Heat dissipation device of power amplifier

Abstract

The utility model provides a heat dissipation device of a power amplifier, which is characterized in that a main air duct is arranged, a fan is arranged at the end part of the main air duct, an auxiliary air duct with a first end and a second end is arranged, and an acute angle is formed between the air inlet direction or the air outlet direction of the first end and the air inlet direction of the main air duct; when the fan is arranged at one of the two ends of the main air duct, the first end serves as an air inlet, the second end serves as an air outlet, one part of airflow pumped out by the fan continues to flow along the main air duct at the junction of the main air duct and the auxiliary air duct, and the other part of airflow enters the auxiliary air duct through the first end. Due to the fact that the obtuse angle is formed between the air outlet direction of the second end and the air inlet direction of the main air channel, air outlet of the second end can hinder airflow in the main air channel, the flow speed of the airflow is reduced, heat exchange between the airflow and the heat dissipation device is more sufficient, the utilization efficiency of the airflow is improved, and the heat dissipation effect is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of radio frequency equipment, specifically, a kind of heat sink of power amplifier. BACKGROUND

[0002] The heat sink of power amplifier is the vital component in its design.Power amplifier will convert a large part of energy provided by direct current power supply into heat energy when working.If these heat energy cannot be promptly and effectively dissipated, it will cause the temperature of amplifier to rise sharply, and then have serious influence on the performance and reliability of transistor and even entire amplification circuit.In extreme case, it can also cause transistor to be permanently and irreparably damaged, thereby shortening the service life of product.In order to ensure that power amplifier can work stably and reliably, it must be ensured that its heat sink can effectively dissipate heat out.Related technology, sometimes fan is arranged in heat sink, and heat is dissipated by airflow blowing through the fin of heat sink, but the utilization efficiency of airflow of ordinary heat sink fin is low, and the heat dissipation capacity of heat sink cannot be fully exerted. SUMMARY

[0003] The utility model provides a kind of heat sink of power amplifier, and the utilization efficiency of airflow of heat sink of related technology is low, and the heat dissipation capacity of heat sink cannot be fully exerted, and it is improved to the problem, can improve the utilization efficiency of airflow of heat sink, to improve the heat dissipation capacity of heat sink.

[0004] To achieve the above object, the utility model provides a kind of heat sink of power amplifier, comprising:

[0005] Main air duct, the main air duct both ends are open mouthed;

[0006] Fan, the fan is set to the main air duct end;

[0007] The auxiliary air duct comprises a first end and a second end which are connected to the main air duct, the air inlet direction or the air outlet direction of the first end is an acute angle with the air inlet direction of the main air duct, and the air outlet direction or the air inlet direction of the second end is an obtuse angle with the air inlet direction of the main air duct. The fan is arranged at different ends of the main air duct, and the heat dissipation device has different effects: when the fan is arranged at one end of the main air duct, the first end is an air inlet, and the second end is an air outlet, at this time, a part of the air flow pumped out by the fan continues to flow along the main air duct at the intersection of the main air duct and the auxiliary air duct, and another part enters the auxiliary air duct through the first end and re-enters the main air duct from the second end, because the air outlet direction of the second end is an obtuse angle with the air inlet direction of the main air duct, the air outlet of the second end will hinder the air flow in the main air duct, thereby reducing the flow rate of the air flow, making the heat exchange between the air flow and the heat dissipation device more sufficient, thereby improving the utilization efficiency of the air flow and improving the heat dissipation effect; when the fan is arranged at the other end of the main air duct, the first end is an air outlet, and the second end is an air inlet, at this time, a part of the air flow pumped out by the fan continues to flow along the main air duct at the intersection of the main air duct and the auxiliary air duct, and another part enters the auxiliary air duct through the second end and re-enters the main air duct from the first end, because the air outlet direction of the first end is an acute angle with the air inlet direction of the main air duct, the air outlet of the first end will not hinder the air flow in the main air duct, because the auxiliary air duct increases the contact area of the air flow and the heat dissipation device, the heat dissipation capacity of the heat dissipation device is improved, especially when the power amplifier generates a large amount of heat, the above-mentioned arrangement mode of the fan and the increase of the fan speed can better play the heat dissipation effect.

