dissipation member.

[0017] As an optional implementation, the liquid-cooled power supply module further includes a mounting plate, the circuit board is arranged on the mounting plate, the mounting plate is used for electrically connecting the circuit board and the probe assembly, and the plurality of circuit boards are arranged at intervals in the thickness direction of the circuit board.

[0018] As an optional implementation, the shell and the circuit board are in thermal contact through a thermal conductive adhesive.

[0019] In a second aspect, the embodiment discloses a battery charging and discharging detection device, the battery charging and discharging detection device comprises:

[0020] A probe assembly is used for charging and discharging the battery.

[0021] The liquid-cooled power module is located above the probe assembly, and the circuit board is electrically connected with the probe assembly.

[0022] Compared with the prior art, the application has the following beneficial effects:

[0023] The liquid-cooled power module provided by the embodiment of the application is used for supplying power to the probe assembly, the heat dissipation member comprises a shell, the shell is provided with an inlet and an outlet, the shell has a medium flow channel therein, the medium flow channel is communicated between the inlet and the outlet, the medium flow channel is used for passing cooling medium, and the shell is in heat conduction connection with the circuit board; the inlet pipe is communicated with the inlet, one end of the inlet pipe is used for connecting a cooling medium supply device to transport cooling medium to the heat dissipation member; the outlet pipe is communicated with the outlet, and one end of the outlet pipe is used for connecting a cooling medium collection device to collect the heat-absorbed cooling medium. By arranging the medium flow channel in the heat dissipation member and passing the cooling medium, and by heat-conducting connecting the shell of the heat dissipation member with the circuit board, heat exchange can be achieved between the cooling medium and the circuit board. This design enables the heat generated by the circuit board to be effectively transferred to the cooling medium, so that the heat is quickly transferred, and thus the heat conduction effect is better and the heat conduction efficiency is higher. The liquid-cooled power module does not generate additional heat, and heat exchange can still be completed in a high-temperature environment. The heat generated by the circuit board can always be taken away by the cooling medium, so that the normal operation of the components in the power module is ensured. BRIEF DESCRIPTION OF DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the application, the following will briefly introduce the drawings needed to be used in the embodiments. Obviously, the drawings in the following description only constitute some embodiments of the application, and for those skilled in the art, other drawings can also be obtained without creative labor.

[0025] Figure 1 A structural schematic view of the liquid-cooled power module disclosed by the embodiment of the application in a first perspective view;

[0026] Figure 2 A structural schematic view of the liquid-cooled power module disclosed by the embodiment of the application in a second perspective view;

[0027] Figure 3 A structural schematic view of the liquid-cooled power module disclosed by the embodiment of the application in a second perspective view; Figure 2 A structural schematic view of the circuit board and the heat dissipation member;

[0028] Figure 4A structure diagram of a heat dissipation member; Figure 3 A structure diagram of a heat dissipation member from another perspective;

[0029] Figure 5 A structure diagram of a heat dissipation member;

[0030] Figure 6 A structure diagram of a heat dissipation member;

[0031] Figure 7 A structure diagram of a heat dissipation member; Figure 6 A sectional view at A-A.

[0032] Explanation of reference signs:

[0033] 100-liquid-cooled power supply module; 1-circuit board; 11-third surface; 11a-connection area; 111-first heat generating element; 12-fourth surface; 121-second heat generating element; 2-heat dissipation member; 21-housing; 21a-liquid inlet; 21b-liquid outlet; 211-first surface; 212-second surface; 22-medium flow channel; 221-first straight segment; 222-second straight segment; 223-connection segment; 23-first heat dissipation member; 24-second heat dissipation member; 3-liquid inlet pipe; 4-liquid outlet pipe; 5-mounting plate; 6-electrical connecting member. DETAILED DESCRIPTION

[0034] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of protection of the present application.

[0035] In the present application, the terms "upper", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. These terms are mainly used to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0036] In addition, in addition to indicating the orientation or positional relationship, the above-mentioned part of the terms can also be used to indicate other meanings, for example, the term "upper" can also be used to indicate a certain dependent relationship or connection relationship in some cases. Those of ordinary skill in the art can understand the specific meaning of these terms in the present application according to the specific situation.

[0037] In addition, the terms "mounting", "arrangement", "provided with", "connected" should be understood broadly. For example, it can be fixed connection, detachable connection, or integral structure; it can be mechanical connection, or electrical connection; it can be direct connection, or indirect connection through intermediate medium, or internal communication between two devices, elements or components. The specific meaning of the above terms in this application can be understood according to the specific circumstances by those skilled in the art.

