Heat dissipation assembly and server

Abstract

The utility model discloses a heat dissipation assembly and a server, and relates to the technical field of heat dissipation. The heat dissipation assembly comprises a first heat dissipation module, a second heat dissipation module and a liquid separation and collection device, and the first heat dissipation module is used for being connected with a first heating module; the second heat dissipation module is used for being connected with the second heating module. The liquid distribution and collection device is fixedly connected with the first heat dissipation module and connected with the second heat dissipation module through a connecting pipeline, and liquid inlet and liquid outlet of the first heat dissipation module and liquid inlet and liquid outlet of the second heat dissipation module are communicated based on the liquid distribution and collection device.

Description

Technical Field

[0001] This disclosure relates to the field of heat dissipation technology, and in particular to a heat dissipation component and a server. Background Technology

[0002] As the power consumption of core server components increases, the resulting heat dissipation problem becomes increasingly prominent. Traditional rack-mount servers typically rely on fans for cooling, but fans are limited by space constraints such as height, width, and depth, making it impossible to improve the internal cooling requirements of the machine by simply increasing the number of fans. Utility Model Content

[0003] To address the aforementioned technical problems, the present disclosure provides the following technical solutions:

[0004] The first aspect of this disclosure provides a heat dissipation component, including:

[0005] The first heat dissipation module is used to connect to the first heat-generating module;

[0006] The second heat dissipation module is used to connect to the second heat-generating module;

[0007] The liquid distributor is fixedly connected to the first heat dissipation module and connected to the second heat dissipation module through a connecting pipe, so that the liquid inlet and outlet of the first heat dissipation module and the second heat dissipation module can be interconnected.

[0008] In some modified embodiments of the first aspect of this disclosure, the manifold includes a first fluid distributor, which is integrally formed with a first heat dissipation module and is connected to the GPU cold plate of the first heat dissipation module.

[0009] In some modified embodiments of the first aspect of this disclosure, the manifold further includes a main inlet fluid distributor and a main outlet fluid distributor, and the second heat dissipation module is connected to the main inlet fluid distributor and the main outlet fluid distributor respectively through connecting pipes;

[0010] The first fluid distributor includes a first inlet fluid distribution component and a first outlet fluid distribution component. The first inlet fluid distribution component is connected to the main inlet fluid distributor, and the first outlet fluid distribution component is connected to the main outlet fluid distributor.

[0011] In some modified embodiments of the first aspect of this disclosure, the main inlet fluid distributor and the main outlet fluid distributor are disposed on both sides of the first fluid distributor, the main inlet fluid distributor and the main outlet fluid distributor are perpendicular to the first fluid distributor, and the second heat dissipation module is connected to the side walls of the main inlet fluid distributor and the main outlet fluid distributor respectively through connecting pipes.

[0012] In some modified embodiments of the first aspect of this disclosure, the first heat dissipation module further includes a plurality of water pipes communicating with the GPU cold plate and a first quick connector, wherein the water pipes are adapted to be connected to the first heat dissipation module via the first quick connector;

[0013] The manifold is equipped with a second quick-connect fitting, and the connecting pipe is connected to the second quick-connect fitting.

[0014] In some modified embodiments of the first aspect of this disclosure, the first heat dissipation module further includes a water collection tray and a leakage detector. The water collection tray is disposed below the liquid distributor and is fixedly connected to the liquid distributor. The leakage detector is disposed in the water collection tray.

[0015] A baffle is installed on the connecting pipe, and the water collection tray is located in the projection area between the liquid distributor and the baffle.

[0016] In some modified embodiments of the first aspect of this disclosure, the liquid distributor is provided with a plurality of inlet connectors for communicating with a plurality of main inlet pipes respectively and a plurality of outlet connectors for communicating with a plurality of main outlet pipes respectively.

[0017] A flow regulating valve is installed on the connecting pipe; and / or a third quick-connect fitting is installed on the connecting pipe.

[0018] In some modified embodiments of the first aspect of this disclosure, the second heat dissipation module includes:

[0019] The memory module cold plate consists of multiple parallel plates and thermal pads. The plates are hollow inside and have thermal pads on the outside.

[0020] A second fluid distributor and a third fluid distributor are disposed on both sides of the plate and communicate with the interior of the plate. The second fluid distributor is connected to the main inlet fluid distributor and the main outlet fluid distributor; and / or

[0021] The CPU cold plate has its input and output terminals connected to the second and third fluid distributors, respectively; and / or

[0022] Power supply heat sinks, multiple power supply heat sinks are respectively connected to the second fluid distributor and the third fluid distributor.

[0023] In some modified embodiments of the first aspect of this disclosure, it further includes:

[0024] The third heat dissipation module includes multiple switch cold plates, and the cooling pipes of the multiple switch cold plates are connected in series to dissipate heat from the third heat dissipation module.

[0025] The inlet and outlet of the third heat dissipation module are connected to the manifold via a fourth quick-connect connector.

[0026] A second aspect of this disclosure provides a server, comprising:

[0027] First heating module;

[0028] Second heating module;

[0029] A heat dissipation assembly is used to dissipate heat from the first heat-generating module and the second heat-generating module; the heat dissipation assembly includes:

[0030] A first heat dissipation module is connected to a first heat-generating module;

[0031] The second heat dissipation module is connected to the second heat generation module;

[0032] The liquid distributor is fixedly connected to the first heat dissipation module and connected to the second heat dissipation module through a connecting pipe, so that the liquid inlet and outlet of the first heat dissipation module and the second heat dissipation module can be interconnected. Attached Figure Description

[0033] The above and other objects, features, and advantages of exemplary embodiments of the present disclosure will become readily apparent upon reading the following detailed description with reference to the accompanying drawings. In the drawings, several embodiments of the present disclosure are illustrated by way of example and not limitation, with the same or corresponding reference numerals denoteing the same or corresponding parts, wherein:

[0034] Figure 1 A schematic diagram of a heat dissipation component is shown.