[0008] As an optional technical solution, the main air duct is provided with a recess in the width direction; the heat dissipation device of the power amplifier further comprises a wing plate, the wing plate is arranged in a spaced manner with the wall surface of the recess, and the wing plate and the wall surface of the recess form the auxiliary air duct, the first end and the second end are respectively formed at the two ends of the auxiliary air duct along the air inlet direction of the main air duct, the wall surface of the recess at the first end is an acute angle with the air inlet direction of the main air duct, and the wall surface of the recess at the second end is an obtuse angle with the air inlet direction of the main air duct. The arrangement of the wing plate can have a certain flow regulating effect on the air flow in the auxiliary air duct, so that the air flow in the auxiliary air duct is uniform, stable and consistent in direction, thereby stabilizing the interaction between the air flow in the auxiliary air duct and the air flow in the main air duct.

[0009] As an optional technical scheme, the wing plate is in a water-drop shape, and the wing plate is provided with a first end and a second end, wherein the end with smaller thickness of the wing plate is located at the first end, and the end with larger thickness of the wing plate is located at the second end. The water-drop-shaped cross section of the wing plate is beneficial to the airflow near the wing plate to always adhere to the movement of the wing plate, thereby promoting the stability of the airflow in the main air duct and the auxiliary air duct, and ensuring the heat dissipation effect of the heat dissipation device.

[0010] As an optional technical scheme, the main air duct is provided with the auxiliary air duct on both sides in the width direction, the auxiliary air ducts on both sides of the main air duct are alternately arranged along the air inlet direction of the main air duct, and the wing plate extends from the auxiliary air duct to the inside of the main air duct. The wing plate extending to the inside of the main air duct can play a role in dividing the airflow, so that the airflow is divided into a flow continuing to flow along the main air duct and a flow entering the auxiliary air duct.

[0011] As an optional technical scheme, the heat dissipation device of the power amplifier comprises a plurality of side walls, the plurality of side walls are arranged in parallel and at intervals, the main air duct is formed between two adjacent side walls, and the side walls are partially hollow. The partially hollow side walls are beneficial to reducing the weight of the heat dissipation device, and on the other hand, can increase the contact area of the heat dissipation device with the external air, and enhance the heat exchange capacity of the heat dissipation device with the external air.

[0012] As an optional technical scheme, the heat dissipation device of the power amplifier comprises a plurality of side plates, a plurality of rib plates and a partition plate, the side plates are arranged longitudinally, the plurality of side plates are arranged in parallel and at intervals, and the interval between the two side plates forms the main air duct.

[0013] The rib plates are connected to the side plates, the thickness direction of the rib plates is at an acute angle with the air inlet direction of the main air duct, the plurality of rib plates connected to the same side plate are arranged in parallel, and a pair of rib plates connected to adjacent side plates are arranged symmetrically with respect to the main air duct.

[0014] The partition plate is arranged at intervals between the two adjacent rib plates, and the partition plate is arranged at intervals with the side plates, and the space between the two adjacent rib plates and the partition plate forms the auxiliary air duct. In this technical scheme, the side plates, the rib plates and the partition plate form the main air duct and the auxiliary air duct, and the structure is relatively simple, which is beneficial to reducing the manufacturing difficulty and cost of the heat dissipation device.

[0015] As an optional technical scheme, the number of the main air ducts is multiple, and the plurality of main air ducts are arranged in parallel. This technical scheme is beneficial to the heat dissipation device to be applied to a power amplifier with a large surface area, and is beneficial to improving the universality of the heat dissipation device.