[0038] In addition, the terms "first", "second", etc. are mainly used to distinguish different devices, elements or components (the specific types and structures may be the same or different), and are not intended to indicate or imply the relative importance and quantity of the indicated devices, elements or components. Unless otherwise stated, the meaning of "multiple" is two or more.

[0039] The battery production technology field is an important part of the battery industry, which covers the entire production process of battery from raw material processing to finished battery assembly. In this process, there are many key process links such as capacity distribution, formation, etc., and each link has very high requirements for the accuracy, efficiency and automation level of the equipment. With the rapid development of the battery industry, higher standards for the performance and reliability of manufacturing equipment are put forward, prompting the industry to continuously innovate technology and optimize process.

[0040] Battery formation is the process of charging the positive and negative materials in the battery and forming an electrochemical reaction, so that the chemical reaction system inside the battery reaches a stable state and forms a SEI film (solid electrolyte interface). The SEI film can prevent the chemical reaction process inside the battery from getting out of control, while protecting the interface between the electrolyte and the electrode material, thereby improving the cycle life and safety performance of the battery. First, the positive and negative materials in the battery are initially charged, which quickly forms a chemical reaction system, thereby laying the foundation for subsequent cell formation. Then the battery is charged at a constant current, which activates and stabilizes the chemical reaction system inside the battery, thereby improving the capacity and cycle life of the battery. Second, the battery is charged at a constant voltage, which stabilizes the chemical reaction system inside the battery, thereby improving the performance stability and safety performance of the battery. After completing the cell formation, the battery needs to be discharged for testing to detect whether the performance and safety performance of the battery meet the requirements.

[0041] Battery capacity is a key step in battery manufacturing and quality control. Capacity refers to charging and discharging tests on the battery to accurately measure the actual capacity of the battery, ensuring that each battery unit in the battery pack has similar performance. The battery is first charged at a constant current until the preset charging cutoff voltage is reached, and after the charging is completed, the battery is allowed to stand for a period of time to allow the temperature and pressure inside the battery to naturally balance. After standing, the battery is discharged at a constant current until the discharge cutoff voltage is reached. The discharge current is usually set according to the rated capacity of the battery, and after the discharge is completed, the battery is again allowed to stand to simulate the rest state in actual use. After standing, the battery is charged at a constant current for the second time until the charging cutoff voltage is reached. After constant current charging, the battery enters the constant voltage charging stage, at which time the charging current gradually decreases until the charging current decreases to a very low value, indicating that the battery is close to full charge. After constant voltage charging, the battery is finally discharged at a constant current to determine the actual capacity of the battery. During the entire capacity test, the voltage, current and temperature of the battery are monitored and recorded in real time. After the capacity test is completed, the performance of the battery is evaluated by analyzing these data, and the battery is classified according to its capacity and internal resistance. According to the results of the capacity test, the battery is classified into different grades for subsequent assembly and use.

[0042] The battery charge and discharge detection device supplies power to the probe assembly through the power module, and the probe assembly can contact the battery and charge and discharge the battery. During the operation of the device, the power module needs to be charged in constant current, constant voltage, constant current and constant voltage, etc. The constant current discharge mode feeds the power back to the power grid. A large amount of heat is released during the operation of the power module, which increases the surrounding temperature. The increase in temperature has a significant impact on the operation of the device.

[0043] To solve the above problems, in the conventional method, the power module device is generally cooled by aluminum fins and forced air cooling by a fan. The fan operation will bring some noise, and it is also unstable due to environmental factors. In a normal temperature environment, the air cooling mode cools slowly and is prone to heat accumulation.

[0044] Based on this, the embodiment of the present application discloses a liquid-cooled power module and a battery charge and discharge detection device, which can pass cooling medium into the heat dissipation piece and thermally connect the shell of the heat dissipation piece with the circuit board to complete heat exchange between the cooling medium and the circuit board.

[0045] The technical solutions of the present application will be further described below with reference to the embodiments and drawings.

