Air conditioner

Abstract

The utility model discloses an air conditioner, and belongs to the technical field of air treatment. An air conditioner comprises a support; the circuit board is mounted on the bracket; the power device comprises a pin which is connected with the circuit board; the base body part is connected with the pins; the refrigerant radiator is connected with the support and used for radiating heat of the power device, the refrigerant radiator comprises a liquid cooling plate, and a slot forming part is arranged on the liquid cooling plate to form a slot; wherein the base part is inserted into the slot, and at least two side surfaces of the base part are in contact with the slot forming part. According to the air conditioner, the at least two side faces of the power device are arranged to make contact with the refrigerant radiator, double-face heat dissipation of the power device can be achieved, and compared with single-face heat dissipation, the heat dissipation effect is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of air treatment, in particular to an air conditioner. BACKGROUND

[0002] The heat dissipation structure of the air conditioner power device is one of the core designs to ensure the efficient and stable operation of the air conditioner. The heat dissipation structure mainly dissipates the heat generated by the power device through reasonable heat conduction, heat convection and heat radiation, etc., to avoid performance degradation or device damage caused by high temperature.

[0003] In the existing heat dissipation structure, the refrigerant radiator mainly takes away heat through the circulation of cooling liquid, and has high heat dissipation efficiency. Due to its high heat dissipation efficiency, the refrigerant radiator is widely used in the heat dissipation of the air conditioner power device.

[0004] The power device and the refrigerant radiator are usually single-sidedly heat-dissipated, and the heat dissipation effect is general. CONTENT OF THE INVENTION

[0005] The present application provides an air conditioner, which can realize double-sided heat dissipation of the power device and improve the heat dissipation efficiency.

[0006] An air conditioner comprises a support, a circuit board installed on the support, a power device comprising a pin connected with the circuit board, a base part connected with the pin, and a refrigerant radiator connected with the support and used for dissipating heat for the power device, wherein the refrigerant radiator comprises a liquid cooling plate, and a refrigerant flows through the liquid cooling plate; and the base part is connected to the liquid cooling plate and at least two side surfaces of the base part are in contact with the liquid cooling plate.

[0007] In the present application, by contacting at least two side surfaces of the base part of the power device with the liquid cooling plate, double-sided heat dissipation of the power device is realized, and the heat dissipation efficiency is improved compared with single-sided heat dissipation.

[0008] In some embodiments, a slot forming part is arranged on the liquid cooling plate to form a slot, and the base part is inserted into the slot.

[0009] In the present application, by arranging the slot on the liquid cooling plate, the base part of the power device is inserted into the slot, and no screw fixing is required, which facilitates installation.

[0010] In some embodiments, the slot forming part comprises oppositely arranged first and second side wall surfaces, and the first and second side wall surfaces are respectively in contact with the base part.

[0011] The cooling channel comprises a first cooling channel arranged on a side of the first side wall surface away from the second side wall surface, and a second cooling channel arranged on a side of the second side wall surface away from the first side wall surface, and the second cooling channel is in communication with the first cooling channel.

[0012] In the application, by arranging the first cooling channel and the second cooling channel on both sides of the slot, that is, the refrigerant flows on both sides of the power device, the distance from each part of the power device to the refrigerant can be shortened, and the power device can be efficiently cooled.

[0013] In some embodiments, the cooling channel comprises a third cooling channel arranged on the bottom side of the slot bottom of the slot forming portion, and the third cooling channel is in communication with the first cooling channel and the second cooling channel.

[0014] In the application, the air conditioner can cool the bottom of the slot through the third cooling channel, so as to realize three-side annular cooling of the power device, and further improve the cooling efficiency.

[0015] In some embodiments, the length direction of the cooling channel is the same as the length direction of the slot forming portion, and the two ends of the length direction are respectively defined as the first end and the second end.

[0016] The first end of the first cooling channel is in communication with the first end of the third cooling channel, and the second end of the third cooling channel is in communication with the second end of the second cooling channel.

[0017] In the application, the length direction of the cooling channel is consistent with the length of the slot forming portion, so that the power device in the slot can be fully cooled, the cooling speed is ensured, the cooling channels are in communication, the refrigerant can circulate and flow, the heat generated by the power device can be timely taken away, and the cooling efficiency is high.

[0018] In some embodiments, the slot, the first cooling channel, the second cooling channel and the third cooling channel form a unit group, a plurality of unit groups are arranged on the refrigerant radiator in a spaced manner, and the cooling channels of the plurality of unit groups are in communication with each other.