[0016] As an optional technical scheme, the power amplifier is mounted on a substrate, and the main air duct and the auxiliary air duct are arranged on the substrate.

[0017] As an optional technical scheme, a cover plate is arranged parallel to the substrate and covers the main air duct and the auxiliary air duct.

[0018] As an optional technical scheme, the cross-sectional area of the auxiliary air duct is 0.5-1 times that of the main air duct.

[0019] The one or more technical schemes of the power amplifier provided by the utility model have at least the following technical effects or advantages:

[0020] The heat dissipation device of the power amplifier comprises a main air duct, a fan and an auxiliary air duct. The fan is arranged at one end of the main air duct. The auxiliary air duct has a first end and a second end. The air inlet direction or the air outlet direction of the first end is at an acute angle with the air inlet direction of the main air duct, and the air outlet direction or the air inlet direction of the second end is at an obtuse angle with the air inlet direction of the main air duct. When the fan is arranged at one end of the main air duct, the first end is the air inlet, and the second end is the air outlet. The fan pumps out airflow. Part of the airflow continues to flow along the main air duct at the intersection of the main air duct and the auxiliary air duct, and the other part enters the auxiliary air duct through the first end and then re-enters the main air duct from the second end. Since the air outlet direction of the second end is at an obtuse angle with the air inlet direction of the main air duct, the air outlet of the second end hinders the airflow in the main air duct, thereby reducing the flow rate of the airflow, making the heat exchange between the airflow and the heat dissipation device more sufficient, improving the utilization efficiency of the airflow and improving the heat dissipation effect. BRIEF DESCRIPTION OF DRAWINGS

[0021] The accompanying drawings, which are included to provide a further understanding of the embodiments of the utility model, form a part of the utility model and do not constitute limitations to the embodiments of the utility model;

[0022] Figure 1 It is a schematic view of the heat dissipation device of the power amplifier (omitting the fan);

[0023] Figure 2 It is Figure 1Schematic diagram of airflow flow direction in main air duct and auxiliary air duct when fan is arranged at different end of main air duct, wherein A is fan arranged at upper end of main air duct, B is fan arranged at lower end of main air duct;

[0024] Figure 3 Schematic diagram of heat dissipation device of another power amplifier in the utility model (omitting fan) ;

[0025] Figure 4 Schematic diagram of heat dissipation device of another power amplifier in the utility model (omitting fan).

[0026] Explanation of reference signs

[0027] Power amplifier-100; heat dissipation device-200;

[0028] Main air duct-1; side wall-11; side plate-12; fan-2;

[0029] Auxiliary air duct-3; first end-31; second end-32; wing plate-33; rib plate-34; partition plate-35;

[0030] Base plate-4; cover plate-5. DETAILED DESCRIPTION

[0031] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.

[0032] In the utility model, the terms "upper", "lower", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. These terms are mainly used for better describing the utility model and its embodiments, and are not used for limiting the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0033] In addition, the above-mentioned part of the terms can be used to indicate the orientation or positional relationship, and can also be used to indicate other meanings, for example, the term "upper" can also be used to indicate a certain dependent relationship or connection relationship in some cases. Those skilled in the art can understand the specific meaning of these terms in the utility model according to the specific situation.

[0034] In addition, the terms "set", "provided with", "connected" should be broadly understood. For example, it can be fixed connection, detachable connection, or integral structure; it can be directly connected, or indirectly connected through an intermediate medium, or internal communication between two devices, elements or components. For those skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0035] In addition, the terms "first", "second" and the like are mainly used to distinguish different devices, elements or components (the specific type and structure may be the same or different), and are not used to indicate or imply the relative importance and quantity of the indicated device, element or component. Unless otherwise stated, the meaning of "multiple" is two or more.

