Laser packaging base

Abstract

The utility model discloses a laser packaging base, which belongs to the technical field of sensor packaging and comprises a base and a substrate. The base comprises a base body and a boss body which are integrally formed; the boss body is fixed on the surface of the base body; the boss body comprises an element carrying surface for carrying a semiconductor element; the base body is provided with a through hole; the substrate comprises a substrate body and a packaging ring for placing a lead; the packaging ring is fixedly connected with the substrate body; the surface of the substrate body is attached to the surface of the base body. And the packaging ring is fixedly arranged in the through hole. According to the utility model, the manufacturing difficulty can be effectively reduced, the manufacturing time is shortened, the manufacturing cost is reduced, and the yield is greatly improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to sensor packaging technical field, especially a kind of laser package pedestal. BACKGROUND

[0002] With the gradually more and more application of high-power semiconductor laser in display lighting, medical treatment, sensing and other fields, the requirement of industry to packaging is also more and more.

[0003] The Chinese invention patent with application number 202111451592.5 discloses a pipe seat for semiconductor packaging, which comprises an eyelet part, a metal block and a metal base. The eyelet part forms a through hole from the first surface to the second surface. The metal block includes a pedestal part and a columnar part protruding from the pedestal part, and the pedestal part is inserted into the through hole. However, in this technical solution, in order to realize the insertion of the pedestal part into the through hole, the pedestal part and the through hole need to be machined separately, and need to have high machining requirements. This will undoubtedly increase the manufacturing time of the pipe seat for semiconductor packaging, and greatly increase its manufacturing cost. At the same time, during the process of inserting the pedestal part into the through hole and brazing, due to the machining precision of the pedestal part and the through hole not meeting the requirements and the influence of the brazing process, the yield of the pipe seat for semiconductor packaging is low.

[0004] Therefore, it is necessary to provide a new technical solution to solve the above problems. UTILITY MODEL CONTENT

[0005] To solve the above technical problems, the present application provides a laser package pedestal, which can effectively reduce the manufacturing difficulty, shorten the manufacturing time, reduce the manufacturing cost, and greatly improve the yield.

[0006] A laser package pedestal comprises:

[0007] a pedestal; the pedestal comprises an integrally formed pedestal body and a boss body; the boss body is fixed to the surface of the pedestal body; the boss body comprises an element mounting surface for mounting a semiconductor element; the pedestal body is provided with a through hole;

[0008] a substrate; the substrate comprises a substrate body and a packaging ring for placing a lead; the packaging ring is fixedly connected with the substrate body; the surface of the substrate body is in contact with the surface of the pedestal body; the packaging ring is fixed in the through hole.

[0009] Preferably, the lower surface of the substrate body is in contact with the upper surface of the pedestal body; the main part of the packaging ring is arranged on the lower surface of the substrate body.

[0010] Preferably, the packaging ring is fixedly connected with the pedestal body by brazing process.

[0011] Preferably, the substrate further comprises a recess disposed on the substrate body; the recess is located below the component mounting surface.

[0012] Preferably, the substrate further comprises a mounting hole disposed on the substrate body; the mounting hole is adapted to the boss body, so that the boss body can be inserted and penetrated through the mounting hole.

[0013] Preferably, the same number of lead wires as the packaging ring is further included; the packaging ring is provided with a packaging hole penetrating through the upper surface and the lower surface thereof; the lead wire is penetrated and packaged and fixed in the packaging hole.

[0014] Preferably, the through hole comprises a first through hole and a second through hole; the packaging ring comprises a first packaging ring with a first packaging hole and a second packaging ring with a second packaging hole; the first packaging ring is fixed in the first through hole; the second packaging ring is fixed in the second through hole.

[0015] Preferably, the upper surface of the substrate body is attached to the lower surface of the base body; the main body part of the packaging ring is disposed on the upper surface of the substrate body.

[0016] Preferably, the base further comprises a recess disposed on the base body; the recess is located below the component mounting surface.

[0017] Preferably, the base body and the boss body are made of copper material; the packaging ring is made of iron material.

[0018] Preferably, the assembly method of the laser package base comprises:

[0019] The packaging ring is placed in the through hole and positioned;

[0020] The molten silver copper solder is made to enter between the outer periphery of the packaging ring and the inner wall of the through hole by heating;

[0021] After the silver copper solder is cooled, the assembly of the laser package base is completed.