[0046] Please refer to Figures 1 to 3 , Figure 1 The structure schematic diagram of the liquid-cooled power module 100 disclosed by the embodiment of the present application is in the first perspective, Figure 2 The structure schematic diagram of the liquid-cooled power module 100 disclosed by the embodiment of the present application is in the second perspective,Figure 3 For Figure 2 A structural schematic diagram of the circuit board 1 and the heat dissipation member 2. The embodiment of the present application discloses a liquid-cooled power module 100, which comprises:

[0047] The circuit board 1 is electrically connected with the probe assembly, and is used for supplying power to the probe assembly;

[0048] The heat dissipation member 2 comprises a shell 21, the shell 21 is provided with an inlet 21a and an outlet 21b, and the shell 21 has a medium flow channel 22 inside, the medium flow channel 22 is communicated between the inlet 21a and the outlet 21b, the medium flow channel 22 is used for transporting the cooling medium, and the shell 21 is in thermal conductive connection with the circuit board 1;

[0049] The inlet pipe 3 is communicated with the inlet 21a, and one end of the inlet pipe 3 is used for connecting a cooling medium supply device to transport the cooling medium to the heat dissipation member 2;

[0050] The outlet pipe 4 is communicated with the outlet 21b, and one end of the outlet pipe 4 is used for connecting a cooling medium collection device to collect the cooling medium after absorbing heat.

[0051] In this way, by arranging the medium flow channel 22 in the heat dissipation member 2 and introducing the cooling medium, and by thermally connecting the shell 21 of the heat dissipation member 2 with the circuit board 1, heat exchange can be realized between the cooling medium and the circuit board 1. The cooling medium can directly absorb the heat generated by the circuit board 1 in this design, and this conduction mode enables the heat to be rapidly transferred from the circuit board 1 to the cooling medium, thereby realizing efficient heat dissipation. The heat generated by the circuit board 1 is more effectively transferred to the cooling medium, realizing rapid heat transfer, thereby achieving better heat conduction effect and higher heat conduction efficiency. The liquid-cooled power module 100 does not generate additional heat, and heat exchange can still be completed in a high-temperature environment, the heat generated by the circuit board 1 can always be taken away by the cooling medium, thereby ensuring the normal operation of the components in the power module.

[0052] Pure liquid cooling for power module heat dissipation does not bring additional noise pollution. Compared with the traditional air-cooled heat dissipation mode, the fan in the air-cooled system will produce noise when running at high speed. Pure liquid cooling can better maintain the operating environment of the circuit board 1 and ensure the good operation of the power module. A stable temperature environment is of great importance to the performance and service life of electronic components. Through effective heat dissipation, the problems such as performance degradation, aging and even damage of the circuit board 1 caused by overheating are avoided.

[0053] It can be understood that the cooling medium can be water, hydrofluorocarbon or any possible cooling medium, and the embodiment does not limit the same.

[0054] As an optional implementation, in combination with Figures 1 to 3The circuit board 1 includes at least two, and the two circuit boards 1 are in thermal contact with the shell 21.

[0055] In this way, one heat dissipation member 2 can simultaneously dissipate heat for two circuit boards 1, improving the overall heat dissipation efficiency, and being particularly suitable for complex circuit systems that need to handle a large amount of heat. In a high-temperature environment, the heat generated by multiple circuit boards 1 working simultaneously is large, and the simultaneous thermal contact of the shell 21 of the heat dissipation member 2 with the two circuit boards 1 can more effectively carry away the heat, ensuring that the circuit boards 1 can still operate normally in a high-temperature environment, improving the stability and reliability of the system.

[0056] In some optional embodiments, in combination with Figures 3 to 5 , Figure 4 For Figure 3 is a structural schematic view from another perspective, Figure 5 is a structural schematic view of the heat dissipation member 2, and the shell 21 includes first and second surfaces 211 and 212 arranged opposite to each other, and the first and second surfaces 211 and 212 are respectively in thermal contact with the adjacent two circuit boards 1.

[0057] In this way, the heat dissipation member 2 can dissipate heat from two directions for two circuit boards 1 respectively, further improving the heat dissipation efficiency, and also making the arrangement of the circuit boards 1 and the heat dissipation member 2 more compact. In a limited space, by reasonably utilizing the two surfaces of the shell 21 to be in thermal contact with the circuit boards 1, the additional space layout that may be needed due to the use of single-sided heat dissipation is avoided.

