Heat dissipation device and testing machine
By optimizing the structure of the flexible connector and heat sink, the thermal resistance problem caused by the large distance between the cold plate and small-sized components was solved, achieving a combination of efficient heat dissipation and electrical connection.
Patent Information
- Application Number
- CN202422714189.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-07
- Publication Date
- 2025-11-25
- Estimated Expiration
- 2034-11-07
AI Technical Summary
In the existing technology, the large distance between the cold plate and small-sized devices requires thicker thermal interface material and a longer heat transfer path, which increases thermal resistance and affects the heat dissipation efficiency of the chip.
Flexible connectors are used to connect the PCB board to the heat sink. The elasticity of the connectors allows the electronic components to fit tightly against the heat sink, shortening the heat transfer path. Furthermore, the heat dissipation path is optimized by setting up bosses, heat dissipation channels, and heat dissipation fins on the heat sink, thereby reducing thermal resistance.
It effectively reduces thermal resistance, improves heat dissipation performance, solves the heat dissipation problem of small-sized electronic devices with high heat flux density, and meets electrical connection requirements.
Smart Images
Figure CN223600187U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a semiconductor technical field especially relates to a heat dissipation device and test machine. BACKGROUND
[0002] At present, the cold plate type liquid cooling solution is commonly used to solve the heat dissipation problem of high-power devices on the PCB. There are usually many devices with high dimensions on the PCB. In order to avoid excessive interference of the cold plate with the high devices, the distance between the cold plate and the PCB is usually increased, and the thermal interface material is used between the cold plate and the small devices to reduce the contact thermal resistance. Because the distance between the cold plate and the small devices is large, the thickness of the required thermal interface material is thick. This method will prolong the heat transfer path of the small size high heat flux device, bring large thermal resistance, and affect the heat dissipation efficiency of the chip.
[0003] Therefore, there is an urgent need for a heat dissipation device and test machine to solve the above problems. UTILITY MODEL CONTENT
[0004] Based on the above, the purpose of the utility model is to provide a heat dissipation device and test machine, thereby reducing the thermal resistance, improving the heat dissipation performance, and solving the heat dissipation problem of small size high heat flux electronic devices. At the same time, the elastic connector can meet the electrical connection requirements between the PCB mainboard and the PCB small plate.
[0005] To achieve the above purpose, the utility model adopts the following technical scheme:
[0006] On the one hand, a heat dissipation device is provided, comprising:
[0007] A PCB small plate is provided with electronic devices;
[0008] A PCB mainboard and an elastic connector are provided, one end of the elastic connector is arranged on the PCB mainboard, the other end supports the side of the PCB small plate away from the electronic devices, and the PCB small plate is electrically connected to the PCB mainboard through the elastic connector;
[0009] A heat dissipation plate is arranged on the side of the PCB small plate away from the PCB mainboard, and the elastic force of the elastic connector can drive the electronic devices to adhere to the heat dissipation plate.
[0010] As a preferred technical scheme of a heat dissipation device, the heat dissipation plate is provided with a boss on the side facing the electronic devices for adhering to the electronic devices.
[0011] As a preferred technical scheme of the heat dissipation device, the area without the boss is provided with a first heat dissipation flow channel, and the boss is provided with a second heat dissipation flow channel communicated with the first heat dissipation flow channel.
[0012] As a preferred technical scheme of the heat dissipation device, the side wall of the second heat dissipation flow channel near the PCB mainboard is connected to the side wall of the first heat dissipation flow channel near the PCB mainboard through a slope.
[0013] As a preferred technical scheme of the heat dissipation device, the second heat dissipation flow channel is uniformly provided with a plurality of heat dissipation fins.
[0014] As a preferred technical scheme of the heat dissipation device, the first heat dissipation flow channel comprises at least two parallel flow channels, and the at least two parallel flow channels are communicated to the second heat dissipation flow channel after being converged.
[0015] As a preferred technical scheme of the heat dissipation device, the elastic connector is a conductive spring, one end of the conductive spring is welded to the PCB mainboard, and the other end is welded to the PCB small plate.
[0016] As a preferred technical scheme of the heat dissipation device, a heat conduction interface material layer is arranged between the electronic device and the heat dissipation plate.
[0017] As a preferred technical scheme of the heat dissipation device, the side of the heat dissipation plate facing the PCB mainboard is provided with a plurality of columns, and the plurality of columns enclose a positioning groove, and the PCB mainboard is embedded in the positioning groove.
[0018] In another aspect, a test machine is provided, comprising the heat dissipation device of any one of the above schemes.
[0019] The heat dissipation device has the following beneficial effects:
[0020] The heat dissipation device and the test machine are provided, one end of the elastic connector is arranged on the PCB mainboard, the other end supports the side of the PCB small plate away from the electronic device, the elastic force of the elastic connector drives the electronic device to be elastically attached to the heat dissipation plate, the distance between the electronic device and the heat dissipation plate is reduced, the heat transfer path is greatly shortened, the thickness of the boss on the heat dissipation plate in the prior art is reduced, and the heat conduction thermal resistance is further reduced, the heat dissipation performance is improved, and the heat dissipation problem of the small-size high-heat flux density electronic device is solved. BRIEF DESCRIPTION OF DRAWINGS
[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the description of the embodiments of the present application. Obviously, the drawings described in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained according to the contents of the embodiments of the present application and the drawings without any creative effort.
