Silicon wafer texturing machine
By introducing a pneumatic drainage structure and a gas storage tank into the silicon wafer texturing machine, the problem of explosion caused by hydrogen accumulation during equipment failure or power outage was solved, enabling rapid discharge of the reaction liquid and ensuring production safety.
Patent Information
- Application Number
- CN202520291812.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-21
- Publication Date
- 2025-11-21
- Estimated Expiration
- 2035-02-21
AI Technical Summary
In the event of equipment failure or power outage, existing silicon wafer texturing machines may accumulate hydrogen gas, potentially leading to an explosion and posing a serious safety hazard.
A silicon wafer texturing machine was designed, comprising a first tank, a second tank, a pneumatic drainage structure, and a gas storage tank. The pneumatic drainage structure prevents hydrogen accumulation by controlling the opening and closing of the drainage port through the cover plate and the drainage port. The gas storage tank is used to regulate the gas pressure and control the opening and closing of the drainage port, thereby enabling the rapid discharge of the reaction liquid.
It effectively prevents hydrogen explosions, ensures production safety, reduces equipment maintenance risks, and improves the safety of the production process.
Smart Images
Figure CN223584637U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to the photovoltaic cell piece manufacturing field relates to a silicon wafer texturing machine. BACKGROUND
[0002] Silicon wafer texturing is one of the key processes in solar cell manufacturing, its purpose is to remove the damage layer on the surface of silicon wafer through chemical or physical method, and form the textured structure with antireflection effect, so as to improve the absorption capacity of silicon wafer to sunlight, reduce reflectivity, and ultimately improve the photoelectric conversion efficiency of solar cell.
[0003] The existing silicon wafer texturing process is mostly to use reaction liquid (such as lye or acid) to quickly corrode the silicon wafer in the groove body of the silicon wafer texturing machine, for example, the single crystal silicon texturing usually adopts alkaline texturing system, mainly using low concentration lye (such as NaOH, KOH, etc.) to corrode the surface of silicon wafer. Due to the crystal structure characteristics of single crystal silicon, pyramid structure will be formed on the surface after corrosion, which can effectively reduce the reflection of light so that the surface of silicon wafer meets the requirements of textured surface; for polycrystalline silicon texturing, acid texturing system is usually adopted, such as mixed solution of HF and HNO3. Because the grain orientation of polycrystalline silicon is complex, it is difficult to form uniform pyramid structure by alkaline texturing, so acid texturing is more suitable for polycrystalline silicon.
[0004] In the silicon wafer texturing process, the reaction of silicon wafer and reaction liquid will release a large amount of hydrogen gas, and hydrogen gas is a dangerous gas with flammability. When the equipment is working normally, the hydrogen gas generated by the reaction of silicon wafer and reaction liquid will be timely discharged by the exhaust system above the groove body, but when the equipment suddenly fails or the production workshop suddenly loses power during operation, the exhaust system stops working. If the reaction of silicon wafer and reaction liquid cannot be stopped in time, hydrogen gas will still be continuously generated, and when the concentration of hydrogen gas reaches a certain concentration, explosion may occur, which has great safety hidden danger.
[0005] Therefore, it is necessary to provide a silicon wafer texturing machine. CONTENT OF UTILITY MODEL
[0006] In view of the above-mentioned defects of the prior art, the purpose of the utility model is to provide a silicon wafer texturing machine for solving the safety hidden trouble problem existing in the prior art silicon wafer texturing machine.
[0007] In order to achieve the above-mentioned purpose and other related purposes, the utility model provides a silicon wafer texturing machine, which comprises:
[0008] A first groove body is used to contain silicon wafer and reaction liquid, and the first groove body has a liquid discharge port;
[0009] A second groove body is connected with the liquid discharge port and used to contain the reaction liquid discharged from the liquid discharge port.
[0010] The pneumatic liquid discharge structure comprises a bracket, a cylinder, a cover plate, a valve core and a spring, wherein the cover plate is fixedly connected with the cylinder, and the cover plate is arranged corresponding to the liquid discharge port; the cylinder comprises a first cylinder cavity and a second cylinder cavity separated by a cylinder partition plate; the spring is arranged in the first cylinder cavity, and a first end of the spring is fixedly connected with the cover plate, and a second end of the spring is fixedly connected with the cylinder partition plate; the valve core is arranged in the second cylinder cavity, and a first end of the valve core is fixedly connected with the cylinder partition plate, and a second end of the valve core is fixedly connected with the bracket through the cylinder.