[0058] In some embodiments, in combination with Figures 3 to 5 The circuit board 1 includes third and fourth surfaces 11 and 12 arranged opposite to each other, the third surface 11 includes a connecting area 11a, the shell 21 is in thermal contact with the connecting area 11a, the third surface 11 of the circuit board 1 is provided with a first heat generating element 111, and the connecting area 11a is arranged close to the first heat generating element 111;

[0059] The circuit board 1 is further provided with a second heat generating element 121, and the second heat generating element 121 is arranged on the fourth surface 12 or the connecting area 11a. When the second heat generating element 121 is arranged on the fourth surface 12, the second heat generating element 121 corresponds in position to the connecting area 11a in the thickness direction of the circuit board 1.

[0060] The first heating element 111 is a capacitor, and the second heating element 121 is a MOS tube (Metal-Oxide-Semiconductor Field-Effect Transistor). The MOS tube controls the current between the source and the drain through the gate voltage and is widely used in circuits such as switching, amplification, and signal processing. The MOS tube has a certain on-resistance when it is turned on, and when the current passes through, it generates Joule heat, resulting in a large amount of heat. The capacitor mainly stores energy and filters in the circuit, and almost has no resistive loss, so the heat is smaller than that of the MOS tube.

[0061] The third surface 11 includes a connecting area 11a for heat conduction connection with the shell 21 and a non-connecting area for arranging the heating element 111. In this way, the heat generated by the heating element 111 can be conducted to the heat dissipation member 2 in the shortest distance, making the heat conduction more direct and efficient, thereby improving the heat conduction effect and efficiency. When the second heating element 121 is arranged on the fourth surface 12, the second heating element 121 corresponds to the position of the connecting area 11a in the thickness direction of the circuit board 1, so that the second heating element 121 is closer to the shell 21 of the heat dissipation member 2, the heat conduction is faster, and the heat dissipation effect is better. When the second heating element 121 is arranged on the connecting area, the shell 21 of the heat dissipation member 2 and the second heating element 121 can more directly transfer heat. Since the MOS tube generates more heat, it can more effectively and quickly transfer the heat generated by the MOS tube.

[0062] The cooling medium in the heat dissipation member 2 exchanges heat with the circuit board 1, which can more quickly and fully absorb the heat generated by the circuit board 1, ensuring that the heat generated by the heating element 111 can be effectively removed under different working conditions, especially when the heating element 111 generates a large amount of heat.

[0063] As an optional embodiment, in combination with Figures 5 to 7 , Figure 6 Another structural diagram of the heat dissipation member 2, Figure 7 A cross-sectional view of A-A in Figure 6 The medium flow channel 22 includes a first straight segment 221 and a second straight segment 222, and a connecting segment 223 connected between the first straight segment 221 and the second straight segment 222. The first straight segment 221 is connected to the liquid inlet 21a, and the second straight segment 222 is connected to the liquid outlet 21b. The end of the first straight segment 221 away from the liquid inlet 21a is connected to the end of the second straight segment 222 away from the liquid outlet 21b through the connecting segment 223. The first straight segment 221 is arranged close to the first surface 211 of the heat dissipation member 2, and the second straight segment 222 is arranged close to the second surface 212 of the heat dissipation member 2.

[0064] In this way, the medium flow channel 22 of the heat dissipation member 2 is approximately U-shaped, and the two straight sections are close to the side walls, so that the distribution of the cooling medium in the accommodation cavity is more reasonable. This design enables the cooling medium to more accurately approach the areas of the circuit board 1 that need to be cooled, without flowing and filling in unnecessary space, thereby effectively reducing the amount of cooling medium used. In mass production and application, the reduction in the amount of cooling medium used means a reduction in cost, while also avoiding the problem of resource waste that may be caused by excessive use of cooling medium. In addition, from the overall system perspective, the reduction in the amount of cooling medium used can also reduce the specification requirements of the cooling medium supply equipment and collection equipment, further saving equipment costs and space resources.

[0065] Since the heat generation conditions at different positions of the circuit board 1 can be different, the cooling medium close to the side walls can more timely absorb these heat, avoiding the accumulation of heat in local areas, further improving the uniformity of heat dissipation. Compared with the traditional heat dissipation structure, this design can more effectively reduce the overall temperature of the circuit board 1, ensuring that the components on the circuit board 1 work in a more suitable temperature environment, reducing the risk of performance degradation and failure caused by excessive temperature.

