Memory bank high and low temperature measurement channel and temperature measurement device

Abstract

The utility model provides a memory bank high and low temperature temperature measurement channel and temperature measurement device, the temperature measurement channel comprises a base for fixing a chip and a cover plate matched with the base, at least one heat dissipation channel is arranged in the cover plate, each heat dissipation channel is divided into a plurality of heat dissipation areas, each heat dissipation area is divided into a plurality of heat dissipation unit cavities by a plurality of partition plates, and the partition plates are arranged in the heat dissipation unit cavities. A plurality of slots for fixing the memory bank are formed in the base, and the heat dissipation units are in one-to-one correspondence with the slots; the heat dissipation assembly comprises a heat dissipation fan, the heat dissipation fan is communicated with the heat dissipation channel through a communication pipeline, the communication pipeline is provided with a plurality of flashboard assemblies in one-to-one correspondence with the heat dissipation areas, and the heat dissipation assembly further comprises a controller which is electrically connected with driving mechanisms of the flashboard assemblies and the temperature sensors in the heat dissipation areas.

Description

TECHNICAL FIELD

[0001] The application relates to the field of memory bar testing, in particular to a memory bar high-low temperature measuring channel and a temperature measuring device. BACKGROUND

[0002] In the prior art, when a memory bar is subjected to high-low temperature testing, the memory bar needs to be heated and cooled respectively to measure the state of the memory bar at high and low temperatures, so heating and cooling devices are needed. The current heating device uses a base to paste a heating cloth for heating, and the heating stability is poor. The cooling device usually uses a cooling fan. Since multiple memory bars need to be cooled at the same time, and the volume of a single memory bar is small, the memory bar cannot be matched with each fan one by one, and usually one fan needs to be matched with multiple memory bars. However, due to the limitation of the size, a large-power and large-size cooling fan cannot be used, so the stability of cooling is poor.

[0003] Therefore, those skilled in the art need to improve the existing temperature measuring device to overcome the above defects. CONTENT OF THE INVENTION

[0004] The main purpose of the application is to provide a memory bar high-low temperature measuring channel and a temperature measuring device, which divides the cooling channel into multiple areas, and independently controls the temperature of each area, so that the stability of cooling and heating is good.

[0005] To achieve the above purpose, in a first aspect, the application provides a memory bar high-low temperature measuring channel, which comprises a base for fixing a chip, a cover plate matched with the base, at least one cooling channel arranged in the cover plate, each cooling channel is divided into multiple cooling areas, each cooling area is divided into multiple cooling unit cavities by multiple partition plates, the base is provided with multiple insertion slots for fixing memory bars, and the cooling units are matched with the insertion slots one by one.

[0006] The application further comprises a cooling assembly, the cooling assembly comprises a cooling fan, the cooling fan is connected with the cooling channel through a communication pipeline, the communication pipeline is provided with multiple gate plate assemblies matched with the cooling areas one by one, and the application further comprises a controller, which is electrically connected with the driving mechanism of the gate plate assembly and the temperature sensor in the cooling area.

[0007] Optionally, the gate plate assembly comprises a gate plate slidingly arranged on the communication pipeline, and a power device for driving the gate plate to slide.

[0008] Optionally, the cover plate is fixedly provided with a mounting rack, the mounting rack is vertically and fixedly provided with a guide rail, and the gate plate is slidingly matched with the guide rail.

[0009] Optionally, the power device is an electric sliding table, a cylinder body of the electric sliding table is fixedly arranged on the mounting frame, and a piston rod of the electric sliding table is fixedly connected with the upper end of the gate plate.

[0010] Optionally, the heat dissipation channels are multiple, and each of the heat dissipation channels corresponds to one of the heat dissipation assemblies.

[0011] Optionally, the communication pipelines are multiple, and each of the communication pipelines corresponds to one of the heat dissipation channels; or the communication pipeline is an integral structure, and the communication pipeline is divided into multiple connection unit channels by a partition plate, and each of the connection unit channels corresponds to one of the heat dissipation channels.

[0012] Optionally, the temperature sensor is a temperature sensor provided by the memory bank.