[0011] The gas storage tank is connected with the second cylinder cavity to regulate the air pressure in the second cylinder cavity, so that the cylinder combined with the spring is stretched and contracted to move along the valve core, to drive the cover plate to open and close the liquid discharge port.
[0012] Optionally, the second groove is arranged below, on the side or periphery of the first groove.
[0013] Optionally, the first groove and the second groove are separated by a groove partition plate, the liquid discharge port is arranged on the groove partition plate, and the bracket is fixed on the groove partition plate.
[0014] Optionally, a plurality of the liquid discharge ports and the pneumatic liquid discharge structures corresponding to the liquid discharge ports are included.
[0015] Optionally, the shape of the liquid discharge port includes a square, a circle or an ellipse; the size of the liquid discharge port includes 100mm-300mm.
[0016] Optionally, the fixed connection mode includes one or a combination of threaded connection, buckle connection and tenon and mortise connection.
[0017] Optionally, the silicon wafer texturing machine comprises an exhaust system, and a projection of an exhaust port of the exhaust system covers the groove of the first groove and the second groove.
[0018] Optionally, the gas storage tank communicates with the exhaust system to adjust the gas supply state of the gas storage tank.
[0019] Optionally, a reaction liquid recovery device connected with the second groove is further arranged.
[0020] Optionally, the silicon wafer texturing machine comprises an acidic silicon wafer texturing machine or an alkaline silicon wafer texturing machine.
[0021] The utility model discloses a silicon wafer texturing machine, including first groove body, second groove body, pneumatic liquid discharge structure and gas storage tank, wherein, first groove body is used to hold silicon wafer and reaction solution, and first groove body has liquid discharge port, second groove body is connected with the liquid discharge port and is used to hold the reaction solution from the liquid discharge port, pneumatic liquid discharge structure includes support, cylinder, cover plate, valve core and spring, cover plate is fixedly connected with cylinder, and cover plate is correspondingly arranged with the liquid discharge port, cylinder includes first cylinder cavity and second cylinder cavity separated by cylinder partition, spring is arranged in first cylinder cavity, and the first end of spring is fixedly connected with cover plate, and the second end of spring is fixedly connected with cylinder partition, valve core is arranged in second cylinder cavity, and the first end of valve core is fixedly connected with cylinder partition, and the second end of valve core is fixedly connected with support through cylinder, and gas storage tank is connected with second cylinder cavity and is used to control the air pressure in second cylinder cavity, so that the expansion and contraction of cylinder combined spring moves along valve core, to drive the switch operation of cover plate to liquid discharge port.
[0022] The utility model discloses a silicon wafer texturing machine can effectively carry out the liquid discharge operation of reaction solution, prevent hydrogen explosion, effectively solve the production safety hidden trouble problem. BRIEF DESCRIPTION OF DRAWINGS
[0023] Figure 1 The structure schematic diagram of the silicon wafer texturing machine in the utility model is shown.
[0024] Figure 2 The structure schematic diagram of the silicon wafer texturing machine in the utility model is shown. Figure 1 The enlarged structure schematic diagram of pneumatic liquid discharge structure is shown.
[0025] BRIEF DESCRIPTION OF DRAWINGS
[0026] 100 first groove body
[0027] 200 second groove body
[0028] 300 pneumatic liquid discharge structure
[0029] 301 support
[0030] 302 cylinder
[0031] 312 first cylinder cavity
[0032] 322 second cylinder cavity
[0033] 332 cylinder partition
[0034] 303 cover plate
[0035] 304 valve core
[0036] 305 spring
[0037] 400 gas storage tank
[0038] 500 groove partition plate
[0039] 600 air outlet DETAILED DESCRIPTION
[0040] The above objectives and other advantages of the present application will become more apparent by describing in detail the only embodiment thereof, as illustrated in the drawings in which:
[0041] It is to be understood that the above-mentioned configurations merely illustrate the basic concept of the present application, and thus the drawings only show the components related to the present application, rather than the actual number, shape and size of the components. The actual implementation of the components may vary, and the layout of the components may be more complex.
[0042] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.