[0066] Optionally, in combination with Figure 3 , a first heat dissipation member 23 and a second heat dissipation member 24 are arranged between the two adjacent circuit boards 1, the first heat dissipation member 23 and the second heat dissipation member 24 are arranged in a spaced manner, the first heat dissipation member 23 is in thermal conductive connection with the two adjacent circuit boards 1 respectively, and the second heat dissipation member 24 is in thermal conductive connection with the two adjacent circuit boards 1 respectively.

[0067] In this way, the two heat dissipation members 2 arranged in a spaced manner are in thermal conductive connection with the two adjacent circuit boards 1 respectively, increasing the contact area of the heat dissipation member 2 and the circuit board 1. The larger the contact area, the faster the heat transfer rate under the same temperature difference. When the contact area of the heat dissipation member 2 and the circuit board 1 increases, the heat generated by the circuit board 1 can be more quickly transferred to the heat dissipation member 2, and then taken away by the cooling medium. This means that the temperature of the circuit board 1 can be reduced more efficiently, ensuring that the components on the circuit board 1 work within a suitable temperature range. Compared with the traditional heat dissipation method, this design of increasing the contact area can significantly improve the heat dissipation effect, effectively reducing the performance degradation, shortening of service life, and even damage of components caused by excessive temperature, and ensuring the stable operation of the power module. In addition, the heat dissipation members 2 arranged in a spaced manner can avoid the components on the circuit board 1, effectively utilize the space, and make the arrangement more reasonable.

[0068] Meanwhile, the larger contact area between the heat dissipation member 2 and the circuit board 1 also enhances the stability of the connection therebetween. During the operation of the power module, the thermal expansion and contraction of the materials due to temperature changes will cause thermal stress. The larger contact area can make the thermal stress more evenly distributed, reducing the stress concentration caused by thermal expansion and contraction, thereby reducing the risk of structural damage and prolonging the service life of the entire power module.

[0069] In some optional embodiments, in combination with Figure 2 and Figure 3 , the liquid outlet 21b of the first heat dissipation member 23 is connected to the liquid inlet 21a of the second heat dissipation member 24.

[0070] In this way, the medium flow channels 22 of the two heat dissipation members 2 between every two adjacent circuit boards 1 are connected, and the flow path of the cooling medium between adjacent heat dissipation members 2 is directly connected. In the actual layout of the liquid cooling system pipeline, this connection greatly simplifies the pipeline connection. Compared with the traditional method of connecting the liquid inlet pipe 3 and the liquid outlet pipe 4 of each heat dissipation member 2 independently, after the medium flow channels 22 of adjacent heat dissipation members 2 are connected, only the liquid inlet and outlet pipeline connection needs to be made at the starting end and the end of a small heat dissipation module. In this way, not only the number and complexity of the pipeline are reduced, the difficulty and cost of pipeline installation are reduced, but also the risk of leakage due to too many pipeline connection points is reduced, and the reliability and stability of the entire liquid cooling system are improved.

[0071] Moreover, after completing the flow in one heat dissipation member 2, the cooling medium can directly enter the adjacent heat dissipation member 2 between two circuit boards 1 to continue to dissipate heat, rather than being directly discharged. This means that the utilization rate of the cooling medium is greatly improved, and the total amount of cooling medium required is reduced under the same heat dissipation demand. In large-scale production and long-term use, the reduction of the amount of cooling medium not only reduces the procurement cost, but also reduces the workload of cooling medium treatment and replacement, saving related human and material resources. At the same time, from the perspective of environmental protection, reducing the use and discharge of cooling medium also conforms to the concept of sustainable development.

[0072] It can be understood that, assuming that the two heat dissipation members 2 of the two adjacent circuit boards 1 form a heat dissipation assembly, the two or more adjacent heat dissipation assemblies can also be connected, which is not limited in the present embodiment.

[0073] In combination with Figure 1 and Figure 2 , the liquid-cooled power module 100 further comprises a mounting plate 5, the circuit board 1 is arranged on the mounting plate 5, and the mounting plate 5 is used to electrically connect the circuit board 1 with the probe assembly. The plurality of circuit boards 1 are arranged along the thickness direction of the circuit board 1.

[0074] The mounting plate 5 provides a stable mounting platform for the circuit board 1, making the installation process of the circuit board 1 more convenient and standardized. In actual production and assembly process, the staff can first accurately install the circuit board 1 on the mounting plate 5, and then assemble the mounting plate 5 as a whole with other components, which greatly improves the installation efficiency and reduces the hidden trouble of failure caused by improper installation of the circuit board 1. Moreover, the mounting plate 5 can play a good fixing role on the circuit board 1, preventing displacement or damage of the circuit board 1 due to factors such as vibration and collision during transportation and use, and ensuring the stability of the entire power module. As an intermediate connecting carrier, the mounting plate 5 can reasonably layout and plan the electrical connection lines between the circuit board 1 and the probe assembly, reduce the cross and confusion of the lines, and reduce the risk of signal interference.