[0035] Figure 2 An exploded view of a heat dissipation component is shown schematically.

[0036] Figure 3 A schematic diagram of the structure of a second heat dissipation module of a heat dissipation assembly is shown.

[0037] Figure 4 A schematic diagram of the structure of a first heat dissipation module of a heat dissipation assembly is shown.

[0038] Figure 5 A schematic diagram of another heat dissipation component is shown.

[0039] Figure 6 A schematic diagram of the structure of another heat dissipation component, the CPU cold plate, is shown.

[0040] Figure 7 A schematic diagram of the structure of a memory module cold plate, another heat dissipation component, is shown.

[0041] Figure 8 A schematic diagram of a current distribution structure for another heat dissipation component is shown.

[0042] Figure 9 A schematic diagram of the structure of a third heat dissipation module of another heat dissipation component is shown.

[0043] Figure 10 A schematic diagram of a server structure is shown.

[0044] Explanation of icon numbers:

[0045] 1. First heat dissipation module; 11. Water pipe; 12. First quick connector; 13. GPU cold plate; 14. Water collection tray; 15. Leak detector; 2. Second heat dissipation module; 21. Connecting pipe; 22. Memory module cold plate; 221. Board body; 222. Thermal pad; 23. Second fluid distributor; 24. Third fluid distributor; 25. CPU cold plate; 26. Power supply heat sink; 3. Liquid distributor; 31. First fluid distributor; 311. First inlet fluid distribution assembly; 312. First outlet fluid distribution assembly; 32. Main inlet fluid distributor; 33. Main outlet fluid distributor; 34. Inlet connector; 35. Outlet connector; 4. Main inlet pipe; 5. Main outlet pipe; 6. Second quick connector; 7. Third heat dissipation module; 71. Switch cold plate; 72. Fourth quick connector; 8. First heating module. Detailed Implementation

[0046] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0047] It should be noted that, unless otherwise stated, the technical or scientific terms used in this disclosure shall have the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure pertains.

[0048] As the power consumption of core server components increases, the resulting heat dissipation problem becomes increasingly prominent. Traditional rack-mount servers typically rely on fans for cooling. However, fans are limited by space constraints such as height, width, and depth, making it impossible to increase the number of fans to meet the internal cooling requirements. For example, some systems design liquid cooling for the CPU (Central Processing Unit) and DIMM (Dual In-line Memory Module) sections. If the server has multiple GPUs (Graphics Processing Units) and uses air cooling to dissipate GPU heat, there may be situations where the airflow is insufficient to dissipate the GPU heat, or the fans need to run at extremely high speeds to dissipate the heat.

[0049] To address the aforementioned technical issues, this disclosure proposes a heat dissipation component and server that integrates multiple heat dissipation modules for liquid cooling, thereby improving heat dissipation efficiency and meeting the heat dissipation needs of various heat-generating components such as the GPU inside the machine.

[0050] Example 1

[0051] like Figure 1 , Figure 2 and Figure 5 As shown, a heat dissipation assembly includes a first heat dissipation module 1, a second heat dissipation module 2, and a manifold 3. The first heat dissipation module 1 is used to connect to a first heat-generating module 8; the second heat dissipation module 2 is used to connect to a second heat-generating module; the manifold 3 is fixedly connected to the first heat dissipation module 1 and connected to the second heat dissipation module 2 through a connecting pipe 21, so that the liquid inlet and outlet of the first heat dissipation module 1 and the second heat dissipation module 2 can be interconnected based on the manifold 3.

[0052] The first heat dissipation module 1 refers to a device capable of, but not limited to, dissipating heat from a graphics processing unit (GPU). It absorbs heat from the GPU chip and dissipates it through a specific heat dissipation mechanism to keep the GPU within its normal operating temperature range and prevent performance degradation or damage caused by overheating. Specifically, the first heat dissipation module 1 may include a fluid distributor with multiple pipes connected to multiple GPU liquid cooling plates of the first heat dissipation module 1 for heat dissipation. More specifically, heat sinks may be installed on the GPU liquid cooling plates to transfer heat to the air, and the hot air is exhausted by a fan.

[0053] The second heat dissipation module 2 refers to a device capable of liquid cooling for heat-generating components. Its main function is to rapidly absorb the heat generated by the heat-generating components through liquid cooling technology and effectively transfer it away to keep these components within their normal operating temperature range, ensuring system stability and performance. For example, it can be a device for cooling components such as the CPU and memory modules together, or it can be a device for cooling components such as the CPU and memory modules separately.

[0054] The manifold 3 is a device for centrally managing and distributing coolant, including an inlet and an outlet. It connects to multiple heat dissipation modules, ensuring uniform coolant distribution among them. The manifold 3 can connect to the main inlet pipe 4 and the main outlet pipe 5, distributing the coolant in the main inlet pipe 4 to branch pipes of multiple heat dissipation modules. The coolant collected by the manifold 3 is then transported to the heat exchanger or radiator for cooling via the main outlet pipe 5. The main inlet pipe 4 and the main outlet pipe 5 can be connected to a water pump, driving the coolant flow in them. Specifically, the water pump can be an integrated pump built into the manifold 3 or a separate external pump. The pump's flow rate and head determine the coolant circulation speed and heat dissipation efficiency. More specifically, the main inlet pipe 4 and the main outlet pipe 5 can be connected to the CDU (Cold Delivery Unit). The CDU is an integrated device used to manage the temperature and flow rate of the coolant, ensuring that each heat dissipation component in the system is effectively cooled. The water pump built into the CDU is responsible for driving the coolant to circulate in the system. The flow rate can be adjusted via a built-in flow control valve to ensure that each heat dissipation component receives an appropriate coolant supply. The condenser within the CDU transfers heat from the coolant to the ambient air or other cooling media. Coolant is a heat transfer medium that transfers heat to the radiator. Specifically, the coolant needs to have good thermal conductivity and chemical stability to prevent corrosion and clogging; for example, the coolant can be deionized water, an aqueous solution of ethylene glycol, etc.