[0019] In the application, the air conditioner is provided with unit groups, each unit group is provided with the first cooling channel, the second cooling channel and the third cooling channel, the multi-face flow cooling of the slot is realized, the cooling channels of the unit groups are in communication with each other, the circulation of the cooling liquid is promoted, and the cooling effect is improved.

[0020] In some embodiments, the cooling channel penetrates the liquid cooling plate, and the cooling channel has an inflow end and an outflow end connected to the refrigerant pipeline.

[0021] The refrigerant radiator further comprises a sealing block for plugging the end portion connected to the cooling channel except the inflow end and the outflow end.

[0022] In the application, the air conditioner is provided with the inflow end and the outflow end of the cooling channel and the sealing block for plugging other ports, so as to ensure that the cooling liquid normally flows into and out of the cooling channel without liquid overflow.

[0023] In some embodiments, a plane perpendicular to the length direction of the slot has a wedge-shaped cross section intersecting the slot.

[0024] The shape of the slot cross section in the air conditioner in the present application is wedge-shaped. On the one hand, the wedge-shaped fitting makes it easier to insert the bottom end of the base part with a smaller width into the top end of the slot with an increased width. This fitting form facilitates the insertion operation of the base part into the slot. On the other hand, it can make the first and second side wall surfaces of the slot closely fit the power device, reduce the interface thermal resistance between the slot and the power module, form an effective heat dissipation surface, and improve the heat dissipation effect.

[0025] In some embodiments, the bracket abuts the slot end of the liquid cooling plate to close the slot opening; the slot is filled with a heat dissipation fluid.

[0026] In the air conditioner in the present application, the slot opening is closed by the abutment of the liquid cooling plate and the bracket, and the slot is filled with a heat dissipation fluid flowing therein. The heat dissipation fluid directly contacts and cools the power device, further improving the heat dissipation effect.

[0027] In some embodiments, the bracket is provided with an isolation part extending in the direction of the circuit board, and the isolation part is provided one-to-one corresponding to the pins; the pins are arranged in the isolation part.

[0028] In the air conditioner in the present application, the isolation part is provided to separate the pins of the power device, thereby enhancing the protection of the power device and improving electrical safety. BRIEF DESCRIPTION OF DRAWINGS

[0029] Figure 1 A schematic view of the refrigerant radiator, bracket and circuit board in the air conditioner of some embodiments of the present application is shown;

[0030] Figure 2 An exploded view of the refrigerant radiator, bracket and circuit board in the air conditioner of some embodiments of the present application is shown;

[0031] Figure 3 A schematic view of the refrigerant radiator and bracket in the air conditioner of some embodiments of the present application is shown;

[0032] Figure 4 A schematic view of the refrigerant radiator and power device in the air conditioner of some embodiments of the present application is shown;

[0033] Figure 5 An exploded view of the refrigerant radiator and power device in the air conditioner of some embodiments of the present application is shown;

[0034] Figure 6 A bottom view of the bracket in the air conditioner of some embodiments of the present application is shown;

[0035] Figure 7A cross-sectional view of a liquid cooling plate and a power device in an air conditioner is shown.

[0036] Figure 8 An exploded view of a liquid cooling plate and a sealing block in an air conditioner is shown.

[0037] Figure 9 and Figure 10 A schematic view of a liquid cooling plate and a power device in an air conditioner is shown.

[0038] In the above figures, 10, bracket; 11, buckle; 12, support table; 13, limiting rib; 131, first limiting rib; 132, second limiting rib; 133, third limiting rib; 14, avoiding hole; 15, isolation part; 20, circuit board; 30, power device; 31, base part; 311, first heat dissipation surface; 312, second heat dissipation surface; 313, third heat dissipation surface; 32, pin; 40, refrigerant radiator; 41, liquid cooling plate; 41a, first end; 41b, second end; 411, insertion slot; 412, insertion slot forming part; 4121, first side wall surface; 4122, second side wall surface; 4123, slot bottom wall surface; 413, cooling channel; 4131, first cooling channel; 4132, second cooling channel; 4133, third cooling channel; 42, refrigerant pipeline; 43, sealing block. DETAILED DESCRIPTION

[0039] In order to make the purpose and implementation of the present application more clear, the following will combine the drawings in the exemplary embodiments of the present application to clearly and completely describe the exemplary embodiments of the present application. Obviously, the described exemplary embodiments are only some of the embodiments of the present application, but not all the embodiments.

