Uniform air supply cooling device for honeycomb plate preparation

By designing a uniform air supply cooling device for honeycomb panel fabrication, combining ambient temperature air cooling and cold air cooling, the problems of deformation and long cooling time during the honeycomb panel cooling process were solved, achieving uniform and efficient cooling.

CN223589867UActive Publication Date: 2025-11-25YINJIA (SANMING) NEW MATERIAL TECH CO LTD
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Patent Information

Application Number
CN202423303934.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-31
Publication Date
2025-11-25
Estimated Expiration
2034-12-31

AI Technical Summary

Technical Problem

In the current cooling process of honeycomb panels, natural cooling is slow and easily damaged, while traditional air cooling is prone to deformation and distortion, and room temperature air cooling is inefficient and has a long cooling time.

Method used

Design a uniform air supply cooling device for honeycomb panel fabrication, combining room temperature air cooling and cold air cooling mechanisms. Uniform air supply is achieved through air supply ducts and semiconductor refrigeration chips. The air supply section area is gradually reduced and cold air is distributed by a cold air distribution plate to ensure cooling uniformity and efficiency.

Benefits of technology

This effectively prevents the honeycomb panel from deforming before it is formed, shortens the cooling time, and improves cooling efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to a uniform air supply cooling device for cellular board preparation, which comprises a cooling box body and a conveying belt which transversely penetrates through the cooling box body to convey cellular boards, a normal temperature air cooling mechanism and a cold air cooling mechanism are sequentially arranged in the cooling box body from left to right, and both the normal temperature air cooling mechanism and the cold air cooling mechanism supply air downwards; the normal-temperature air cooling mechanism comprises a first fan supplying air from left to right, an air supply pipeline is transversely arranged on the right side of the first fan, the air supply pipeline comprises a plurality of air supply sections in the length direction of the air supply pipeline, the longitudinal section areas of the air supply sections are sequentially decreased in the air flowing direction of the air supply pipeline, and an air supply opening penetrating in the vertical direction is formed in the bottom of each air supply section. According to the device, uniform air supply cooling of the cellular board is achieved, the problem that the cellular board is prone to deformation and deformity before being formed during traditional air cooling is effectively avoided, meanwhile, a normal-temperature air cooling mode and a cooled air cooling mode are combined, the cooling time is effectively shortened, and the cooling efficiency is improved.
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Description

TECHNICAL FIELD

[0001] The utility model relates to a uniform air supply cooling device of honeycomb board preparation. BACKGROUND

[0002] Plastic honeycomb is made of two thin panels firmly bonded on both sides of a thick honeycomb core material, in the production process, plastic is shot into the mold plate by the extruder to form, and then it is cooled. At present, honeycomb board cooling is mainly through natural cooling and cooling device, wherein the natural cooling speed is slow, and the shape is easily damaged by touching during long time placement. Moreover, the current cooling device mainly cools by air cooling, and it is difficult to control the air cooling, and the air force is easy to blow into the mold to cause the honeycomb board to deform before forming and cause deformation. Furthermore, the traditional air cooling for honeycomb board is single normal temperature air cooling, which is slow and requires a long cooling time, thereby affecting the cooling efficiency. SUMMARY

[0003] The utility model improves the above prior art, that is, the technical problem to be solved by the utility model is to provide a uniform air supply cooling device for honeycomb board preparation, which is reasonable in design, and can overcome the problem of deformation of the honeycomb board before forming and cause deformation during traditional air cooling.

[0004] In order to achieve the above purpose, the utility model adopts the technical scheme of a uniform air supply cooling device for honeycomb board preparation, which comprises a cooling box body, a conveying belt for conveying the honeycomb board from left to right along the transverse direction of the cooling box body, a normal temperature air cooling mechanism and a cold air cooling mechanism arranged in the cooling box body from left to right, and the normal temperature air cooling mechanism and the cold air cooling mechanism both supply air downward.

[0005] Further, the normal temperature air cooling mechanism comprises a first fan for supplying air from left to right, a air supply pipeline is arranged transversely on the right side of the first fan, the air supply pipeline comprises a plurality of air supply sections along its length direction, the longitudinal section area of the plurality of air supply sections gradually decreases in the air flow direction of the air supply pipeline, and an air supply port is arranged vertically through the bottom of each air supply section.

[0006] Further, the length of each air supply section is the same, and the longitudinal section area of each air supply section gradually decreases along its length direction.

[0007] Further, the size of the air supply port of each air supply section gradually decreases along the length direction of the air supply pipeline.