[0055] Specifically, the manifold 3 can be a multi-channel manifold 3, with multiple inlets and outlets, capable of connecting to multiple heat dissipation modules, suitable for complex liquid cooling systems. The multi-channel manifold 3 can connect to multiple heat dissipation modules as needed, flexibly addressing different heat dissipation requirements. Through its internal piping design, it ensures uniform distribution of coolant to each heat dissipation module. It is suitable for high-performance computing servers, data centers, and other systems with multiple GPUs or CPUs. The manifold 3 can also be an integrated manifold 3, integrating the manifold 3 with components such as radiators and pumps to form a complete liquid cooling module. This reduces system connection points, improves system reliability and stability, and simplifies installation by requiring only one module. The optimized coordination between components further enhances overall heat dissipation efficiency. It is suitable for applications requiring high performance and high reliability, such as high-end workstations and professional servers. The manifold 3 can also be an adjustable manifold 3, allowing users to adjust the coolant flow rate of each heat dissipation module according to actual needs, achieving personalized heat dissipation management. Users can adjust the coolant flow rate based on the heat output of different components, ensuring that each component receives appropriate cooling. It can also be equipped with a temperature sensor and control system to automatically adjust the coolant flow and optimize heat dissipation. Suitable for high-performance computing and laboratory environments requiring precise temperature control.

[0056] To ensure a secure and reliable connection between the manifold 3 and the first heatsink module 1 (such as the GPU's water block), various fixing methods can be employed. For example, the manifold 3 and the first heatsink module 1 can be connected using clips or quick-release devices. Installation and removal are quick and easy, requiring no tools. Alternatively, a dedicated adhesive can be used to fix the manifold 3 to the first heatsink module 1; no drilling or tools are needed, simply apply the adhesive directly. The adhesive provides a good seal, preventing coolant leakage. Clamps can also be used to fix the manifold 3 to the first heatsink module 1. Clamps provide some adjustment leeway to ensure a tight connection. The clamps can be equipped with quick-release mechanisms for easy disassembly. Welding can also be used to fix the manifold 3 to the first heatsink module 1; the welded connection is very strong, virtually impossible to loosen, and provides excellent sealing. The manifold 3 and the first heatsink module 1 can also be designed to interlock, achieving fixation through a mechanical structure. The integrated structure is compact, occupies little space, and installation can be completed with simple alignment. After the manifold 3 and the first heat dissipation module 1 are fixedly connected together in the above manner, the manifold 3 and the first heat dissipation module 1 can be connected through a guide plate to facilitate the inlet and outlet communication between the first heat dissipation module 1, the manifold 3, and the second heat dissipation module 2. Alternatively, the manifold 3 and the first heat dissipation module 1 can be integrally molded, which can significantly improve the stability and heat dissipation efficiency of the system. This design reduces connection points, lowers the risk of leakage, and simplifies the installation and maintenance process by merging the two components into one.

[0057] This disclosure integrates the first heat dissipation module 1 and the second heat dissipation module 2 into the manifold 3 by fixing the manifold 3 to the first heat dissipation module 1 and connecting the manifold 3 to the second heat dissipation module 2 via the connecting pipe 21. The manifold 3 allows the liquid inlet and outlet of the first heat dissipation module 1 and the second heat dissipation module 2 to be interconnected, thereby integrating multiple heat dissipation modules together for liquid cooling, thereby improving heat dissipation efficiency and meeting the heat dissipation needs of various heat-generating components such as the GPU inside the machine.

[0058] like Figure 1 , Figure 2 and Figure 4 As shown, in some modified embodiments of this disclosure, the manifold 3 includes a first fluid distributor 31, which is integrally formed with the first heat dissipation module 1 and is connected to the GPU cold plate 13 of the first heat dissipation module 1.

[0059] The first fluid distributor 31 is part of the manifold 3. Specifically, the first fluid distributor 31 can be a multi-channel fluid distributor with multiple inlets and outlets, capable of connecting multiple heat dissipation modules as needed to flexibly address different heat dissipation requirements. Its internal piping design ensures uniform distribution of coolant to each heat dissipation module. This is suitable for systems requiring multiple heat dissipation modules, such as high-performance computing servers and data centers. The first fluid distributor 31 can also be an integrated fluid distributor, integrating the fluid distributor with components such as radiators and water pumps to form a complete liquid cooling module. This reduces system connection points and improves system reliability and stability. Users only need to install one module, simplifying the installation process. The optimized coordination between components improves overall heat dissipation efficiency. This is suitable for applications requiring high performance and high reliability, such as high-end workstations and professional servers. It can also be an adjustable fluid distributor, allowing users to adjust the coolant flow rate of each heat dissipation module according to actual needs, achieving personalized heat dissipation management. Users can adjust the coolant flow rate according to the heat output of different components, ensuring that each component receives appropriate cooling. Adjustable fluid distributors can also be equipped with temperature sensors and control systems to automatically adjust coolant flow and optimize heat dissipation. They are suitable for high-performance computing and laboratory environments requiring precise temperature control.

