Pedestal processing equipment and semiconductor processing system

Abstract

The utility model provides a susceptor processing apparatus and a semiconductor processing system including the susceptor processing apparatus. The base processing equipment comprises a main control device, a processing chamber and a consignment device, wherein the consignment device is in communication connection with the main control device so as to enter the processing chamber under the control of the main control device. A base supporting device arranged on the consignment device comprises a plurality of displacement mechanisms which are distributed in a radial mode, a supporting base is arranged on the top of each displacement mechanism in a sliding mode, the positions of the supporting bases on the displacement mechanisms can be changed, bearing surfaces are arranged on the top faces of the supporting bases, and a buffering area capable of achieving the supporting effect through surface contact with the bottom face of a base is defined. Therefore, the base supporting device is suitable for bearing bases of different sizes, the bearing capacity of the bases of different sizes is achieved on the same base supporting device, the utilization rate is increased, the situation that the base cannot be placed due to the fact that the size of a buffer area of an unloaded base supporting device is improper is avoided, and then the utilization rate is increased.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor manufacturing, in particular to a susceptor processing device and a semiconductor processing system. BACKGROUND

[0002] With the development of semiconductor technology, the processing efficiency of wafers is increasingly required. As an important component for carrying wafers, the susceptor plays a key role in the semiconductor manufacturing process. In order to improve the integration to reduce the occupied space, the prior art usually sets a conveying device matched with a specific size susceptor to convey the susceptor. The conveying device carries the susceptor and, after the susceptor is cleaned and purged, transfers the susceptor to a pre-processing chamber to load wafers to be processed, and then transfers the susceptor to the corresponding process chamber to complete semiconductor processes such as vapor deposition process.

[0003] For a semiconductor processing system with multiple reaction chambers, part of the reaction chambers are set to be different in size from the susceptors that can be accommodated by other reaction chambers according to process requirements. The susceptors of different sizes carry wafers of different sizes, or carry the same size but different number of wafers, which is beneficial to realize parallel processing of multiple size wafers and improve productivity. For such a semiconductor processing system, if a corresponding conveying device is separately set for each size susceptor, it will involve the integration design of multiple conveying devices in the system, which inevitably increases the occupation of space and easily affects other associated devices in the system, for example, the other associated devices need to be redesigned to adapt to multiple conveying devices, increasing the research and development cost. CONTENT OF THE UTILITY MODEL

[0004] The purpose of the present application is to provide a susceptor processing device and a semiconductor processing system, which can adaptively adjust the size of the corresponding storage area according to the size of the susceptor to improve the utilization rate.

[0005] To achieve the above purpose, the susceptor processing device of the present application comprises a main control device, a processing chamber and a conveying device. The conveying device is communicatively connected to the main control device to enter the processing chamber under the control of the main control device. The conveying device is provided with a susceptor supporting device, and the susceptor supporting device comprises a plurality of displacement mechanisms and a plurality of supporting seats. The plurality of displacement mechanisms are distributed radially, and each displacement mechanism is provided with a supporting seat on the top thereof. The top surface of each supporting seat comprises a carrying surface, and the carrying surfaces enclose a buffer area capable of supporting the bottom surface of the susceptor through surface contact.

[0006] In an implementable scheme, the displacement mechanism comprises a guide rail structure, and the supporting seat comprises a sliding groove which is in sliding cooperation with the guide rail structure to enable the supporting seat to slide along the extension direction of the corresponding displacement mechanism.

[0007] In an implementation, the base support device further comprises a locking member arranged at the bottom of the support base, for locking the support base on the guide rail structure, and for releasing the locking relationship between the support base and the guide rail structure.

[0008] In an implementation, each displacement mechanism comprises a guide rail structure and a driving device, each support base is slidingly arranged on the guide rail structure by a driving device, and the control device is communicatively connected with each driving device, so as to change the position of each support base on the displacement mechanism by controlling each driving device.

