Liquid cooling power supply module and battery charging and discharging detection equipment

Abstract

The utility model relates to the technical field of battery production equipment, in particular to a liquid cooling power supply module and battery charging and discharging detection equipment. The liquid cooling power supply module comprises a circuit board; the heat dissipation piece is connected to the circuit board, the heat dissipation piece comprises a first straight line part and a second straight line part which are parallel to each other, and a connecting part connected between the first end of the first straight line part and the first end of the second straight line part, and the first straight line part, the second straight line part and the connecting part are all in heat conduction connection with the circuit board; a liquid inlet is formed in the second end of the first linear part, a liquid outlet is formed in the second end of the second linear part, a medium flow channel is formed in the heat dissipation piece, the medium flow channel communicates with the liquid inlet and the liquid outlet, the medium flow channel is used for allowing a cooling medium to pass through, and the liquid inlet is used for being connected with cooling medium supply equipment so as to transport the cooling medium to the heat dissipation piece; the liquid outlet is used for being connected with cooling medium collecting equipment so as to collect the cooling medium after heat absorption.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of battery production equipment, in particular to a liquid-cooled power module and a battery charge-discharge detection device. BACKGROUND

[0002] The technical field of battery production equipment is an important part of the battery industry, which covers the entire production process of batteries from raw material processing to finished battery assembly. In this process, there are multiple key process links such as capacity distribution and formation, and each link has high requirements for the accuracy, efficiency and automation level of the equipment. With the rapid development of the battery industry, higher standards are required for the performance and reliability of manufacturing equipment, prompting the industry to continuously innovate technology and optimize processes.

[0003] The battery charge-discharge detection device supplies power to the probe assembly through the power module, and the probe assembly can contact and charge-discharge the battery. During the operation of the device, the power module needs to be charged in constant current, constant voltage, constant current and constant voltage, and other charging modes, and the constant current discharging mode will feed the power back to the power grid. A large amount of heat will be released during the operation of the power module, which will increase the surrounding temperature, and the temperature increase will have a significant impact on the operation of the device. CONTENT OF THE UTILITY MODEL

[0004] The application embodiment discloses a liquid-cooled power module and a battery charge-discharge detection device. The two straight parts and the connecting part of the heat dissipation piece are connected with the first surface of the circuit board, so that the contact area of the cooling medium with the circuit board is larger, the heat conduction effect is better, the liquid inlet and the liquid outlet can be arranged on one side, and the connection of the liquid inlet and the liquid outlet is more convenient.

[0005] In order to achieve the above purpose, the application embodiment discloses a liquid-cooled power module, which comprises:

[0006] a circuit board;

[0007] a heat dissipation piece connected to the circuit board, the heat dissipation piece comprising two mutually parallel first and second straight parts and a connecting part connected between the first end of the first straight part and the first end of the second straight part, the first straight part, the second straight part and the connecting part being in thermal conductive connection with the circuit board;

[0008] a liquid inlet is arranged at the second end of the first straight part, and a liquid outlet is arranged at the second end of the second straight part, the heat dissipation piece has a medium flow channel inside, the medium flow channel being communicated with the liquid inlet and the liquid outlet, the medium flow channel being used for passing cooling medium, the liquid inlet being used for connecting a cooling medium supply device to transport cooling medium to the heat dissipation piece, and the liquid outlet being used for connecting a cooling medium collection device to collect the cooling medium after heat absorption.

[0009] As an optional implementation, the first linear part and the second linear part are arranged in a first direction, the circuit board comprises a first surface, the first surface is provided with a heating element, and the first linear part and the second linear part are arranged at the side of the heating element in the first direction.

[0010] As an optional implementation, the first linear part and the second linear part both extend along the length direction of the circuit board.

[0011] As an optional implementation, the first linear part comprises a second surface, the second linear part comprises a third surface, the second surface is in thermal conductive connection with the first surface, and the third surface is in thermal conductive connection with the first surface.

[0012] As an optional implementation, the liquid-cooled power module further comprises a connecting piece, the circuit board is provided with a plurality of first connecting holes, the second surface and the third surface are provided with a plurality of second connecting holes, each first connecting hole and each second connecting hole are arranged in correspondence in the thickness direction of the circuit board, and the connecting piece is arranged in the first connecting hole and the second connecting hole to connect the circuit board and the heat dissipation piece.

[0013] As an optional implementation, the liquid-cooled power module further comprises a mounting rack, the circuit board is arranged in the mounting rack, the mounting rack is used for electrically connecting the circuit board and a probe assembly, the circuit board is a plurality of and arranged in correspondence in the thickness direction of the circuit board, and the heat dissipation piece is a plurality of and connected to the circuit board respectively.