[0060] Integrated molding refers to the first fluid distributor 31 and the first heat dissipation module 1 being integrated into a single component during manufacturing. Specifically, the first fluid distributor 31 and the first heat dissipation module 1 can be molded in one piece using a casting process, suitable for designs with complex shapes. For parts that cannot be molded in one piece, precision welding technology can be used for connection. High-precision machining using CNC machine tools can also be used to ensure that the dimensions and shapes of each component meet design requirements. More specifically, coolant channels can be designed inside the first fluid distributor 31, directly connecting to the inlet and outlet of the GPU liquid cooling plate. Optimizing the channel design can ensure uniform distribution of coolant on the GPU liquid cooling plate, improving heat dissipation efficiency. Temperature sensors can also be embedded in the integrated component to monitor the temperature of the GPU and other critical components in real time. The speed of the water pump and fan can be adjusted through an intelligent control system to ensure optimal heat dissipation. More specifically, the manifold 3 can be made of copper or aluminum, both materials having good thermal conductivity and mechanical strength. To prevent corrosion from the coolant, corrosion-resistant coatings or materials can be used. Specifically, such as... Figure 2 As shown, the first fluid distributor 31 can be directly connected to the second heat dissipation module 2 and other heat dissipation modules through pipes; for example... Figure 5 As shown, the first fluid distributor 31 can also be indirectly connected to the second heat dissipation module 2 and other heat dissipation modules through pipes via the main inlet fluid distributor 32 and the main outlet fluid distributor 33.

[0061] Specifically, such as Figure 2 As shown, the GPU cold plate 13 is a fluid distributor used to distribute the coolant in the first fluid distributor 31 to the GPU liquid cooling plate. The first fluid distributor 31 can be placed in the middle of the manifold 3, and the GPU cold plate 13 can be placed at both ends of the first fluid distributor 31. The GPU cold plate 13 of the first heat dissipation module 1 and the first fluid distributor 31 of the manifold 3 are integrated together and connected through a cavity inside the plate. The GPU cold plate 13 of the first heat dissipation module 1 is provided with multiple connectors for connecting the inlet and outlet of multiple GPU liquid cooling plates. The manifold 3, which is located in the middle, is connected to other heat dissipation modules through pipes. The first fluid distributor 31 is integrally formed with the first heat dissipation module 1, reducing intermediate connection points, lowering thermal resistance, and improving heat dissipation efficiency. Reducing connection points also reduces the risk of coolant leakage, improves the structural stability of the system, and reduces the possibility of vibration and loosening. Users only need to install a single integrated component, simplifying the installation process. The integrated design also makes better use of limited space, making it suitable for space-constrained servers and workstations.

[0062] like Figure 5 and Figure 8 As shown, in some modified embodiments of this disclosure, the manifold 3 further includes a total inlet fluid distributor 32 and a total outlet fluid distributor 33. The second heat dissipation module 2 is connected to the total inlet fluid distributor 32 and the total outlet fluid distributor 33 respectively through a connecting pipe 21. The first fluid distributor 31 includes a first inlet fluid distribution component 311 and a first outlet fluid distribution component 312. The first inlet fluid distribution component 311 is connected to the total inlet fluid distributor 32, and the first outlet fluid distribution component 312 is connected to the total outlet fluid distributor 33.

[0063] The main coolant distributor 32 is responsible for evenly distributing the coolant to the inlets of each heat dissipation module, ensuring that the coolant flows uniformly from the main circulation system into each heat dissipation module. Specifically, the main coolant distributor 32 can be a pipe network with multiple outlets, each outlet connecting to the inlet of a heat dissipation module. Each outlet is equipped with a standard quick connector for easy connection to the connection pipe 21 of the heat dissipation module. More specifically, the main coolant distributor 32 is made of copper or aluminum, which has good corrosion resistance and thermal conductivity.

[0064] The main outlet fluid distributor 33 is responsible for collecting the hot liquid flowing from each heat dissipation module and returning it to the main circulation system. This ensures that the hot liquid flowing from each heat dissipation module can smoothly return to the radiator or cooling device. The main outlet fluid distributor 33 is a network of pipes with multiple inlets, each inlet connecting to the outlet of a heat dissipation module. Each inlet can also be equipped with a standard quick connector for easy connection to the connection pipe 21 of the heat dissipation module. The main outlet fluid distributor 33 is also made of copper or aluminum, which has good corrosion resistance and thermal conductivity.

[0065] The first liquid inlet fluid distribution component 311 is a component with multiple internal flow channels, each flow channel connected to the liquid inlet of a GPU liquid cooling plate. Specifically, as shown... Figure 1 As shown, when the first liquid inlet distribution component 311 is far from the GPU liquid cooling plate, the first liquid inlet distribution component 311 can be connected to the liquid inlet of the GPU liquid cooling plate through a pipe; as shown Figure 5 As shown, when the first liquid inlet distribution assembly 311 is close to the GPU liquid cooling plate, it can be directly connected to the liquid inlet of the GPU liquid cooling plate via a connector, or it can be connected to the liquid inlet of the GPU liquid cooling plate via the liquid inlet distribution assembly of the GPU liquid cooling plate 13. More specifically, as... Figure 8 As shown, the outlets of the first liquid inlet fluid distribution assembly 311 and the main liquid inlet fluid distributor 32 can be connected by a guide plate to facilitate the flow of liquid inside the first liquid inlet fluid distribution assembly 311 and the main liquid inlet fluid distributor 32.

[0066] The first liquid outlet fluid distribution assembly 312 is an assembly with multiple internal flow channels, each of which connects to the outlet of a GPU liquid cooling plate. Similarly, when the first liquid outlet fluid distribution assembly 312 is far from the GPU liquid cooling plate, it can be connected to the inlet of the GPU liquid cooling plate via a pipe; when it is close to the GPU liquid cooling plate, it can be directly connected to the inlet of the GPU liquid cooling plate via a connector, or it can be connected to the inlet of the GPU liquid cooling plate via the liquid outlet fluid distribution assembly of the GPU cooling plate 13. The inlet of the first liquid outlet fluid distribution assembly 312 and the main liquid outlet fluid distributor 33 can also be connected via a guide plate to facilitate liquid flow within the integrally formed first liquid outlet fluid distribution assembly 312 and main liquid outlet fluid distributor 33.