[0009] In an implementation, the base support device further comprises a position measuring device, which is communicatively connected with the control device, so that the control device obtains the position information of each support base on the corresponding guide rail structure by the position measuring device.

[0010] In an implementation, the number of support bases slidingly arranged on at least one displacement mechanism is at least two, and the support bases are sequentially arranged along the extension direction of the displacement mechanism.

[0011] In an implementation, the base processing apparatus further comprises an auxiliary support column, which is arranged between adjacent displacement mechanisms, and the top surface of the auxiliary support column does not exceed the load bearing surface of the support base.

[0012] In an implementation, a plurality of auxiliary support columns arranged along the same circumferential direction form an auxiliary support column group, and the heights of the auxiliary support columns in the same auxiliary support column group are consistent.

[0013] The semiconductor processing system provided by the present application comprises at least two process chambers and the aforementioned base processing apparatus, and the size of the base accommodated by at least one process chamber is different from the size of the base accommodated by other process chambers.

[0014] In an implementation, the semiconductor processing system further comprises a transfer chamber, and the transfer chamber is provided with at least one base support device, which comprises a plurality of displacement mechanisms and a plurality of support bases. The plurality of displacement mechanisms are radially distributed, each displacement mechanism is provided with a support base slidingly arranged at the top thereof, and the top surface of each support base comprises a load bearing surface, so that the load bearing surfaces of the support bases enclose a buffer area capable of supporting the base by surface contact.

[0015] Compared with the prior art, the base processing apparatus and the semiconductor processing system of the present application have at least the following beneficial effects:

[0016] The shipping device in the base processing device of the application is in communication connection with the master control device to enter the processing chamber under the control of the master control device. The base supporting device provided by the shipping device comprises a plurality of displacement mechanisms distributed radially, each displacement mechanism is slidably provided with a supporting seat at the top, the supporting seat can be changed on the displacement mechanism, the top surface of each supporting seat is provided with a bearing surface, and a buffer area capable of supporting the base through surface contact is surrounded, so as to adapt to bearing different sizes of bases, realize the bearing capacity of different sizes of bases on the same base supporting device, improve the utilization rate, and avoid the situation that the buffer area size of the empty base supporting device is not suitable to place the base, thereby improving the space utilization rate. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the application, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the application, and therefore should not be regarded as a limitation to the scope. For those skilled in the art, other related drawings can also be obtained without creative labor.

[0018] Figure 1 A structural schematic diagram of a semiconductor processing system shown in an embodiment of the application;

[0019] Figure 2 A structural schematic diagram of another semiconductor processing system shown in an embodiment of the application;

[0020] Figure 3a A structural schematic diagram of a transfer chamber with a plurality of buffer cavities shown in an embodiment of the application;

[0021] Figure 3b A top view of the transfer chamber with a plurality of buffer cavities shown in an embodiment of the application;

[0022] Figure 4 A three-dimensional schematic diagram of a first base supporting device shown in an embodiment of the application;

[0023] Figure 5 A top view of Figure 4 ;

[0024] Figure 6 A working state schematic diagram of the base supporting device of the embodiment of the application with a larger bearing area size.

[0025] Figure 7 A working state schematic diagram of the base supporting device of the embodiment of the application with a smaller bearing area size;

[0026] Figure 8A structural diagram of a pedestal support device with a position measuring device according to an embodiment of the present application is shown in the figure.

[0027] Figure 9 A perspective view of a second pedestal support device according to an embodiment of the present application is shown in the figure.

[0028] Figure 10 A Figure 9 An assembly structure diagram of a displacement mechanism of the pedestal support device and a support seat is shown in the figure.

[0029] Figure 11 A Figure 9 An exploded structure diagram of a displacement mechanism of the pedestal support device and a support seat is shown in the figure.

[0030] Figure 12 A structural diagram of a bearing device with two support seats on a single displacement mechanism according to an embodiment of the present application is shown in the figure.

[0031] Figure 13 A structural diagram of a pedestal support device with an auxiliary support column according to an embodiment of the present application is shown in the figure.

