Positioning device for wafer and tray

Abstract

The utility model discloses a wafer and tray positioning device. The wafer and tray positioning device comprises a tray fixing device, a rotary lifting device and a positioning ring, a tray groove for placing a graphite tray is formed in the surface of the tray fixing device; the rotary lifting device comprises a lifting device and a rotating device, the rotating device is connected with the lifting device, a rotating shaft of the rotating device is connected with the positioning ring, and a guide channel for guiding the moving process of the wafer is formed in the positioning ring; the rotary lifting device is used for moving the positioning ring to the top of the tray groove and enabling the positioning ring to be coaxial with the graphite tray, and the wafer enters the groove of the graphite tray through the guide channel; accurate positioning of the wafer and the graphite tray is achieved, the production efficiency of the wafer is improved, and meanwhile the electroplating efficiency and the yield of the wafer are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer manufacturing technical field, concretely is a kind of positioning device of wafer and tray. BACKGROUND

[0002] Wafer processing is a highly precise and extremely stringent manufacturing process, and is usually carried out in a dust-free workshop. Surface plating is a key step in the wafer processing process, which aims to enhance the conductivity, corrosion resistance of the wafer or serve as a protective layer for subsequent processes by plating one or more layers of metal or non-metal materials.

[0003] Before vacuum plating, the wafer is placed on a graphite tray, and the surface of the graphite tray is formed with a circular groove for positioning the graphite tray. The wafer is manually sucked by a vacuum pen and then moved to the graphite tray. Since the circular groove has a gap of only 0.5 mm with the wafer, the wafer placement efficiency is very low and the wafer is easily contaminated. In the automated production process of the wafer, the wafer is placed on a mechanical tray. However, due to image positioning or movement error of the mechanical arm, the wafer cannot be accurately placed in the circular groove, which seriously affects the production efficiency of the wafer. SUMMARY

[0004] To solve the problems in the prior art, the utility model provides a positioning device for wafer and tray, which realizes accurate positioning of the wafer and the graphite tray by guiding the wafer, improves the production efficiency of the wafer, and improves the plating efficiency and yield of the wafer.

[0005] The utility model is realized by the following technical solutions:

[0006] A positioning device for wafer and tray, comprising a tray fixing device, a rotating lifting device and a positioning ring.

[0007] The surface of the tray fixing device is formed with a tray groove for placing the graphite tray.

[0008] The rotating lifting device comprises a lifting device and a rotating device, and the rotating device is connected with the lifting device. The rotating shaft of the rotating device is connected with the positioning ring, and the positioning ring is formed with a guide channel for guiding the movement of the wafer. The rotating lifting device is used to move the positioning ring to the top of the tray groove and coaxially with the graphite tray. The wafer enters the groove of the graphite tray through the guide channel.

[0009] Preferably, the tray fixing device comprises a base and an empty slot.

[0010] The tray groove is a circular recess formed on the base surface, and the clearance groove is located in the middle of the tray groove and extends downward, with one end of the clearance groove being communicated with the side wall of the base.

[0011] Preferably, the base is provided with a positioning device, including a positioning cylinder, a positioning block and a positioning groove.

[0012] The positioning groove is arranged on the edge of the base surface, the positioning cylinder is fixed on the side wall of the base, the positioning block is connected with the piston of the positioning cylinder, and the positioning hole is located in the positioning groove, and the positioning cylinder can drive the positioning block to move along the positioning groove to the tray direction.

[0013] Preferably, the side of the positioning block in contact with the graphite tray is provided with a plurality of positioning convex points.

[0014] Preferably, the lifting device and the rotating device are respectively a lifting cylinder and a rotating cylinder.

[0015] The lifting cylinder is fixedly connected to the lower end of the fixed seat, the piston end of the lifting cylinder is connected with the lifting arm, the rotating cylinder is connected with the lifting arm, and the rotating shaft of the rotating cylinder is connected with the side wall of the positioning ring.

[0016] Preferably, the lifting arm is slidably connected with the side wall of the fixed seat through a sliding rail.

[0017] Preferably, the fixed seat is further provided with a rotating stroke limiting device for positioning the rotation angle of the positioning ring.

[0018] Preferably, the guide channel is a tapered channel, and the inclination of the channel is inclined to the center from top to bottom.

[0019] Preferably, the lower end of the tapered channel is provided with a vertical channel.

[0020] Compared with the prior art, the wafer automatic transposition device has the following beneficial technical effects:

[0021] The wafer automatic transposition device of the present application adopts a rotating lifting device to control the position of the positioning ring, moves the positioning ring before placing the graphite tray, and then moves the positioning ring to the top of the graphite tray and keeps concentric through the rotating lifting device, and in the process of placing the wafer, the wafer is accurately dropped into the circular recess of the graphite tray through the guide channel, thereby improving the production efficiency of the wafer and reducing the production cost. BRIEF DESCRIPTION OF DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some of the embodiments of the present application, and therefore should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained without creative labor.