[0067] Specifically, multiple connectors and plugs can be provided on the inlet ports of the first liquid inlet fluid distribution component 311 and the first liquid outlet fluid distribution component 312. The connectors are connected to the pipes of the GPU liquid cooling plate, and the plugs are used to seal unused connectors, thereby making room for more GPUs in the future and improving the applicability.

[0068] like Figure 5 and Figure 8As shown, in some modified embodiments of this disclosure, the main inlet fluid distributor 32 and the main outlet fluid distributor 33 are disposed on both sides of the first fluid distributor 31, perpendicular to the first fluid distributor 31. The second heat dissipation module 2 is connected to the side walls of the main inlet fluid distributor 32 and the main outlet fluid distributor 33 respectively via connecting pipes 21. Through vertical arrangement and optimized flow channel design, limited space is better utilized, making the entire system more compact and suitable for space-constrained servers and workstations. The vertical arrangement of each component makes the system layout more rational, facilitating expansion and upgrades. If a new heat dissipation module needs to be added, only a new pipe needs to be connected at the corresponding location. More specifically, the interfaces of the main inlet fluid distributor 32 and the main outlet fluid distributor 33 can be located on their opposite sides, further saving space.

[0069] like Figure 2 and Figure 4 As shown, in some modified embodiments of this disclosure, the first heat dissipation module 1 further includes multiple water pipes 11 connected to the GPU cold plate 13 and a first quick connector 12. The water pipes 11 are adapted to connect to the first heat dissipation module 8 through the first quick connector 12. The manifold 3 is provided with a second quick connector 6, and the connecting pipe 21 is connected to the second quick connector 6.

[0070] The first quick-connect coupling 12 and the second quick-connect coupling 6 are key components in the liquid cooling system for quickly connecting and disconnecting water pipes 11. They facilitate installation and maintenance while ensuring reliable and airtight connections. Specifically, the first quick-connect coupling 12 and the second quick-connect coupling 6 include a body, a sealing ring, a locking mechanism, and an interface. The body is made of stainless steel, brass, or engineering plastic, offering good corrosion resistance and pressure resistance. The body is cylindrical or conical, containing a sealing ring and a locking mechanism. The sealing ring is made of EPDM (ethylene propylene diene monomer rubber), NBR (nitrile butadiene rubber), or PTFE (polytetrafluoroethylene), offering good heat and chemical resistance. The sealing ring ensures a tight seal at the connection, preventing coolant leakage. The locking mechanism can be push-pull, rotary, or press-type. It ensures reliable and stable connections, preventing accidental disconnection. The interface uses standardized connectors, such as G1 / 4, G1 / 2, and 1 / 4 inch, facilitating compatibility with other pipes and fittings. The interface is designed for quick plug-in operation, making it simple and fast. More specifically, the structures of the first quick-connector 12 and the second quick-connector 6 can be the same or different. More specifically, the first quick-connector 12 and the second quick-connector 6 can be connected using an NVQD02 connector. More specifically, the first quick-connector 12 and the second quick-connector 6 can consist of male and female connectors, with the connection ensured by the mating of the male and female connectors.

[0071] During connection, taking the first quick-connect coupling 12 as an example, the other end of the pipe can be inserted into the body of the first quick-connect coupling 12. By pushing, pulling, rotating, or pressing the locking mechanism, the connecting pipe 21 is securely fixed to the first quick-connect coupling 12, and the sealing ring forms a seal at the connection to prevent coolant leakage. To disconnect, the locking mechanism can be reversed to release the lock. Gently pull out the connecting pipe 21 to disconnect the connection. The interface between the body of the first quick-connect coupling 12 and the pipe is equipped with a self-sealing function to prevent coolant leakage when disconnected.

[0072] By setting the first quick-connect connector 12 and the second quick-connect connector 6, the manifold and the other two heat dissipation modules can be quickly disassembled and assembled. Designing the liquid cooling system module as three detachable modules means that when one module needs to be replaced, the other two modules can be removed via the quick-connect connectors to complete the module maintenance. This effectively reduces maintenance and repair costs and significantly lowers the packaging and transportation costs of the entire liquid cooling system module.

[0073] like Figure 4 As shown, in some modified embodiments of this disclosure, the first heat dissipation module 1 further includes a water collection tray 14 and a leakage detector 15. The water collection tray 14 is disposed below the liquid distributor 3 and is fixedly connected to the liquid distributor 3. The leakage detector 15 is disposed in the water collection tray 14. A baffle is provided on the connecting pipe 21, and the water collection tray 14 is disposed in the projection area between the liquid distributor 3 and the baffle.

[0074] The coolant tray 14 is a device used to collect any leaking coolant. It is positioned below the manifold 3 to prevent coolant leakage into other components, thus protecting the system from damage. Specifically, the coolant tray 14 is made of stainless steel, plastic, or aluminum, offering good corrosion resistance and pressure resistance. The coolant tray 14 can be a flat, disc-shaped structure with slightly raised edges to prevent coolant overflow. More specifically, the coolant tray 14 can be securely connected to the manifold using various fixing methods such as screws, clips, or adhesives, ensuring the coolant tray 14 is firmly fixed below the manifold 3 and preventing displacement.