[0014] As an optional implementation, the liquid-cooled power module further comprises a support assembly, the support assembly is connected to the mounting rack to support the circuit board and the heat dissipation piece.

[0015] As an optional implementation, the support assembly comprises a guide rail, the guide rail extends in the first direction to enable the circuit board to be mounted on the mounting rack along the guide rail, and the circuit board further comprises a fourth surface arranged opposite to the first surface, and the fourth surface abuts against the guide rail.

[0016] As an optional implementation, the heat dissipation piece and the circuit board are in thermal conductive connection through a thermal conductive glue.

[0017] In a second aspect, the embodiments of the present application further disclose a battery charging and discharging detection device, comprising:

[0018] a probe assembly, the probe assembly being used for charging and discharging the battery.

[0019] The liquid-cooled power module as claimed in any one of the first aspect, the circuit board is electrically connected with the probe assembly.

[0020] Compared with the prior art, the application has the following beneficial effects:

[0021] The liquid-cooled power module provided by the embodiment of the application can continuously generate a large amount of heat when the power module is running. Since the liquid has good heat conduction performance, the heat can be quickly transferred from the circuit board to the cooling medium. The pure water cooling mode can quickly reduce the temperature of the circuit board, greatly improve the heat dissipation efficiency, ensure that the electronic components work in an appropriate temperature range, and effectively reduce the performance decline and failure risk caused by high temperature. The heat dissipation member adopts an approximately U-shaped structure, and the two straight parts and the connecting part are connected with the first surface of the circuit board. This design makes the contact area of the cooling medium and the circuit board larger, and the larger contact area means that the heat can be transferred more quickly, thereby accelerating the heat dissipation speed. Moreover, the water flow can fully contact the circuit board and cover the heat generating area in a larger range, to a certain extent, avoiding the problem of local heat accumulation and further improving the uniformity of heat dissipation. The liquid inlet is arranged at the second end of the first straight part, and the liquid outlet is arranged at the second end of the second straight part and located on the same side, which makes the connection of the liquid inlet and the liquid outlet more convenient. In actual equipment installation and layout, this design simplifies the pipeline connection and reduces the space occupied by the pipeline. BRIEF DESCRIPTION OF DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the application, the following will briefly introduce the drawings needed to be used in the embodiments. Obviously, the drawings in the following description only constitute some embodiments of the application, and for those skilled in the art, other drawings can also be obtained from these drawings without creative labor.

[0023] Figure 1 A structural schematic diagram of the liquid-cooled power module disclosed by the embodiment of the application in a first perspective view;

[0024] Figure 2 A structural schematic diagram of the liquid-cooled power module disclosed by the embodiment of the application in a second perspective view (omitting the circuit board);

[0025] Figure 3 A structural schematic diagram of the liquid-cooled power module disclosed by the embodiment of the application in a first perspective view; Figure 2 A structural schematic diagram of the liquid-cooled power module disclosed by the embodiment of the application in a first perspective view;

[0026] Figure 4 A structural schematic diagram of the liquid-cooled power module disclosed by the embodiment of the application in a first perspective view; Figure 3 A structural schematic diagram of the liquid-cooled power module disclosed by the embodiment of the application in a first perspective view;

[0027] Figure 5 A structural schematic diagram of the liquid-cooled power module disclosed by the embodiment of the application in a first perspective view;

[0028] Figure 6 Another structure diagram of the heat dissipation member disclosed in the embodiments of the present application.

[0029] Explanation of reference signs:

[0030] 100-liquid-cooled power module; 1-circuit board; 1a-first surface; 1b-fourth surface; 11-heating element; 12-electric connecting member; 2-heat dissipation member; 2a-medium flow channel; 21-first straight part; 21a-second surface; 22-second straight part; 22a-third surface; 23-connecting part; 24-second connecting hole; 3-liquid inlet; 4-liquid outlet; 5-mounting rack; 6-supporting assembly; 61-rail; X-first direction. DETAILED DESCRIPTION

[0031] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0032] In the present application, the positions or location relationships indicated by the terms "upper", "inner" and the like are based on the positions or location relationships shown in the drawings. These terms are mainly used for better describing the present application and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific position, or to be constructed and operated in a specific position.

