Circuit board jig

Abstract

The utility model provides a circuit board jig, which comprises a first jig, a second jig and at least one elastic assembly, and is characterized in that the first jig is used for fixing a substrate of a circuit board; the second jig is connected to the first jig, and the second jig and the substrate are located on different sides of the first jig; the elastic assembly is connected to the second jig, and the elastic assembly is used for abutting against the first electronic element on the substrate and applying elastic force to the first electronic element. The circuit board jig can prevent the first electronic component from falling off from the substrate or generating a floating phenomenon to a certain extent.

Description

Technical Field

[0001] This application relates to the field of circuit board manufacturing technology, and in particular to a circuit board fixture. Background Technology

[0002] Currently, most circuit board manufacturing processes use surface mount technology, which is a double-sided process. This means that electronic components are mounted on one side of the circuit board, and then on the other side.

[0003] In related technologies, the substrate is placed on a mounting fixture, and a portion of the heavier electronic components are mounted on the first side of the substrate. Then, the substrate is flipped over and placed on the mounting fixture again. Finally, a portion of the lighter electronic components are mounted on the second side of the substrate.

[0004] However, when mounting electronic components on the second side, a reflow soldering process is required. Under the influence of high temperature and gravity, electronic components already mounted on the first side may fall off or become dislodged. This would affect the manufacturing efficiency of the circuit board. Utility Model Content

[0005] This application provides a circuit board fixture that can, to a certain extent, prevent pre-mounted electronic components from falling off or becoming floating, thereby improving the manufacturing efficiency of circuit boards.

[0006] This application provides a circuit board fixture, including a first fixture, a second fixture, and at least one elastic component. The first fixture is used to fix the substrate of the circuit board. The second fixture is connected to the first fixture, and the second fixture and the substrate are located on different sides of the first fixture. The elastic component is connected to the second fixture and is used to abut against a first electronic component on the substrate. The elastic component is used to apply an elastic force to the first electronic component.

[0007] As an optional implementation, the first fixture includes a first frame portion and a support portion, the support portion being connected to the inner side of the first frame portion and used to support the circuit board; wherein, the support portion is provided with a first connecting hole, the second fixture is provided with a second connecting hole opposite to the first connecting hole, and an elastic component is passed through the first connecting hole and the second connecting hole; the end of the elastic component abuts against the first electronic component and is used to apply an elastic force to the first electronic component.

[0008] As an optional implementation, the second fixture includes a second frame portion and an extension connecting portion, the extension connecting portion being connected to the inner side of the second frame portion; the second frame portion is connected to the first frame portion, and a second connecting hole is formed on the extension connecting portion.

[0009] As an optional implementation, the elastic component is a spring needle; the spring needle comprises a needle tube, a needle head and a spring, the needle tube is sequentially arranged in the second connecting hole and the first connecting hole, a bottom of the needle tube is located outside the second connecting hole and connected with the second frame part; the needle head is in sliding fit with the needle tube, the spring is located in the needle tube and connected between the needle head and the needle tube; an end of the needle head abuts against the first electronic component so that the spring is compressed.

[0010] As an optional implementation, the circuit board jig further comprises a magnetic attraction component, the first jig and the second jig are connected together through the magnetic attraction component.

[0011] As an optional implementation, the magnetic attraction component comprises a first magnetic part and a second magnetic part, the first magnetic part is arranged on a side of the first jig facing the second jig, and the second magnetic part is arranged on a side of the second jig facing the first jig.

[0012] As an optional implementation, the first jig and the second jig are connected together through a plurality of magnetic attraction components arranged at intervals.

[0013] As an optional implementation, the circuit board jig further comprises a positioning structure arranged between the first jig and the second jig to limit the relative position of the first jig and the second jig.

[0014] As an optional implementation, the positioning structure comprises a positioning column and a positioning hole, the positioning column is inserted into the positioning hole; the positioning column is arranged on one of the first jig and the second jig, and the positioning hole is arranged on the other one of the first jig and the second jig.