[0008] Further, the cold air cooling mechanism is used for sending air from top to bottom by a pair of second air fans, a conical air flow distribution plate is arranged below the pair of second air fans, a plurality of distribution holes are arranged on the conical surface of the air flow distribution plate, and a semiconductor refrigerating sheet is arranged above the pair of second air fans and is installed on the top of the cooling box body, wherein the cold end of the semiconductor refrigerating sheet is located inside the cooling box body and the hot end is located outside the cooling box body.

[0009] Further, a plurality of vertical cooling plates are fixed to the cold end of the semiconductor refrigerating sheet, and a plurality of vertical heat conduction plates are fixed to the hot end of the semiconductor refrigerating sheet, and a heat dissipation fan is installed on the top of the cooling box body and is used for blowing air from left to right, and the heat dissipation fan is opposite to the heat conduction plates.

[0010] Further, the pair of second air fans are distributed left and right, and the second air fans are horizontally arranged.

[0011] Further, the left and right side walls of the cooling box body are respectively provided with a gap for facilitating the conveying belt to pass through.

[0012] Compared with the prior art, the utility model has the following effects: the utility model discloses reasonable design, realizes the uniform air supply cooling of honeycomb plate, effectively avoids the problem that the honeycomb plate is deformed to cause the abnormal shape before forming when traditional air cooling is used, and the cooling time is effectively shortened by combining the normal temperature air cooling mode with the air cooling mode after refrigeration, and the cooling efficiency is improved. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 It is the front view structure schematic diagram of the utility model embodiment. DETAILED DESCRIPTION

[0014] The utility model will be further explained in detail in combination with the drawings and specific implementation.

[0015] In the description of the utility model, it is understood that the orientation or position relationship indicated by the terms "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like is based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the utility model, and does not indicate or imply that the indicated device or element must have a particular orientation, a particular orientation and operation, therefore, it cannot be understood as the limitation of the utility model.

[0016] As Figure 1The utility model discloses a uniform air supply cooling device of honeycomb plate preparation, including cooling box 1, the horizontal state honeycomb plate 2 of cooling box 1 is used for conveying from left to right along the transverse and is conveyed to the belt 3, the inside of cooling box 1 is provided with normal temperature air cooling mechanism 4 and cold air cooling mechanism 5 from left to right in proper order, normal temperature air cooling mechanism 4 and cold air cooling mechanism 5 all downward air supply. When working, the honeycomb plate 2 of horizontal placement is conveyed from left to right by the conveying belt 3, when the honeycomb plate 2 enters into the cooling box 1, normal temperature air cooling mechanism 4 downward output normal temperature air, utilizes normal temperature air and cools the honeycomb plate 2, when the honeycomb plate 2 is conveyed to the below of cold air cooling mechanism 5, cold air cooling mechanism 5 downward conveys cold air (that is, the air after refrigeration), utilizes cold air and cools the honeycomb plate 2. The combination of normal temperature air cooling mode and the mode of the air after refrigeration cooling effectively shortens the cooling time, and further improves the cooling efficiency.

[0017] In the embodiment, the normal temperature air cooling mechanism 4 includes a first fan 6 for air supply from left to right, a air supply pipeline 7 is provided transversely on the right side of the first fan 6, the air supply pipeline 7 includes a plurality of air supply sections 8 along the length direction thereof, in the air flow direction of the air supply pipeline 7, the longitudinal section area of the plurality of air supply sections 8 decreases in turn, and an air supply opening 9 penetrating vertically is arranged on the bottom of each air supply section 8. The length of each air supply section is the same, and the longitudinal section area of each air supply section gradually decreases along the length direction thereof. The size of the air supply opening of each air supply section decreases in turn along the length direction of the air supply pipeline. Since the cross-sectional area of the air supply pipeline gradually decreases along the air supply direction, the pressure of the air supply opening of each air supply section remains the same, achieving the purpose of uniform air supply.

[0018] In the embodiment, the cold air cooling mechanism 5 is a pair of second fans 10 for air supply from top to bottom, a wind power flow dividing plate 11 in the shape of a cone is arranged directly below the pair of second fans 10, a plurality of flow dividing holes 12 are arranged on the conical surface of the wind power flow dividing plate 11, and a semiconductor refrigeration sheet 13 is arranged on the top of the cooling box 1 directly above the pair of second fans 10, with the cold end of the semiconductor refrigeration sheet 13 located inside the cooling box 1 and the hot end located outside the cooling box 1. When working, the cold end of the semiconductor refrigeration sheet refrigerates the air directly above the pair of second fans, forming cold air, and the pair of second fans convey the cold air from top to bottom to the wind power flow dividing plate, and the cold air is uniformly conveyed downward through the flow dividing holes on the conical surface of the wind power flow dividing plate, cooling the honeycomb plate on the conveying belt.