[0033] In addition, the above-mentioned part of the terms can be used to represent other meanings in addition to the position or location relationship, for example, the term "upper" can also be used to represent a certain dependent relationship or connection relationship in some cases. Those skilled in the art can understand the specific meanings of these terms in the present application according to the specific circumstances.

[0034] In addition, the terms "mounting", "setting", "provided with" and "connection" should be understood broadly. For example, it can be fixed connection, detachable connection, or integral structure; it can be mechanical connection, or electrical connection; it can be direct connection, or indirect connection through intermediate medium, or internal communication between two devices, elements or components. Those skilled in the art can understand the specific meanings of the above-mentioned terms in the present application according to the specific circumstances.

[0035] In addition, the terms "first", "second", and the like are used primarily for the purpose of differentiating different devices, elements or components (the specific type and configuration of which can be the same or different), and are not intended to indicate or imply relative importance and quantity of the indicated devices, elements or components. Unless otherwise specified, the meaning of "a plurality" is two or more.

[0036] The battery production technology field is an important part of the battery industry, which covers the entire production process of batteries from raw material processing to finished battery assembly. In this process, there are many key process links such as capacity distribution and formation, each of which has very high requirements for the accuracy, efficiency and automation level of the equipment. With the rapid development of the battery industry, higher standards for the performance and reliability of manufacturing equipment are put forward, prompting the industry to continuously innovate technology and optimize processes.

[0037] The battery production technology field is an important part of the battery industry, which covers the entire production process of batteries from raw material processing to finished battery assembly. In this process, there are many key process links such as capacity distribution and formation, each of which has very high requirements for the accuracy, efficiency and automation level of the equipment. With the rapid development of the battery industry, higher standards for the performance and reliability of manufacturing equipment are put forward, prompting the industry to continuously innovate technology and optimize processes.

[0038] Battery formation is the process of charging the positive and negative materials inside the battery and forming an electrochemical reaction, so that the chemical reaction system inside the battery reaches a stable state and forms a SEI film (solid electrolyte interface). The SEI film can prevent the chemical reaction process inside the battery from getting out of control, while protecting the interface between the electrolyte and the electrode material, thereby improving the cycle life and safety performance of the battery. First, the positive and negative materials inside the battery are initially charged, allowing them to quickly form a chemical reaction system, thereby laying the foundation for subsequent cell formation. Then the battery will be charged at a constant current, allowing the internal chemical reaction system to be better activated and stabilized, thereby improving the capacity and cycle life of the battery. Second, the battery will be charged at a constant voltage, allowing the internal chemical reaction system to be better stabilized, thereby improving the performance stability and safety performance of the battery. After completing the cell formation, the battery needs to be discharged for testing to detect whether the performance and safety performance of the battery meet the requirements.

[0039] Battery capacity is a key step in battery manufacturing and quality control. Capacity refers to charging and discharging tests on the battery to accurately measure the actual capacity of the battery, ensuring that each battery unit in the battery pack has similar performance. The battery is first charged at a constant current until the preset charging cutoff voltage is reached, and after the charging is completed, the battery is allowed to stand for a period of time to allow the temperature and pressure inside the battery to naturally balance. After standing, the battery is discharged at a constant current until the discharge cutoff voltage is reached. The discharge current is usually set according to the rated capacity of the battery, and after the discharge is completed, the battery is again allowed to stand to simulate the rest state in actual use. After standing, the battery is charged at a constant current for the second time until the charging cutoff voltage is reached. After constant current charging, the battery enters the constant voltage charging stage, at which time the charging current gradually decreases until the charging current decreases to a very low value, indicating that the battery is close to full charge. After constant voltage charging, the battery is finally discharged at a constant current to determine the actual capacity of the battery. During the entire capacity test, the voltage, current and temperature of the battery are monitored and recorded in real time. After the capacity test is completed, the performance of the battery is evaluated by analyzing these data, and the battery is classified according to its capacity and internal resistance. According to the results of the capacity test, the battery is classified into different grades for subsequent assembly and use.

[0040] The battery charge and discharge detection device supplies power to the probe assembly through the power module, and the probe assembly can contact and charge and discharge the battery. During the operation of the device, the power module needs to be charged in constant current, constant voltage, constant current and constant voltage, etc. The constant current discharge mode will feed the power grid. A large amount of heat will be released during the operation of the power module, which will increase the surrounding temperature. The increase in temperature will have a significant impact on the operation of the device.

[0041] To solve the above problems, in the conventional method, the power module device generally uses aluminum fins for heat conduction and uses a fan for forced air cooling to dissipate heat. The fan operation will produce some noise, and it is also unstable due to environmental influences. In a normal temperature environment, the air cooling mode dissipates heat slowly and is prone to heat accumulation.

