Heat dissipation system
By designing a heat dissipation system on the circuit board, and using the first heat sink and heat dissipation components to be in close contact with the heat-generating area, the problem of insufficient heat dissipation of the circuit board is solved, efficient thermal management is achieved, and the operating efficiency and reliability of the circuit board are improved.
Patent Information
- Application Number
- CN202422978934.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-03
- Publication Date
- 2025-11-21
- Estimated Expiration
- 2034-12-03
AI Technical Summary
Existing circuit boards cannot dissipate heat in time when high-performance integrated circuits are working, resulting in increased temperature and affecting device performance and reliability.
Design a heat dissipation system including a circuit board, a first heat sink and a first heat dissipation component. The first heat dissipation component is in close contact with the heat-generating area of the circuit board. The first heat sink and the heat dissipation component are used to accelerate heat dissipation. A second heat sink and heat dissipation component are added to further improve the heat dissipation efficiency.
This enables timely heat dissipation of the circuit board, improves operating efficiency, reduces local temperature, and ensures stable operation of the circuit board under high load.
Smart Images
Figure CN223584567U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of circuit board heat dissipation, more particularly to a heat dissipation system. BACKGROUND
[0002] With the continuous improvement of electronic equipment performance, the use of high-power integrated circuits is becoming more and more common. These high-performance integrated circuits will generate a large amount of heat when working, and if this heat cannot be effectively dissipated, it will cause the device temperature to rise, thereby affecting its performance and reliability. Therefore, for these high-power integrated circuits, thermal management becomes particularly important.
[0003] In high-performance circuit board design, power density is a key parameter, which represents the power consumed per unit volume or unit area. However, the increase in power density is often accompanied by thermal decay problems, that is, as the temperature rises, the output power of the device will decrease. Therefore, there is an urgent need for a device that can dissipate heat from the circuit board to ensure that the circuit board can maintain stable output under actual working conditions. SUMMARY
[0004] The utility model discloses to overcome the defect that the circuit board cannot be cooled in time in the prior art, and provides a heat dissipation system that can cool the circuit board in time.
[0005] To solve the above technical problems, the technical scheme of the utility model is as follows:
[0006] A heat dissipation system includes a circuit board, a first heat sink and a first heat dissipation component.
[0007] The first heat dissipation component is arranged on the inner surface of the first heat sink, and the first heat sink is detachably connected to the circuit board. When the first heat sink is connected to the circuit board, the first heat dissipation component is tightly attached to the heating area of the circuit board.
[0008] Compared with the prior art, the utility model technical scheme has the beneficial effects that:
[0009] The heat dissipation system of the present application uses the first heat sink to dissipate heat from the circuit board, and adds a first heat dissipation component at a position corresponding to the heating area of the circuit board. The first heat dissipation component accelerates the heat dissipation speed of the heating area, and can cool the circuit board in time, thereby improving the operating efficiency of the circuit board. BRIEF DESCRIPTION OF DRAWINGS
[0010] Figure 1 The first structure of the heat dissipation system proposed in Example 1 is shown in the first structure diagram.
[0011] Figure 2 The second structure of the heat dissipation system proposed in Example 1 is shown in the second structure diagram.
[0012] Figure 3 A high-speed plate diagram for example 1 is shown in the figure;
[0013] Figure 4 A diagram of the first heat sink for example 3 is shown in the figure;
[0014] Wherein, 1-circuit board, 2-first heat sink, 3-first heat dissipation component, 4-second heat sink, 5-second heat dissipation component, 6-fixing screw, 7-directional column. DETAILED DESCRIPTION
[0015] The accompanying drawings are only for illustrative purposes and should not be construed as limiting the patent;
[0016] In order to better illustrate the embodiment, some components in the drawings may be omitted, enlarged or reduced, and do not represent the actual product size;
[0017] It is understandable to some skilled persons in the art that some well-known structures and their descriptions in the drawings may be omitted.
[0018] The technical scheme of the utility model will be further described below in combination with the drawings and embodiments.
[0019] Example 1
[0020] The embodiment provides a heat dissipation system, Figure 1 A first structure diagram of the heat dissipation system of the embodiment is shown in the figure, wherein, Figure 1 The cross-sectional view and the front view of the heat dissipation system are shown in the figure; Figure 2 A second structure diagram of the heat dissipation system of the embodiment is shown in the figure, wherein, Figure 2 The structure split diagram of the heat dissipation system is shown in the figure.
[0021] The embodiment provides a heat dissipation system, comprising a circuit board 1, a first heat sink 2 and a first heat dissipation component 3;
[0022] Wherein, the first heat dissipation component 3 is arranged on the inner surface of the first heat sink 2, the first heat sink 2 is detachably connected with the circuit board 1, and the first heat dissipation component 3 is tightly attached to the heating area of the circuit board 1 when the first heat sink 2 is connected with the circuit board 1.