[0075] A leak detector 15 is a device used to detect coolant leaks. It is installed in the coolant collection pan 14 and emits an alarm signal when a leak is detected, alerting the user to take timely action. Specifically, the leak detector 15 may include a sensor and an alarm system. The sensor can be conductivity-type, optical-type, or humidity-type, and can be installed at the bottom or side wall of the coolant collection pan 14. The alarm system can be an audible and visual alarm, a remote alarm, and a data logging system; it emits an alarm signal when a leak is detected, alerting the user to handle the situation promptly. More specifically, the leak detector 15 can be a conductivity-type leak detector 15, which determines whether a leak has occurred by detecting the conductivity of the coolant; it has high sensitivity and fast response speed, and is suitable for coolants with high conductivity. The leak detector 15 can also be an optical leak detector 15, which determines whether a leak has occurred by detecting the reflection or refraction of light by the coolant; it is unaffected by the conductivity of the coolant and is suitable for various types of coolants. The leak detector 15 can also be a humidity-type leak detector 15, which determines whether a leak has occurred by detecting changes in the humidity of the surrounding environment; it is suitable for situations with significant humidity changes. More specifically, the leak detector 15 can also be a leak detection line, a cable-type sensor composed of multiple conductive wires and an insulating layer. When coolant comes into contact with the conductive wires, it changes the resistance or conductivity between the wires, thereby triggering the alarm system.

[0076] The baffle can be integrally formed with the connecting pipe 21 and set on the outer periphery of the connecting pipe 21 or only set on the bottom of the connecting pipe 21. The baffle on the connecting pipe 21 can prevent the leakage from flowing along the lower edge of the connecting pipe 21 and flowing into a larger area. The water collection tray 14 is set in the projection area between the liquid distributor 3 and the baffle, which can ensure that the leakage is received while avoiding the water collection tray 14 being too large and occupying too much space.

[0077] like Figure 5 As shown, in some modified embodiments of this disclosure, the manifold 3 is provided with a plurality of inlet connectors 34 for communicating with a plurality of main inlet pipes 4 respectively and a plurality of outlet connectors 35 for communicating with a plurality of main outlet pipes 5 respectively; a flow regulating valve is provided on the connecting pipe 21; and / or a third quick-connect connector is provided on the connecting pipe 21.

[0078] The manifold 3 is equipped with multiple inlet connectors 34 for connecting to multiple main inlet pipes 4 and multiple outlet connectors 35 for connecting to multiple main outlet pipes 5. This allows users to select the appropriate number of inlet connectors 34 and outlet connectors 35 according to their needs. For example, three inlet connectors 34 and three outlet connectors 35 can be provided. Depending on the total flow requirement of the system, one, two, or three connectors can be used to supply liquid simultaneously. When the system's liquid supply demand is not high, only the connector part needs to be replaced with a plug to ensure no leakage. This design provides a reserve for future higher power consumption CPUs and GPUs, allowing for shared design in the next generation, reducing development time and saving design costs.

[0079] A flow regulating valve is installed on the connecting pipe 21 to adjust the flow rate. When replacing a heat dissipation component with one that requires higher heat dissipation, the flow regulating valve can be used to increase the passage of the connecting pipe 21 and decrease its flow resistance coefficient to meet the heat dissipation requirements. More specifically, when the heat dissipation requirement of the first heat dissipation module 1 increases, the total required flow rate and pressure drop of the system increase. Using the 2-way and 3-way connectors for joint liquid supply, the pipes of the first heat dissipation module 1 and the second heat dissipation module 2 are connected in parallel with the same pressure drop. However, the first heat dissipation module 1, which has not been replaced, does not require more flow. In this case, the flow regulating valve can be used to decrease the passage of the connecting pipe 21 and increase its flow resistance coefficient to reduce the flow of the second module, thereby reducing costs. Furthermore, a flow meter can be installed on the flow regulating valve for convenient adjustment and observation of its flow rate.

[0080] An additional third quick-connect fitting can also be installed to adjust flow resistance. When greater flow resistance is required on connecting pipe 21, a third quick-connect fitting can be installed on connecting pipe 21. When greater flow rate is required on connecting pipe 21 and flow resistance needs to be reduced, the third quick-connect fitting can be removed and connected directly to the second fitting.

[0081] like Figure 3 As shown, in some modified embodiments of this disclosure, the second heat dissipation module 2 includes a memory module cold plate 22, a second fluid distributor 23, and a third fluid distributor 24. The memory module cold plate 22 includes multiple parallel plates 221 and thermal pads 222. The plates 221 are hollow inside, and thermal pads 222 are provided on the outside of the plates 221. The second fluid distributor 23 and the third fluid distributor 24 are disposed on both sides of the plates 221 and communicate with the inside of the plates 221. The second fluid distributor 23 is connected to the main inlet fluid distributor 32 and the main outlet fluid distributor 33.

[0082] The memory module cooling plate 22 consists of multiple parallel plates 221, hollow inside to form microchannels for easy coolant flow. The plates 221 can be designed according to the size and heat dissipation requirements of the memory module, ensuring a good fit. The plates 221 are commonly made of copper or aluminum, which have good thermal conductivity. Thermal pads 222 are located on the outer side of the plates 221 to improve heat conduction efficiency. The thermal pads 222 are made of thermal grease, thermal pads, or phase change materials, possessing good thermal conductivity and flexibility. This ensures close contact between the plates 221 and the surface of the memory module, improving heat conduction efficiency.

[0083] The second fluid distributor 23 is a pipe network with multiple inlets and outlets, with the inlets and outlets respectively located on both sides of the second fluid distributor 23. A baffle is provided in the middle of the second fluid distributor 23 to separate the multiple inlets and outlets. It is located on one side of the plate body 221 and communicates with the interior of the plate body 221. Each outlet is equipped with an interface for easy connection to the plate body 221. The second fluid distributor 23 can also be integrally formed with the plate body 221. The third fluid distributor 24 is a pipe network with multiple inlets and outlets. Each inlet connects to a liquid outlet of the plate body 221, and each outlet connects to a liquid near-liquid port of the body. The multiple inlets of the third fluid distributor 24 correspond to the multiple outlets of the second fluid distributor 23; the multiple outlets of the third fluid distributor 24 correspond to the multiple inlets of the second fluid distributor 23. The third fluid distributor 24 is located on the other side of the plate body 221 and communicates with the interior of the plate body 221. The third fluid distributor 24 can also be integrally formed with the plate body 221. The coolant enters the cold plate from multiple inlets of the second fluid distributor 23 and flows out from multiple outlets of the third fluid distributor 24.