[0042] Therefore, the embodiment of the present application discloses a liquid-cooled power module and a battery charge and discharge detection device, which can pass cooling medium into the heat dissipation piece, and the two straight parts and the connecting part of the heat dissipation piece are connected with the first surface of the circuit board, so that the contact area of the cooling medium with the circuit board is larger, the heat conduction effect is better, the liquid inlet and the liquid outlet can be arranged on one side of the heat dissipation piece, and the connection of the liquid inlet and the liquid outlet is more convenient.

[0043] The technical solutions of the present application will be further described below with reference to the embodiments and the accompanying drawings.

[0044] Please refer to Figures 1 to 4 , Figure 1A structural schematic view of the liquid-cooled power module 100 disclosed by the embodiment of the present application is shown from a first perspective, Figure 2 A structural schematic view of the liquid-cooled power module 100 disclosed by the embodiment of the present application is shown from a second perspective (omitting the circuit board 1), Figure 3 A structural schematic view of the liquid-cooled power module 100 disclosed by the embodiment of the present application is shown from a first perspective, Figure 2 A structural schematic view of the liquid-cooled power module 100 disclosed by the embodiment of the present application is shown from a first perspective, Figure 4 A structural schematic view of the liquid-cooled power module 100 disclosed by the embodiment of the present application is shown from a first perspective, Figure 3 A structural schematic view of the liquid-cooled power module 100 disclosed by the embodiment of the present application is shown from a first perspective,

[0045] The circuit board 1 is used to supply power to the probe assembly;

[0046] The heat sink 2 is connected to the circuit board 1, and the heat sink 2 includes two first linear portions 21 and second linear portions 22 that are parallel to each other, and a connecting portion 23 connected between the first end of the first linear portion 21 and the first end of the second linear portion 22, and the first linear portion 21, the second linear portion 22 and the connecting portion 23 are in thermal conductive connection with the circuit board 1;

[0047] The second end of the first linear portion 21 is provided with an inlet 3, and the second end of the second linear portion 22 is provided with an outlet 4, and the heat sink 2 has a medium flow channel 2a inside, which is communicated with the inlet 3 and the outlet 4, and the medium flow channel 2a is used for passing cooling medium, the inlet 3 is used for connecting a cooling medium supply device to transport cooling medium to the heat sink 2, and the outlet 4 is used for connecting a cooling medium collection device to collect the heat-absorbed cooling medium.

[0048] In this way, the power module is cooled by pure water cooling, and the thermal conductivity of the liquid is significantly better than that of air. When the power module is running, the heating elements 11 on the circuit board 1 will continuously generate a large amount of heat. Because the liquid has good heat conduction performance, it can quickly transfer these heat from the circuit board 1 to the cooling medium. Compared with air cooling and other cooling methods, the heat dissipation efficiency is greatly improved. The pure water cooling method can quickly reduce the temperature of the circuit board 1, ensuring that the electronic components work in an appropriate temperature range, effectively reducing the performance decline and failure risk caused by high temperature. Even in a high-temperature environment, the pure water cooling system can still stably exchange heat, and the liquid has a large specific heat capacity, which can absorb a large amount of heat, and the temperature rise of the liquid itself is relatively small. In a high-temperature environment, the cooling medium can continuously absorb heat from the circuit board 1 and take away the heat through circulation, so that the temperature of the circuit board 1 is always maintained within a reasonable range. This stable heat exchange capacity ensures the reliability of the power module in harsh environments and ensures the normal operation of the equipment. In addition, the pure water cooling cooling method does not produce additional noise pollution, and the equipment runs more quietly, which does not interfere with the surrounding environment and the operating personnel, and is conducive to improving the quality and efficiency of work.

[0049] The heat dissipation member 2 adopts a U-like structure, and both of its straight sections and the connecting section 23 are connected with the first surface of the circuit board 1. This design maximizes the contact area between the cooling medium and the circuit board 1. A larger contact area means that heat can be transferred more quickly, thereby accelerating the heat dissipation speed. Moreover, the water flow can fully contact the circuit board 1 and cover the heat generating area in a larger range, to a certain extent, further improving the uniformity of heat dissipation.

[0050] The liquid inlet 3 is arranged at the second end of the first straight section 21, and the liquid outlet 4 is arranged at the second end of the second straight section 22 and located on the same side, which makes the connection of the liquid inlet and the liquid outlet more convenient. In actual equipment installation and layout, this design simplifies the pipeline connection and reduces the space occupied by the pipeline. At the same time, the compact structure of the U-shaped heat dissipation member 2 and the space-saving connection with the circuit board 1 are conducive to the miniaturization and integration of the power module.