[0023] In the specific implementation process, the heat dissipation system uses the first heat sink 2 to dissipate heat for the circuit board 1, and the first heat dissipation component 3 is additionally arranged at the position corresponding to the heating area of the circuit board 1, so as to accelerate the heat dissipation speed of the heating area by using the first heat dissipation component 3, so that the heat dissipation of the circuit board 1 is timely, thereby improving the operation efficiency of the circuit board 1.
[0024] In an optional embodiment, when the first heat-dissipating component 3 is in close contact with the circuit board 1, the contact area of the first heat-dissipating component 3 with the circuit board 1 is greater than or equal to twice the area of the heat-generating region of the circuit board 1.
[0025] In an optional embodiment, the heat-dissipating system further comprises a second heat-dissipating component 5, which is arranged on the inner surface of the second heat-dissipating device 4, and when the circuit board 1 is connected with the first heat-dissipating device 2 and the second heat-dissipating device 4 is connected with the first heat-dissipating device 2, the second heat-dissipating component 5 is in close contact with the region of the circuit board 1 where no components are arranged.
[0026] In an optional embodiment, the heat-dissipating system further comprises a second heat-dissipating component 5, which is arranged on the inner surface of the second heat-dissipating device 4, and when the circuit board 1 is connected with the first heat-dissipating device 2 and the second heat-dissipating device 4 is connected with the first heat-dissipating device 2, the second heat-dissipating component 5 is in close contact with the region of the circuit board 1 where no components are arranged.
[0027] In an optional embodiment, the circuit board 1 is provided with a fixing hole, and the heat-dissipating system further comprises a fixing screw 6, and the first heat-dissipating device 2 and the second heat-dissipating device 4 are both provided with fixing holes matched with the fixing screw 6, and the first heat-dissipating device 2 and the second heat-dissipating device 4 are detachably connected through the fixing screw 6.
[0028] Embodiment 2
[0029] This embodiment improves the heat-dissipating system proposed in Embodiment 1.
[0030] This embodiment proposes a heat-dissipating system, which comprises a circuit board 1, a first heat-dissipating device 2 and a first heat-dissipating component 3.
[0031] In an optional embodiment, the first heat-dissipating component 3 is arranged on the inner surface of the first heat-dissipating device 2, and the first heat-dissipating device 2 is detachably connected with the circuit board 1, and when the first heat-dissipating device 2 is connected with the circuit board 1, the first heat-dissipating component 3 is in close contact with the heat-generating region of the circuit board 1.
[0032] In the process of specific implementation, the heat-dissipating system uses the first heat-dissipating device 2 to dissipate heat for the circuit board 1, and the first heat-dissipating component 3 is additionally arranged at the position corresponding to the heat-generating region of the circuit board 1, so as to accelerate the heat-dissipating speed of the heat-generating region by using the first heat-dissipating component 3, which can make the heat-dissipating of the circuit board 1 timely, thereby improving the operation efficiency of the circuit board 1.
[0033] In an optional embodiment, the first heat sink 2 and the second heat sink 4 are provided with a plurality of directional posts 7 and / or directional holes, and the first heat sink 2 and the second heat sink 4 are detachably connected through the directional posts 7 and directional holes.
[0034] When the first heat sink 2 is provided with a plurality of directional posts 7 and the second heat sink 4 is provided with a plurality of directional holes, the directional posts 7 and the directional holes are matched.
[0035] When the first heat sink 2 is provided with a plurality of directional holes and the second heat sink 4 is provided with a plurality of directional posts 7, the directional posts 7 and the directional holes are matched.
[0036] When the first heat sink 2 and the second heat sink 4 are both provided with a plurality of directional posts 7 and directional holes, the directional posts 7 of the first heat sink 2 and the directional holes of the second heat sink 4 are matched, and the directional posts 7 of the second heat sink 4 and the directional holes of the first heat sink 2 are matched.
[0037] In an optional embodiment, the material of the first heat sink 2 includes aluminum alloy.
[0038] In an optional embodiment, the material of the first heat sink 2 includes aluminum alloy.
[0039] As an exemplary illustration, the heat-conductive alloy can be high-heat-conductive alloy such as red copper, brass, or copper-silver.
[0040] In an optional embodiment, the material of the second heat sink 4 includes aluminum alloy.
[0041] As an exemplary illustration, when the materials of the first heat sink 2 and the second heat sink 4 are both aluminum alloy, the aluminum alloy can be used for heat dissipation due to its good heat-conductive property, and can also shield external interference signals.
[0042] In an optional embodiment, the material of the second heat sink 4 includes heat-conductive silica gel, graphene, diamond, or silver.