[0043] Referring to Figure 1 and Figure 2 The present embodiment provides a silicon wafer texturing machine, which comprises:
[0044] A first tank 100 is used to hold silicon wafers and reaction liquid, and has a liquid outlet (not shown);
[0045] A second tank 200 is connected with the liquid outlet and used to hold the reaction liquid discharged from the liquid outlet;
[0046] The pneumatic liquid discharge structure 300 comprises a bracket 301, a cylinder body 302, a cover plate 303, a valve core 304 and a spring 305, wherein the cover plate 303 is fixedly connected with the cylinder body 302, and the cover plate 303 is arranged corresponding to the liquid discharge port; the cylinder body 302 comprises a first cylinder cavity 312 and a second cylinder cavity 322 which are separated by a cylinder partition plate 332; the spring 305 is arranged in the first cylinder cavity 312, and a first end of the spring 305 is fixedly connected with the cover plate 303, and a second end of the spring 305 is fixedly connected with the cylinder partition plate 332; the valve core 304 is arranged in the second cylinder cavity 322, and a first end of the valve core 304 is fixedly connected with the cylinder partition plate 332, and a second end of the valve core 304 is fixedly connected with the bracket 301 through the cylinder body 302;
[0047] The gas storage tank 400 is connected with the second cylinder cavity 322 to regulate the air pressure in the second cylinder cavity 322, so that the cylinder body 302 moves along the valve core 304 in combination with the expansion and contraction of the spring 305, to drive the cover plate 303 to open and close the liquid discharge port.
[0048] In the embodiment, the reaction liquid in the first groove body 100 can be effectively discharged by the silicon wafer texturing machine, so as to prevent hydrogen explosion and effectively solve the production safety hidden trouble problem.
[0049] For example, the silicon wafer texturing machine comprises an acidic silicon wafer texturing machine or an alkaline silicon wafer texturing machine.
[0050] Specifically, when different materials of silicon wafers are subjected to texturing treatment, for example, an alkaline texturing system is usually used for single crystal silicon wafers, and low-concentration alkali such as NaOH and KOH is mainly used to corrode the surface of the silicon wafer, at this time, the components of the silicon wafer texturing machine are selected to be alkali-resistant, and the alkaline silicon wafer texturing machine can be obtained; when the polycrystalline silicon wafer is subjected to texturing treatment, an acidic texturing system such as a mixed solution of HF and HNO3 can be used to corrode the surface of the silicon wafer, at this time, the components of the silicon wafer texturing machine are selected to be acid-resistant, and the acidic silicon wafer texturing machine can be obtained. The silicon wafer texturing machine in the embodiment takes the alkaline silicon wafer texturing machine as an example, but is not limited thereto.
[0051] Specifically, referring to Figure 1 and Figure 2 , the working principle of the silicon wafer texturing machine is as follows:
[0052] When the device is working normally, the compressed gas in the gas tank 400 can continuously enter the second cylinder cavity 322, so that the internal pressure of the second cylinder cavity 322 increases, and the internal pressure of the second cylinder cavity 322 is greater than the elastic force of the spring 305 in the first cylinder cavity 312, the spring 305 is in a compressed state, and since the second end of the valve core 304 is fixedly connected with the support 301, the cylinder 302 moves downward along the valve core 304 to drive the cover plate 303 to cover the liquid outlet, so that the liquid outlet is in a closed state. At this time, the reaction liquid in the first tank 100 continuously reacts with the silicon wafer, and the generated hydrogen gas is removed by the exhaust system to ensure the safe production process.
[0053] When the device fails or other conditions such as power failure occur in the workshop, the compressed gas in the gas tank 400 stops supplying, at this time, the pressure of the second cylinder cavity 322 is less than the elastic force of the spring 305, the spring 305 naturally expands, and since the second end of the valve core 304 is fixedly connected with the support 301, the cylinder 302 moves upward, so that the cover plate 303 is away from the liquid outlet, so that the liquid outlet is in an open state. At this time, the reaction liquid in the first tank 100 flows to the second tank 200 through the liquid outlet, so that the chemical reaction between the silicon wafer and the reaction liquid in the first tank 100 can be quickly cut off, the continuous generation of hydrogen gas is prevented, the accumulation of hydrogen gas above the tank is reduced, the safety hidden danger is avoided, and the safe equipment maintenance is ensured.
[0054] As an example, the silicon wafer texturing machine includes an exhaust system, and the exhaust port 600 of the exhaust system covers the tank openings of the first tank 100 and the second tank 200.
[0055] Specifically, when the projection of the exhaust port 600 of the exhaust system covers the tank openings of the first tank 100 and the second tank 200, the exhaust port 600 can not only remove the hydrogen gas and volatile substances released from the first tank 100, but also remove the volatile substances from the second tank 200, so as to effectively avoid the accumulation of hydrogen gas and the influence of volatile substances on the product and the device.