[0022] Figure 1 is a structural schematic diagram of the heat dissipation device provided by the embodiment of the present application;
[0023] Figure 2 is a partial structural schematic diagram of the heat dissipation device provided by the embodiment of the present application;
[0024] Figure 3 is a partial sectional view of the heat dissipation device provided by the embodiment of the present application;
[0025] Figure 4 is a structural explosion diagram of the heat dissipation device provided by the embodiment of the present application.
[0026] The marks in the drawings are as follows:
[0027] 1, PCB small plate; 2, electronic device; 3, PCB main plate; 4, elastic connector;
[0028] 5, heat dissipation plate; 51, boss; 52, first heat dissipation flow channel; 521, parallel flow channel; 53, second heat dissipation flow channel; 54, inclined surface; 55, heat dissipation fin; 56, stand; 57, base plate; 58, cover plate;
[0029] 6, heat-conducting interface material layer. DETAILED DESCRIPTION
[0030] The present application will be further described in detail below in combination with the drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present application, but not to limit the present application. In addition, it should be noted that, in order to facilitate the description, only the parts related to the present application are shown in the drawings, but not all the structures.
[0031] In the description of the present application, unless otherwise explicitly specified and limited, the terms "connected", "connected", "fixed" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two devices or the interaction relationship between two devices. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0032] In the present application, unless otherwise explicitly specified and limited, the first feature is "on" or "under" the second feature, which can include direct contact between the first and second features, or indirect contact between the first and second features through another feature therebetween. Moreover, the first feature "on", "above" and "over" the second feature includes the first feature directly above and obliquely above the second feature, or only indicates that the first feature is higher than the second feature in horizontal height. The first feature "under", "below" and "underneath" the second feature includes the first feature directly below and obliquely below the second feature, or only indicates that the first feature is lower than the second feature in horizontal height.
[0033] In the description of the present application, the terms "up", "down", "left", "right", and other orientation or position relationships are based on the orientation or position relationships shown in the drawings, and are only for the convenience of description and simplification of operation, and do not indicate or imply that the device or device must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are only used to distinguish in the description, and have no special meaning.
[0034] In the prior art, due to the large spacing between the cold plate and the small-sized device, the thickness of the required thermal interface material is thick or the cold plate needs to be provided with a long boss. This way will prolong the heat transfer path of the small-sized high heat flux device, bring a larger thermal resistance, and affect the heat dissipation efficiency of the chip.
[0035] To solve the above problems, as shown in Figures 1-3 The present application provides a test machine, which comprises a heat dissipation device, and the heat dissipation device comprises a PCB small plate 1, a PCB main plate 3, an elastic connector 4 and a heat dissipation plate 5.
[0036] Specifically, the electronic device 2 is arranged on the PCB small plate 1; one end of the elastic connector 4 is arranged on the PCB main plate 3, and the other end supports one side of the PCB small plate 1 away from the electronic device 2, and the PCB small plate 1 is electrically connected to the PCB main plate 3 through the elastic connector 4; the heat dissipation plate 5 is arranged on the side of the PCB small plate 1 away from the PCB main plate 3, and the elastic force of the elastic connector 4 can drive the electronic device 2 to be attached to the heat dissipation plate 5. Wherein, one end of the elastic connector 4 is arranged on the PCB main plate 3, and the other end supports one side of the PCB small plate 1 away from the electronic device 2, and the elastic force of the elastic connector 4 drives the electronic device 2 to be elastically attached to the heat dissipation plate 5, so as to reduce the spacing between the electronic device 2 and the heat dissipation plate 5, thereby greatly shortening the heat transfer path, reducing the thickness of the boss 51 on the heat dissipation plate 5 in the prior art, and further reducing the thermal resistance, improving the heat dissipation performance, and solving the heat dissipation problem of the small-sized high heat flux electronic device 2. At the same time, the elastic connector 4 can simultaneously meet the electrical connection requirement between the PCB main plate 3 and the PCB small plate 1.
[0037] Preferably, the heat dissipation plate 5 is provided with a boss 51 on the side facing the electronic device 2 for attaching the electronic device 2. By providing the boss 51, the distance between the electronic device 2 and the heat dissipation plate 5 is reduced, the thermal resistance is reduced, and the heat dissipation efficiency is improved. Among them, the electronic device 2 includes a plurality of small size high heat flux chips, and the plurality of small size high heat flux chips can share one boss 51, and the spreading thermal resistance of the boss 51 part is reduced.