[0023] Figure 1 Structure diagram of the non-contact wafer transfer system of the present application;

[0024] Figure 2 Structure diagram of the positioning device of the present application;

[0025] Figure 3 First structure diagram of the rotary lifting device of the present application;

[0026] Figure 4 Second structure diagram of the rotary lifting device of the present application;

[0027] Figure 5 Structure diagram of the positioning ring of the present application;

[0028] Figure 6 Structure diagram of the positioning surface of the present application;

[0029] Figure 7 Structure diagram of the tray fixing device of the present application;

[0030] Figure 8 Structure diagram of the tray positioning device of the present application.

[0031] In the drawings: 1, rotary lifting device; 2, tray fixing device; 3, positioning ring;

[0032] 11, fixed seat; 12, lifting cylinder; 13, rotary cylinder; 14, lifting arm; 15, photoelectric switch; 16, limiting plate; 21, base; 22, tray groove; 23, empty slot; 24, positioning cylinder; 25, positioning block; 26, positioning groove; 31, inclined surface; 32, connecting arm; 33, vertical guide surface; 100, graphite tray; 200, workbench. DETAILED DESCRIPTION

[0033] In order to make the purpose, technical solutions and advantages of the embodiments of the present application more clear, the following will combine the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are some of the embodiments of the present application, not all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0034] The following detailed description of embodiments of the application provided in the accompanying drawings is not intended to limit the scope of the application as claimed, but merely represents selected embodiments of the application. Based upon the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of the present application.

[0035] Wafer, is the silicon semiconductor integrated circuit manufacturing silicon wafer, because its shape is round, so called wafer. Wafer is the basic raw material for manufacturing integrated circuits (IC). On the silicon wafer can be processed into various circuit element structure, thus forming a specific electrical function of IC products. The raw material of wafer is silicon, and there is abundant silica resources on the earth's surface. These silica ore after refining and processing, can be made of high purity polysilicon, and then used to manufacture wafer.

[0036] Referring to Figures 1-8 A wafer and tray positioning device, comprising a workbench 200, and a tray fixing device 2, a rotating lifting device 1 and a positioning ring 3 arranged thereon.

[0037] The surface of the tray fixing device 2 is formed with a tray groove 22 for placing a graphite tray;

[0038] The rotating lifting device 1 comprises a lifting device and a rotating device, the lifting device is connected with the tray fixing device 2, the rotating device is connected with the lifting device, the rotating shaft of the rotating device is connected with the positioning ring 3, and the positioning ring 3 is formed with a guide surface for guiding the movement of the wafer; the rotating lifting device is used to move the positioning ring to the top of the tray groove and coaxial with the graphite tray, and the wafer enters the groove of the graphite tray through the guide surface.

[0039] In some embodiments, the tray fixing device 2 comprises a base 21, a tray groove 22 and a positioning device; the base 21 is fixed on the top of the workbench by supporting legs, the tray groove 22 is a circular groove formed on the surface of the base, and the diameter of the tray groove 22 is greater than that of the graphite tray. During the wafer processing, the graphite tray is placed in the tray groove to position the graphite tray.

[0040] The base 21 is provided with an empty slot 23, which is located in the middle of the tray groove. The empty slot 23 is a U-shaped slot structure and is in communication with the side wall of the base. When the graphite tray is transported by a mechanical arm, the mechanical arm places the graphite tray in the tray groove by entering the empty slot.

[0041] The positioning device is a pneumatic positioning device, and the piston of the pneumatic positioning device abuts against the side wall of the graphite tray to realize positioning.

[0042] The pneumatic positioning device comprises a positioning cylinder 24, a positioning block 25 and a positioning groove 26.

[0043] The positioning slot 26 is a groove arranged at the edge of the base surface, the positioning cylinder 24 is fixed on the side wall of the base, the positioning block 25 is connected with the piston of the positioning cylinder, and the positioning hole is located in the positioning slot, and the positioning cylinder can drive the positioning block to move along the positioning slot to the tray direction, and the positioning block 25 is in abutment with the side wall of the graphite tray, and the positioning of the graphite tray is completed.

[0044] A plurality of positioning convex points are arranged on the side of the positioning block in contact with the graphite tray, so that the positioning block and the graphite tray form point contact.

[0045] In some embodiments, the lifting device and the rotating device are respectively a lifting cylinder 12 and a rotating cylinder 13.

[0046] The lifting cylinder 12 is fixedly connected to the lower end of the fixed seat, the fixed seat is fixedly connected to the side wall of the base, the piston end of the lifting cylinder 12 is located at the upper end, the piston end of the lifting cylinder 12 is connected to the lifting arm 14, and the movement of the piston end of the lifting cylinder 12 drives the lifting arm 14 to move up and down.

[0047] The lifting arm 14 is an L-shaped structure, the horizontal plate of the lifting arm 14 is connected to the piston of the lifting cylinder 12, the vertical plate of the horizontal plate of the lifting arm 14 is slidingly connected to the side wall of the fixed seat through a sliding rail, the upper end of the vertical plate is provided with a fixed plate, the upper end of the rotating cylinder 13 is connected to the fixed plate, and the rotating shaft of the rotating cylinder 13 penetrates through the fixed plate, the rotating shaft is connected to the side wall of the positioning ring, and then the rotation of the positioning ring is realized.