[0043] As an exemplary illustration, the heat conductivity of graphene is 5000 W / (m·K), the heat conductivity of diamond is 2000 W / (m·K), and the heat conductivity of silver is 429 W / (m·K), all of which are good heat-conductive materials.
[0044] Embodiment 3
[0045] This embodiment proposes a specific implementation example of a heat dissipation system based on the heat dissipation systems proposed in Embodiment 1 and Embodiment 2.
[0046] In the embodiment, the circuit board 1 is a high-speed board, the first heat sink 2 and the second heat sink 4 are both aluminum alloy shielding covers, the first heat dissipation component 3 is high-speed heat dissipation red copper, the second heat dissipation component 5 is a high-thermal-conductivity silica gel sheet, the fixing screw 6 is a fixed M2 screw, and the directional column 7 is an anti-fool directional hole column; wherein the aluminum alloy shielding cover can be made of aluminum alloy 6061 or aluminum alloy 6063, the high-speed heat dissipation red copper can be replaced by high-thermal-conductivity alloys such as brass or copper-silver, the high-speed board can be other high-heat-generating components, the fixed M2 screw can be any size mechanical tooth or self-tapping tooth screw, and the high-thermal-conductivity silica gel sheet can be replaced by a soft graphite sheet.
[0047] As shown in the left heat dissipation profile of Fig. Figure 2 The aluminum alloy shielding cover is made of aluminum alloy 6063, which has both shielding and heat dissipation functions, and the thinnest position is greater than or equal to 1 mm, which can shield most signals, and the 6063 material has relatively high heat dissipation efficiency among all aluminum alloy materials, with a thermal conductivity greater than or equal to 201 W / (m·K) and a specific heat capacity of 0.88×103 J / (kg·℃); and good processability.
[0048] The technical scheme of the utility model, compared with the conventional aluminum alloy heat sink, adds seamless fitting of red copper (thermal conductivity greater than or equal to 401 W / (m·K), specific heat capacity 0.386×103 J / (kg·℃)) in the high-heat-generating area of the high-speed board, which is used for high-speed heat conduction, and the heat of the heat-generating area is conducted into the high-speed heat dissipation red copper, and then the heat is dissipated to the air through the aluminum alloy shielding cover with high specific heat capacity, thereby achieving the effect of high-speed heat conduction and heat dissipation, and effectively reducing the local temperature of the high-speed board.
[0049] Figure 3 The high-speed board schematic diagram provided in the embodiment is shown in Fig. Figure 3 The left side is a top view of the high-speed board, the middle is a side view of the high-speed board, and the right side is a bottom view of the high-speed board, Figure 3 The dimensions in Fig. Figure 3 The heat-generating area in Fig.
[0050] For the high-speed board, first select the high-heat-generating area, as shown in Fig. Figure 3The identified heat generating area, the corresponding area is designed on the opposite bare copper, the high thermal conductivity silica gel sheet is attached on the corresponding area of the aluminum alloy shielding cover, the area corresponds to the high heat generating area of the high speed board, meanwhile, the shielding cover is installed on the high speed board according to the specified fool-proof directional hole column; meanwhile, the aluminum alloy shielding cover has four M2 threaded through holes; the shielding cover and the high speed heat dissipation red copper are simultaneously assembled on the opposite side of the high speed board, the two aluminum alloy shielding covers are pressed on the high speed board by the fixed M2 screws through the marked diameter 2.2mm through holes on the high speed board, and the precise attachment is guaranteed; (if the high speed board or the heat sink does not have holes, the two aluminum alloy shielding covers can be designed to be 1-2mm larger than the high speed board, the high speed board is wrapped, and the two aluminum alloy shielding covers are locked together, which can achieve the same effect), after the two aluminum alloy shielding covers wrap the high speed board, the wrapped body can play a heat dissipation role and also play a shielding role.
[0051] Figure 4 The first heat sink for the embodiment is schematically shown in the figure, Figure 4 The upper half part in the figure is a cross-sectional view of the first heat sink, Figure 4 The lower half part in the figure is a top view of the first heat sink, Figure 4 The dimensions in the figure are only exemplary.