[0056] Preferably, the gas tank 400 communicates with the exhaust system, so as to obtain the on-off state of the exhaust system in time, and control the gas supply and cut-off of the gas tank 400 in the first time. The communication between the gas tank 400 and the exhaust system can be realized by a controller or the like.
[0057] As an example, the second tank 200 can be arranged below, on the side or on the periphery of the first tank 100.
[0058] Specifically, in the embodiment, referring to Figure 1 and Figure 2 , the second tank 200 is preferably arranged below the first tank 100, so that the discharge operation of the reaction liquid can be effectively performed, and the equipment space ratio is reduced. However, the position distribution of the second tank 200 and the first tank 100 is not limited to this, and the second tank 200 can also be arranged at the side or periphery of the first tank 100.
[0059] As an example, the first tank 100 and the second tank 200 can be separated by a tank partition plate 500, wherein the discharge port is arranged on the tank partition plate 500, and the support 301 is fixed on the tank partition plate 500.
[0060] Specifically, in the embodiment, referring to Figure 1 and Figure 2 , the first tank 100 and the second tank 200 are separated by a tank partition plate 500, the discharge port is arranged on the tank partition plate 500, and the support 301 is fixed on the tank partition plate 500, so as to facilitate the modification and operation of the equipment. However, the separation mode between the first tank 100 and the second tank 200 is not limited to this. For example, when the second tank 200 is arranged at the periphery of the first tank 100, the outer wall of the first tank 100 can also be used as a tank partition plate 500 to separate the first tank 100 and the second tank 200, and the like.
[0061] As an example, the shape of the discharge port can include square, circular or oval, etc.; the size of the discharge port can include 100mm-300mm.
[0062] Specifically, in the embodiment, since the size of the first tank 100 for containing silicon wafers and reaction liquid is large, the size of the discharge port is preferably 100mm-300mm, so as to facilitate rapid discharge. For example, the size of the discharge port can be 100mm, 200mm, 300mm, etc. In the embodiment, the discharge port is preferably a square discharge port with a size of 200mm×200mm. However, the shape and size of the discharge port are not limited to this, and can be set as needed.
[0063] In the embodiment, since the size of the discharge port is large, the valve core 304 is fixed in the pneumatic discharge structure, and the cylinder body 302 drives the cover plate 303 with a large size and corresponding to the discharge port to open and close the discharge port, so as to improve the operation stability and control accuracy.
[0064] As an example, the silicon wafer texturing machine can include a plurality of the liquid discharge ports and the pneumatic liquid discharge structure 300 corresponding to the liquid discharge ports.
[0065] Specifically, when the silicon wafer texturing machine has a plurality of the liquid discharge ports and the pneumatic liquid discharge structure 300 corresponding to the liquid discharge ports, the liquid discharge speed can be further improved, the time efficiency can be saved, and the risk can be reduced.
[0066] Further, preferably, the plurality of the liquid discharge ports are distributed at equal intervals to improve the flow stability of the reaction liquid in the first tank 100 during the liquid discharge process.
[0067] Wherein, the plurality can include 2, 3, 5, etc. N≥2 integers.
[0068] As an example, the fixed connection mode of the cover plate 303 and the cylinder body 302 can include, for example, threaded connection, buckle connection or tenon and mortise connection; the fixed connection mode of the first end of the spring 305 and the cover plate 303 can include, for example, threaded connection, buckle connection or tenon and mortise connection; the fixed connection mode of the second end of the spring 305 and the cylinder body partition plate 332 can include, for example, threaded connection, buckle connection or tenon and mortise connection; the fixed connection mode of the first end of the valve core 304 and the cylinder body partition plate 332 can include, for example, threaded connection, buckle connection or tenon and mortise connection; the fixed connection mode of the second end of the valve core 304 and the bracket 301 can include, for example, threaded connection, buckle connection or tenon and mortise connection. In order to facilitate subsequent maintenance, adjustment and replacement of parts, and improve operation convenience.
[0069] As an example, a reaction liquid recovery device (not shown) connected with the second tank 200 is also provided.
[0070] Specifically, when the reaction liquid recovery device is provided, the reaction liquid in the second tank 200 can be recovered in time through the reaction liquid recovery device, so as to realize the reuse of the reaction liquid, thereby effectively reducing the cost.