[0032] The reference signs in the figure are as follows: 1, a transfer device; 2, a processing chamber; 3, a process chamber; 4, a transfer chamber; 5, a main control device; 6, a carrying device; 100, a pedestal support device; 101, a displacement mechanism; 1011, a guide rail structure; 102, a support seat; 1021, a sliding groove; 1022, a threaded hole; 103, a position measuring device; 105, a locking piece; 200, a buffer cavity; 300, an auxiliary support column; S, a bearing area; 01, a pedestal; 02, a wafer. DETAILED DESCRIPTION

[0033] In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some but not all of the embodiments of the present application. The components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0034] Therefore, the detailed description of the embodiments of the present application provided in the drawings below is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative labor are within the scope of protection of the present application.

[0035] As Figure 1As shown, the embodiment of the present application provides a semiconductor processing system, wherein the semiconductor processing system comprises a pedestal processing device, and the pedestal processing device comprises a main control device 5, a processing chamber 2 and a conveying device 6. The conveying device 6 is in communication connection with the main control device 5, so as to enter the processing chamber 2 under the control of the main control device 5.

[0036] The conveying device 6 is provided with a pedestal supporting device 100. As shown in Figure 4 , the pedestal supporting device 100 comprises a plurality of displacement mechanisms 101 and a plurality of supporting seats 102. The plurality of displacement mechanisms 101 are distributed radially, and each displacement mechanism 101 is provided with a supporting seat 102 sliding on the top thereof. The top surface of each supporting seat 102 comprises a bearing surface, and the bearing surfaces enclose a buffer area capable of supporting the bottom surface of the pedestal 01 through surface contact.

[0037] In use of the semiconductor processing system, when the processing chamber 3 needs to transfer the pedestal 01, the main control device 5 adjusts the size of the bearing area S (see Figure 5 ) of the pedestal supporting device 100 of the conveying device 6 according to the size information of the pedestal 01 needed to be transferred by the processing chamber 3, so as to bear the corresponding pedestal 01 and transport it into the processing chamber 2 to wait for further transfer into the processing chamber 3. The size information of the pedestal 01 can be pre-stored in the main control device 5, imported from a preset database or data file, or sent by other controllers.

[0038] In some embodiments, the processing chamber 2 can also be used for cleaning and purging the pedestal 01. After the cleaning and purging of the pedestal 01 in the processing chamber 2, the wafer 02 is arranged on the pedestal 01. Since the pedestal supporting device 100 supports the pedestal 01 through the bearing area S, most of the surface of the pedestal 01 is exposed, thereby improving the cleaning and purging effect.

[0039] In some embodiments, the wafer 02 can also be arranged on the cleaned and purged pedestal 01, and then the pedestal 01 is transported into the processing chamber 2 by the conveying device 6. In this case, the pedestal 01 is the pedestal carrying the wafer 02.

[0040] In some embodiments, as shown in Figure 1 , the semiconductor processing system can further comprise a transfer device 1 and two processing chambers 3, and the main control device 5 is in communication connection with the transfer device 1. Specifically, the two processing chambers 3 can accommodate pedestals 01 of different sizes. After the pedestal 01 enters the processing chamber 2 and the wafer 02 is arranged thereon, the transfer device 1 is controlled by the main control device 5 to be transferred to the processing chamber 3 which needs to transfer the pedestal 01.

[0041] In some embodiments, the number of process chambers 3 is at least two, and some of the process chambers 3 are used to accommodate pedestals 01 of different sizes. The pedestals 01 of different sizes, which carry wafers 02 of different sizes or a same size but different numbers, are conducive to the parallel processing of a plurality of wafers of different sizes or numbers, thereby improving the production capacity.