[0040] In the description of the present application, it needs to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0041] The terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, unless otherwise stated, "a plurality of" means two or more.

[0042] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mount", "connect", "connection" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integrally connected; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or the internal communication of two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0043] The air conditioner in the present application performs a refrigeration cycle of the air conditioner by using a compressor, a condenser, an expansion valve and an evaporator. The refrigeration cycle includes a series of processes involving compression, condensation, expansion and evaporation, and supplies refrigerant to the air that has been adjusted and heat exchanged.

[0044] The compressor compresses the refrigerant gas in a low-temperature and low-pressure state and discharges the compressed refrigerant gas. The discharged refrigerant gas flows into the condenser. The condenser condenses the compressed refrigerant into a liquid phase, and heat is released to the surrounding environment through the condensation process.

[0045] The expansion valve expands the liquid-phase refrigerant in a high-temperature and high-pressure state condensed in the condenser into a low-pressure liquid-phase refrigerant. The evaporator evaporates the refrigerant expanded in the expansion valve and returns the refrigerant gas in a low-temperature and low-pressure state to the compressor. The evaporator can achieve a refrigeration effect by exchanging heat with the material to be cooled by using the latent heat of evaporation of the refrigerant. Throughout the cycle, the air conditioner can adjust the temperature of the indoor space.

[0046] The outdoor unit of the air conditioner refers to the part of the refrigeration cycle including the compressor and the outdoor heat exchanger, the indoor unit of the air conditioner includes the indoor heat exchanger, and the expansion valve can be provided in the indoor unit or the outdoor unit.

[0047] The indoor heat exchanger and the outdoor heat exchanger are used as a condenser or an evaporator. When the indoor heat exchanger is used as a condenser, the air conditioner is used as a heater in a heating mode, and when the indoor heat exchanger is used as an evaporator, the air conditioner is used as a cooler in a cooling mode.

[0048] The air conditioner of the present application can be a split air conditioner with the outdoor unit and the indoor unit separated, or a one-piece air conditioner with the outdoor unit and the indoor unit integrated.

[0049] The air conditioner of the present application is provided with an electric control box, and the electric control box is provided with electrical components for realizing the electric control function of the air conditioner.

[0050] The present application mainly improves the heat dissipation of power devices in electrical components:

[0051] Reference Figures 1 to 3According to the air conditioner of the embodiment of the present application, the bracket 10 is used to carry and install the circuit board 20.

[0052] The bracket 10 is generally in the shape of a cuboid box, and the material thereof can be plastic and formed by injection molding.

[0053] For the convenience of description, in the present application, the open end of the bracket 10 is defined as the top end, and the end of the bracket 10 opposite to the top end is defined as the bottom end. The top end of the bracket 10 is the box top end, and the bottom end of the bracket 10 is the box bottom end.

[0054] The air conditioner comprises the circuit board 20. The electrical components are connected on the circuit board 20. The circuit board 20 is installed in the bracket 10.

[0055] In some embodiments, the circuit board 20 can be connected to the bracket 10 by means of buckling. The four side walls of the bracket 10 are provided with buckles 11 extending upward. In the assembled state, the buckles 11 buckle the circuit board 20 from all around.

[0056] In some embodiments, the circuit board 20 and the bracket 10 can be connected by fasteners such as screws.

[0057] In some embodiments, the circuit board 20 and the bracket 10 are connected by a combination of buckling and screwing.

[0058] In some embodiments, the side walls of the bracket 10 can be provided with support tables 12 in the form of protruding structures. The top end of the support table 12 is lower than the top end of the bracket 10.

[0059] The circuit board 20 abuts against the support table 12. The height of the circuit board 20 can be raised by the support table 12, so that the circuit board 20 is separated from the box bottom of the bracket 10 by a predetermined distance.

[0060] Most of the electrical components are installed on the front surface of the circuit board 20, i.e. the top surface of the circuit board 20, so that the operator can conveniently perform maintenance and repair operations on the electrical components of the circuit board 20 from the top end of the bracket 10.

[0061] The back surface of the circuit board 20 is separated from the box bottom of the bracket 10 by a predetermined distance, so that the soldering pins and other structures on the back surface of the circuit board 20 are prevented from touching the box bottom.