[0071] In summary, the silicon wafer texturing machine comprises a first tank body, a second tank body, a pneumatic liquid discharge structure and a gas storage tank, wherein the first tank body is used for containing silicon wafers and reaction liquid, and the first tank body has a liquid discharge port; the second tank body is connected with the liquid discharge port and used for containing the reaction liquid discharged from the liquid discharge port; the pneumatic liquid discharge structure comprises a support, a cylinder body, a cover plate, a valve core and a spring, the cover plate is fixedly connected with the cylinder body, and the cover plate is arranged in correspondence with the liquid discharge port; the cylinder body comprises a first cylinder cavity and a second cylinder cavity which are separated by a cylinder partition plate; the spring is arranged in the first cylinder cavity, and a first end of the spring is fixedly connected with the cover plate, and a second end of the spring is fixedly connected with the cylinder partition plate; the valve core is arranged in the second cylinder cavity, a first end of the valve core is fixedly connected with the cylinder partition plate, and a second end of the valve core is fixedly connected with the support through the cylinder body; the gas storage tank is connected with the second cylinder cavity in communication to control the air pressure in the second cylinder cavity, so that the cylinder body moves along the valve core in combination with the expansion and contraction of the spring to drive the cover plate to open and close the liquid discharge port.
[0072] The silicon wafer texturing machine can effectively discharge the reaction liquid, prevent hydrogen explosion and effectively solve the production safety hazard problem, so that the silicon wafer texturing machine effectively overcomes various shortcomings in the prior art and has high industrial utilization value.
[0073] The above embodiments only exemplarily illustrate the principles and effects of the silicon wafer texturing machine, and are not used to limit the silicon wafer texturing machine. Any person skilled in the art can modify or change the above embodiments without departing from the spirit and scope of the silicon wafer texturing machine. Therefore, all equivalent modifications or changes completed by those skilled in the art without departing from the spirit and technical thought disclosed by the silicon wafer texturing machine should be covered by the claims of the silicon wafer texturing machine.
Claims
1. A silicon wafer texturing machine, characterized in that, The silicon wafer texturing machine includes: The first tank is used to hold silicon wafers and reaction liquid, and the first tank has a drain port; The second tank is connected to the drain outlet and is used to hold the reaction liquid discharged from the drain outlet; A pneumatic drainage structure includes a support, a cylinder, a cover plate, a valve core, and a spring. The cover plate is fixedly connected to the cylinder and is correspondingly positioned to the drainage port. The cylinder includes a first cylinder cavity and a second cylinder cavity separated by a cylinder partition. The spring is disposed in the first cylinder cavity, with its first end fixedly connected to the cover plate and its second end fixedly connected to the cylinder partition. The valve core is disposed in the second cylinder cavity, with its first end fixedly connected to the cylinder partition and its second end penetrating the cylinder and fixedly connected to the support. An air storage tank is connected to the second cylinder cavity to regulate the air pressure inside the second cylinder cavity, so that the cylinder moves along the valve core in conjunction with the extension and retraction of the spring, thereby driving the cover plate to open and close the drain port.
2. The silicon wafer texturing machine according to claim 1, characterized in that: The second tank is located below, on the side or around the first tank.
3. The silicon wafer texturing machine according to claim 1, characterized in that: The first tank and the second tank are separated by a tank partition, the drain port is provided on the tank partition, and the bracket is fixed to the tank partition.
4. The silicon wafer texturing machine according to claim 1, characterized in that: It includes multiple drainage ports and a pneumatic drainage structure corresponding to each drainage port.
5. The silicon wafer texturing machine according to claim 1, characterized in that: The shape of the drain outlet includes square, circular or elliptical; the size of the drain outlet includes 100mm to 300mm.
6. The silicon wafer texturing machine according to claim 1, characterized in that: Fixed connections include one or a combination of threaded connections, snap-fit connections, and tenon joints.
7. The silicon wafer texturing machine according to claim 1, characterized in that: The silicon wafer texturing machine includes an exhaust system, and the projection of the exhaust port of the exhaust system covers the openings of the first tank and the second tank.
8. The silicon wafer texturing machine according to claim 7, characterized in that: The gas storage tank communicates with the exhaust system to regulate the gas supply status of the gas storage tank.
9. The silicon wafer texturing machine according to claim 1, characterized in that: A reaction liquid recovery device connected to the second tank is also provided.
10. The silicon wafer texturing machine according to claim 1, characterized in that: The silicon wafer texturing machine includes an acidic silicon wafer texturing machine or an alkaline silicon wafer texturing machine.