[0015] As an optional implementation, the first jig is provided with a buckle for fastening the substrate, and the second jig is provided with a avoiding slot for avoiding the buckle.

[0016] In the circuit board jig, the elastic component can abut against the first electronic component, so that when the double-sided process mounting technology is used to manufacture the circuit board, the elastic component can generate elastic force on the first electronic component during mounting of the second electronic component on the other side of the substrate, so that the first electronic component can overcome its own gravity, and even in a high temperature environment, the first electronic component and the substrate are difficult to separate under the action of the elastic component. Therefore, the first electronic component can be prevented from falling off or floating to a certain extent, so that the manufacturing efficiency of the circuit board can be improved, and the qualified rate of the circuit board can be improved. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained from the structures shown in these drawings without creative labor.

[0018] Figure 1 The use state diagram of the circuit board jig provided by the embodiment of the present application is shown in the figure.

[0019] Figure 2 The Figure 1 The plane structure diagram from another perspective is shown in the figure.

[0020] Figure 3 The exploded view of the circuit board jig provided by the embodiment of the present application is shown in the figure.

[0021] Figure 4 The Figure 1 The sectional view along the A-A direction is shown in the figure.

[0022] Figure 5 The Figure 4 The enlarged schematic diagram of the local structure at B is shown in the figure.

[0023] Figure 6 The plane structure diagram of the first jig in the circuit board jig provided by the embodiment of the present application is shown in the figure.

[0024] Figure 7 The Figure 6 The plane structure diagram from another perspective is shown in the figure.

[0025] Figure 8 The Figure 6 The plane structure diagram along the C direction is shown in the figure.

[0026] Figure 9 The plane structure diagram of the second jig in the circuit board jig provided by the embodiment of the present application is shown in the figure.

[0027] Figure 10 The three-dimensional structure diagram of the second jig in the circuit board jig provided by the embodiment of the present application is shown in the figure.

[0028] Figure 11 The Figure 1 The sectional view along the D-D direction is shown in the figure.

[0029] Figure 12 The Figure 11 The enlarged schematic diagram of the local structure at E is shown in the figure.

[0030] Explanation of figure reference:

[0031] 1, first jig; 2, second jig; 3, elastic assembly; 4, magnetic attraction assembly; 5, positioning structure;

[0032] 10, circuit board jig; 11, first frame part; 12, bearing part; 13, mounting groove; 14, guide part; 15, buckle; 21, second connecting hole; 22, second frame part; 23, extension connecting part; 24, avoiding groove; 25, protruding block; 31, needle tube; 32, needle head; 33, spring; 41, first magnetic part; 42, second magnetic part; 51, positioning column; 52, positioning hole; 20, circuit board;

[0033] 111, first heat dissipation hole; 121, avoiding part; 122, first connecting hole; 131, transition groove; 221, second heat dissipation hole; 311, base; 201, base plate; 202, first electronic component;

[0034] 1221, first hole section; 1222, second hole section; 2011, first surface; 2012, second surface.

[0035] The implementation, functional features and advantages of the present application will be further described with reference to the embodiments and the accompanying drawings. DETAILED DESCRIPTION

[0036] The technical solutions in the present application will be described in detail below with reference to the accompanying drawings. In the description of the embodiments of the present application, unless otherwise specified, " / " represents the meaning of or, for example, A / B can represent A or B: "and / or" in the text only describes the association relationship of the associated objects, which means that there can be three relationships, for example, A and / or B, which means that there are three cases of A alone, A and B together, and B alone. In addition, in the description of the embodiments of the present application, "multiple" means two or more than two.

[0037] Hereinafter, the terms "first" and "second" are used only for descriptive purposes and cannot be understood as implying or suggesting relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with "first" and "second" can explicitly or implicitly include one or more features.