[0019] In the embodiment, the cold end of the semiconductor refrigeration sheet 13 is fixed with a plurality of vertically arranged cold conducting plates 14, and the hot end of the semiconductor refrigeration sheet 13 is fixed with a plurality of vertically arranged heat conducting plates 15; the top of the cooling box body 1 is provided with a heat dissipation fan 16 for blowing from left to right, and the heat dissipation fan 16 is opposite to the position of the heat conducting plate 15.

[0020] In the embodiment, the second fan 10 is horizontally arranged.

[0021] In the embodiment, the left and right side walls of the cooling box body 1 are respectively provided with a left and right side wall 17 for facilitating the conveying belt to pass through.

[0022] If the utility model discloses or relates to the parts or structural members fixedly connected with each other, then, except for another declaration, fixed connection can be understood as: detachably fixed connection (for example, using bolt or screw connection), and also can be understood as: non-detachable fixed connection (for example, riveting, welding), of course, the fixed connection with each other can also be replaced by an integral structure (for example, using casting process integral forming is manufactured) (obviously, except for integral forming process).

[0023] In addition, the terms used to represent the positional relationship or shape in any of the technical solutions disclosed in the utility model above include the approximate, similar or close state or shape, except for another declaration.

[0024] Any component provided by the utility model can be assembled by a plurality of separate components, or can be a separate component manufactured by integral forming process.

[0025] Finally, it should be explained that: the above embodiments are only used to illustrate the technical solutions of the utility model and not to limit them; although the utility model has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that: the specific embodiments of the utility model can still be modified or some technical features can be replaced by equivalents; without departing from the spirit of the technical solutions of the utility model, they should be covered in the technical solution range of the utility model claimed by the utility model.

Claims

1. A uniform air supply cooling device for honeycomb panel production, characterized by: The cooling box, the conveying belt for conveying the honeycomb plate from left to right, the normal-temperature air cooling mechanism and the cold air cooling mechanism arranged in sequence from left to right inside the cooling box, and the downward air supply of the normal-temperature air cooling mechanism and the cold air cooling mechanism.

2. A uniform air supply cooling device for a honeycomb panel according to claim 1, characterized in that: The normal-temperature air cooling mechanism comprises a first air blower for air supply from left to right, and a air supply duct is arranged laterally on the right side of the first air blower, the air supply duct comprises a plurality of air supply sections along the length direction thereof, the longitudinal sectional area of the plurality of air supply sections decreases in sequence in the air flow direction of the air supply duct, and an air supply opening is arranged on the bottom of each air supply section and penetrates vertically.

3. A device for uniform air supply cooling of a honeycomb panel prepared according to claim 2, characterized in that: The length of each air supply section is the same, and the longitudinal sectional area of each air supply section gradually decreases along the length direction thereof.

4. A device for uniform air supply cooling of a honeycomb panel according to claim 3, characterized in that: The size of the air supply opening of each air supply section decreases in sequence along the length direction of the air supply duct.

5. A uniform air supply cooling device for honeycomb panel manufacturing according to claim 1, characterized in that: The cold air cooling mechanism comprises a pair of second air blowers for air supply from top to bottom, a conical air power shunt plate is arranged directly below the pair of second air blowers, a plurality of shunt holes are arranged on the conical surface of the air power shunt plate, a semiconductor refrigeration sheet is arranged directly above the pair of second air blowers and is mounted on the top of the cooling box, the cold end of the semiconductor refrigeration sheet is located inside the cooling box, and the hot end of the semiconductor refrigeration sheet is located outside the cooling box.

6. A device for uniform air supply cooling of a honeycomb panel according to claim 5, characterized in that: A plurality of vertically arranged cold-lead plates are fixed to the cold end of the semiconductor refrigeration sheet, and a plurality of vertically arranged heat-conducting plates are fixed to the hot end of the semiconductor refrigeration sheet; a heat-dissipation fan for air blowing from left to right is mounted on the top of the cooling box, and the heat-dissipation fan is opposite to the heat-conducting plates.

7. A device for uniform air supply cooling of a honeycomb panel according to claim 5, characterized in that: The pair of second air blowers are distributed left and right, and the second air blowers are horizontally arranged.

8. A uniform air supply cooling device for a honeycomb panel according to claim 1, wherein: Respective left and right side walls of the cooling box are provided with a clearance opening for facilitating the penetration of the conveying belt.