High-reliability ceramic chip capacitor

Abstract

The utility model relates to the technical field of capacitors, in particular to a high-reliability ceramic chip capacitor which comprises a ceramic chip capacitor body, an auxiliary mounting mechanism is arranged on the side edge of the ceramic chip capacitor body, and a portable heat dissipation mechanism is arranged above the auxiliary mounting mechanism. When the high-reliability ceramic chip capacitor is used, the heat dissipation fins are arranged on the side edges of the ceramic chip capacitor, so that the heat dissipation area of the ceramic chip capacitor is increased through the heat dissipation fins, and the heat dissipation efficiency of the ceramic chip capacitor is improved. Heat accumulated in the ceramic chip capacitor during working can be rapidly dissipated to the outside of the device, the heat dissipation fins are detachably designed through the mechanism assembly, the whole ceramic chip capacitor is convenient to clean and maintain, the structural design is ingenious, and the practical effect is good.

Description

TECHNICAL FIELD

[0001] The utility model relates to capacitor technical field especially relates to high reliability ceramic chip capacitor. BACKGROUND

[0002] Ceramic chip capacitor is a kind of common capacitor type, mainly by ceramic material as medium is made, usually have small surface mount package, they are widely used in electronic circuit, especially in high frequency, high stability and small volume requirement occasion;

[0003] The overall structure of the existing ceramic chip capacitor is simple, and damage is easily caused when subjected to external force collision, and the existing ceramic chip capacitor is of closed structure, the heat dissipation rate is slow, and the overall safety performance is lacking, so a ceramic chip capacitor with high safety performance and good heat dissipation effect is needed. UTILITY MODEL CONTENTS

[0004] The utility model discloses a high reliability ceramic chip capacitor is provided to solve the above -mentioned problem, improve the overall structure of the existing ceramic chip capacitor simple, and damage is easily caused when subjected to external force collision, and the existing ceramic chip capacitor is of closed structure, the heat dissipation rate is slow, and the overall safety performance is lacking.

[0005] High reliability ceramic chip capacitor, including ceramic chip capacitor body: the side of ceramic chip capacitor body is provided with auxiliary installation mechanism, the upper portion of auxiliary installation mechanism is provided with portable heat dissipation mechanism, the upper portion of portable heat dissipation mechanism is provided with collision protection mechanism;

[0006] The auxiliary installation mechanism includes an ear plate, and the two outer walls on both sides of the ceramic chip capacitor body at the bottom end are symmetrically provided with two groups of ear plates.

[0007] Preferably, the portable heat dissipation mechanism includes a lining plate, an auxiliary mounting plate and a heat dissipation fin, the two outer walls on both sides of the ceramic chip capacitor body are provided with a lining plate, the side outer wall of the lining plate is attached with an auxiliary mounting plate, and the side outer wall of the auxiliary mounting plate is installed with heat dissipation fins at equal intervals.

[0008] Preferably, the side outer wall of the auxiliary mounting plate close to the lining plate position is symmetrically provided with a positioning T-shaped strip, and the side outer wall of the lining plate is correspondingly provided with two groups of positioning T-shaped grooves, and the positioning T-shaped strip and the positioning T-shaped groove are slidably installed.

[0009] Preferably, the side outer wall of the auxiliary mounting plate is symmetrically provided with a first threaded groove, and the side outer wall of the lining plate is correspondingly provided with two groups of second threaded grooves, and the first threaded groove and the second threaded groove are threadedly installed with the fastening bolts.

[0010] Preferably, the collision protection mechanism comprises a support top plate and a limiting cylinder, the top end outer wall of the ceramic chip capacitor body is provided with the support top plate, and the top end outer wall of the support top plate is symmetrically and equidistantly provided with the limiting cylinder.

[0011] Preferably, the inside of the limiting cylinder is slidably provided with a limiting piston rod, a support spring is connected and installed between the bottom end outer wall of the limiting piston rod and the bottom end inner wall of the limiting cylinder, the extending end of the limiting piston rod is arranged above the limiting cylinder, and the top end outer wall of the limiting piston rod is connected with the bottom end outer wall of the protection plate.

[0012] Preferably, the top end outer wall of the support top plate at the middle position is provided with a first elastic support pad, a second elastic support pad is installed on the side away from the first elastic support pad of the limiting cylinder, and the bottom end outer wall of the second elastic support pad is connected with the top end outer wall of the support top plate.

