Testing device for semiconductor device
By embedding conductive metal blocks in the cover and base plates of the test device, the contact area and heat dissipation performance are increased, which solves the problem of insufficient contact pins in the prior art, improves the current carrying capacity and heat capacity of the semiconductor device test device, and avoids damage to device pins and contact pins.
Patent Information
- Application Number
- CN202422868658.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-25
- Publication Date
- 2025-11-25
- Estimated Expiration
- 2034-11-25
AI Technical Summary
The limited number of contact pins in existing semiconductor device testing equipment results in insufficient current carrying capacity and thermal capacity, making it prone to burnout or breakdown during high-voltage and high-current testing.
Conductive metal blocks are embedded in the cover and base plates of the test device to increase the contact area. Through the electrical contact between the cover and base plate metal blocks and the device pins and printed circuit boards, the contact area and heat dissipation performance are improved.
The current carrying capacity and thermal capacity of the test device have been enhanced, parasitic capacitance has been reduced, and device pins and contact pins have been protected from burning or breakdown during high voltage and high current testing.
Smart Images
Figure CN223597818U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the field of semiconductor, especially relate to the testing arrangement for semiconductor device. BACKGROUND
[0002] As part of the manufacturing process of semiconductor devices, it is necessary to use a testing arrangement to test the semiconductor devices to evaluate their performance. During testing, the device pins of the semiconductor devices are electrically connected to the contact pins of the testing arrangement.
[0003] Figure 1 An exploded view of a portion of a prior art testing arrangement 100 is shown in FIG. 1. Figure 1 As shown in FIG. 1, the testing arrangement 100 includes a socket cover plate 101, a socket base plate 102, and a plurality of contact pins 103 disposed in the socket cover plate 101 and the socket base plate 102. Figure 2 A perspective view of the prior art testing arrangement 100 in relation to a semiconductor device 200 is shown in FIG. 2, wherein the socket cover plate 101, the socket base plate 102, and the plurality of contact pins 103 are combined to form a socket. Figure 2 As shown in FIG. 2, the testing arrangement 100 further includes a printed circuit board 104 located below the socket base plate 102. The socket cover plate 101 and the socket base plate 102 are typically made of an engineering plastic material.
[0004] Figure 3 A cross-sectional view of the testing of the semiconductor device 200 using the prior art testing arrangement 100 is shown in FIG. 3. Figure 3 As shown in FIG. 3, two contact pins 103 are shown. When testing the semiconductor device 200 using the prior art testing arrangement 100, the contact ends 103a, 103b of each contact pin 103 are in contact with the device pins 201 of the semiconductor device 200, which provides fewer contact points, affecting the current-carrying capacity and heat capacity of the testing arrangement 100. During high-voltage and high-current testing, the device pins 201 or the testing arrangement 100 can be burned out and broken down due to instantaneous high voltage or high current, and the contact pins 103 therein bear high parasitic inductance and increase the risk of burning out the contact pins 103.
[0005] In addition, due to the limited test space, more contact pins 103 cannot be arranged to distribute the current, and therefore, as the temperature of the test area rises, the device pins 201 or the contact pins 103 can be burned out. SUMMARY
[0006] To solve the above problems in the prior art, the utility model provides a testing arrangement for semiconductor devices, which comprises:
[0007] a cover plate, the cover plate being provided with at least one first cover plate opening, each first cover plate opening accommodating a corresponding first cover plate metal block;
[0008] a bottom plate, the bottom plate being provided with at least one first bottom plate opening, each first bottom plate opening accommodating a corresponding first bottom plate metal block;
[0009] at least one contact pin provided in at least one of the first cover plate metal block and the first bottom plate metal block;
[0010] a printed circuit board located below the bottom plate;
[0011] wherein, when the semiconductor device is tested by the testing device, a device pin of the semiconductor device is in electrical contact with the contact end of each contact pin, at least one of the first cover plate metal blocks, and the connection portion of each contact pin, at least one of the first bottom plate metal blocks is in electrical contact with the printed circuit board.
[0012] Preferably, the at least one contact pin comprises a plurality of groups of contact pins, each group of contact pins comprising a first contact pin and a second contact pin,
[0013] when the semiconductor device is tested by the testing device, a device pin of the semiconductor device is in electrical contact with the contact end of each first contact pin, the contact end of each second contact pin, at least one of the first cover plate metal blocks, and the connection portion of each first contact pin, the connection portion of each second contact pin, at least one of the first bottom plate metal blocks is in electrical contact with the printed circuit board.