[0075] The plurality of circuit boards 1 are arranged on the mounting plate 5 along the thickness direction of the circuit boards 1. This layout makes full use of space, making the structure of the entire liquid-cooled power module 100 more compact. In a limited space, by reasonably arranging the positions of the circuit boards 1, the number of circuit boards 1 can be increased, and the power density of the power module can be improved. Moreover, the spacing between the circuit boards 1 is beneficial to air circulation and heat dissipation, combined with the liquid cooling heat dissipation method, which can further improve the heat dissipation effect. In addition, this space layout also facilitates the maintenance and repair of the circuit boards 1, and the staff can easily access each circuit board 1 for fault diagnosis, replacement of components, and other operations.

[0076] Optionally, the circuit board 1 is connected to the mounting plate 5 through the electrical connector 6, ensuring the reliability of the electrical connection. The electrical connector 6 is usually precisely designed and manufactured, having good electrical conductivity and low resistance characteristics, which makes the current and signal transmission between the circuit board 1 and the mounting plate 5 stable and efficient. During the operation of the power module, stable electrical connection can avoid problems such as voltage fluctuation and signal interruption caused by poor contact, ensuring that the electronic components on the circuit board 1 can obtain stable power supply and accurate control signals, thereby ensuring the normal operation of the entire power module.

[0077] As an optional embodiment, the shell 21 and the circuit board 1 are connected by heat-conducting glue.

[0078] The heat-conducting glue has good heat-conducting performance and can effectively transfer heat between the shell 21 and the circuit board 1. Compared with other connection methods, such as simple mechanical fixation without special heat-conducting measures, the heat-conducting glue can reduce the thermal resistance, so that the heat generated by the circuit board 1 can be quickly transferred to the shell 21 of the heat sink 2 and then taken away by the cooling medium. This helps to improve the heat dissipation efficiency of the entire liquid-cooled power module 100, ensures that the components on the circuit board 1 work at a lower temperature, and reduces the risk of performance degradation and failure caused by high temperature.

[0079] The heat-conducting glue generally has good fluidity and filling property. When connecting the shell 21 and the circuit board 1, it can fill the small gaps and uneven places between the two, ensuring more close contact. This is crucial to ensure good heat conduction effect, because even a small air gap can increase the thermal resistance. Moreover, the heat-conducting glue can adapt to different shapes and materials of the shell 21 and the circuit board 1, whether it is a plane or a curved surface, metal or non-metal material, it can achieve effective heat-conducting connection, improving the flexibility of the liquid-cooled power module 100 in the design and manufacturing process.

[0080] It can be understood that the heat-conducting glue can be silicone, acrylic, polyurethane or epoxy resin, etc. In the first possible implementation, the silicone heat-conducting glue is one of the most common types of heat-conducting glue, which has excellent high-temperature resistance and can maintain stable physical and chemical properties in a wide temperature range, generally can withstand temperatures of-50℃ to 250℃. The silicone heat-conducting glue has a high thermal conductivity, which can meet the heat dissipation requirements of most electronic devices, and has good flexibility and less stress to the adherend, and is not easy to crack due to thermal expansion and contraction. In addition, it also has good electrical insulation, weather resistance and chemical stability.

[0081] In the second possible implementation, the acrylic heat-conducting glue has the characteristics of fast curing speed, which can be quickly cured at room temperature or under heating conditions, which is conducive to improving production efficiency. It has high bonding strength and can firmly connect the shell 21 and the circuit board 1. The thermal conductivity of the acrylic heat-conducting glue can also reach a certain level to meet general heat dissipation requirements. Moreover, it has good adhesion to a variety of materials and has a wide range of applications, which is not limited in this embodiment.

[0082] In a second aspect, the application also discloses a battery charging and discharging detection device, which comprises:

[0083] A probe assembly is used for charging and discharging the battery.

[0084] The liquid-cooled power module 100 of any one of the first aspect is located above the probe assembly, and the circuit board 1 is electrically connected with the probe assembly.