[0062] In some embodiments, the support tables 12 are provided in multiple numbers along the four side walls of the bracket 10, so as to stably and uniformly support the circuit board 20, avoid the shaking of the circuit board 20 under stress, and ensure the reliability of the connection of the circuit board 20 in the bracket 10.

[0063] In some embodiments, with reference to Figure 4 and Figure 5 The air conditioner comprises a power device 30. The power device 30 is mainly used to drive the operation of the compressor and the like.

[0064] The power device 30 includes a base portion 31. The base portion 31 includes a package case having a regular shape, and a semiconductor element is generally provided inside the package case.

[0065] The power device 30 includes a pin 32. The pin 32 is connected to the base portion 31. The pin 32 has a portion extending out of the base portion 31.

[0066] The pin 32 of the power device 30 is generally connected to the circuit board 20. For example, the pin 32 is connected to the circuit board 20 in the form of soldering.

[0067] In some embodiments, the air conditioner includes a refrigerant radiator 40. The refrigerant radiator 40 is used to dissipate heat from the power device 30.

[0068] The refrigerant radiator 40 includes a liquid cooling plate 41. The liquid cooling plate 41 is made of metal, preferably aluminum.

[0069] The liquid cooling plate 41 is in contact with the base portion 31 of the power device 30. Heat generated by the power device 30 is transferred to the liquid cooling plate 41, and the refrigerant flowing in the liquid cooling plate 41 carries away the heat.

[0070] The refrigerant radiator 40 includes a refrigerant pipeline 42 for circulating refrigerant. The refrigerant pipeline 42 is connected to the liquid cooling plate 41.

[0071] The refrigerant pipeline 42 can be connected to a refrigerant circulation system of the air conditioner, so that low-temperature refrigerant flows in the refrigerant radiator 40. The specific position and connection form of the refrigerant radiator 40 in the refrigerant circulation system are applicable to the prior art, and will not be described in detail here.

[0072] In some embodiments, in combination with reference to Figure 3 and Figure 6 The liquid cooling plate 41 is connected to the outer side of the bracket 10. Specifically, the liquid cooling plate 41 is connected to the outer bottom wall of the bracket 10.

[0073] For example, the liquid cooling plate 41 can be connected to the bracket 10 by fasteners such as screws.

[0074] In some embodiments, the outer bottom wall of the bracket 10 is provided with a limiting rib 13 protruding outward. The side surface of the liquid cooling plate 41 abuts against the limiting rib 13 to realize the positioning of the liquid cooling plate 41 and the bracket 10.

[0075] The liquid cooling plate 41 can be in the shape of a cuboid block. The limiting rib 13 can include a first limiting rib 131 and a second limiting rib 132. The first limiting rib 131 and the second limiting rib 132 are perpendicular to each other to limit the liquid cooling plate 41 from two directions. When assembled, the liquid cooling plate 41 is placed against the first limiting rib 131 and the second limiting rib 132.

[0076] In some embodiments, the limiting ribs 13 can include a third limiting rib 133. The first limiting rib 131, the second limiting rib 132 and the third limiting rib 133 limit the liquid cooling plate 41 from three directions. When assembled, the liquid cooling plate 41 can be pushed into the space surrounded by the limiting ribs 13 from the opening end.

[0077] In some embodiments, the limiting ribs 13 can include four limiting ribs located in four directions to limit the liquid cooling plate 41 from four directions. When assembled, the liquid cooling plate 41 can be placed into the space surrounded by the limiting ribs 13 from the lower side.

[0078] In the related art, the base part 31 of the power device 30 forms a single surface contact with the top surface of the liquid cooling plate 41. Heat dissipation is performed in the form of single surface heat conduction.

[0079] The single surface contact heat dissipation structure is limited in heat dissipation area and heat dissipation distance, and the heat dissipation efficiency is limited.

[0080] To solve this technical problem, in some embodiments of the present application, continuing to refer to Figure 4 , Figure 5 , the base part 31 of the power device 30 is connected in the liquid cooling plate 41, and at least two side surfaces of the base part 31 are in contact with the liquid cooling plate 41. Thus, the heat generated by the power device 30 can be transferred to the liquid cooling plate 41 through the two side surfaces in contact with the liquid cooling plate 41. On the one hand, double surface heat dissipation replaces single surface heat dissipation, the heat dissipation area is increased, the heat transfer speed can be improved, and thus the heat dissipation efficiency is improved.