[0022] Compared with the prior art, the present application has at least the following beneficial effects:

[0023] 1、The base of the utility model includes the base body and the boss body which are integrally formed, the number of components is reduced, the processing difficulty is reduced, the processing efficiency is improved, and the manufacturing cost is effectively reduced.

[0024] 2、Compared with the prior art, the base body and the boss body of the utility model do not need to be independently processed, and the base body and the boss body do not need to be assembled, and the yield of the laser package base is effectively improved.

[0025] 3, The utility model discloses a packing ring, and the packing ring is placed in the through -hole of base body and is fixedly connected with base body, can improve the airtightness in packing process through the change of material quality, effectively prevent the air leakage. BRIEF DESCRIPTION OF DRAWINGS

[0026] Some embodiments of the present application will now be described in detail with reference to the drawings, which are by way of illustration only and shall not be construed in a limiting sense. Wherever possible, like reference numerals used in the figures will refer to like or similar elements throughout the figures. It shall be understood that the figures are not necessarily drawn to scale.

[0027] In the drawings:

[0028] Figure 1 is a perspective view of the laser package base from a first perspective in accordance with an embodiment of the present application;

[0029] Figure 2 is a perspective view of the laser package base from a second perspective in accordance with an embodiment of the present application;

[0030] Figure 3 is a top view of the laser package base in accordance with an embodiment of the present application;

[0031] Figure 4 is a cross-sectional view of the laser package base at position A-A in accordance with an embodiment of the present application; Figure 3

[0032] Figure 5 is a perspective view of the base in accordance with an embodiment of the present application;

[0033] Figure 6 is a perspective view of the baseboard from a first perspective in accordance with an embodiment of the present application;

[0034] Figure 7 is a perspective view of the baseboard from a second perspective in accordance with an embodiment of the present application;

[0035] Figure 8 is a top view of the laser package base in accordance with an embodiment of the present application;

[0036] Figure 9 is a cross-sectional view of the laser package base at position B-B in accordance with an embodiment of the present application. Figure 8 In the drawings:

[0037]

[0038] ​​10, base; 11, base body; 12, boss body; 13, first through hole; 14, second through hole; 15, first notch part; 16, second notch part; 17, third notch part; 20, base plate; 21, base plate body; 22, first packaging ring; 23, second packaging ring; 24, first packaging hole; 25, second packaging hole; 26, mounting hole; 30, first lead wire; 40, first packaging body; 50, second packaging body; 60, second lead wire; 70, element mounting surface; 80, groove. DETAILED DESCRIPTION

[0039] To make the objects, technical solutions and advantages of the present application clearer, the following will be a clear and complete description of the technical solutions of the present application in combination with the embodiments of the present application and corresponding drawings. Obviously, the described embodiments are only some of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0040] As shown in the drawings, a laser package base comprises a base 10 and a base plate 20. The base 10 comprises a base body 11 and a boss body 12 which are integrally formed. The boss body 12 is fixed on the surface of the base body 11. The boss body 12 comprises an element mounting surface 70 for mounting semiconductor elements. The base body 11 is provided with a through hole. Figures 1-7 The base plate 20 comprises a base plate body 21 and a packaging ring for placing lead wires. The packaging ring is fixedly connected with the base plate body 21. The surface of the base plate body 21 is attached to the surface of the base body 11. The packaging ring is fixedly arranged in the through hole.

[0041] Preferably, the base body 11 and the boss body 12 are made of copper material, and the packaging ring is made of iron material.

[0042] In the embodiment, the base body 11 and the boss body 12 are integrally processed by copper or copper alloy. Preferably, the base body 11 and the boss body 12 are made of oxygen-free copper. It should be noted that the base body 11 and the boss body 12 can be processed by other copper alloys under the condition of meeting one or more of the requirements of thermal expansion and contraction coefficient, electrical conductivity and thermal conductivity.

[0043] In the embodiment, the packaging ring and the base plate body 21 are integrally formed by carbon steel with a SPCC brand.

[0044] In other embodiments of the present application, the base plate body 21 and the packaging ring can be integrally formed by the same iron material, for example, by casting, stamping or machining.