[0013] The utility model discloses the beneficial effect is:

[0014] 1. The high reliability ceramic chip capacitor, when using, through the design that installs the heat dissipation fin in ceramic chip capacitor side, utilizes heat dissipation fin and has increased the heat dissipation area of ceramic chip capacitor, and then makes the heat that ceramic chip capacitor internal work accumulates can be more quickly scattered to the outside of device, further through mechanism assembly and set up the heat dissipation fin to detachable design, overall clean maintenance portable, and the structure design is ingenious, and practical effect is good.

[0015] 2. The high reliability ceramic chip capacitor, when using, through the design that mechanism assembly sets up damping buffer structure above ceramic chip capacitor, utilizes the buffer effect of damping structure and can effectively consume the external impact force that ceramic chip capacitor receives, and then effectively realizes the effect that ceramic chip capacitor collides protection, and the overall structure design is ingenious, and practical effect is good. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 It is the whole three-dimensional structure schematic diagram of the utility model;

[0017] Figure 2 It is the three-dimensional structure schematic diagram of the auxiliary installation mechanism of the utility model;

[0018] Figure 3 It is the three-dimensional structure schematic diagram of the portable heat dissipation mechanism of the utility model;

[0019] Figure 4 It is the Figure 3 It is the three-dimensional structure schematic diagram of the utility model's A place amplification;

[0020] Figure 5 It is the three-dimensional structure schematic diagram of the utility model's collision protection mechanism;

[0021] Figure 6 For the Figure 5 Amplified perspective view schematic diagram of B place.

[0022] In the figure: 1, ceramic chip capacitor body; 2, auxiliary mounting mechanism; 21, lug; 3, portable heat dissipation mechanism; 31, lining plate; 32, auxiliary mounting plate; 33, heat dissipation fin; 34, positioning T-shaped strip; 35, positioning T-shaped groove; 36, first threaded groove; 37, second threaded groove; 38, fastening bolt; 4, collision protection mechanism; 41, support top plate; 42, limiting cylinder; 43, limiting piston rod; 44, support spring; 45, protection plate; 46, first elastic support pad; 47, second elastic support pad. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0024] In specific implementation: as Figures 1-6 indicated, the high-reliability ceramic chip capacitor comprises a ceramic chip capacitor body 1: the side of the ceramic chip capacitor body 1 is provided with an auxiliary mounting mechanism 2, the upper portion of the auxiliary mounting mechanism 2 is provided with a portable heat dissipation mechanism 3, and the upper portion of the portable heat dissipation mechanism 3 is provided with a collision protection mechanism 4.

[0025] The auxiliary mounting mechanism 2 comprises lugs 21, and the two groups of lugs 21 are symmetrically arranged on the outer walls at both sides of the ceramic chip capacitor body 1 located at the bottom end position.

[0026] The arrangement of the lugs 21 enables the ceramic chip capacitor body 1 to be welded to the specified position by the lugs 21 during installation.

[0027] The portable heat dissipation mechanism 3 comprises a lining plate 31, an auxiliary mounting plate 32 and a heat dissipation fin 33, both sides of the ceramic chip capacitor body 1 are provided with the lining plate 31, the side of the lining plate 31 is provided with the auxiliary mounting plate 32, the side of the auxiliary mounting plate 32 is provided with the heat dissipation fin 33 in an equidistant arrangement, the side of the auxiliary mounting plate 32 close to the lining plate 31 is symmetrically provided with a positioning T-shaped strip 34, the side of the lining plate 31 is correspondingly provided with two groups of positioning T-shaped grooves 35, the positioning T-shaped strip 34 and the positioning T-shaped groove 35 are slidably connected, the side of the auxiliary mounting plate 32 is symmetrically provided with a first threaded groove 36, the side of the lining plate 31 is correspondingly provided with two groups of second threaded grooves 37, and the first threaded groove 36 and the second threaded groove 37 are threadedly connected with a fastening bolt 38.