[0042] In some embodiments, as shown in Figure 2 The semiconductor processing system can further include a transfer chamber 4. The transfer chamber 4 is provided with a pedestal support device 100 capable of adjusting the size of the loading area, so that when facing the buffering needs of pedestals 01 of different sizes, the size of the loading area of the pedestal support device 100 can be adjusted to accommodate pedestals 01 of different sizes. For example, when the number of pedestal support devices 100 in the transfer chamber 4 is one, when the pedestal 01 to be transferred in one process chamber 3 is transferred to the pedestal support device 100 in the transfer chamber 4 and cooled to room temperature, the pedestal 01 is transferred out of the transfer chamber, and the size of the loading area of the pedestal support device 100 is adapted to the pedestal 01. When the pedestal 01 of different sizes to be transferred in another process chamber 3 needs to be transferred to the pedestal support device 100 in the transfer chamber 4, because the loading area of the pedestal support device 100 can be flexibly adjusted, adjusting the size of the loading area of the pedestal support device 100 can still enable the pedestal support device 100 to buffer the pedestal 01 of different sizes transferred from another process chamber 3, thereby making full use of the pedestal support device 100 and improving the buffering flexibility of pedestals 01 of different sizes.

[0043] As shown in Figure 3a and Figure 3b The embodiment of the present application provides a transfer chamber 4, which includes a plurality of buffer cavities 200, and each buffer cavity 200 is provided with a pedestal support device 100.

[0044] As shown in Figure 4 and Figure 9 The pedestal support device 100 includes a plurality of displacement mechanisms 101 and a plurality of support seats 102. The plurality of displacement mechanisms 101 are distributed radially around the same center position O, and each displacement mechanism 101 is provided with a support seat 102 on the top thereof.

[0045] The top surface of each support seat 102 includes a loading surface, and the loading surfaces of the support seats 102 are distributed around the center position O and are formed with a buffer area S capable of supporting the pedestal 01 by surface contact. The plurality of displacement mechanisms 101 are distributed radially around the same center position O, that is, the upper surfaces of the support seats 102 are distributed around the same center position O, and together form a buffer area for loading the pedestal 01. As shown in Figure 6As shown, the support seat 102 on each displacement mechanism 101 slides away from the center position O along the extension direction of the displacement mechanism, and the size of the buffer area S becomes larger. Figure 7 As shown, the support seat 102 on each displacement mechanism 101 slides away from the center position O along the extension direction of the displacement mechanism, and the size of the buffer area S becomes larger.

[0046] In some embodiments, the upper surfaces of all support seats 102 are of the same height to form a flat surface contact with the bottom surface of the pedestal 01 for stable support.

[0047] In some embodiments, the upper surfaces of the support seats 102 are not of the same height, and when the upper surfaces of the support seats 102 form a surface contact with the bottom surface of the pedestal 01, the pedestal can be stably supported.

[0048] The pedestal support device 100 in the pedestal processing equipment of the present embodiment is as shown in Figure 6 and Figure 7 As shown, each support seat 102 is slidingly arranged on the corresponding displacement mechanism 101, and the size of the buffer area S surrounded by the plurality of support seats 102 can be changed by changing the position of the support seat 102 on the displacement mechanism 101. That is, the plurality of support seats 102 move towards or away from the center position O, so that the buffer area S formed by the upper surfaces of the plurality of support seats 102 becomes smaller or larger, and thus can be suitable for supporting pedestals of different sizes, and the same pedestal support device 100 can realize the supporting capacity for pedestals of different sizes, thereby improving the space utilization.

[0049] In some embodiments, each support seat 102 is synchronously moved on the displacement mechanism 101 for position adjustment.

[0050] In some embodiments, the position of each support seat 102 on the displacement mechanism 101 can be adjusted respectively, or a part of the support seats 102 can be adjusted step by step.

[0051] In the present embodiment, the position adjustment of each support seat 102 on the displacement mechanism 101 can be a manual adjustment structure or an electric adjustment structure.

[0052] In some embodiments, as shown in Figure 9 , Figure 10 and Figure 11 The displacement mechanism 101 can include a guide rail structure 1011, and the support seat 102 can include a sliding groove 1021, which is slidingly matched with the guide rail structure 1011 to make the support seat 102 slide along the extension direction of the corresponding displacement mechanism 101.