[0014] Preferably, each of the first cover plate metal blocks is provided with a plurality of cover plate metal block openings, the contact end passing through a corresponding cover plate metal block opening so as to be in electrical contact with the device pin;
[0015] each of the first bottom plate metal blocks is provided with a plurality of bottom plate metal block openings, the connection portion passing through a corresponding bottom plate metal block opening so as to be in electrical contact with the printed circuit board.
[0016] Preferably, the cover plate is provided with an elongated first slot, the at least one first cover plate opening is located at one side of the first slot, the first fixing portion of each first contact pin is inserted into the first slot, thereby fixing a plurality of first contact pins in the cover plate,
[0017] wherein the cover plate is further provided with at least one second cover plate opening located at the other side of the first slot, the at least one second cover plate opening corresponds to the at least one first cover plate opening one-to-one, each second cover plate opening accommodates a corresponding second cover plate metal block,
[0018] wherein, when testing the semiconductor device with the testing device, the device pins are further in electrical contact with at least one second lid plate metal block, and the plurality of first contact pins are further in electrical contact with corresponding second lid plate metal blocks.
[0019] Preferably, the bottom plate is provided with an elongated second slot, the at least one first bottom plate opening is located at one side of the second slot, and the second fixing portion of each second contact pin is inserted into the second slot, thereby fixing the plurality of second contact pins in the bottom plate,
[0020] wherein the bottom plate is further provided with at least one second bottom plate opening located at the other side of the second slot, the at least one second bottom plate opening corresponds to the at least one first bottom plate opening one by one, and each second bottom plate opening accommodates a corresponding second bottom plate metal block,
[0021] wherein, when testing the semiconductor device with the testing device, the plurality of second contact pins are further in electrical contact with corresponding second bottom plate metal blocks.
[0022] Preferably, the first lid plate metal blocks and the first bottom plate metal blocks are configured to match the structure of each contact pin so as to accommodate and contact the contact pin.
[0023] Preferably, the second lid plate metal blocks are configured to match the structure of each contact pin so as to accommodate and contact the contact pin.
[0024] Preferably, the upper surface of each first lid plate metal block and each second lid plate metal block is flush with the upper surface of the lid plate, and the lower surface of each first lid plate metal block and each second lid plate metal block is flush with the lower surface of the lid plate.
[0025] Preferably, the lower surface of each first bottom plate metal block is flush with the lower surface of the bottom plate, and the upper surface of each first bottom plate metal block and each second bottom plate metal block is flush with the upper surface of the bottom plate.
[0026] Preferably, the first lid plate metal blocks, the first bottom plate metal blocks, the second lid plate metal blocks, and the second bottom plate metal blocks are copper alloy blocks.
[0027] Preferably, the lid plate and / or the bottom plate are made of a metal material.
[0028] Preferably, the metal material is a copper alloy material.
[0029] In the utility model, the first cover plate metal piece which is conductive is embedded in the cover plate, and the first bottom plate metal piece which is conductive is embedded in the bottom plate, when testing the semiconductor device by using the testing device, the device pin not only is in electrical contact with the contact part of the contact pin, but also is in electrical contact with the first cover plate metal piece, and the connecting part of the contact pin and the first bottom plate metal piece are in electrical contact with the printed circuit board. Because the surface area of the metal piece made of copper alloy material is increased, the contact area of the contact pin, the device pin and the printed circuit board is increased, the current carrying capacity and the heat capacity capacity of the testing device are improved, and the parasitic capacitance is reduced, therefore the performance of the testing device is improved.
[0030] In the utility model, the second cover plate metal piece which is conductive is further embedded in the cover plate, and the second bottom plate metal piece which is conductive is embedded in the bottom plate, the current carrying capacity and the heat capacity capacity can be further improved, the parasitic capacitance can be reduced, and therefore the performance of the testing device is further improved.
[0031] In the utility model, the metal piece made of copper alloy material has excellent heat absorption performance, which helps better heat dissipation between the device pin and the contact pin, even if instantaneous high voltage or large current appears, the device pin or the testing device will not be burned out or broken down.
[0032] In the utility model, the cover plate and / or the bottom plate can be made of conductive metal material, so that the heat dissipation effect is further improved. Other purposes and advantages will be more fully apparent from the following disclosure and the appended claims. BRIEF DESCRIPTION OF DRAWINGS
[0033] Figure 1 A disassembly view of part of the prior testing device is shown.