[0045]

[0046] ​Further, the substrate body 21 and the packaging ring can be made of different materials, wherein the packaging ring is made of ferrous material. For example, according to design requirements, the packaging ring can be made of different grades of carbon steel or ferrous materials such as iron-nickel alloy, which meet one or more of the requirements of thermal expansion and contraction coefficient, conductivity and thermal conductivity. As for the substrate body 21, it can be made of the same or different ferrous materials as the packaging ring, or other metal materials, as long as it can position and fix the packaging ring.

[0047] In the embodiment, the lower surface of the substrate body 21 is attached to the upper surface of the base body 11, and the main body portion of the ring is arranged on the lower surface of the substrate body 21.

[0048] In the embodiment, the substrate 20 further comprises a mounting hole 26 arranged on the substrate body 21, which is adapted to the boss body 12, so that the boss body 12 can be inserted and passed through the mounting hole 26, thereby realizing that the surface of the substrate body 21 can at least partially cover part of the surface of the base body 11 and be attached to the surface of the base body 11.

[0049] It should be noted that in the case of a small area of the substrate body 21, it will not cover the corresponding position of the boss body 12, and there will be no interference between the substrate body 21 and the boss body 12. In this case, the mounting hole 26 can not be arranged on the substrate body 21.

[0050] Preferably, the packaging ring is fixedly connected with the base body 11 by brazing process.

[0051] As another embodiment of the present application, the substrate 20 further comprises a groove 80 arranged on the substrate body 21, which is located below the element mounting surface 70. The bottom surface of the groove 80 is arranged at a certain angle with the upper surface of the substrate body 21. This arrangement enables the groove 80 to change the reflection path of the light emitted by the light-emitting component to the upper surface of the substrate body 21, thereby avoiding the light reflected from the upper surface of the substrate body 21 back to the light-emitting component and causing damage to the light-emitting component.

[0052] As another embodiment of the present application, a laser packaging base further comprises a number of lead wires equal to the number of packaging rings; the packaging ring is provided with a packaging hole penetrating through its upper surface and its lower surface; the lead wire is penetrated and fixedly packaged in the packaging hole. The lead wire is fixedly packaged in the packaging hole by the packaging body. Preferably, the packaging body is made of glass.

[0053] It should be noted that according to the packaging process and the nature of each material during the packaging process, the packaging body can be other commonly used packaging materials other than glass.

[0054] The laser packaging base is assembled by the following steps:

[0055] The lead wire is penetrated and fixedly encapsulated in the encapsulation hole;

[0056] The encapsulation ring is placed in the penetration hole, and silver copper solder is placed between the outer periphery of the encapsulation ring and the inner wall of the penetration hole;

[0057] The base and the substrate are heated at the same time to completely melt the silver copper solder, and the melted silver copper solder is filled in the gap between the outer periphery of the encapsulation ring and the inner wall of the penetration hole in a liquid state;

[0058] After the silver copper solder is cooled, the assembly of the laser package base is realized.

[0059] In the embodiment, the penetration hole includes a first penetration hole 13 and a second penetration hole 14, and the encapsulation ring includes a first encapsulation ring 22 with a first encapsulation hole 24 and a second encapsulation ring 23 with a second encapsulation hole 25. The first encapsulation ring 22 is arranged in the first penetration hole 13 and is fixedly connected with the base body 11 by brazing. The second encapsulation ring 23 is fixedly arranged in the second penetration hole 14 and is fixedly connected with the base body 11 by brazing.

[0060] The lead wire includes a first lead wire 30 and a second lead wire 60. The first lead wire 30 penetrates the first encapsulation ring 22 and is encapsulated in the first encapsulation hole 24 by the first encapsulation body 40. The second lead wire 60 penetrates the second encapsulation ring 23 and is encapsulated in the second encapsulation hole 25 by the second encapsulation body 50.

[0061] As another embodiment of the utility model, a notch part recessed from the outer periphery to the center side is formed on the outer edge of the base body 11. The notch part can be used for position determination of the element mounting surface 70 of the laser package base mounted with a light emitting component, etc.

[0062] Preferably, the notch part includes a first notch part 15, a second notch part 16 and a third notch part 17, and can be used for position determination of the rotating direction of the laser package base, etc. It should be noted that the first notch part 15, the second notch part 16 and the third notch part 17 can be arranged as needed, for example, the number or position can be adjusted as needed.