[0028] The lining plate 31 and the auxiliary mounting plate 32 are made of temperature-conducting plate material, when the ceramic chip capacitor body 1 generates heat during use, the heat generated by the ceramic chip capacitor body 1 is transferred to the auxiliary mounting plate 32 through the lining plate 31, and then the auxiliary mounting plate 32 transfers the heat to the heat dissipation fin 33, the heat dissipation fin 33 increases the heat dissipation area of the device, so that the heat in the ceramic chip capacitor body 1 can be quickly dissipated to the outside of the device, when the heat dissipation fin 33 needs to be removed from the side of the ceramic chip capacitor body 1 for cleaning and maintenance, the fastening bolt 38 is first completely screwed out of the first threaded groove 36, the auxiliary mounting plate 32 changes from the locked state to the active state, then the heat dissipation fin 33 is pulled along the vertical upward direction to completely pull out the positioning T-shaped strip 34 on the side of the auxiliary mounting plate 32 from the positioning T-shaped groove 35, thus the heat dissipation fin 33 is disassembled, and the cleaning is completed, when reinstalling, the positioning T-shaped strip 34 on the side of the heat dissipation fin 33 is pushed into the positioning T-shaped groove 35 in the corresponding position along the top-down direction after adjusting the position of the heat dissipation fin 33, when the positioning T-shaped strip 34 moves to the bottom end of the positioning T-shaped groove 35, the first threaded groove 36 and the second threaded groove 37 are in the corresponding overlapping state, then the fastening bolt 38 is directly used to screw through the first threaded groove 36 to the bottom end of the second threaded groove 37 to complete the installation.

[0029] The collision protection mechanism 4 comprises a support top plate 41 and a limiting cylinder 42, the top end outer wall of the ceramic chip capacitor body 1 is provided with the support top plate 41, the top end outer wall of the support top plate 41 is symmetrically and equidistantly provided with the limiting cylinder 42, the limiting cylinder 42 is internally slidably provided with a limiting piston rod 43, the bottom end outer wall of the limiting piston rod 43 and the bottom end inner wall of the limiting cylinder 42 are connected and provided with a support spring 44, the extending end of the limiting piston rod 43 is arranged above the limiting cylinder 42, and the top end outer wall of the limiting piston rod 43 is connected with the bottom end outer wall of a protection plate 45, the top end outer wall of the support top plate 41 located at the middle position is provided with a first elastic support pad 46, and the side edge of the limiting cylinder 42 away from the first elastic support pad 46 is provided with a second elastic support pad 47, and the bottom end outer wall of the second elastic support pad 47 is connected with the top end outer wall of the support top plate 41;

[0030] When the upper part of the ceramic chip capacitor body 1 is collided by external objects, at this time, the protection plate 45 is automatically displaced downward under the impact effect and synchronously drives the limiting piston rod 43 to slide in the limiting cylinder 42, and the support spring 44 is automatically contracted under extrusion and buffers the impact force, it is noted that the limiting cylinder 42 is internally pre-installed with damping liquid, when the limiting piston rod 43 moves in the limiting cylinder 42, the damping liquid flows through the gap between the limiting piston rod 43 and the inner wall of the limiting cylinder 42, due to the flow characteristics and viscosity of the damping liquid, the flow of the liquid generates resistance, so as to slow down the movement speed of the limiting piston rod 43, so as to form the damping buffering effect, when the protection plate 45 is not impacted, at this time, the support spring 44 automatically drives the restoration to the original position, so as to continue to protect the ceramic chip capacitor body 1.

[0031] In use, the ear plate 21 is arranged, so that the ceramic chip capacitor body 1 can be installed to the specified position through the ear plate 21 and the welding point.

[0032] The lining plate 31 and the auxiliary mounting plate 32 are both arranged as temperature-conducting plate materials, when the ceramic chip capacitor body 1 generates heat in the use process, the heat carried by the ceramic chip capacitor body 1 itself is transmitted to the auxiliary mounting plate 32 through the lining plate 31, and then the auxiliary mounting plate 32 transmits the heat to the heat dissipation fins 33, the heat dissipation fins 33 are arranged, so that the heat in the ceramic chip capacitor body 1 can be more quickly dissipated to the outside of the device through the arrangement of the increased overall heat dissipation area of the device.