[0038] In the related art, when a double-sided process mounting technology is used to manufacture a circuit board, the substrate of the circuit board is placed on a mounting jig, a part of electronic components with larger quality is first mounted on the first surface of the substrate, then the second surface of the substrate is turned up, and the substrate is placed on the mounting jig again, and finally, a part of electronic components with smaller quality is mounted on the second surface. In the process of mounting, the furnace needs to be passed for reflow soldering.

[0039] However, when reflow soldering the electronic components on the second surface, the electronic components already mounted on the first surface may fall off or float up under the action of high temperature and gravity. At this time, the electronic components mounted on the first surface need to be repaired, which affects the manufacturing efficiency of the circuit board and the yield of the circuit board.

[0040] The floating up phenomenon refers to the uneven distance between the surface-mounted device and the substrate after welding, resulting in the phenomenon that part of the components cannot be closely attached to the surface of the substrate.

[0041] Therefore, the circuit board jig provided in the embodiments of the present application can avoid the falling or floating up of the electronic components that have been mounted to a certain extent, thereby improving the manufacturing efficiency of the circuit board.

[0042] The embodiments of the present application will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0043] Please refer to Figures 1 to 3 , Figure 1 the use state diagram of the circuit board jig provided in the embodiments of the present application, Figure 2 is Figure 1 a plan view from another perspective, Figure 3 is an exploded view of the circuit board jig provided in the embodiments of the present application. As shown in the figure, the present embodiment provides a circuit board jig 10, which includes a first jig 1, a second jig 2, and at least one elastic component 3. The first jig 1 is used to fix the substrate 201 of the circuit board 20. The second jig 2 is connected to the first jig 1, and the second jig 2 and the substrate 201 are located on different sides of the first jig 1.

[0044] Please continue to refer to Figure 4 and Figure 5 , Figure 4 is Figure 1 a sectional view along the A-A direction, Figure 5 is Figure 4 a local structure enlarged view at B in the figure. In the present embodiment, the elastic component 3 is connected to the second jig 2, and the elastic component 3 is used to abut against the first electronic component 202 on the substrate 201. The elastic component 3 is used to apply a elastic force to the first electronic component 202 to prevent the first electronic component 202 from moving away from the substrate 201.

[0045] In the embodiment, the first surface 2011 is the surface of the substrate 201 on which the first electronic component 202 is mounted, and the second surface 2012 is the surface opposite to the first surface 2011, on which the second electronic component (not shown in the figure) is mounted. Generally, the weight of the first electronic component 202 is greater than that of the second electronic component, and the first electronic component 202 satisfies G / Square inch>30, that is, the weight of the first electronic component 202 per unit area (1 square inch) is greater than 30 grams.

[0046] Generally, the second electronic component is mounted and reflow soldered after the mounting of the first electronic component 202 is completed. Thus, during the mounting of the second electronic component, the first electronic component 202 is located below the substrate 201, and the first electronic component 202 may be separated from the substrate 201 and float up under the action of gravity and high temperature.

[0047] The elastic assembly 3 abuts against the first electronic component 202 and applies an elastic force to the first electronic component 202, so that the first electronic component 202 can overcome the gravity and avoid being separated from the substrate 201 or floating up to a certain extent even under high temperature. Thus, the manufacturing efficiency of the circuit board 20 can be improved, and the yield of the circuit board 20 can be improved.

[0048] Please continue to combine Figure 6 and Figure 7 , Figure 6 the planar structure schematic view of the first jig in the circuit board jig provided by the embodiment of the present application, Figure 7 is Figure 6 the planar structure schematic view from another perspective. In order to support the circuit board 20, in some specific embodiments, the first jig 1 includes a first frame part 11 and a supporting part 12 connected to the inner side of the first frame part 11. The supporting part 12 is used to support the circuit board 20. Specifically, the supporting part 12 and the first frame part 11 form a mounting groove 13 therebetween, and the supporting part 12 is formed with a void part 121 for avoiding the first electronic component 202 or the second electronic component. Generally, the number of the void parts 121 corresponds to the number of the electronic components, and the void parts 121 are arranged in multiple.