[0084] like Figure 2 As shown, in some modified embodiments of this disclosure, the second heat dissipation module 2 further includes a CPU cold plate 25, which can be directly connected to the manifold 3 via a pipe. The input and output ends of the CPU cold plate 25 can also be connected to the second fluid distributor 23 and the third fluid distributor 24, respectively. Figure 5 , Figure 6 and Figure 7 As shown, the CPU cold plate 25 can also be directly connected to the manifold 3 via a pipe.

[0085] The CPU cold plate 25 is a liquid cooling device specifically designed for CPU heat dissipation. It can be made of metal, with internal microchannels and an external thermal pad. Coolant flows through the microchannels, carrying away the heat generated by the CPU for efficient heat dissipation. More specifically, the main body of the CPU cold plate 25 can be made of copper or aluminum, which have excellent thermal conductivity. The main structure can be a flat rectangular or square plate with internal microchannels to ensure full contact between the coolant and the CPU surface. The CPU cold plate 25 can also have a thermally conductive structure on its bottom, such as thermal grease, a thermal pad, or a phase change material, to ensure tight contact between the cold plate and the CPU surface, improving heat transfer efficiency.

[0086] like Figure 2 As shown, in some modified embodiments of this disclosure, the second heat dissipation module 2 further includes power radiators 26, and multiple power radiators 26 are respectively connected to the second fluid distributor 23 and the third fluid distributor 24. The power radiator 26 is a device for heat dissipation of the power module. Specifically, the power radiator 26 can be a thermally conductive block, thereby conducting the heat from the power module to the second fluid distributor 23 and the third fluid distributor 24 for heat dissipation. More specifically, the power radiator 26 can be a metal block such as a thermally conductive copper block. The power radiator 26 can also be a liquid cooling device with internal microchannels to ensure sufficient contact between the coolant and the surface of the power module for efficient heat transfer. The power radiator 26 has an external thermally conductive pad 222 located at the bottom of the radiator to improve heat conduction efficiency.

[0087] like Figure 5 , Figure 8 and Figure 9As shown, in some modified embodiments of this disclosure, the heat dissipation assembly further includes a third heat dissipation module 7. The third heat dissipation module 7 includes multiple switch cold plates 71, and the cooling pipes of the multiple switch cold plates 71 are connected in series for heat dissipation of the third heat-generating module. The liquid inlet and liquid outlet of the third heat dissipation module 7 are respectively connected to the manifold 3 via a fourth quick connector 72. The switch cold plates 71 of the third heat dissipation module 7 are liquid cooling devices for heat dissipation of the switches, with microchannels inside and thermal pads on the outside. The cooling pipes of the multiple switch cold plates 71 are connected in series, thereby providing unified heat dissipation for multiple switch chips and improving heat dissipation efficiency. The fourth quick connector 72 is also a connector for quickly connecting and disconnecting the connecting pipe 21. The structure and composition of the fourth quick connector 72 can be the same as or different from the first quick connector 12. Its type can be push-pull, rotary, or press-type. The fourth quick connector 72 is used to connect the liquid inlet and liquid outlet of the third heat dissipation module 7 to the manifold 3, facilitating installation and maintenance. Specifically, the third heatsink module can be connected to the main inlet pipe via a pair of UQD02 connectors. The flow rate and pressure drop can be adjusted by using the connectors and the main inlet pipe orifice diameter. Due to limited space on the motherboard, a copper cold plate can be used for this part, with the four switches connected in series. Because of motherboard limitations, the entire cold plate is mounted upside down on the top of the chassis. For stability, copper rigid tubing is used for the switch cold plates, and EPDM (ethylene propylene diene monomer) flexible tubing with connectors is used to connect them to the main inlet pipe, allowing for adjustment and compensating for installation tolerances. Similarly, other heatsink modules can be connected to the manifold via UQD02 connectors, and the flow resistance and pressure drop can be adjusted by using the connectors and pipe orifice diameter. All the tubing connected to the manifold can be made of EPDM material to reduce the pressure effects caused by friction between the tubing.

[0088] Example 2

[0089] like Figure 10 As shown, a server includes a first heating module 8, a second heating module, and a heat dissipation assembly. The heat dissipation assembly is used to dissipate heat from the first heating module 8 and the second heating module. The heat dissipation assembly includes a first heat dissipation module 1, a second heat dissipation module 2, and a manifold 3. The first heat dissipation module 1 is connected to the first heating module 8. The second heat dissipation module 2 is connected to the second heating module. The manifold 3 is fixedly connected to the first heat dissipation module 1 and connected to the second heat dissipation module 2 through a connecting pipe 21. The manifold 3 enables the inlet and outlet of liquid in the first heat dissipation module 1 and the second heat dissipation module 2 to communicate with each other.