[0051] As an optional embodiment, in combination with Figure 3 and Figure 4 , the first straight section 21 and the second straight section 22 are arranged in the first direction X, and the circuit board 1 comprises a first surface 1a, and the first surface 1a is provided with a heat generating element 11, and the first straight section 21 and the second straight section 22 are arranged on the side of the heat generating element 11 along the first direction X.

[0052] In this way, the heat dissipation member 2 can more accurately dissipate heat for the heat generating element 11. When the heat generating element 11 on the circuit board 1 works and generates heat, the heat will spread around, and the first straight section 21 and the second straight section 22 located on both sides of the heat generating element 11 can quickly absorb the heat. Since the cooling medium flows in the medium flow channel 2a of the straight section, the heat can be quickly transferred to the cooling medium and taken away, greatly improving the heat dissipation efficiency of the heat generating element 11, ensuring that the heat generating element 11 is always at an appropriate working temperature, and reducing the risk of performance degradation and failure caused by overheating.

[0053] The two straight sections are located on both sides of the heat generating element 11, which not only avoids the elements on the circuit board 1, but also makes the heat more evenly dispersed during transmission. The heat generated by different parts of the heat generating element 11 may be different, and if the heat dissipation method is unreasonable, the local temperature may be too high. This design allows heat to be absorbed and transferred from both sides of the heat generating element 11, avoiding the accumulation of heat on one side, thereby improving the uniformity of heat dissipation of the entire circuit board 1.

[0054] In some optional embodiments, in combination with Figure 3 and Figure 4 , the first straight section 21 and the second straight section 22 extend along the length direction of the circuit board 1.

[0055] In this way, the straight sections of the heat dissipation member 2 cover a larger area on the circuit board 1. When the cooling medium flows in the medium flow channels 2a of the straight sections, it can exchange heat with more heat generating areas, thereby expanding the coverage of heat dissipation and improving the overall heat dissipation efficiency.

[0056] The first straight section 21 and the second straight section 22 extending along the length direction of the circuit board 1 provide structural support for the circuit board 1 to some extent. In the actual use of the power module, it may be subjected to external forces such as vibration and impact. This extension of the straight sections can increase the contact area and connection strength between the heat dissipation member 2 and the circuit board 1, thereby improving the stability of the overall structure.

[0057] In some embodiments, in combination with Figure 4 and Figure 5 , Figure 5 A structural schematic diagram of the heat dissipation member 2 disclosed in the embodiments of the present application, the first straight section 21 includes a second surface 21a, the second straight section 22 includes a third surface 22a, the second surface 21a is in thermal conductive connection with the first surface 1a, and the third surface 22a is in thermal conductive connection with the first surface 1a.

[0058] Compared with point contact or line contact, this surface contact heat conduction mode greatly increases the heat conduction contact area between the heat dissipation member 2 and the circuit board 1, and more heat can be transferred in unit time, thereby significantly improving the heat dissipation efficiency. When the heat generating element 11 on the circuit board 1 generates heat, the heat can be quickly transferred to the heat dissipation member 2 through the larger contact area and be taken away by the cooling medium in time, which can ensure that the heat can be efficiently transferred from the circuit board 1 to the heat dissipation member 2, avoiding the influence on the performance of the circuit board 1 due to overheating.

[0059] In addition, this also increases the connection area and connection strength between the heat dissipation member 2 and the circuit board 1. In the actual use of the power module, it may be subjected to external forces such as vibration and impact. The surface contact connection mode can better resist these external forces, making the connection between the heat dissipation member 2 and the circuit board 1 more stable, reducing the risk of connection loosening or displacement caused by external forces. When the heat dissipation member 2 is affected by factors such as the pressure of the cooling medium flow, its own weight, and thermal stress caused by temperature change, the surface contact can disperse these forces to a larger area, avoiding stress concentration on local points or lines, and uniform stress distribution helps to protect the circuit board 1 and the heat dissipation member 2, prolonging their service life.

[0060] As an optional implementation, Figure 5 and Figure 6 , Figure 6Another structure diagram of the heat dissipation member 2 disclosed in the embodiments of the present application is shown in FIG. 6. The liquid-cooled power module 100 further comprises a connecting member (not shown in the figure). The circuit board 1 is provided with a plurality of first connecting holes (not shown in the figure). The second surface 21a and the third surface 22a are provided with a plurality of second connecting holes 24. Each first connecting hole is correspondingly arranged with each second connecting hole 24 along the thickness direction of the circuit board 1. The connecting member is arranged through the first connecting hole and the second connecting hole 24 to connect the circuit board 1 and the heat dissipation member 2.