[0081] On the other hand, the distance from each part of the base part 31 of the power device 30 to the liquid cooling plate 41 is effectively reduced, and the heat dissipation efficiency is also improved.

[0082] In some embodiments, the liquid cooling plate 41 is provided with a slot 411. The slot 411 has a slot end facing the bracket 10. The base part 31 of the power device 30 is inserted into the slot 411. Specifically, the base part 31 can be inserted into the slot 411 from the slot end of the upper end.

[0083] Referring to Figure 7 , the liquid cooling plate 41 is provided with a slot forming part 412. The slot forming part 412 is a wall surface of the liquid cooling plate 41 surrounding the slot 411.

[0084] The base part 31 is inserted into the slot 411, which facilitates the installation of the power device 30 on the liquid cooling plate 41. Only the base part 31 of the power device 30 needs to be inserted into the slot 411 on the liquid cooling plate 41.

[0085] In some embodiments, the slot forming part 412 has a first side wall surface 4121. The base part 31 has a first heat dissipation surface 311 in contact with the first side wall surface 4121.

[0086] The slot forming portion 412 has a second side wall surface 4122. The second side wall surface 4122 and the first side wall surface 4121 are two opposite wall surfaces. The base portion 31 has a second heat dissipation surface 312 in contact with the second side wall surface 4122.

[0087] The first heat dissipation surface 311 and the second heat dissipation surface 312 can be two side surfaces with relatively large areas on the base portion 31, which can increase the contact area of the base portion 31 with the liquid cooling plate 41 as much as possible and improve the heat dissipation efficiency.

[0088] In some embodiments, the slot forming portion 412 includes a slot bottom wall surface 4123. The slot bottom wall surface 4123 is connected to the bottom ends of the first side wall surface 4121 and the second side wall surface 4122.

[0089] The base portion 31 has a third heat dissipation surface 313. The third heat dissipation surface 313 is in contact with the slot bottom wall surface 4123, which can further increase the contact heat dissipation area of the base portion 31 with the liquid cooling plate 41.

[0090] In some embodiments, the power device 30 has a plurality of power devices 30 arranged at intervals.

[0091] The slots 411 on the liquid cooling plate 41 have a plurality of slots 411 arranged one-to-one with the power devices 30. One power device 30 is inserted into one slot 411.

[0092] The slot forming portion 412 is only open at the top end to form the slot opening of the slot 411. The other side surfaces of the base portion 31 except the top surface are in contact with the slot forming portion 412. In this way, the contact heat dissipation area of the base portion 31 with the liquid cooling plate 41 can be maximized.

[0093] In some embodiments, continuing to refer to Figure 4 and Figure 5 , the slots 411 on the liquid cooling plate 41 extend along the length direction of the liquid cooling plate 41. The slots 411 form a long and narrow channel shape. In this way, the structure of the slots 411 can be simplified, and the processing difficulty and cost can be reduced.

[0094] The power devices 30 are arranged in the slots 411 along the length direction of the slots 411.

[0095] In some embodiments, the two ends of the length extension direction of the slot 411 penetrate through the liquid cooling plate 41.

[0096] In this embodiment, the structure of the slot 411 is relatively simple, which can be formed by profile extrusion, and is more conducive to processing and manufacturing.

[0097] In some embodiments, the two ends of the length direction of the slot 411 can be sealed by the sealing block 43.

[0098] The sealing block 43 can be made of aluminum. The sealing block 43 is connected to the liquid cooling plate 41 by high-temperature welding to form a sealed connection.

[0099] In some embodiments, the bracket 10 abuts the notched end of the liquid cooling plate 41 to close the notch of the insertion slot 411.

[0100] Specifically, the bottom surface of the bracket 10 abuts the top surface of the liquid cooling plate 41.

[0101] The insertion slot 411 can be filled with a heat dissipation fluid to reduce the interfacial thermal resistance between the insertion slot forming portion 412 and the base portion 31 and improve the heat dissipation efficiency.

[0102] The heat dissipation fluid can be a nanofluid or a liquid metal, which has high thermal conductivity.

[0103] In some embodiments, continuing to refer to Figure 7 The cross section of the insertion slot 411, which is perpendicular to the length extension direction of the insertion slot 411, is wedge-shaped. The wedge-shaped cross section of the insertion slot 411 has a structure in which the width gradually decreases from the top to the bottom.