[0048] The fixed plate is also provided with a rotating stroke limiting device, including a photoelectric switch 15 and a limiting plate 16, the photoelectric switch 15 is fixed on one side of the fixed plate through a support, the limiting plate 16 is connected to the rotating shaft, and the photoelectric switch 15 is located on the rotating path of the limiting plate 16, when the limiting plate 16 rotates to trigger the photoelectric switch 15, the rotating shaft stops rotating.

[0049] In some embodiments, a connecting arm 32 is arranged on the side wall of the positioning ring, the connecting arm 32 is fixedly connected to the rotating shaft of the rotating cylinder, the positioning ring is a circular ring structure, the annular inner wall thereof is a guide surface, and the wafer is placed in the graphite tray 100 through the inner ring of the positioning ring during the placing process.

[0050] The guide surface includes an inclined surface 31 and a vertical guide surface 33, the inclined surface is inclined from bottom to top to a direction away from the center of the positioning ring and forms a horn shape, the upper end of the vertical guide surface is connected to the lower end of the inclined surface, and the diameter of the vertical guide surface matches the diameter of the wafer.

[0051] In the working process, when the wafer is located on the top of the positioning ring, it enters the positioning ring under the action of gravity, the annular slope corrects the position of the wafer, and the wafer enters the annular vertical guide channel, since the positioning ring is concentric with the graphite tray, the wafer can be accurately dropped into the circular groove of the graphite tray,

[0052] In the working process, the graphite tray is placed in the tray groove through the mechanical arm, then the lifting cylinder drives the rotating cylinder to move upward, then the rotating cylinder drives the positioning ring to rotate, so that the positioning ring is coaxial with the graphite tray, it should be noted that a gap is formed between the positioning ring and the graphite tray to avoid friction between the positioning ring and the graphite tray. Then, the wafer is moved to the top of the positioning ring through the suction cup, the suction force of the suction cup is cancelled, the wafer enters the positioning ring under the action of gravity, the inner wall of the positioning ring guides the wafer, so that the wafer is accurately dropped into the circular groove of the graphite tray, and the positioning of the wafer and the graphite tray is realized. The wafer and tray positioning device transfers the wafer to the tray in a non-contact state, improves the production efficiency of the wafer, and improves the plating yield of the wafer.

[0053] Reference Figure 1 The application also provides a non-contact wafer transfer system comprising the wafer and tray positioning device.

[0054] The above content only illustrates the technical idea of the utility model, and cannot limit the protection scope of the utility model, and any modification made on the basis of the technical scheme according to the technical idea of the utility model falls within the protection scope of the utility model claim.

Claims

1. A positioning device for a wafer and a tray, characterized in that, Includes pallet fixing device, rotating lifting device and positioning ring; The surface of the tray fixing device is formed with a tray groove for placing a graphite tray; The rotary lifting device includes a lifting device and a rotating device. The rotating device is connected to the lifting device, and the rotating shaft of the rotating device is connected to the positioning ring. A guide channel is formed in the positioning ring to guide the movement of the wafer. The rotary lifting device is used to move the positioning ring to the top of the tray groove and coaxial with the graphite tray. The wafer enters the groove of the graphite tray through the guide channel.

2. The wafer and tray positioning device according to claim 1, characterized in that, The pallet fixing device includes a base and a clearance groove; The tray groove is a circular groove formed on the surface of the base. The clearance groove is located in the middle of the tray groove and extends downward. One end of the clearance groove is connected to the side wall of the base.

3. The wafer and tray positioning device according to claim 2, characterized in that, The base is provided with a positioning device, including a positioning cylinder, a positioning block and a positioning groove; The positioning groove is set in the groove on the edge of the base surface. The positioning cylinder is fixed on the side wall of the base. The positioning block is connected to the piston of the positioning cylinder, and the positioning hole is located in the positioning groove. The positioning cylinder can drive the positioning block to move along the positioning groove towards the tray.

4. The wafer and tray positioning device according to claim 3, characterized in that, The positioning block has multiple positioning protrusions on the side that contacts the graphite tray.

5. The wafer and tray positioning device according to claim 1, characterized in that, The lifting device and the rotating device are a lifting cylinder and a rotating cylinder, respectively; The lifting cylinder is fixedly connected to the lower end of the fixed base. The piston end of the lifting cylinder is connected to the lifting arm, the rotary cylinder is connected to the lifting arm, and the rotating shaft of the rotary cylinder is connected to the side wall of the positioning ring.

6. A wafer and tray positioning device according to claim 5, characterized in that, The lifting arm is slidably connected to the side wall of the fixed base via a slide rail.

7. A wafer and tray positioning device according to claim 6, characterized in that, The fixed base is also equipped with a rotation stroke limiting device for positioning the rotation angle of the positioning ring.

8. The wafer and tray positioning device according to claim 1, characterized in that, The guide channel is a tapered channel, with its slope sloping downwards towards the center.

9. A wafer and tray positioning device according to claim 8, characterized in that, A vertical channel is provided at the lower end of the tapered channel.

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