[0036] Embodiment one

[0037] The embodiment provides a heat dissipation device 200 of a power amplifier, which comprises a main air duct 1, a fan 2 and a secondary air duct 3. The main air duct 1 is open at both ends. The fan 2 is arranged at the end of the main air duct 1. The secondary air duct 3 comprises a first end 31 and a second end 32 in communication, and the first end 31 and the second end 32 are communicated with the main air duct 1 respectively, the air inlet direction or the air outlet direction of the first end 31 is an acute angle with the air inlet direction of the main air duct 1, and the air outlet direction or the air inlet direction of the second end 32 is an obtuse angle with the air inlet direction of the main air duct 1.

[0038] The fan 2 is arranged at different ends of the main air duct 1, and the heat dissipation device 200 has different effects: Figure 2 As shown in Fig. A, the fan 2 is arranged at the upper end of the main air duct 1, the first end 31 is an air inlet, and the second end 32 is an air outlet. At this time, the airflow pumped out by the fan 2 continues to flow along the main air duct 1 at the intersection of the main air duct 1 and the secondary air duct 3, and the other part enters the secondary air duct 3 through the first end 31 and reenters the main air duct 1 from the second end 32. Since the air outlet direction of the second end 32 is an obtuse angle with the air inlet direction of the main air duct 1, the air outlet of the second end 32 will hinder the airflow in the main air duct 1, thereby reducing the flow rate of the airflow, making the heat exchange between the airflow and the heat dissipation device 200 more sufficient, thereby improving the utilization efficiency of the airflow and improving the heat dissipation effect. Especially when the power amplifier 100 runs for a long time, but the heat generation is relatively small, the above-mentioned fan 2 arrangement is adopted, because the utilization efficiency of the airflow is high, the fan 2 does not need to maintain a high speed for a long time, which is beneficial to reduce noise and energy consumption;

[0039] As shown in Fig. B, the fan 2 is arranged at the lower end of the main air duct 1, the first end 31 is an air outlet, and the second end 32 is an air inlet. At this time, the airflow pumped out by the fan 2 continues to flow along the main air duct 1 at the intersection of the main air duct 1 and the secondary air duct 3, and the other part enters the secondary air duct 3 through the first end 31 and reenters the main air duct 1 from the second end 32. Since the air inlet direction of the second end 32 is an acute angle with the air inlet direction of the main air duct 1, the air inlet of the second end 32 will hinder the airflow in the main air duct 1, thereby reducing the flow rate of the airflow, making the heat exchange between the airflow and the heat dissipation device 200 more sufficient, thereby improving the utilization efficiency of the airflow and improving the heat dissipation effect. Especially when the power amplifier 100 runs for a long time, but the heat generation is relatively small, the above-mentioned fan 2 arrangement is adopted, because the utilization efficiency of the airflow is high, the fan 2 does not need to maintain a high speed for a long time, which is beneficial to reduce noise and energy consumption; Figure 2As shown in Fig. B, the fan 2 is arranged at the lower end of the main air duct 1, with the first end 31 as the air outlet and the second end 32 as the air inlet. At this time, the fan 2 pumps out the airflow, part of which continues to flow along the main air duct 1 at the intersection of the main air duct 1 and the auxiliary air duct 3, and the other part enters the auxiliary air duct 3 through the second end 32 and re-enters the main air duct 1 from the first end 31. Since the air outlet direction of the first end 31 forms an acute angle with the air inlet direction of the main air duct 1, the air outlet of the first end 31 does not hinder the airflow in the main air duct 1. Since the auxiliary air duct 3 increases the contact area of the airflow with the heat dissipation device 200, the heat dissipation capacity of the heat dissipation device 200 is improved. Compared with the aforementioned fan 2 arrangement, the resistance of the airflow flowing in the heat dissipation device 200 is greatly reduced, and the flow rate of the airflow is higher. In particular, when the power amplifier 100 generates a large amount of heat for a short time, the fan 2 arrangement can better play a heat dissipation role by increasing the rotation speed of the fan 2.