[0049] It should be noted that, in order to avoid damage to the corner structure of the substrate 201 caused by the corner structure of the mounting groove 13, in some embodiments, a transition groove 131 recessed towards the outside is formed on the side wall corresponding to the corner position of the mounting groove 13, and the side wall of the transition groove 131 is curved. Thus, the corner structure of the substrate 201 can be prevented from being damaged by the corner structure of the mounting groove 13 to a certain extent.

[0050] Further, in some embodiments, a plurality of first heat dissipation holes 111 are arranged on the first frame part 11 in a spaced manner. The first heat dissipation holes 111 mainly serve to reduce the weight of the first jig 1 for facilitating manual moving, and reduce the heat absorption of the first jig 1, so as to avoid affecting the temperature of the surface of the circuit board 20 to a certain extent. In the process of mounting the first electronic component 202 and the second electronic component, the temperature control is relatively strict, and the mounting time is relatively short. If the first jig 1 absorbs too much heat, the surface temperature of the circuit board 20 may not reach the expected temperature rapidly, thereby causing poor welding.

[0051] In order to connect the elastic assembly 3 between the first jig 1 and the second jig 2, a first connecting hole 122 is arranged on the bearing part 12, a second connecting hole 21 opposite to the first connecting hole 122 is arranged on the second jig 2, and the elastic assembly 3 is arranged in the first connecting hole 122 and the second connecting hole 21. The end of the elastic assembly 3 abuts against the first electronic component 202, so as to apply elastic force to the first electronic component 202. In this way, the elastic assembly 3 can be connected between the first jig 1 and the second jig 2, so that the elastic assembly 3 applies elastic force to the first electronic component 202.

[0052] In some embodiments, in order to avoid the first electronic component 202, the first connecting hole 122 can be arranged to include a first hole section 1221 and a second hole section 1222 in communication. The second hole section 1222 is located on the side of the first hole section 1221 close to the substrate 201, and the hole diameter of the second hole section 1222 is greater than the hole diameter of the first hole section 1221. In this way, not only can the first electronic component 202 be avoided, but also the weight of the first jig 1 can be reduced while reducing the use of raw materials by the first jig 1.

[0053] Please continue to combine Figure 8 , Figure 8 To Figure 6 A schematic view of the planar structure along the C direction. It can be understood that in the process of manufacturing the circuit board 20, the circuit board jig 10 provided in the embodiment and the circuit board 20 need to be placed in the furnace together to reflow the first electronic component 202 or the second electronic component. Therefore, in order to facilitate the movement of the circuit board jig 10 and the circuit board 20 in the furnace, in some embodiments, the two sides of the first frame part 11 are connected with guide parts 14, and the thickness of the guide parts 14 is less than the thickness of the first frame part 11, that is, the two sides of the first jig 1 are formed as a step. In this way, through the arrangement of the guide parts 14, the circuit board jig 10 and the circuit board 20 provided in the embodiment can be moved in the furnace.

[0054] Please continue to combine Figure 9 andFigure 10 , Figure 9 FIG. 2 is a schematic diagram of a planar structure of a second jig in a circuit board jig according to an embodiment of the present application; Figure 10 FIG. 2 is a schematic diagram of a planar structure of a second jig in a circuit board jig according to an embodiment of the present application;

[0055] It should be noted that in the present embodiment, one extension connecting portion 23 corresponds to one second connecting hole 21, that is, the number of extension connecting portions 23 is the same as the number of first electronic elements 202.

[0056] Similarly, the second frame portion 22 can be provided with a second heat dissipation hole 221, which has the same function as the first heat dissipation hole 111. Here, no further description is given.

[0057] In order to avoid the influence of the second connecting hole 21 on the structural strength of the second jig 2, in some embodiments, the thickness of the position where the extension connecting portion 23 is located is greater than the structural thickness of other regions of the second jig 2.