[0053] Furthermore, as shown in Figure 10 and Figure 11As shown, the base support device 100 can further include a locking member 105 arranged at the bottom of the support base 102. After the support base 102 is adjusted to a position on the guide rail structure 1011, the locking member 105 is used to lock the support base 102 on the guide rail structure 1011, or to release the locking relationship between the support base 102 and the guide rail structure 1011.

[0054] Specifically, as shown in Figure 10 and Figure 11 the locking member 105 can have a threaded column portion, and the side wall of the support base 102 is provided with a threaded hole 1022 penetrating into the sliding groove 1021, and the threaded portion of the locking member 105 is installed in the threaded hole 1022 in a threaded manner. In use, the locking member 105 is rotated in a first rotation direction to make the end of the locking member 105 abut against the guide rail structure 1011; the locking member 105 is rotated in a second rotation direction opposite to the first rotation direction, so that the end of the locking member 105 has a spacing with the guide rail structure 1011 to release the locking relationship between the support base 102 and the guide rail structure 1011.

[0055] In some embodiments, each displacement mechanism 101 includes a guide rail structure and a driving device, and each support base 102 is slidably arranged on the guide rail structure by a driving device. The main control device 5 is communicatively connected with each driving device to change the position of each support base 102 on the displacement mechanism 101 by controlling each driving device. Specifically, the guide rail structure can be an electrically driven linear displacement device, which can be a lead screw module, a synchronous belt module, etc., and the driving device is a driving motor.

[0056] In some specific embodiments, the main control device 5 is an upper computer.

[0057] In some specific embodiments, the driving device can be a cooperation structure of a motor and a roller, and the guide rail structure can be provided with a groove or a protruding structure matched with the roller of the driving device, so as to limit the running direction of the roller, so as to achieve the purpose of driving the support base 102 to change the position in the extension direction of the displacement mechanism 101.

[0058] In some embodiments, as shown in Figure 8 the base support device 100 can further include a position measuring device 103, and the position measuring device 103 is signal connected with the main control device. The main control device obtains the position of the support base 102 on the displacement mechanism 101 through the position measuring device 103. The position measuring device 103 can adopt, but is not limited to, a grating sensor, an ultrasonic sensor, a proximity switch, etc.

[0059] In some embodiments, as shown in Figure 12As shown, one or more support seats 102 can be slidably installed on one or more displacement mechanisms 101. When a plurality of support seats 102 that can change positions in a slidable manner are installed on a displacement mechanism 101, the support seats 102 are arranged in sequence along the extension direction of the displacement mechanism 101. On the same displacement mechanism 101, the support seat 102 far from the center position O determines the maximum size of the bearing area S, and the support seat 102 close to the center position O is used to form effective support for the inner side portion of the base 01, thereby forming a more stable support effect and preventing the base 01 from falling as much as possible.

[0060] In some embodiments, when the base processing device includes a plurality of buffer cavities 200, as shown in Figure 3a As shown, the buffer cavities 200 can be arranged in a vertical direction, or, as shown in Figure 3b As shown, the buffer cavities 200 can be arranged in the same plane space.

[0061] In some embodiments, as shown in Figure 13 As shown, the base support device can further include at least one or a plurality of auxiliary pillars 300. The auxiliary pillars 300 are arranged between adjacent displacement mechanisms 101 and within the buffer area surrounded by all the support seats 102, and the top surface of the auxiliary pillars 300 does not exceed the bearing surface of the support seats 102. In some embodiments, the top surface of the auxiliary pillars 300 is flush with the bearing surface of the support seats 102.

[0062] In addition, in some embodiments, a plurality of auxiliary pillars 300 arranged in the same circumferential direction can form an auxiliary pillar group, and the heights of the auxiliary pillars in the same auxiliary pillar group are consistent.