[0013] In order to achieve the above purpose, in a first aspect, the application provides a high and low temperature measuring device for a memory bank, which comprises a base for fixing a chip, a cover plate matched with the base, at least one heat dissipation channel arranged in the cover plate, each of the heat dissipation channels being divided into multiple heat dissipation areas, each of the heat dissipation areas being divided into multiple heat dissipation unit cavities by multiple partition plates, multiple insertion slots for fixing the memory bank being arranged on the base, the heat dissipation units corresponding to the insertion slots one by one, and a heating device arranged in the base for heating the chip.

[0014] The device further comprises a heat dissipation assembly, the heat dissipation assembly comprising a heat dissipation fan, the heat dissipation fan being connected with the heat dissipation channel through a communication pipeline, multiple gate plate assemblies corresponding to the heat dissipation areas being arranged on the communication pipeline, and a controller being electrically connected with a driving mechanism of the gate plate assembly and a temperature sensor in the heat dissipation area.

[0015] The base and the cover plate are rotationally or slidably arranged, and a driving mechanism for driving the cover plate to move is further arranged between the base and the cover plate.

[0016] Optionally, the base and the cover plate are rotationally arranged through a rotating shaft, the driving mechanism is a motor for driving the rotating shaft to rotate, the rotating shaft is fixedly connected with the cover plate, and both ends of the rotating shaft are connected with the base through rotating bearings, respectively.

[0017] Optionally, the heating device is a semiconductor refrigeration sheet.

[0018] The utility model provides a kind of memory bank high-low temperature temperature measurement channel and temperature measuring device, compared with prior art, its beneficial effect is, first set multiple heat dissipation channels, each heat dissipation channel corresponds a heat dissipation fan, secondly each heat dissipation channel is divided into multiple heat dissipation zones, each heat dissipation zone is independently temperature-controlled by controller, gate assembly and temperature sensor, so that the temperature stability of each heat dissipation zone is guaranteed. BRIEF DESCRIPTION OF DRAWINGS

[0019] The drawings constituting a part of this application are used to provide further understanding of the application, so that other features, objects and advantages of the application become more apparent.The illustrative embodiment drawings of the present application and its description are used to explain the present application, and do not constitute undue limitation on the present application.In the drawings:

[0020] Figure 1 is temperature measurement channel schematic Figure One ;

[0021] Figure 2 is temperature measurement channel schematic Figure Two ;

[0022] Figure 3 is temperature measurement device schematic Figure One ;

[0023] Figure 4 is temperature measurement device schematic Figure Two .

[0024] Wherein: 1, base, 2, cover plate, 3, heat dissipation fan, 4, communication pipeline, 5, gate, 6, mounting bracket, 7, guide rail, 8, electric sliding table, 9, heat dissipation channel, 10, memory bank, 11, baffle, 12, motor; 13, shaft. DETAILED DESCRIPTION

[0025] In order to make the person in the art better understand the present application scheme, the technical scheme in the present application embodiment will be described clearly and completely below, combined with the drawings in the present application embodiment, obviously, the described embodiment is only a part of the embodiment of the present application, not all the embodiments.Based on the embodiment in the present application, all other embodiments obtained by the person skilled in the art without doing creative work should belong to the scope of the present application.

[0026] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above drawings are used to distinguish similar objects, and do not necessarily indicate a specific order or sequence. It should be understood that the data thus used can be interchanged under appropriate circumstances, so that the embodiments of the present application described herein can be implemented. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion, for example, a process, method, system, product or device including a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but can include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0027] In the present application, the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. These terms are mainly used to better describe the present application and its embodiments, and are not intended to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0028] In addition, in addition to indicating the orientation or positional relationship, the above-mentioned partial terms can also be used to indicate other meanings, for example, the term "upper" can also be used to indicate a certain dependent relationship or connection relationship in some cases. For those skilled in the art, the specific meaning of these terms in the present application can be understood according to the specific circumstances.

[0029] In addition, the meaning of the term "a plurality of" should be two and more than two.

[0030] It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict. The present application will be described in detail below with reference to the drawings and in combination with the embodiments.