[0040] Further, fans 2 can also be arranged at both ends of the main air duct 1. According to the heat generation characteristics of the power amplifier 100 in actual work, different fans 2 located at both ends of the main air duct 1 are selected to be turned on.

[0041] Embodiment Two

[0042] On the basis of Embodiment One, the heat dissipation device 200 comprises a plurality of side plates 12, a plurality of rib plates 34, and a partition plate 35. The side plates 12 are arranged in length, and a plurality of side plates 12 are arranged in parallel and at intervals. The interval between two side plates 12 forms the main air duct 1.

[0043] The rib plate 34 is connected to the side plate 12, and the thickness direction of the rib plate 34 forms an acute angle with the air inlet direction of the main air duct 1. A plurality of rib plates 34 connected to the same side plate 12 are arranged in parallel, and a pair of rib plates 34 connected to adjacent side plates 12 are arranged symmetrically with respect to the main air duct 1.

[0044] The partition plate 35 is arranged at intervals between two adjacent rib plates 34, and the partition plate 35 is arranged at intervals between the side plates 12. The space between the two adjacent rib plates 34 and the partition plate 35 forms the auxiliary air duct 3. In this embodiment, the side plate 12, the rib plate 34, and the partition plate 35 form the main air duct 1 and the auxiliary air duct 3, which has a relatively simple structure and is conducive to reducing the manufacturing difficulty and cost of the heat dissipation device 200.

[0045] Embodiment Three

[0046] On the basis of the first embodiment, the main air duct 1 is provided with a recess along the width direction; the heat dissipation device 200 further comprises a wing plate 33, the wing plate 33 is arranged in a spaced manner with the wall surface of the recess, and the wing plate 33 and the wall surface of the recess form a secondary air duct 3, the secondary air duct 3 is formed with a first end 31 and a second end 32 at two ends along the air inlet direction of the main air duct 1, the wall surface of the recess at the first end 31 is at an acute angle with the air inlet direction of the main air duct 1, and the wall surface of the recess at the second end 32 is at an obtuse angle with the air inlet direction of the main air duct 1. The arrangement of the wing plate 33 can play a certain flow regulating effect on the airflow in the secondary air duct 3, so that the airflow in the secondary air duct 3 is uniform, stable and consistent in direction, thereby stabilizing the interaction of the airflow in the secondary air duct 3 with the airflow in the main air duct 1.

[0047] As an optional embodiment, the cross section of the wing plate 33 is in the shape of a water droplet, one end of the wing plate 33 with a smaller thickness is arranged at the first end 31, and the other end of the wing plate 33 with a larger thickness is arranged at the second end 32. The cross section of the wing plate 33 in the shape of a water droplet is conducive to making the airflow near the wing plate 33 always adhere to the wing plate 33, thereby promoting the stability of the airflow in the main air duct 1 and the secondary air duct 3 and ensuring the heat dissipation effect of the heat dissipation device 200.

[0048] As an optional embodiment, the main air duct 1 is provided with the secondary air duct 3 at both sides along the width direction, the secondary air ducts 3 at both sides of the main air duct 1 along the width direction are arranged alternately along the air inlet direction of the main air duct 1, and the wing plate 33 extends from the secondary air duct 3 to the inside of the main air duct 1. The wing plate 33 extending to the inside of the main air duct 1 can play a role in dividing the airflow, so that the airflow is divided into a flow continuing to flow along the main air duct 1 and a flow entering the secondary air duct 3.

[0049] As an optional embodiment, the heat dissipation device 200 comprises a plurality of side walls 11, the plurality of side walls 11 are arranged in parallel and at intervals, the main air duct 1 is formed between two adjacent side walls 11, and the side wall 11 is partially hollow. The partially hollow side wall 11 is conducive to reducing the weight of the heat dissipation device 200 on the one hand, and on the other hand, can increase the contact area of the heat dissipation device 200 with the external air and enhance the heat exchange capacity of the heat dissipation device 200 with the external air.