[0063] It should be noted that according to the design of the laser, it can have more than two lead wires, in which case the number of encapsulation rings will also change accordingly, so that the number of encapsulation rings is the same as the number of lead wires, and each lead wire is encapsulated in each encapsulation ring.

[0064] Embodiment 2

[0065] Embodiment 2 is the same as embodiment 1. The difference is only that:

[0066] As Figure 8 and Figure 9 The upper surface of the substrate body 21 is attached to the lower surface of the base body 11; the main body portion of the encapsulation ring is disposed on the upper surface of the substrate body 21.

[0067] In the present embodiment, the base 20 further comprises a recess 80 disposed on the base body 11; the recess 80 is located below the component mounting surface 70. The recess 80 is also used to change the path of the light rays emitted by the light emitting component to the upper surface of the substrate body 21, thereby avoiding the light rays being reflected from the upper surface of the substrate body 21 back to the light emitting component and damaging the light emitting component. In this case, the recess 80 is no longer disposed on the substrate body 21.

[0068] For purposes of the description hereinafter, spatial relative terms are used to describe the positional relationship of one device or feature to another device or to another feature as illustrated in the drawings. The spatial and relative terms are intended to encompass different orientations of the device and its components in use or operation, for example, position of the device in use or operation in both orientations. For example, if the device described herein is turned over, a device positioned "above" or "below" other devices or components would then be oriented "below" or "above" the other devices or components. Accordingly, the exemplary term "above" can encompass both an orientation of above and below. The devices can be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

[0069] It is to be noted that the terms used herein are merely for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and / or "comprising", when used in this specification, specify the presence of stated features, steps, operations, devices, components and / or combinations thereof, but do not preclude the presence or addition of one or more other features, steps, operations, devices, components and / or combinations thereof.

[0070] It is to be noted that the terms "first", "second", and the like in the description and in the claims of the present application are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the terms so used are interchangeable under appropriate circumstances such that the embodiments of the application described herein are, for example, capable of practical implementation irrespective of the particular sequential or chronological order of the steps composing them.

[0071] The above merely describes preferred embodiments of the present application and is not intended to limit the present application. For those skilled in the art, the present application can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A laser package submount, characterized by, Comprise: a base; the base comprises a base body and a boss body; the boss body is fixed on the surface of the base body; the boss body comprises an element mounting surface for mounting a semiconductor element; the base body is provided with a through hole; a substrate; the substrate comprises a substrate body and a packaging ring for placing a lead; the packaging ring is fixedly connected with the substrate body; the surface of the substrate body is attached to the surface of the base body; the packaging ring is fixed in the through hole.

2. The laser package submount of claim 1, wherein, The lower surface of the substrate body is attached to the upper surface of the base body; the main part of the packaging ring is arranged on the lower surface of the substrate body.

3. The laser package submount of claim 2, wherein, The packaging ring is fixedly connected with the base body by brazing process.

4. The laser package base of claim 2, wherein, The substrate further comprises a groove arranged on the substrate body; the groove is located below the element mounting surface.

5. The laser package base of claim 2, wherein, The substrate further comprises a mounting hole arranged on the substrate body; the mounting hole is adapted to the boss body, so that the boss body can be inserted and penetrated through the mounting hole.

6. The laser package base of claim 1, wherein, Further comprising the same number of leads as the packaging ring; the packaging ring is provided with a packaging hole penetrating through its upper surface and its lower surface; the lead is penetrated and packaged and fixed in the packaging hole.

7. The laser package base of claim 1, wherein, The through hole comprises a first through hole and a second through hole; the packaging ring comprises a first packaging ring with a first packaging hole and a second packaging ring with a second packaging hole; the first packaging ring is fixed in the first through hole; the second packaging ring is fixed in the second through hole.

8. The laser package base of claim 1, wherein, The upper surface of the substrate body is attached to the lower surface of the base body; the main part of the packaging ring is arranged on the upper surface of the substrate body.

9. The laser package base of claim 8, wherein, The base further comprises a groove arranged on the base body; the groove is located below the element mounting surface.

10. The laser package base of claim 1, wherein, The base body and the boss body are made of copper material; the packaging ring is made of iron material.

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