[0052] The high speed board and the high speed heat dissipation red copper are closely attached together, and the high speed heat dissipation red copper and the high heat generating area on the high speed board are preferentially seamlessly attached (with an interference of 0mm) through the locking of the four fixed M2 screws, so that the purpose of high speed heat conduction is achieved, and the heat can be rapidly diffused into the air due to the large specific heat capacity of the aluminum alloy. Figure 3 and Figure 4 As shown in the figures, the bare copper area and the high heat generating area need to ensure a certain flatness (≤0.05mm), so as to ensure that the high speed heat dissipation red copper rapidly brings the heat into the entire heat dissipation system circulation; wherein, when the aluminum alloy shielding cover and the high speed heat dissipation red copper are embedded, the surface area of the high speed heat dissipation red copper is more than 2 times the area of the high heat generating area, in the process of embedding the high speed heat dissipation red copper into the aluminum alloy shielding cover, the high speed heat dissipation red copper needs to be reserved with a height allowance of 0.2mm (the high speed heat dissipation red copper needs to be higher than the aluminum alloy shielding cover by 0.2mm or more), after the high speed heat dissipation red copper and the aluminum alloy shielding cover are embedded into each other, the high speed heat dissipation red copper can first contact the high speed board, so as to ensure that the high speed heat dissipation red copper guides the heat into the two aluminum alloy shielding covers of the heat sink, or the two materials can be cut to the same flatness (≤0.03mm) by using cutting processing after embedding.
[0053] By using the heat dissipation system, the temperature of the high speed board can be rapidly reduced, the heat can be guided out to the surrounding air, the working temperature of the high speed board is rapidly reduced, and high application value is achieved in the pursuit of product operation speed.
[0054] The same or similar reference numerals correspond to the same or similar components;
[0055] The terms describing the positional relationship in the drawings are only used for illustrative description, and should not be understood as a limitation on the patent;
[0056] Obviously, the above embodiments of the present application are only examples for clearly illustrating the present application, and are not a limitation on the embodiments of the present application. For those skilled in the art, other different forms of changes or variations can be made on the basis of the above description. Here, it is not necessary and impossible to exhaust all the embodiments. Any modification, equivalent replacement and improvement, etc. made within the spirit and principle of the present application should be included in the protection scope of the claims of the present application.
Claims
1. A heat dissipation system, characterized in that, It includes a circuit board (1), a first heat sink (2) and a first heat dissipation component (3); The first heat dissipation component (3) is disposed on the inner surface of the first heat sink (2). The first heat sink (2) is detachably connected to the circuit board (1). When the first heat sink (2) is connected to the circuit board (1), the first heat dissipation component (3) is in close contact with the heat-generating area of the circuit board (1).
2. The heat dissipation system according to claim 1, characterized in that, When the first heat dissipation component (3) is in close contact with the circuit board (1), the contact area between the first heat dissipation component (3) and the circuit board (1) is greater than or equal to twice the area of the heat-generating area of the circuit board (1).
3. The heat dissipation system according to claim 1, characterized in that, The heat dissipation system also includes a second radiator (4), which is detachably connected to the first radiator (2), and the second radiator (4) is provided with a cavity; when the circuit board (1) is connected to the first radiator (2) and the second radiator (4) is connected to the first radiator (2), the components of the circuit board (1) are located in the cavity of the second radiator (4).
4. The heat dissipation system according to claim 3, characterized in that, The heat dissipation system further includes a second heat dissipation component (5), which is disposed on the inner surface of the second heat sink (4). When the circuit board (1) is connected to the first heat sink (2) and the second heat sink (4) is connected to the first heat sink (2), the second heat dissipation component (5) is in close contact with the area of the circuit board (1) where no components are disposed.
5. The heat dissipation system according to claim 3, characterized in that, The circuit board (1) has a fixing hole, and the heat dissipation system also includes a fixing screw (6). The first heat sink (2) and the second heat sink (4) both have fixing holes that match the fixing screw (6). The first heat sink (2) and the second heat sink (4) are detachably connected by the fixing screw (6).
6. The heat dissipation system according to any one of claims 3 to 5, characterized in that, The first radiator (2) and the second radiator (4) are provided with a plurality of directional posts (7) and / or directional holes, and the first radiator (2) and the second radiator (4) are detachably connected through the directional posts (7) and directional holes; When the first radiator (2) is provided with a plurality of directional posts (7) and the second radiator (4) is provided with a plurality of directional holes, the directional posts (7) match the directional holes; When the first radiator (2) is provided with a plurality of directional holes and the second radiator (4) is provided with a plurality of directional posts (7), the directional posts (7) are matched with the directional holes; When both the first radiator (2) and the second radiator (4) are provided with a plurality of directional posts (7) and directional holes, the directional posts (7) of the first radiator (2) match the directional holes of the second radiator (4), and the directional posts (7) of the second radiator (4) match the directional holes of the first radiator (2).
7. The heat dissipation system according to any one of claims 1 to 5, characterized in that, The material of the first heat sink (2) includes aluminum alloy.
8. The heat dissipation system according to any one of claims 1 to 5, characterized in that, The material of the first heat dissipation component (3) includes a thermally conductive alloy.
9. The heat dissipation system according to any one of claims 3 to 5, characterized in that, The material of the second heat sink (4) includes aluminum alloy.
10. The heat dissipation system according to claim 4, characterized in that, The material of the second heat dissipation component (5) includes thermally conductive silicone, graphene, diamond or silver.