[0034] Figure 2 A position relation view of the prior testing device and the semiconductor device is shown.
[0035] Figure 3 A cross section when testing the semiconductor device by using the prior testing device is shown.
[0036] Figure 4 A disassembly view of part of the testing device for testing the semiconductor device according to the utility model embodiment is shown.
[0037] Figure 5 A position relation view of the testing device and the semiconductor device according to the utility model embodiment is shown.
[0038] Figure 6 A cross section when testing the semiconductor device by using the testing device according to the utility model embodiment is shown.
[0039] REFERENCE NUMERALS
[0040] Existing test device 100
[0041] Socket cover plate 101
[0042] Socket bottom plate 102
[0043] Contact pin 103
[0044] Semiconductor device 200
[0045] Device pin 201
[0046] Test device 40
[0047] Cover plate 41
[0048] Bottom plate 42
[0049] Contact pin 43
[0050] First cover plate opening 411, 412
[0051] First bottom plate opening 421, 422
[0052] First cover plate metal block 441, 442
[0053] First bottom plate metal block 451, 452
[0054] Semiconductor device 50
[0055] Device pin 51
[0056] Printed circuit board 44
[0057] First contact pin 431
[0058] Second contact pin 432
[0059] First contact end 4311
[0060] First fixing part 4312
[0061] First connecting part 4313
[0062] Second contact end 4321
[0063] Second fixing part 4322
[0064] Second connecting part 4323
[0065] Cover plate metal block opening 4411, 4421
[0066] Bottom plate metal block opening 4511, 4521
[0067] First slot 413
[0068] Second cover plate openings 414, 415
[0069] Second cover plate metal blocks 443, 444
[0070] Second slots 423
[0071] Second bottom plate openings 424, 425
[0072] Second bottom plate metal blocks 453, 454 DETAILED DESCRIPTION
[0073] Embodiments of the present application will be described below with reference to the accompanying drawings.
[0074] Exemplary embodiments are described herein below with reference to the accompanying drawings. In the following description, for the purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of one or more embodiments. It can be evident, however, that the present application can be practiced without these specific details. In other instances, well-known structures and devices are not shown or described in order to avoid obscuring the description of the embodiments of the present application.
[0075] The terminology used in the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and / or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.
[0076] It should be noted that the following detailed description is directed to contact pins for a test apparatus for semiconductor devices and test apparatuses, and is not limited to any particular size or configuration, but rather a variety of sizes and configurations are within the general scope of the following description.
[0077] Figure 4 An exploded view of a portion of a test apparatus 40 for testing semiconductor devices according to an embodiment of the present application is shown. As shown, the test apparatus 40 includes a cover plate 41, a bottom plate 42, and at least one contact pin 43. Figure 4
[0078] The cover plate 41 has at least one first cover plate opening disposed thereon. In the present embodiment, as shown, the cover plate 41 has a first cover plate opening 411 disposed thereon. Figure 4 As shown, the cover plate 41 is provided with two first cover plate openings 411, 412. Each of the first cover plate openings 411, 412 accommodates a corresponding first cover plate metal block. For example, the first cover plate opening 411 accommodates a first cover plate metal block 441, and the other first cover plate opening 412 accommodates another first cover plate metal block 442.
[0079] The bottom plate 42 is provided with at least one first bottom plate opening. In this embodiment, as shown in the figure, the bottom plate 42 is provided with two first bottom plate openings 421, 422. Each of the first bottom plate openings 421, 422 accommodates a corresponding first bottom plate metal block. For example, the first bottom plate opening 421 accommodates a first bottom plate metal block 451, and the other first bottom plate opening 422 accommodates another first bottom plate metal block 452. Figure 4
[0080] The at least one contact pin 43 is arranged in the first cover plate metal blocks 441, 442 and the first bottom plate metal blocks 451, 452.
[0081] Figure 5 A position relationship diagram of the test device 40 and the semiconductor device 50 according to an embodiment of the present application is shown. Figure 5 A state diagram of the cover plate 41, the bottom plate 42, the at least one contact pin 43, the first cover plate metal blocks 441, 442, and the first bottom plate metal blocks 451, 452 combined together to form a socket is shown. As shown in the figure, Figure 5 The test device 40 further includes a printed circuit board 44 located below the bottom plate 42. The semiconductor device 50 is located above the cover plate 41.