[0031] As shown in Figures 1-2 A memory stick 10 high and low temperature measuring channel, including a base 1 for fixing the chip, a cover plate 2 matched with the base 1, at least one heat dissipation channel 9 is arranged in the cover plate 2, each heat dissipation channel 9 is divided into a plurality of heat dissipation areas, each heat dissipation area is divided into a plurality of heat dissipation unit cavities by a plurality of partition plates 11, a plurality of insertion slots for fixing the memory stick 10 are arranged on the base 1, and the heat dissipation unit corresponds to the insertion slot one by one;

[0032] It also includes a heat dissipation component, which includes a cooling fan 3. The cooling fan 3 is connected to the heat dissipation channel 9 through a connecting pipe. The connecting pipe is provided with a plurality of gate plate 5 components that correspond one-to-one with the heat dissipation area. It also includes a controller, which is electrically connected to the drive mechanism of the gate plate 5 components and the temperature sensor in the heat dissipation area.

[0033] Working principle: First, the memory module 10 is manually inserted into the corresponding slot on the base 1, and then the cover plate 2 is closed for temperature control. When heat dissipation is required, the corresponding gate plate 5 component of the heat dissipation area is opened, and heat dissipation is carried out by the cooling fan 3. The memory module 10 has a built-in temperature sensor. The controller compares the temperature measured by the temperature sensor with the preset temperature. When the temperature is high, the gate plate 5 component is opened, and when the temperature is low, the gate plate 5 component is closed. This achieves independent temperature control of multiple channels in different areas, resulting in good temperature control stability.

[0034] Preferably, the gate 5 assembly includes a gate 5 slidably disposed with the connecting pipe and a power device for driving the gate 5 to slide. A mounting bracket 6 is fixedly disposed on the cover plate 2, and a guide rail 7 is vertically fixedly disposed on the mounting bracket 6. The gate 5 is slidably engaged with the guide rail 7. The power device is an electric slide table 8, the cylinder of the electric slide table 8 is fixedly disposed on the mounting bracket 6, and the piston rod of the electric slide table 8 is fixedly connected to the upper end of the gate 5. Alternatively, a cylinder can also be used as the power device.

[0035] When the corresponding gate 5 assembly needs to be opened, the controller controls the electric slide 8 to pull up the gate 5, thereby opening the connecting pipe 4. Specifically, there are multiple connecting pipes 4, each corresponding to one of the heat dissipation channels 9; or the connecting pipe 4 is a single structure, divided into multiple connecting unit channels by partition plates, each corresponding to one of the heat dissipation channels 9.

[0036] To provide overall testing efficiency, the heat dissipation channel 9 has multiple channels arranged side by side, and each heat dissipation channel 9 corresponds to one heat dissipation component.

[0037] like Figures 3-4 As shown, a high and low temperature measuring device for a memory module 10 includes a base 1 for fixing a chip and a cover plate 2 that cooperates with the base 1. The cover plate 2 is provided with at least one heat dissipation channel 9, each heat dissipation channel 9 is divided into multiple heat dissipation areas, and each heat dissipation area is divided into multiple heat dissipation unit cavities by multiple partitions 11. The base 1 is provided with multiple slots for fixing the memory module 10, and the heat dissipation units correspond one-to-one with the slots. The base 1 is also provided with a heating device for heating the chip.

[0038] Further comprising a heat dissipation assembly, the heat dissipation assembly comprises a heat dissipation fan 3, the heat dissipation fan 3 is communicated with the heat dissipation channel 9 through a communication pipeline, a plurality of shutter 5 assemblies corresponding to the heat dissipation area are arranged on the communication pipeline, further comprising a controller, the controller is electrically connected with the driving mechanism of the shutter 5 assembly and the temperature sensor in the heat dissipation area respectively;

[0039] The base 1 and the cover plate 2 are rotationally or slidably arranged, and a driving mechanism for driving the cover plate 2 to move is further arranged between the base 1 and the cover plate 2.

[0040] Preferably, the base 1 and the cover plate 2 are rotationally arranged through a rotating shaft 13, the driving mechanism is a motor 12 for driving the rotating shaft 13 to rotate, the rotating shaft 13 is fixedly connected with the cover plate 2, and the two ends of the rotating shaft 13 are respectively connected with the base 1 through rotating bearings.

[0041] Before testing, first, the cover plate 2 is turned open by the motor 12, then the work personnel inserts the memory stick 10 into the corresponding slot on the base 1 one by one, after the memory stick 10 is installed, the cover plate 2 is closed on the base 1 by the motor 12, and then the temperature measurement operation is performed, thereby the degree of automation is high.