[0061] The connecting holes are correspondingly arranged along the thickness direction of the circuit board 1, so that the connecting member can be accurately arranged through the circuit board 1 and the heat dissipation member 2, and the precise positioning of the circuit board 1 and the heat dissipation member 2 is realized. During the installation process, this corresponding arrangement facilitates the operator to quickly align and connect the two, ensuring that the second surface 21a and the third surface 22a of the heat dissipation member 2 are tightly attached to the first surface 1a of the circuit board 1, thereby ensuring good heat conduction performance. The tight attachment can reduce the thermal resistance in the heat transfer process, improve the heat dissipation efficiency, and ensure that the electronic components on the circuit board 1 work in a suitable temperature environment.

[0062] In addition, the plurality of first connecting holes correspond one-to-one with the plurality of second connecting holes 24. Compared with a single connecting point, the design of multiple connecting points can provide stronger fixing force. During the operation of the power module, it may be subjected to external forces such as vibration and impact. The multiple connecting points can evenly disperse these external forces, avoiding loosening of the connection due to excessive local stress, and ensuring that the heat dissipation member 2 and the circuit board 1 remain tightly connected to ensure the stability of the heat dissipation effect.

[0063] Among them, the number of connecting holes on the first straight part 21 and the second straight part 22 is the same, which can provide more stable connection for the heat dissipation member 2 and the circuit board 1.

[0064] Specifically, the connecting member can be a screw, and the first connecting hole and the second connecting hole 24 can be a threaded hole. The connecting member and the connecting hole are threadedly connected, which can generate strong fastening force. By rotating the screw, the interaction of the threads can tightly fix the circuit board 1 and the heat dissipation member 2 together, which will not easily separate due to external forces, ensuring the integrity of the power module structure.

[0065] Optionally, in combination with Figure 1 and Figure 2 The liquid-cooled power module 100 further comprises a mounting rack 5, and the circuit board 1 is arranged on the mounting rack 5. The mounting rack 5 is used to electrically connect the circuit board 1 and the probe assembly. There are a plurality of circuit boards 1 arranged along the thickness direction of the circuit board 1, and a plurality of heat dissipation members 2, each of which is connected to each circuit board 1.

[0066] The mounting frame 5 provides a stable mounting platform for the circuit board 1, making the installation process of the circuit board 1 more convenient and standardized. In actual production and assembly process, the staff can first accurately install the circuit board 1 on the mounting frame 5, and then assemble the mounting frame 5 as a whole with other components, which greatly improves the installation efficiency and reduces the hidden trouble of failure caused by improper installation of the circuit board 1. Moreover, the mounting frame 5 can play a good fixing role on the circuit board 1, preventing displacement or damage of the circuit board 1 due to factors such as vibration and collision during transportation and use, and ensuring the stability of the entire power module. As an intermediate connecting carrier, the mounting frame 5 can reasonably layout and plan the electrical connection lines between the circuit board 1 and the probe assembly, reduce the cross and confusion of the lines, and reduce the risk of signal interference.

[0067] The plurality of circuit boards 1 are arranged on the mounting frame 5 along the thickness direction of the circuit board 1. This layout makes full use of space, making the structure of the entire liquid-cooled power module 100 more compact. In a limited space, by reasonably arranging the position of the circuit board 1, the number of circuit boards 1 can be increased, and the power density of the power module can be improved. Moreover, the spacing between the circuit boards 1 is beneficial to air circulation and heat dissipation, combined with the liquid cooling heat dissipation method, which can further improve the heat dissipation effect. In addition, this space layout also facilitates the maintenance and repair of the circuit board 1, and the staff can easily access each circuit board 1 for troubleshooting, replacing components, and other operations.

[0068] Optionally, along the first direction X, one side of the circuit board 1 is provided with an electrical connector 12, which is connected to the mounting frame 5 to ensure the reliability of the electrical connection. The electrical connector 12 is usually precisely designed and manufactured, with good electrical conductivity and low resistance characteristics, which makes the current and signal transmission between the circuit board 1 and the mounting frame 5 stable and efficient. During the operation of the power module, stable electrical connection can avoid problems such as voltage fluctuation and signal interruption caused by poor contact, ensuring that the electronic components on the circuit board 1 can obtain stable power supply and accurate control signals, thereby ensuring the normal operation of the entire power module.