[0104] The base portion 31 of the power device 30 has a shape that is adapted to the shape of the insertion slot 411. That is, the base portion 31 and the insertion slot 411 are wedge-shaped.

[0105] On the one hand, the wedge-shaped structure makes it easier to insert the bottom end of the base portion 31, which has a smaller width, into the top end of the insertion slot 411, which has a larger width. Therefore, this structure facilitates the insertion of the base portion 31 into the insertion slot 411.

[0106] On the other hand, when the power device 30 is pushed from top to bottom, the base portion 31 can be tightly fitted with the insertion slot forming portion 412, thereby reducing the interfacial thermal resistance and improving the heat dissipation efficiency.

[0107] In some embodiments, the refrigerant pipeline 42 can be connected to the liquid cooling plate 41 by pressure bonding, welding, expansion, or the like.

[0108] The refrigerant pipeline 42 can have a "U" shape and be installed in the liquid cooling plate 41. The two ports of the refrigerant pipeline 42 are connected to the refrigerant circulation system of the air conditioner. The low-temperature refrigerant flows through the refrigerant pipeline 42 while taking away the heat on the liquid cooling plate 41, thereby achieving the heat dissipation effect.

[0109] The insertion slot 411 can be arranged in the U-shaped space formed by the refrigerant pipeline 42.

[0110] In some embodiments, referring to Figure 7 and Figure 8The liquid cooling plate 41 is provided with a cooling channel 413. The cooling channel 413 is connected with the refrigerant pipeline 42, and the refrigerant flows in the cooling channel 413.

[0111] The cooling channel 413 can include an inflow end and an outflow end. The inflow end and the outflow end of the cooling channel 413 are respectively connected with the refrigerant pipeline 42.

[0112] In some embodiments, the length direction of the cooling channel 413 is the same as the length direction of the slot 411.

[0113] In some embodiments, the cooling channel 413 can include a first cooling channel 4131. The first cooling channel 4131 is located on the side of the first side wall surface 4121 away from the second side wall surface 4122.

[0114] The first cooling channel 4131 is closer to the first heat dissipation surface 311 of the power device 30, and the refrigerant flowing in the first cooling channel 4131 can quickly take away the heat transferred from the first heat dissipation surface 311 to the liquid cooling plate 41.

[0115] The refrigerant channel 413 can include a second cooling channel 4132. The second cooling channel 4132 is located on the side of the second side wall surface 4122 away from the first side wall surface 4121.

[0116] The second cooling channel 4132 is closer to the second heat dissipation surface 312 of the power device 30, and the refrigerant flowing in the second cooling channel 4132 can quickly take away the heat transferred from the second heat dissipation surface 312 to the liquid cooling plate 41.

[0117] The first cooling channel 4131 and the second cooling channel 4132 are respectively located on the two sides of the power device 30, which can reduce the distance from each part of the power device 30 to the refrigerant, thereby improving the heat dissipation efficiency.

[0118] In some embodiments, the flow path cross section of the first cooling channel 4131 and the second cooling channel 4132 can be a waist-shaped hole with a large size in the up-down direction. The transverse width of the first cooling channel 4131 and the second cooling channel 4132 is small, which can avoid excessively increasing the width size of the liquid cooling plate 41 due to the arrangement of the cooling channel 413, and can make the size of the liquid cooling plate 41 more compact.

[0119] It should be noted that the flow path cross section refers to the cross section of the cooling channel 413 in the plane perpendicular to the flow direction of the refrigerant. The refrigerant flows in the length direction of the cooling channel 413.

[0120] In some embodiments, the cooling channel 413 can include a third cooling channel 4133. The third cooling channel 4133 is arranged on the lower side of the slot forming portion 412.

[0121] The third cooling passage 4133 is in communication with the first cooling passage 4131 and the second cooling passage 4132, so that the refrigerant can flow among the first cooling passage 4131, the second cooling passage 4132, and the third cooling passage 4133.

[0122] The first cooling passage 4131, the second cooling passage 4132, and the third cooling passage 4133 are located in three directions of the slot 411, and surround the slot 411 on three sides, which can further improve the heat dissipation efficiency.

[0123] In some embodiments, the flow path section of the third cooling passage 4133 can be in the shape of a waist hole with a smaller size in the up-down direction. In this way, the height dimension of the liquid cooling plate 41 can be prevented from being excessively increased, and the size of the liquid cooling plate 41 can be made more compact.