[0042] Of course, in addition to rotation, the sliding mode for opening the cover plate 2 is also within the protection scope of the present application, and the driving mechanism for sliding can select an electric sliding table 8 to drive, in comparison, the sliding mode needs to occupy a larger space, therefore, the turning form is preferably adopted.

[0043] In order to ensure the stability of heating, the heating device is a semiconductor refrigeration sheet.

[0044] The above only describes the preferred embodiments of the present application and is not used to limit the present application, for those skilled in the art, the present application can have various changes and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A memory bank high and low temperature measuring channel, characterized in that, The application relates to a heat dissipation device for a computer, which comprises a base for fixing a chip, a cover plate matched with the base, at least one heat dissipation channel arranged in the cover plate, each heat dissipation channel being divided into multiple heat dissipation areas, each heat dissipation area being divided into multiple heat dissipation unit cavities by multiple partition plates, multiple slots for fixing memory strips being arranged on the base, and the heat dissipation units corresponding to the slots one by one. The heat dissipation device further comprises a heat dissipation assembly, the heat dissipation assembly comprising a heat dissipation fan, the heat dissipation fan being connected with the heat dissipation channel through a communication pipeline, multiple gate plate assemblies corresponding to the heat dissipation areas being arranged on the communication pipeline, and a controller being electrically connected with the driving mechanisms of the gate plate assemblies and the temperature sensors in the heat dissipation areas.

2. The memory high and low temperature measuring channel according to claim 1, wherein: The gate plate assembly comprises a gate plate slidingly arranged on the communication pipeline and a power device for driving the gate plate to slide.

3. The memory module high and low temperature measurement channel of claim 2, wherein: The cover plate is fixedly provided with a mounting rack, and a guide rail is vertically fixedly arranged on the mounting rack; the gate plate is slidingly matched with the guide rail.

4. The memory module high and low temperature measurement channel of claim 3, wherein: The power device is an electric sliding table, a cylinder body of the electric sliding table is fixedly arranged on the mounting rack, and a piston rod of the electric sliding table is fixedly connected with an upper end of the gate plate.

5. The memory module high and low temperature measurement channel of claim 1, wherein: The heat dissipation channel has multiple heat dissipation channels arranged side by side, and each heat dissipation channel corresponds to one heat dissipation assembly.

6. The memory module high and low temperature sensing channel of claim 5, wherein: The communication pipeline has multiple communication pipelines corresponding to the heat dissipation channels one by one, or the communication pipeline has an integral structure, and the communication pipeline is divided into multiple connection unit channels by a partition plate; the connection unit channels correspond to the heat dissipation channels one by one.

7. The memory module high and low temperature measurement channel of claim 1, wherein: The temperature sensor is a temperature sensor provided with the memory strip.

8. A memory bank high and low temperature measuring device, characterized in that: The application relates to a heat dissipation device for a computer, which comprises a base for fixing a chip, a cover plate matched with the base, at least one heat dissipation channel arranged in the cover plate, each heat dissipation channel being divided into multiple heat dissipation areas, each heat dissipation area being divided into multiple heat dissipation unit cavities by multiple partition plates, multiple slots for fixing memory strips being arranged on the base, and the heat dissipation units corresponding to the slots one by one. The heat dissipation device further comprises a heat dissipation assembly, the heat dissipation assembly comprising a heat dissipation fan, the heat dissipation fan being connected with the heat dissipation channel through a communication pipeline, multiple gate plate assemblies corresponding to the heat dissipation areas being arranged on the communication pipeline, and a controller being electrically connected with the driving mechanisms of the gate plate assemblies and the temperature sensors in the heat dissipation areas. The base and the cover plate are rotationally or slidingly arranged, and a driving mechanism for driving the cover plate to move is further arranged between the base and the cover plate.

9. The memory module high and low temperature measurement device of claim 8, wherein: The base and the cover plate are rotationally arranged through a rotating shaft, the driving mechanism is a motor for driving the rotating shaft to rotate, the rotating shaft is fixedly connected with the cover plate, and the rotating shaft is connected with the base through rotating bearings at two ends.

10. The memory module high and low temperature measurement device of claim 8, wherein: The heating device is a semiconductor refrigeration sheet.

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