[0063] Specifically, if one or more support seats 102 cannot change positions on the displacement mechanism 101 due to a fault, and at this time the support seat 102 is far from the center position O and cannot support the base 01, even if the base 01 is placed on the base support device 100, due to the presence of the auxiliary pillars 300, the base can still be assisted to a certain extent. support to prevent the base from falling and damaging the wafer.

[0064] In some embodiments, the auxiliary pillars 300 can be provided as a height-adjustable structure. When the height of the bearing surface of the support seat 102 changes, or the top surface of the auxiliary pillar 300 is not flush with the bearing surface of the support seat 102, the height of the auxiliary pillar 300 can be adjusted to improve flexibility.

[0065] Among them, the auxiliary pillar 300 can directly adopt a vertical displacement output mechanism, for example, an electric push rod, a pneumatic cylinder, etc. mechanism, and a structure block can be installed at the top end of the vertical displacement output mechanism. The structure block has a flat upper surface to effectively support the lower surface of the base.

[0066] The above descriptions are only the preferred embodiments of the present application, and are not intended to limit the present application. The present application can have various modifications and changes for those skilled in the art. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A susceptor processing apparatus, characterized by, The base supporting device comprises a main control device, a processing chamber and a substrate supporting device; The substrate supporting device is communicatively connected to the main control device, and is capable of entering the processing chamber under the control of the main control device; The substrate supporting device comprises a plurality of displacement mechanisms and a plurality of supporting seats; The plurality of displacement mechanisms are radially distributed, and each displacement mechanism is slidably provided with a supporting seat on the top thereof, and the top surface of each supporting seat comprises a bearing surface, and the bearing surfaces of the supporting seats enclose a buffer area capable of supporting a substrate through surface contact. The substrate supporting device further comprises auxiliary supporting columns arranged between adjacent displacement mechanisms, and the top surface of each auxiliary supporting column does not exceed the bearing surface of the supporting seat. A plurality of auxiliary supporting columns arranged along the same circumferential direction form an auxiliary supporting column group, and the auxiliary supporting columns in the same auxiliary supporting column group have the same height.

2. The susceptor processing apparatus of claim 1, wherein, The displacement mechanism comprises a guide rail structure, and the supporting seat comprises a sliding groove slidably matched with the guide rail structure to enable the supporting seat to slide along the extension direction of the displacement mechanism.

3. The susceptor processing apparatus of claim 2, wherein, The substrate supporting device further comprises a locking member arranged at the bottom of the supporting seat, which is used to lock the supporting seat on the guide rail structure and to release the locking relationship between the supporting seat and the guide rail structure.

4. The pod handling apparatus of claim 1, wherein, Each displacement mechanism comprises a guide rail structure and a driving device, and each supporting seat is slidably arranged on the guide rail structure by the driving device, and the main control device is communicatively connected to each driving device to change the position of each supporting seat on the displacement mechanism by controlling each driving device.

5. The susceptor processing apparatus of claim 4, wherein, The substrate supporting device further comprises a position measuring device communicatively connected to the main control device, so that the main control device obtains the position information of each supporting seat on the corresponding guide rail structure through the position measuring device.

6. The pod handling apparatus of claim 1, wherein, The number of supporting seats slidably arranged on at least one displacement mechanism is at least two, and the supporting seats are sequentially arranged along the extension direction of the displacement mechanism.

7. A semiconductor processing system, characterized by comprising: The substrate processing device comprises at least two process chambers and the base supporting device of any one of claims 1-6, and the size of the substrate accommodated by at least one process chamber is different from the size of the substrate accommodated by the other process chambers.

8. The semiconductor processing system of claim 7, wherein, The substrate processing device further comprises a transfer chamber, and the transfer chamber is provided with at least one base supporting device comprising a plurality of displacement mechanisms and a plurality of supporting seats; The plurality of displacement mechanisms are radially distributed, and each displacement mechanism is slidably provided with a supporting seat on the top thereof, and the top surface of each supporting seat comprises a bearing surface, and the bearing surfaces of the supporting seats enclose a buffer area capable of supporting a substrate through surface contact.

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