[0050] As an optional embodiment, the number of the main air ducts 1 is multiple, and the multiple main air ducts 1 are arranged in parallel. This embodiment is conducive to the application of the heat dissipation device 200 to the power amplifier 100 with a large surface area, and is conducive to improving the versatility of the heat dissipation device 200.

[0051] As an optional embodiment, the heat dissipation device 200 further comprises a substrate 4, the substrate 4 is mounted on the power amplifier 100, and the main air duct 1 and the secondary air duct 3 are arranged on the substrate 4. The substrate 4 is arranged in close contact with the power amplifier 100, the substrate 4 can disperse the heat of the power amplifier 100 locally to the entire substrate 4, and the heat is dissipated by the main air duct 1 and the secondary air duct 3, which is conducive to improving the heat dissipation capacity of the heat dissipation device 200.

[0052] As an optional embodiment, a cover plate 5 is further included, which is arranged parallel to the base plate 4 and covers the main air duct 1 and the auxiliary air duct 3. The cover plate 5 can seal the main air duct 1 and the auxiliary air duct 3, preventing the airflow in the main air duct 1 and the auxiliary air duct 3 from escaping from the middle, and the end of the main air duct 1 or the auxiliary air duct 3 away from the fan 2 cannot receive airflow flushing, resulting in poor heat dissipation effect.

[0053] As an optional embodiment, the cross-sectional area of the auxiliary air duct 3 is 0.5-1 times that of the main air duct 1. The auxiliary air duct 3 and the main air duct 1 are arranged in the above ratio, which is conducive to the stable interaction of the airflow in the auxiliary air duct 3 with the airflow in the main air duct 1.

[0054] Although the preferred embodiments of the present application have been described, those skilled in the art who have the basic creative concept can make further changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications falling within the scope of the present application.

Claims

1. A heat dissipating device for a power amplifier, characterized by, The application relates to a heat dissipation device of a power amplifier. The application relates to a heat dissipation device of a power amplifier. The application relates to a heat dissipation device of a power amplifier. The application relates to a heat dissipation device of a power amplifier.

2. A heat sink for a power amplifier as claimed in claim 1, wherein, The application relates to a heat dissipation device of a power amplifier.

3. A heat sink for a power amplifier as claimed in claim 2, wherein, The application relates to a heat dissipation device of a power amplifier.

4. The heat sink device for a power amplifier according to claim 2, wherein The application relates to a heat dissipation device of a power amplifier.

5. The heat sink device for a power amplifier according to claim 2, wherein The application relates to a heat dissipation device of a power amplifier.

6. The heat sink device for a power amplifier according to claim 1, wherein The application relates to a heat dissipation device of a power amplifier. The application relates to a heat dissipation device of a power amplifier. The application relates to a heat dissipation device of a power amplifier.

7. The heat sink device for a power amplifier according to claim 1, wherein The application relates to a heat dissipation device of a power amplifier.

8. The heat sink device for a power amplifier according to claim 1, wherein The application relates to a heat dissipation device of a power amplifier.

9. A heat sink for a power amplifier as claimed in claim 8, wherein, The application relates to a heat dissipation device of a power amplifier.

10. The heat sink device for a power amplifier according to claim 1, wherein The application relates to a heat dissipation device of a power amplifier. The application relates to a heat dissipation device of a power amplifier. The application relates to a heat dissipation device of a power amplifier. The application relates to a heat dissipation device of a power amplifier. The application relates to a heat dissipation device of a power amplifier. The application relates to a heat dissipation device of a power amplifier. The application relates to a heat dissipation device of a power amplifier. The application relates to a heat dissipation device of a power amplifier. The application relates to a heat dissipation device of a power amplifier. The application relates to a heat dissipation device of a power amplifier. The application relates to a heat dissipation device of a power amplifier. The application relates to a heat dissipation device of a power amplifier. 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