[0069] In some optional embodiments, in combination with Figure 1 and Figure 2 , the liquid-cooled power module 100 further comprises a support assembly 6 connected to the mounting frame 5 to support the circuit board 1 and the heat sink 2.

[0070] In the power module, the weight of the circuit board 1 and the heat sink 2 and the vibration that may be generated during operation and other factors require stable support. The support assembly 6 can share part of the pressure borne by the mounting frame 5, and more stably fix the circuit board 1 and the heat sink 2 in place. When the power module is subjected to external forces such as vibration, impact, etc., the support assembly 6 can disperse these external forces to each support point, avoid excessive local stress, and thus the circuit board 1 and the heat sink 2 can remain stable under various external forces, reduce the risk of damage caused by uneven stress, and improve the stability of the power module.

[0071] In some embodiments, in combination Figure 1 and Figure 2 Figure 2 The support assembly 6 includes a guide rail 61 extending along the first direction X to enable the circuit board 1 to be installed on the mounting frame 5 along the guide rail 61, and the circuit board 1 further includes a fourth surface 1b opposite the first surface 1a, and the fourth surface 1b abuts against the guide rail 61.

[0072] The guide rail 61 extends along the first direction X to enable the circuit board 1 to be installed on the mounting frame 5 along the guide rail 61, providing clear guidance for the installation of the circuit board 1 and simplifying the installation process. In actual production, the operator only needs to align the circuit board 1 with the guide rail 61 and then easily slide along the guide rail 61 to accurately install the circuit board 1 to the predetermined position. Compared with the installation method without the guide rail 61, the repeated adjustment of the position of the circuit board 1 during installation is reduced, a large amount of installation time is saved, and the production efficiency is improved.

[0073] Specifically, the guide rail 61 is two, which are arranged near the two sides of the circuit board 1 along the length direction of the circuit board 1 and can abut against the fourth surface 1b of the circuit board 1. The two guide rails 61 are arranged near the two sides of the circuit board 1, which can provide uniform support force for the circuit board 1. When the power module is subjected to external forces such as vibration, impact, etc., the guide rails 61 on both sides jointly bear the acting force, avoiding the deformation, fracture and other damage of the circuit board 1 due to uneven stress, ensuring the stable operation of the circuit board 1 and improving the reliability of the power module.

[0074] As an optional implementation, the heat sink 2 and the circuit board 1 are connected by a heat-conducting adhesive.

[0075] The heat-conducting adhesive has good heat-conducting performance and can effectively transfer heat between the heat sink 2 and the circuit board 1. Compared with other connection methods, such as simple mechanical fixation without special heat-conducting measures, the heat-conducting adhesive can reduce the thermal resistance, so that the heat generated by the circuit board 1 can be transferred to the heat sink 2 more quickly and then be taken away by the cooling medium. This helps to improve the heat dissipation efficiency of the entire liquid-cooled power module 100, ensures that the components on the circuit board 1 work at a lower temperature, and reduces the risk of performance degradation and failure caused by excessive temperature.

[0076] The heat-conducting glue generally has good fluidity and filling property. When connecting the heat-dissipating member 2 and the circuit board 1, it can fill the tiny gaps and unevenness between the two, ensuring more close contact. This is crucial to ensure good heat-conducting effect, because even a tiny air gap can increase thermal resistance.

[0077] Optionally, the first surface 1a of the entire circuit board 1 can be filled with the heat-conducting glue. In this way, the circuit board 1 has better heat-conducting effect, and the heat generated by the circuit board 1 can be more directly and quickly transferred to the heat-dissipating member 2 through the heat-conducting glue.

[0078] It can be understood that the heat-conducting glue can be silicone, acrylic, polyurethane or epoxy resin, etc. In the first possible implementation, the silicone heat-conducting glue is one of the most common types of heat-conducting glue, which has excellent high-temperature resistance and can maintain stable physical and chemical properties in a wide temperature range. It can generally withstand temperatures of-50℃ to 250℃. The silicone heat-conducting glue has a high thermal conductivity, which can meet the heat-dissipating requirements of most electronic devices. At the same time, it has good flexibility and small stress on the adherend, and is not easy to crack due to thermal expansion and contraction. In addition, it also has good electrical insulation, weather resistance and chemical stability.