[0082] Figure 6 A cross section of the test device 40 when testing the semiconductor device 50 according to an embodiment of the present application is shown. The following will be described in detail in combination with Figures 4-6
[0083] The at least one contact pin 43 includes a plurality of groups of contact pins. As shown in the figure, in this embodiment, there are 12 groups of contact pins, of which 6 groups of contact pins are arranged in the first cover plate metal block 441 and the first bottom plate metal block 451, and the other 6 groups of contact pins are arranged in the other first cover plate metal block 442 and the other first bottom plate metal block 452. Figure 4 As shown in the figure, each group of contact pins includes a first contact pin 431 and a second contact pin 432. The first contact pin 431 includes a first contact end 4311, a first fixing portion 4312, and a first connecting portion 4313, and the second contact pin 432 includes a second contact end 4321, a second fixing portion 4322, and a second connecting portion 4323.
[0084] Figure 6
[0085] When the semiconductor device 50 is tested by the testing device 40, the device pins 51 of the semiconductor device 50 are electrically contacted with the contact ends of each of the contact pins 43, the at least one first cover plate metal block, and the connection portions of each of the contact pins 43, the at least one first bottom plate metal block are electrically contacted with the printed circuit board 44.
[0086] In the present embodiment, as shown in Figure 6 When the semiconductor device 50 is tested by the testing device 40, the device pins 51 of the semiconductor device 50 are electrically contacted with the first contact ends 4311 of each of the first contact pins 431, the second contact ends 4321 of each of the second contact pins 432, the first cover plate metal blocks 441, 442, and the first connection portions 4313 of each of the first contact pins 431, the second connection portions 4323 of each of the second contact pins 432, the first bottom plate metal blocks 451, 452 are electrically contacted with the printed circuit board 44.
[0087] Further, each of the first cover plate metal blocks is provided with a plurality of cover plate metal block openings, and the contact ends pass through the corresponding cover plate metal block openings so as to be electrically contacted with the device pins. Each of the first bottom plate metal blocks is provided with a plurality of bottom plate metal block openings, and the connection portions pass through the corresponding bottom plate metal block openings so as to be electrically contacted with the printed circuit board.
[0088] In particular, as shown in Figure 4 For example, the first cover plate metal block 441 is provided with a plurality of cover plate metal block openings 4411, and the contact ends (for example, the first contact ends 4311 and the second contact ends 4321 as shown in Figure 6 The first contact ends 4311 and the second contact ends 4321 of the contact pins 43 pass through the corresponding cover plate metal block openings 4411 so as to be electrically contacted with the device pins 51. The first bottom plate metal block 451 is provided with a plurality of bottom plate metal block openings 4511, and the connection portions (for example, the first connection portions 4313 and the second connection portions 4323 as shown in Figure 6 The first connection portions 4313 and the second connection portions 4323 of the contact pins 43 pass through the corresponding bottom plate metal block openings 4511 so as to be electrically contacted with the printed circuit board 44.
[0089] Similarly, the other first cover plate metal block 442 is provided with a plurality of cover plate metal block openings 4421, and the other first bottom plate metal block 452 is provided with a plurality of bottom plate metal block openings 4521.
[0090] It can be understood that the two contact ends of a group of the contact pins 43 pass through the same cover plate metal block opening, and the two connection portions of a group of the contact pins 43 pass through the same bottom plate metal block opening.
[0091] Referring to Figure 4 , the cover plate 41 is provided with an elongated first slot 413, and the first cover plate openings 411, 412 are located at one side of the first slot 413. As shown in Figure 5 andFigure 6 As shown, the first fixed part 4312 of the first contact pin 431 is inserted into the first slot 413, thereby fixing the first contact pin 431 in the cover plate 41.
[0092] Preferably, further at least one second cover plate opening is provided on the cover plate 41, which is located on the other side of the first slot 413, for example, two second cover plate openings 414, 415 are provided in the present embodiment. Figure 4 As shown, two second cover plate openings 414, 415 are provided in the present embodiment. The second cover plate openings 414, 415 are one-to-one corresponding to the first cover plate openings 411, 412, and each of the second cover plate openings 414, 415 accommodates a corresponding second cover plate metal block. For example, the second cover plate opening 414 accommodates a second cover plate metal block 443, and the other second cover plate opening 415 accommodates another second cover plate metal block 444.