[0124] In some embodiments, referring to Figure 9 and Figure 10 , an opening is provided on the partition wall of the first cooling passage 4131 and the third cooling passage 4133 to realize the communication between the first cooling passage 4131 and the third cooling passage 4133.

[0125] The two ends of the length direction of the cooling passage 413 are respectively the first end 41a and the second end 41b.

[0126] The first end 41a of the first cooling passage 4131 is in communication with the first end 41a of the third cooling passage 4133. The opening is provided at the first end 41a.

[0127] In some embodiments, an opening is provided on the partition wall of the third cooling passage 4133 and the second cooling passage 4132 to realize the communication between the third cooling passage 4133 and the second cooling passage 4132.

[0128] The second end 41b of the third cooling passage 4133 is in communication with the second end 41b of the second cooling passage 4132. The opening is provided at the second end 41b.

[0129] In some embodiments, the slot 411 and the first cooling passage 4131, the second cooling passage 4132, and the third cooling passage 4133 surrounding the outside of the slot 411 form a unit group. Multiple unit groups can be provided on the liquid cooling plate 41.

[0130] In some embodiments, the liquid cooling plate 41 has only one unit group.

[0131] The second end 41b of the first cooling passage 4131 can serve as the inflow end of the cooling passage 413, and the first end 41a of the second cooling passage 4132 can serve as the outflow end of the cooling passage 413.

[0132] The refrigerant flows into the first cooling channel 4131 from the inflow end, continues to flow from the first end 41a of the first cooling channel 4131 to the first end 41a of the third cooling channel 4133, passes through the third cooling channel 4131, and then flows out from the second end 41b of the third cooling channel 4131 to the second end 41b of the second cooling channel 4132, and then passes through the second cooling channel 4132.

[0133] In other embodiments, the second end 41b of the first cooling channel 4131 can serve as the outflow end of the cooling channel 413, and the first end of the second cooling channel 4132 can serve as the inflow end of the cooling channel 413.

[0134] In some embodiments, a plurality of unit groups are arranged on the liquid cooling plate 41, and the cooling channels 413 of the plurality of unit groups are in communication with each other.

[0135] In two adjacent unit groups, the second cooling channel 4132 is located between the two slots 411. The first ends 41a of the two second cooling channels 4132 are in communication, thereby achieving the communication of the cooling channels 413 of the two unit groups.

[0136] The second end 41b of the first cooling channel 4131 of one unit group can serve as the inflow end of the cooling channel 413, and the second end 41b of the second cooling channel 4132 of the other unit group can serve as the outflow end of the cooling channel 413.

[0137] In some embodiments, the cooling channel 413 extends through the liquid cooling plate 41. In this way, the cooling channel 413 can be processed by profile extrusion, which is relatively simple to manufacture and can reduce production costs.

[0138] In some embodiments, with reference to Figure 8 , the other ends of the cooling channel 413 except the inflow end and the outflow end can be blocked by the sealing block 43.

[0139] Specifically, the first end 41a of the first cooling channel 4131 and the first end 41a of the third cooling channel 4133 can be blocked by an "L"-shaped sealing block 43.

[0140] The second end 41b of the third cooling channel 4133 and the second end 41b of the second cooling channel 4132 can be blocked by an "L"-shaped sealing block 43.

[0141] In two adjacent unit groups, the first ends 41a of the two second cooling channels 4132 can be blocked by a square sealing block 43.

[0142] In some embodiments, since the base body 31 of the power device 30 is connected to the liquid cooling plate 41, the base body 31 is located outside the bracket 10 together with the liquid cooling plate 41.

[0143] The pins of the power device 30 are connected with the circuit board 20 through the bracket 10. Specifically, referring to Figure 6 , the bottom wall of the bracket 10 can be provided with the avoiding holes 14, and the pins of the power device 30 pass through the avoiding holes 14 into the bracket 10.

[0144] In some embodiments, the avoiding holes 14 are provided one-to-one corresponding to the pins of the power device 30.

[0145] Exemplarily, one power device 30 has three pins, and the bracket 10 is provided with three avoiding holes 14 corresponding to the three pins.

[0146] In this way, the pins of the power device 30 can be isolated through the bottom wall of the bracket 10, thereby improving the electrical safety.

[0147] In some embodiments, referring to Figure 3 , the bracket 10 is provided with the isolation part 15 extending towards the circuit board 20. Specifically, the isolation part 15 is formed by extending upward from the bottom wall of the bracket 10. The isolation part 15 is located between the bottom wall of the bracket 10 and the circuit board 20.