[0058] In order to connect the first jig 1 and the second jig 2 together, the circuit board jig 10 provided in the present embodiment further comprises a magnetic attraction assembly 4, and the first frame portion 11 of the first jig 1 and the second frame portion 22 of the second jig 2 are connected together through the magnetic attraction assembly 4. In this way, the connection between the first jig 1 and the second jig 2 can be achieved.

[0059] Specifically, the magnetic attraction assembly 4 comprises a first magnetic member 41 and a second magnetic member 42, the first magnetic member 41 is arranged on the side of the first frame portion 11 facing the second frame portion 22, and the second magnetic member 42 is arranged on the side of the second frame portion 22 facing the first frame portion 11. The first magnetic member 41 can be a magnet, and the second magnetic member 42 can be a magnetic attraction buckle. Of course, in other embodiments, the first magnetic member 41 and the second magnetic member 42 can both be magnets or both be magnetic attraction buckles, and here, the types of the first magnetic member 41 and the second magnetic member 42 are not specifically limited.

[0060] It should be noted that the first jig 1 and the second jig 2 can also be connected by other connection modes, for example, connected together by a snap connection mode. Here, the connection mode between the first jig 1 and the second jig 2 is not specifically limited.

[0061] In order to improve the connection reliability between the first jig 1 and the second jig 2, the first jig 1 and the second jig 2 are connected together by a plurality of spaced magnetic attraction assemblies 4. For example, as shown in Figure 7 and Figure 10 , the first magnetic member 41 is distributed at the four corner regions of the first frame part 11, and the second magnetic member 42 is distributed at the four corner regions of the second frame part 22. Of course, in some other embodiments, the first magnetic member 41 and the second magnetic member 42 can also be distributed at other positions, and here the setting position of the first magnetic member 41 and the second magnetic member 42 is not specifically limited.

[0062] Please continue to combine Figure 11 and Figure 12 , Figure 11 for Figure 1 the cross-sectional view along the D-D direction, Figure 12 for Figure 11 the enlarged schematic view of the local structure at E in FIG. 4. It can be understood that if the relative position of the first jig 1 and the second jig 2 is determined when the first jig 1 and the second jig 2 are connected, the connection efficiency between the first jig 1 and the second jig 2 can be improved. Therefore, in some embodiments, the circuit board jig 10 provided in the present embodiment further comprises a positioning structure 5, which is arranged between the first jig 1 and the second jig 2 to limit the relative position of the first jig 1 and the second jig 2. In this way, by arranging the positioning structure 5 between the first jig 1 and the second jig 2, the connection efficiency between the first jig 1 and the second jig 2 can be improved.

[0063] In some optional embodiments, the positioning structure 5 comprises a positioning column 51 and a positioning hole 52, the positioning column 51 is inserted into the positioning hole 52; the positioning column 51 is arranged on one of the first jig 1 and the second jig 2, and the positioning hole 52 is arranged on the other one of the first jig 1 and the second jig 2. In this way, by cooperating between the positioning column 51 and the positioning hole 52, the relative position between the first jig 1 and the second jig 2 can be determined to improve the connection efficiency between the first jig 1 and the second jig 2.

[0064] In the specific embodiments of the present embodiment, the positioning column 51 is arranged on the second frame part 22, and the positioning hole 52 is arranged on the first frame part 11.

[0065] To improve the positioning effect between the first fixture 1 and the second fixture 2, two positioning structures 5 can be provided, with the two positioning structures 5 respectively located on opposite sides of the circuit board fixture 10. Here, no specific restrictions are placed on the number or location of the positioning structures 5.

[0066] Generally, the first fixture 1 needs to be provided with a buckle 15 to fasten the substrate 201. Since the second fixture 2 may interfere with the buckle 15, in some embodiments, the side of the second frame portion 22 of the second fixture 2 facing the first frame portion 11 is formed with a relief groove 24 to avoid the buckle 15.