[0093] As shown, when testing the semiconductor device 50 by using the test device 40, the device pin 51 further electrically contacts the second cover plate metal blocks 443, 444, and each of the first contact pins 431 further electrically contacts a corresponding second cover plate metal block 443, 444. Figure 6 As shown, the bottom plate 42 is provided with an elongated second slot 423, and the first bottom plate openings 421, 422 are located on one side of the second slot 423. The second fixed part 4322 (see
[0094] ) of the second contact pin 432 is inserted into the second slot 423, thereby fixing the second contact pin 432 in the bottom plate 42. Figure 4 Figure 6 As shown, the bottom plate 42 is provided with an elongated second slot 423, and the first bottom plate openings 421, 422 are located on one side of the second slot 423. The second fixed part 4322 (see
[0095] Preferably, further at least one second bottom plate opening is provided on the bottom plate 42, which is located on the other side of the second slot 423, for example, two second bottom plate openings 424, 425 are provided in the present embodiment. The second bottom plate openings 424, 425 are one-to-one corresponding to the first bottom plate openings 421, 422, and each of the second bottom plate openings 424, 425 accommodates a corresponding second bottom plate metal block. For example, the second bottom plate opening 424 accommodates a second bottom plate metal block 453, and the other second bottom plate opening 425 accommodates another second bottom plate metal block 454.
[0096] As shown, when testing the semiconductor device 50 by using the test device 40, each of the second contact pins 432 further electrically contacts a corresponding second bottom plate metal block 453, 454. Figure 6 As shown, when testing the semiconductor device 50 by using the test device 40, each of the second contact pins 432 further electrically contacts a corresponding second bottom plate metal block 453, 454.
[0097] Figure 4 , Figure 6 As shown, the first cover plate metal blocks 441, 442 and the first bottom plate metal blocks 451, 452 are configured to match the structure of each contact pin 43 so as to accommodate and contact the contact pins 43. The second cover plate metal blocks 443, 444 are configured to match the structure of each contact pin 43 so as to accommodate and contact the contact pins 43.
[0098] It can be understood that, as shown in Figure 5 、 Figure 6 each first cover plate metal block 441, 442 and each second cover plate metal block 443, 444 has an upper surface flush with the upper surface of the cover plate 41, and each first cover plate metal block 441, 442 and each second cover plate metal block 443, 444 has a lower surface flush with the lower surface of the cover plate 41. In this way, the first cover plate metal blocks 441, 442 and the second cover plate metal blocks 443, 444 are embedded in the cover plate 41, thereby ensuring that the contact portions of each contact pin 43 can be in electrical contact with the device pins 51.
[0099] each first bottom plate metal block 451, 452 has a lower surface flush with the lower surface of the bottom plate 42, and each first bottom plate metal block 451, 452 and each second bottom plate metal block 453, 454 has an upper surface flush with the upper surface of the bottom plate 42. In this way, the first bottom plate metal blocks 451, 452 and the second bottom plate metal blocks 453, 454 are embedded in the bottom plate 42, thereby the connection portions of each contact pin can be in electrical contact with the printed circuit board 44.
[0100] Preferably, the first cover plate metal blocks 441, 442, the first bottom plate metal blocks 451, 452, the second cover plate metal blocks 443, 444, and the second bottom plate metal blocks 453, 454 are copper alloy blocks.
[0101] Preferably, the cover plate 41 and / or the bottom plate 42 are made of a metal material, such as a copper alloy material.
[0102] In the utility model, the conductive first cover plate metal blocks 441, 442 are embedded in the cover plate 41, and the conductive first bottom plate metal blocks 451, 452 are embedded in the bottom plate 42. When the semiconductor device 50 is tested by the test device 40, the device pins 51 are not only in electrical contact with the contact portions of the contact pins, but also in electrical contact with the first cover plate metal blocks, and the connection portions of the contact pins and the first bottom plate metal blocks are in electrical contact with the printed circuit board. Since the surface area of the metal blocks of the copper alloy material is increased, the contact area of the contact pins, the device pins, and the printed circuit board is increased, the current-carrying capacity and the heat capacity of the test device are improved, and the parasitic capacitance is reduced, thereby improving the performance of the test device.
[0103] In the utility model, the second cover plate metal block 443, 444 of conducting is further embedded in the cover plate 41, and the second bottom plate metal block 453, 454 of conducting is embedded in the bottom plate 42, so that the through-flow capacity and the heat capacity capacity can be further improved, the parasitic capacitance is reduced, and the performance of the testing device is further improved.
[0104] In the utility model, the metal block made of copper alloy material has excellent heat absorption performance, helps better heat dissipation between the device pin and the contact pin, and even when instantaneous high voltage or large current appears, the device pin or the testing device will not be burnt out or broken down.