[0033] When the upper part of the ceramic chip capacitor body 1 is impacted by external objects, the protective plate 45 will automatically displace downward and synchronously drive the limiting piston rod 43 to slide inside the limiting cylinder 42, and the supporting spring 44 will be automatically compressed and buffer the impact force, it is noted that the limiting cylinder 42 is pre-filled with damping liquid, when the limiting piston rod 43 moves inside the limiting cylinder 42, the damping liquid will flow through the gap between the limiting piston rod 43 and the inner wall of the limiting cylinder 42, due to the flow characteristics and viscosity of the damping liquid, the flow of the liquid will generate resistance, thereby slowing down the movement speed of the limiting piston rod 43, thereby forming the damping buffering effect, when the protective plate 45 is not impacted, the supporting spring 44 will automatically drive it to return to the original position to continue to protect the ceramic chip capacitor body 1, when the protective plate 45 is impacted and moves downward, it will also automatically compress the first elastic supporting pad 46 and the second elastic supporting pad 47, and realize the buffering protection effect through the deformation effect of the first elastic supporting pad 46 and the second elastic supporting pad 47.

[0034] In addition, it should be understood that although the present specification is described in terms of embodiments, not every embodiment contains only one independent technical solution, and the description of the specification is only for the sake of clarity, and those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can be combined appropriately to form other embodiments that those skilled in the art can understand.

Claims

1. A high reliability ceramic chip capacitor characterized by, Including ceramic chip capacitor body (1): the side of the ceramic chip capacitor body (1) is provided with an auxiliary mounting mechanism (2), the upper side of the auxiliary mounting mechanism (2) is provided with a portable heat dissipation mechanism (3), and the upper side of the portable heat dissipation mechanism (3) is provided with a collision protection mechanism (4); The auxiliary mounting mechanism (2) includes an ear plate (21), and the two sides of the ceramic chip capacitor body (1) are symmetrically provided with two groups of ear plates (21) on the outer wall of the bottom end position.

2. The high reliability ceramic chip capacitor of claim 1, wherein: The portable heat dissipation mechanism (3) includes a lining plate (31), an auxiliary mounting plate (32) and a heat dissipation fin (33), the two sides of the ceramic chip capacitor body (1) are provided with lining plates (31), the side outer wall of the lining plate (31) is attached with an auxiliary mounting plate (32), and the side outer wall of the auxiliary mounting plate (32) is installed with heat dissipation fins (33) in an equidistant arrangement.

3. The high reliability ceramic chip capacitor of claim 2, wherein: The side outer wall of the auxiliary mounting plate (32) near the lining plate (31) is symmetrically provided with a positioning T-shaped strip (34), and the side outer wall of the lining plate (31) is correspondingly provided with two groups of positioning T-shaped grooves (35), and the positioning T-shaped strip (34) and the positioning T-shaped groove (35) are slidably installed.

4. The high reliability ceramic chip capacitor of claim 3, wherein: The side outer wall of the auxiliary mounting plate (32) is symmetrically provided with a first threaded groove (36), and the side outer wall of the lining plate (31) is correspondingly provided with two groups of second threaded grooves (37), and the first threaded groove (36) and the second threaded groove (37) are threadedly installed with the fastening bolt (38).

5. The high reliability ceramic chip capacitor of claim 1, wherein: The collision protection mechanism (4) includes a supporting top plate (41) and a limiting cylinder (42), the top end outer wall of the ceramic chip capacitor body (1) is provided with a supporting top plate (41), and the top end outer wall of the supporting top plate (41) is symmetrically and equidistantly provided with a limiting cylinder (42).

6. The high reliability ceramic chip capacitor of claim 5, wherein: The inside of the limiting cylinder (42) is slidably installed with a limiting piston rod (43), the bottom end outer wall of the limiting piston rod (43) and the bottom end inner wall of the limiting cylinder (42) are connected and installed with a supporting spring (44), the extending end of the limiting piston rod (43) is arranged above the limiting cylinder (42), and the top end outer wall of the limiting piston rod (43) is connected with the bottom end outer wall of the protection plate (45).

7. The high reliability ceramic chip capacitor of claim 6, wherein: The top end outer wall of the supporting top plate (41) at the middle position is provided with a first elastic supporting pad (46), the side of the limiting cylinder (42) away from the first elastic supporting pad (46) is provided with a second elastic supporting pad (47), and the bottom end outer wall of the second elastic supporting pad (47) is connected with the top end outer wall of the supporting top plate (41).

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