[0067] Specifically, the second frame portion 22 is provided with protrusions 25, and a clearance groove 24 is formed between every two protrusions 25. Here, there are no specific restrictions on the formation of the clearance groove 24.

[0068] like Figure 5 As shown, in some specific embodiments, the elastic component 3 is a spring-loaded pin; the spring-loaded pin includes a needle tube 31, a needle tip 32, and a spring 33. The needle tube 31 passes through the second connecting hole 21 and the first connecting hole 122 in sequence. The base 311 of the needle tube 31 is located outside the second connecting hole 21 and connected to the second frame portion 22. The needle tip 32 is slidably engaged with the needle tube 31, and the spring 33 is located inside the needle tube 31, connecting the needle tip 32 and the needle tube 31. The end of the needle tip 32 abuts against the first electronic component 202, so that the spring 33 is compressed. In this way, through the spring 33, the elastic component 3 can apply an elastic force to the corresponding first electronic component 202, so as to a certain extent, prevent the first electronic component 202 from falling off or floating.

[0069] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A circuit board fixture, comprising: The utility model relates to a circuit board fixing device, comprising: a first jig for fixing a substrate of a circuit board; a second jig connected to the first jig, and the second jig and the substrate are located at different sides of the first jig; and at least one elastic component connected to the second jig, the elastic component is used for abutting against a first electronic component on the substrate, and the elastic component is used for applying an elastic force to the first electronic component. The first jig comprises a first frame part and a bearing part connected to the inner side of the first frame part, and the bearing part is used for bearing the circuit board; 2. The circuit board fixture of claim 1, wherein wherein a first connecting hole is formed on the bearing part, a second connecting hole opposite to the first connecting hole is formed on the second jig, and the elastic component is arranged in the first connecting hole and the second connecting hole; The end of the elastic component abuts against the first electronic component, and is used for applying an elastic force to the first electronic component. The second jig comprises a second frame part and an extension connecting part connected to the inner side of the second frame part; 3. The circuit board fixture of claim 2, wherein The second frame part is connected to the first frame part, and the second connecting hole is formed on the extension connecting part. The elastic component is a spring needle; 4. The circuit board fixture of claim 3, wherein The spring needle comprises a needle tube, a needle head and a spring, the needle tube is arranged in the second connecting hole and the first connecting hole in sequence, the base of the needle tube is located outside the second connecting hole and is connected to the second frame part; The needle head is in sliding fit with the needle tube, the spring is located in the needle tube and is connected between the needle head and the needle tube; The end of the needle head abuts against the first electronic component, so that the spring is compressed. Further comprising a magnetic assembly, the first jig and the second jig are connected together through the magnetic assembly.

5. The circuit board fixture of any one of claims 1 to 4, wherein, The magnetic assembly comprises a first magnetic member and a second magnetic member, the first magnetic member is arranged on the side of the first jig facing the second jig, and the second magnetic member is arranged on the side of the second jig facing the first jig.

6. The circuit board fixture of claim 5, wherein The first jig and the second jig are connected together through a plurality of magnetic assemblies arranged at intervals.

7. The circuit board fixture of claim 5, wherein Further comprising a positioning structure arranged between the first jig and the second jig to limit the relative position of the first jig and the second jig.

8. The circuit board fixture of any one of claims 1 to 4, 6 to 7, wherein, The positioning structure comprises a positioning column and a positioning hole, and the positioning column is inserted into the positioning hole; 9. The circuit board fixture of claim 8, wherein, The positioning column is arranged on one of the first jig and the second jig, and the positioning hole is formed on the other one of the first jig and the second jig. The first jig has a buckle for fastening the substrate, and the second jig has an avoiding groove for avoiding the buckle.

10. The circuit board fixture of any one of claims 1 to 4, 6 to 7, 9, wherein, ​

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