[0079] In the second possible implementation, the acrylic heat-conducting glue has the characteristics of fast curing speed, which can be rapidly cured at room temperature or under heating conditions, which is conducive to improving production efficiency. It has high bonding strength and can firmly connect the heat-dissipating member 2 and the circuit board 1. The thermal conductivity of the acrylic heat-conducting glue can also reach a certain level, which can meet the general heat-dissipating requirements. Moreover, it has good adhesion to a variety of materials and has a wide range of applications, which is not limited in the present embodiment.

[0080] Optionally, the first straight part 21 and the second straight part 22 are connected through the heat-conducting glue. In this way, the first straight part 21 and the second straight part 22 can also quickly exchange heat, so that the cooling medium in the heat-dissipating member 2 can absorb more heat, and the heat-dissipating member 2 can achieve better heat-conducting effect.

[0081] In a second aspect, the present application discloses a battery charging and discharging detection device, which comprises:

[0082] A probe assembly is used for charging and discharging the battery.

[0083] The liquid-cooled power module 100 of any one of the first aspect, the circuit board 1 is electrically connected with the probe assembly.

[0084] The high-efficiency heat conduction of the approximately U-shaped heat dissipation member 2 of the liquid-cooled power module 100 and the close fit of the multi-circuit board 1 and the heat dissipation member 2 can ensure the stability of the circuit board 1 during operation. The stable circuit board 1 operation state provides a stable power supply for the probe assembly, which can accurately control the battery charging and discharging process. During the battery charging and discharging process, stable power supply can avoid detection errors caused by voltage fluctuations and unstable current, thereby improving the accuracy of battery charging and discharging detection.

[0085] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A liquid-cooled power module, characterized by, The liquid-cooled power module comprises: a circuit board; a heat dissipation member connected to the circuit board, the heat dissipation member comprising two first and second straight sections parallel to each other and a connecting section connected between a first end of the first straight section and a first end of the second straight section, the first straight section, the second straight section and the connecting section being in thermal contact with the circuit board; a second end of the first straight section being provided with an inlet, a second end of the second straight section being provided with an outlet, the heat dissipation member having a medium flow channel inside, the medium flow channel being in communication with the inlet and the outlet, the medium flow channel being used for passing cooling medium, the inlet being used for connecting a cooling medium supply device to transport cooling medium to the heat dissipation member, and the outlet being used for connecting a cooling medium collection device to collect the cooling medium after absorbing heat.

2. The liquid-cooled power module of claim 1, wherein, The first straight section and the second straight section are arranged in a first direction, the circuit board comprises a first surface provided with a heating element, and the first straight section and the second straight section are arranged on the side of the heating element in the first direction.

3. The liquid-cooled power module of claim 1, wherein, The first straight section and the second straight section both extend along the length direction of the circuit board.

4. The liquid-cooled power module of claim 2, wherein, The first straight section comprises a second surface, and the second straight section comprises a third surface, the second surface being in thermal contact with the first surface, and the third surface being in thermal contact with the first surface.

5. The liquid-cooled power module of claim 4, wherein, The liquid-cooled power module further comprises a connecting member, the circuit board is provided with a plurality of first connecting holes, the second surface and the third surface are provided with a plurality of second connecting holes, each first connecting hole and each second connecting hole are arranged in correspondence in the thickness direction of the circuit board, and the connecting member is arranged in the first connecting hole and the second connecting hole to connect the circuit board and the heat dissipation member.

6. The liquid-cooled power module of claim 2, wherein, The liquid-cooled power module further comprises a mounting rack, the circuit board is arranged on the mounting rack, the mounting rack is used to electrically connect the circuit board and a probe assembly, the circuit board is a plurality of and arranged in the thickness direction of the circuit board, and the heat dissipation member is a plurality of and connected to the circuit board.

7. The liquid-cooled power module of claim 6, wherein, The liquid-cooled power module further comprises a support assembly connected to the mounting rack to support the circuit board and the heat dissipation member.

8. The liquid-cooled power module of claim 7, wherein, The support assembly comprises a guide rail extending in the first direction to enable the circuit board to be mounted on the mounting rack along the guide rail, and the circuit board further comprises a fourth surface arranged opposite to the first surface, and the fourth surface is in abutment with the guide rail.

9. The liquid-cooled power module of claim 1, wherein, The heat dissipation member and the circuit board are in thermal contact through a thermal conductive adhesive.

10. A battery charge / discharge detection device characterized by comprising: The liquid-cooled power module comprises: a probe assembly used for charging and discharging a battery; The liquid-cooled power module according to any one of claims 1-9, the circuit board being electrically connected to the probe assembly.

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