[0105] In the utility model, the cover plate and / or the bottom plate can be made of a metal material of conducting, so that the heat dissipation effect is further improved.
[0106] Although several particularly preferred embodiments of the utility model have been described and illustrated, it will be apparent to those skilled in the art that various changes and modifications can be made without departing from the scope of the utility model. Therefore, the following claims are intended to include such changes, modifications and applications within the scope of the utility model.
Claims
1. A testing apparatus for semiconductor devices, characterized in that, The testing apparatus includes: A cover plate, wherein at least one first cover plate opening is provided on the cover plate, and each first cover plate opening accommodates a corresponding first cover plate metal block; A base plate, wherein at least one first base plate opening is provided on the base plate, and each first base plate opening accommodates a corresponding first base plate metal block; At least one contact pin is disposed in at least one first cover plate metal block and at least one first base plate metal block; A printed circuit board is located below the base plate; When the semiconductor device is tested using the testing device, the device pins of the semiconductor device are in electrical contact with the contact ends of each contact pin and at least one of the first cover metal blocks, and the connection portion of each contact pin and at least one of the first base metal blocks are in electrical contact with the printed circuit board.
2. The testing apparatus according to claim 1, characterized in that, The at least one contact pin includes multiple sets of contact pins, each set of contact pins including a first contact pin and a second contact pin. When the semiconductor device is tested using the test apparatus, the device pins of the semiconductor device are in electrical contact with the contact ends of each first contact pin, each second contact pin, and at least one first cover metal block, and the connection portions of each first contact pin, each second contact pin, and at least one first base metal block are in electrical contact with the printed circuit board.
3. The testing apparatus according to claim 2, characterized in that, Each of the first cover metal blocks is provided with multiple cover metal block openings, and the contact end passes through the corresponding cover metal block opening to make electrical contact with the device pins; Each of the first base plate metal blocks has multiple base plate metal block openings, and the connecting part passes through the corresponding base plate metal block opening to make electrical contact with the printed circuit board.
4. The testing apparatus according to claim 2, characterized in that, The cover plate is provided with an elongated first slot, and at least one opening of the first cover plate is located on one side of the first slot. The first fixing part of each first contact pin is inserted into the first slot, thereby fixing multiple first contact pins in the cover plate. The cover plate is further provided with at least one second cover plate opening located on the other side of the first slot. The at least one second cover plate opening corresponds one-to-one with the at least one first cover plate opening, and each second cover plate opening accommodates a corresponding second cover plate metal block. When the semiconductor device is tested using the testing device, the device pins are further electrically contacted with at least one second cover metal block, and the plurality of first contact pins are further electrically contacted with the corresponding second cover metal blocks.
5. The testing apparatus according to claim 4, characterized in that, The base plate is provided with an elongated second slot, and at least one opening of the first base plate is located on one side of the second slot. The second fixing part of each second contact pin is inserted into the second slot, thereby fixing multiple second contact pins in the base plate. The base plate is further provided with at least one second base plate opening located on the other side of the second slot. The at least one second base plate opening corresponds one-to-one with the at least one first base plate opening, and each second base plate opening accommodates a corresponding second base plate metal block. When the semiconductor device is tested using the testing device, the plurality of second contact pins further make electrical contact with the corresponding second base metal block.
6. The testing apparatus according to claim 1, characterized in that, The first cover plate metal block and the first base plate metal block are configured to match the structure of each contact pin in order to accommodate and contact the contact pin.
7. The testing apparatus according to claim 4, characterized in that, The second cover metal block is configured to match the structure of each contact pin in order to accommodate and contact the contact pin.
8. The testing apparatus according to claim 4, characterized in that, The upper surface of each of the first cover plate metal blocks and each of the second cover plate metal blocks is flush with the upper surface of the cover plate, and the lower surface of each of the first cover plate metal blocks and each of the second cover plate metal blocks is flush with the lower surface of the cover plate.
9. The testing apparatus according to claim 4, characterized in that, The lower surface of each of the first base plate metal blocks is flush with the lower surface of the base plate, and the upper surface of each of the first base plate metal blocks and each of the second base plate metal blocks is flush with the upper surface of the base plate.
10. The testing apparatus according to claim 5, characterized in that, The first cover plate metal block, the first bottom plate metal block, the second cover plate metal block, and the second bottom plate metal block are copper alloy blocks.