[0090] Specifically, the first heat-generating module 8 includes the main heat-generating components requiring heat dissipation, such as the CPU and GPU. The first heat-generating module 8 is connected to the first heat dissipation module 1 and dissipates heat through coolant. The second heat-generating module includes secondary heat-generating components requiring heat dissipation, such as memory modules, power modules, and switches. The first heat-generating module 8 is connected to the second heat dissipation module 2 and dissipates heat through coolant. The heat dissipation assembly includes multiple heat dissipation modules for cooling multiple heat-generating modules. More specifically, the manifold and the first heat dissipation module 1 can be secured to the iron parts inside the server chassis via through holes on a small bracket. By configuring a server including the first heat-generating module 8, the second heat-generating module, and the heat dissipation assembly, not only is heat dissipation efficiency and system reliability improved, but system flexibility and maintenance convenience are also increased. The use of the manifold 3 ensures that the coolant is evenly distributed and recycled between the first heat dissipation module 1 and the second heat dissipation module 2, avoiding localized overheating. It is particularly suitable for high-load applications such as high-performance computing and data centers, ensuring efficient, stable, and safe system operation.

[0091] This disclosure integrates the first heat dissipation module 1 and the second heat dissipation module 2 into the manifold 3 by fixing the manifold 3 to the first heat dissipation module 1 and connecting the manifold 3 to the second heat dissipation module 2 via the connecting pipe 21. The manifold 3 allows the liquid inlet and outlet of the first heat dissipation module 1 and the second heat dissipation module 2 to be interconnected, thereby integrating multiple heat dissipation modules together for liquid cooling, thereby improving heat dissipation efficiency and meeting the heat dissipation needs of various heat-generating components such as the GPU inside the machine.

[0092] The above are merely specific embodiments of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A heat dissipating assembly, characterized by, The application relates to a heat dissipation assembly. The heat dissipation assembly comprises: a first heat dissipation module for connecting a first heat generation module; a second heat dissipation module for connecting a second heat generation module; a distribution reservoir fixedly connected with the first heat dissipation module, and connected with the second heat dissipation module through a connecting pipeline, so that the first heat dissipation module and the second heat dissipation module are in liquid communication.

2. The heat dissipation assembly according to claim 1, wherein: the distribution reservoir comprises a first fluid distributor integrally formed with the first heat dissipation module, and the first fluid distributor is in communication with a GPU cold plate of the first heat dissipation module.

3. The heat dissipation assembly according to claim 2, wherein: the distribution reservoir further comprises a total liquid inlet fluid distributor and a total liquid outlet fluid distributor, and the second heat dissipation module is connected with the total liquid inlet fluid distributor and the total liquid outlet fluid distributor through the connecting pipeline respectively; the first fluid distributor comprises a first liquid inlet fluid distribution assembly and a first liquid outlet fluid distribution assembly, the first liquid inlet fluid distribution assembly is in communication with the total liquid inlet fluid distributor, and the first liquid outlet fluid distribution assembly is in communication with the total liquid outlet fluid distributor.

4. The heat dissipation assembly according to claim 3, wherein: the total liquid inlet fluid distributor and the total liquid outlet fluid distributor are arranged on both sides of the first fluid distributor, the total liquid inlet fluid distributor and the total liquid outlet fluid distributor are perpendicular to the first fluid distributor, and the second heat dissipation module is connected with the side walls of the total liquid inlet fluid distributor and the total liquid outlet fluid distributor through the connecting pipeline respectively.

5. The heat dissipation assembly according to claim 2, wherein: the first heat dissipation module further comprises a plurality of water pipes in communication with the GPU cold plate and a first quick connector, and the water pipes are connected with the first heat generation module through the first quick connector; the distribution reservoir is provided with a second quick connector, and the connecting pipeline is connected with the second quick connector.

6. The heat dissipation assembly according to claim 1, wherein: the first heat dissipation module further comprises a water collecting disc and a liquid leakage detector, the water collecting disc is arranged below the distribution reservoir and fixedly connected with the distribution reservoir, and the liquid leakage detector is arranged in the water collecting disc; the connecting pipeline is provided with a baffle, and the water collecting disc is arranged in the projection area between the distribution reservoir and the baffle.

7. The heat dissipation assembly according to claim 1, wherein: the distribution reservoir is provided with a plurality of liquid inlet connectors for being in communication with a plurality of total liquid inlet pipes respectively and a plurality of liquid outlet connectors for being in communication with a plurality of total liquid outlet pipes respectively; the connecting pipeline is provided with a flow regulating valve; and / or the connecting pipeline is provided with a third quick connector.

8. The heat dissipation assembly according to claim 1, wherein: the second heat dissipation module comprises: a memory bank cold plate comprising a plurality of parallel plate bodies and heat conduction pads, the plate bodies are hollow inside, and the heat conduction pads are arranged on the outer sides of the plate bodies; A second fluid distributor and a third fluid distributor are arranged on both sides of the plate body and communicate with the inside of the plate body, the second fluid distributor is connected with a total liquid inlet fluid distributor and a total liquid outlet fluid distributor; and / or A CPU cold plate, an input end and an output end of the CPU cold plate are connected with the second fluid distributor and the third fluid distributor respectively; and / or A plurality of power supply radiators are connected with the second fluid distributor and the third fluid distributor respectively.

9. The heat dissipating assembly of claim 1, wherein, Further comprising: A third heat dissipation module, the third heat dissipation module comprises a plurality of switch cold plates, cooling pipelines of the plurality of switch cold plates are connected in series, and the third heat dissipation module is used for dissipating heat of a third heat generation module; The liquid inlet end and the liquid outlet end of the third heat dissipation module are connected with the liquid distribution tank through fourth quick connectors respectively.

10. A server, characterized by Comprise: A first heat generation module; A second heat generation module; A heat dissipation assembly is used for dissipating heat of the first heat generation module and the second heat generation module; the heat dissipation assembly comprises: A first heat dissipation module connected with the first heat generation module; A second heat dissipation module connected with the second heat generation module; A liquid distribution tank is fixedly connected with the first heat dissipation module, the liquid distribution tank is connected with the second heat dissipation module through a connecting pipeline, and the liquid distribution tank is used for making the liquid inlet and the liquid outlet of the first heat dissipation module and the second heat dissipation module intercommunicate.

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