[0085] During the battery charging and discharging detection process, the liquid-cooled power module 100 is located above the probe assembly, and stable electrical connection can ensure accurate transmission of current and voltage signals, reducing signal interference and loss. This helps to improve the accuracy of the battery charging and discharging parameter measurement of the detection equipment, making the detection results more accurately reflect the true performance of the battery, which is of great significance for battery quality evaluation, performance optimization, and safety detection. The probe assembly is responsible for physical contact with the battery and implements charging and discharging operations, while the liquid-cooled power module 100 provides stable power supply for it. The cooperative work of the two makes the battery charging and discharging detection process more smooth and efficient. For example, when performing large-scale battery detection, stable power supply and precise probe contact can quickly complete the detection task of multiple batteries, greatly improving the detection efficiency and saving time and labor costs.

[0086] During the battery charging and discharging process, the heat generated by the power module can be carried away by the cooling medium in time. If the power module performance decreases due to overheating, it may cause the output voltage and current to be unstable, thereby affecting the reliability of the battery detection results. Through liquid cooling, it ensures that the power module always maintains good performance during long-term operation, thereby ensuring the continuous and stable operation of the battery charging and discharging detection equipment, and prolonging the service life of the entire battery charging and discharging detection equipment.

[0087] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A liquid-cooled power supply module, characterized in that, include: A circuit board for supplying power to the probe assembly; A heat sink includes a housing with an inlet and an outlet. The housing has a medium flow channel that connects the inlet and outlet and allows cooling medium to pass through. The housing is thermally connected to the circuit board. A liquid inlet pipe is connected to the liquid inlet, and one end of the liquid inlet pipe is used to connect to a cooling medium supply device to transport cooling medium to the heat sink. The liquid outlet pipe is connected to the liquid outlet, and one end of the liquid outlet pipe is used to connect to the cooling medium collection device to collect the cooling medium after heat absorption.

2. The liquid-cooled power supply module according to claim 1, characterized in that, The circuit board includes at least two circuit boards, both of which are thermally connected to the housing.

3. The liquid-cooled power supply module according to claim 2, characterized in that, The housing includes a first surface and a second surface arranged opposite to each other, and the first surface and the second surface are respectively thermally connected to two adjacent circuit boards.

4. The liquid-cooled power supply module according to claim 3, characterized in that, The circuit board includes a third surface and a fourth surface arranged opposite to each other. The third surface includes a connection area. The housing is thermally connected to the connection area. The third surface of the circuit board is provided with a first heating element. The connection area is located close to the first heating element. The circuit board is also provided with a second heating element, which is disposed on the fourth surface or the connection area. When the second heating element is disposed on the fourth surface, the position of the second heating element corresponds to that of the connection area along the thickness direction of the circuit board.

5. The liquid-cooled power supply module according to claim 4, characterized in that, The medium flow channel includes a first straight segment and a second straight segment, and a connecting segment connecting the first straight segment and the second straight segment. The first straight segment is connected to the liquid inlet, and the second straight segment is connected to the liquid outlet. The end of the first straight segment away from the liquid inlet and the end of the second straight segment away from the liquid outlet are connected through the connecting segment. The first straight segment is disposed near the first surface of the heat sink, and the second straight segment is disposed near the second surface of the heat sink.

6. The liquid-cooled power supply module according to claim 3, characterized in that, A first heat sink and a second heat sink are provided between two adjacent circuit boards. The first heat sink and the second heat sink are arranged at intervals. The first heat sink is thermally connected to the two adjacent circuit boards respectively, and the second heat sink is thermally connected to the two adjacent circuit boards respectively.

7. The liquid-cooled power supply module according to claim 6, characterized in that, The liquid outlet of the first heat sink is connected to the liquid inlet of the second heat sink.

8. The liquid-cooled power supply module according to claim 7, characterized in that, The liquid-cooled power module also includes a mounting plate, on which the circuit board is disposed. The mounting plate is used to electrically connect the circuit board to the probe assembly, and the plurality of circuit boards are spaced apart along their own thickness direction.

9. The liquid-cooled power supply module according to claim 1, characterized in that, The housing and the circuit board are thermally connected by thermally conductive adhesive.

10. A battery charge / discharge testing device, characterized in that, include: A probe assembly for charging and discharging a battery; The liquid-cooled power module as described in any one of claims 1-9, wherein the liquid-cooled power module is located above the probe assembly, and the circuit board is electrically connected to the probe assembly.

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