[0148] The pins of the power device 30 pass through the isolation part 15. The end of the pin of the power device 30 is exposed from the isolation part 15 and welded with the circuit board 20.

[0149] Specifically, the avoiding hole 14 extends upward from the outer bottom surface of the bracket 10 to the top end of the isolation part 15, that is, the avoiding hole 14 penetrates the bottom wall of the bracket 10 and the isolation part 15.

[0150] By providing the isolation part 15, the pins of the power device 30 can be isolated, thereby improving the electrical installation.

[0151] In addition, the isolation part 15 can abut against the circuit board 20, thereby supporting the circuit board 20 and avoiding the middle part of the circuit board 20 from shaking under force without support.

[0152] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, but not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

[0153] For the sake of explanation, the foregoing descriptions have been presented in terms of specific embodiments. However, it is to be appreciated that specific embodiments described herein are not intended to limit the scope of the present application, which is defined with reference to the following claims. Various modifications and changes can be made thereto by those skilled in the art which fall within the scope of the present application as defined by the following claims. The embodiments were chosen and described in order to explain the principles of the application and the practical application and to enable others skilled in the art to understand for implementing various embodiments and with various modifications as are suited to the particular use contemplated.

Claims

1. An air conditioner, characterized in that, include: support; The circuit board is mounted on the bracket; Power devices, including: Pins are connected to the circuit board; The base portion is connected to the pins; A refrigerant radiator is used to dissipate heat from the power device. The refrigerant radiator includes a liquid cooling plate, and the liquid cooling plate is provided with a slot forming portion to form a slot. The base portion is inserted into the slot, and at least two sides of the base portion are in contact with the slot forming portion.

2. The air conditioner according to claim 1, characterized in that, The slot forming portion includes a first side wall and a second side wall disposed opposite to each other, and the first side wall and the second side wall respectively contact the base portion; The liquid cooling plate is provided with cooling channels for circulating refrigerant, and the cooling channels include: The first cooling channel is located on the side of the first side wall away from the second side wall; The second cooling channel is located on the side of the second sidewall away from the first sidewall, and the second cooling channel is connected to the first cooling channel.

3. The air conditioner according to claim 2, characterized in that, The cooling channel includes: The third cooling channel is located on the bottom side of the slot forming part, and the third cooling channel is connected to the first cooling channel and the second cooling channel.

4. The air conditioner according to claim 3, characterized in that, The length direction of the cooling channel is the same as the length direction of the slot forming portion; the two ends of the length direction are defined as the first end and the second end, respectively. The first end of the first cooling channel is connected to the first end of the third cooling channel, and the second end of the third cooling channel is connected to the second end of the second cooling channel.

5. The air conditioner according to claim 3, characterized in that, The slot, the first cooling channel, the second cooling channel and the third cooling channel form a unit group, and multiple unit groups are arranged at intervals on the refrigerant radiator, and the cooling channels of the multiple unit groups are interconnected.

6. The air conditioner according to claim 1, characterized in that, The liquid cooling plate is provided with a cooling channel for circulating refrigerant. The cooling channel runs through the liquid cooling plate and has an inlet end and an outlet end for connecting the refrigerant pipeline. The refrigerant radiator also includes: A sealing block, which seals the ends of the cooling channel that exclude the inflow and outflow ends.

7. The air conditioner according to claim 1, characterized in that, The cross-section of the slot cut by a plane perpendicular to the length direction of the slot is wedge-shaped.

8. The air conditioner according to claim 1, characterized in that, The bracket abuts against the slot end of the liquid cooling plate to seal the slot opening; The slot is filled with heat-dissipating fluid.

9. The air conditioner according to claim 1, characterized in that, The bracket is provided with an isolation portion extending toward the circuit board, and the isolation portion is provided in a one-to-one correspondence with the pins; The pin passes through the isolation section.

10. An air conditioner, characterized in that, include: support; The circuit board is connected to the bracket; Power devices, including: Pins are connected to the circuit board; The base portion is connected to the pins; A refrigerant radiator, connected to the bracket, is used to dissipate heat from the power device. The refrigerant radiator includes a liquid cooling plate through which refrigerant flows. The base portion is connected to the liquid cooling plate, and at least two sides of the base portion are in contact with the liquid cooling plate.

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