[0038] Further preferably, as shown in Figure 3 and Figure 4 , the area of the heat dissipation plate 5 without the boss 51 is provided with a first heat dissipation flow channel 52, and the boss 51 is provided with a second heat dissipation flow channel 53 communicating with the first heat dissipation flow channel 52. The first heat dissipation flow channel 52 and the second heat dissipation flow channel 53 are used to flow the cooling medium, and the side wall of the second heat dissipation flow channel 53 close to the PCB mainboard 3 is sunken into the boss 51 relative to the side wall of the first heat dissipation flow channel 52 close to the PCB mainboard 3. In operation, the cooling medium flows through the first heat dissipation flow channel 52 and the second heat dissipation flow channel 53 to achieve heat exchange of the heat dissipation plate 5, and the cooling medium can be cooling liquid. Among them, the second heat dissipation flow channel 53 is sunken into the boss 51, which only needs to ensure that the second heat dissipation flow channel 53 has a certain thickness between the end face of the boss 51 to ensure its safe pressure bearing, reduces the distance between the electronic device 2 and the cooling medium in the sunken flow channel, shortens the heat transmission path, and reduces the thermal resistance of the heat dissipation plate 5.
[0039] As a preferred, the side wall of the second heat dissipation flow channel 53 close to the PCB mainboard 3 is transitioned to the side wall of the first heat dissipation flow channel 52 close to the PCB mainboard 3 through a slope 54. The slope 54 can guide the flow of the cooling medium, reduce the flow resistance of the junction between the second heat dissipation flow channel 53 and the first heat dissipation flow channel 52, and further improve the conveying efficiency of the cooling medium.
[0040] In this embodiment, a plurality of heat dissipation fins 55 are uniformly arranged in the second heat dissipation flow channel 53, which increases the contact area between the heat dissipation plate 5 and the cooling medium and improves the heat exchange efficiency.
[0041] In this embodiment, the first heat dissipation flow channel 52 includes at least two parallel flow channels 521, and the at least two parallel flow channels 521 are communicated to the second heat dissipation flow channel 53 after converging. Since the second heat dissipation flow channel 53 is provided with heat dissipation fins 55, if the refrigerant is directly introduced into the second heat dissipation flow channel 53 provided with the heat dissipation fins 55, the flow resistance will be large. This embodiment reduces the flow resistance in the first heat dissipation flow channel 52 by arranging two parallel flow channels 521, so as to match the flow resistance of the entire heat dissipation plate 5, ensure the smooth flow of the cooling medium in the flow channel, and improve the heat exchange efficiency.
[0042] In this embodiment, as shown in Figure 1 and Figure 2As shown, the elastic connector 4 is a conductive spring, one end of which is welded to the PCB mainboard 3, and the other end of which is welded to the PCB small plate 1. On the one hand, the conductive spring can exert elastic force on the PCB small plate 1 to make the PCB small plate 1 adhere to the heat dissipation plate 5; on the other hand, the conductive spring can realize the electrical connection between the PCB mainboard 3 and the PCB small plate 1.
[0043] In this embodiment, the elastic connector 4 supports the PCB small plate 1, can reduce the layout pressure between the PCB mainboard 3 and the electronic device 2, and can layout the small-size high heat flux density device on the PCB small plate 1. Meanwhile, the elastic connector 4 can flexibly adjust the elastic force, so that the small-size high heat flux density device is in close contact with the heat dissipation plate 5 or the boss 51 without being damaged by overpressure, and the phenomenon of poor contact caused by external vibration or device tolerance can be avoided.
[0044] Preferably, a heat-conducting interface material layer 6 is arranged between the electronic device 2 and the heat dissipation plate 5, which reduces the contact thermal resistance between the electronic device 2 and the heat dissipation plate 5 and improves the heat conduction efficiency. The elastic connector 4 can flexibly adjust the elasticity to ensure that the heat-conducting interface material layer 6 is effectively compressed without overpressure, effectively reducing the thickness of the heat-conducting interface material layer 6 and reducing the thermal resistance of the heat-conducting interface material layer 6. Specifically, the heat-conducting interface material layer 6 is a heat-conducting silicone sheet, heat-conducting silicone grease or graphene heat-conducting sheet.
[0045] Further, as shown in Figure 1 and Figure 4 , the heat dissipation plate 5 is provided with a plurality of columns 56 on the side facing the PCB mainboard 3, and the plurality of columns 56 enclose a positioning groove, and the PCB mainboard 3 is embedded in the positioning groove, which improves the installation precision of the PCB mainboard 3 and improves the assembly convenience.
[0046] Further, the heat dissipation plate 5 includes a cover plate 58 and a base plate 57, the first heat dissipation channel 52, the second heat dissipation channel 53 and the fins in the second heat dissipation channel 53 are processed by a milling machine, and then the cover plate 58 and the base plate 57 are welded together by brazing. The first heat dissipation channel 52 and the second heat dissipation channel 53 are away from the bottom of the base plate 57 and the top of the cover plate 58 by a certain distance to ensure the pressure bearing capacity of the heat dissipation plate 5.
[0047] It should be noted that the above only the preferred embodiments of the present application and the use of technical principles. Those skilled in the art will understand that the present application is not limited to the specific embodiments described herein, those skilled in the art can make various obvious changes, re-adjustment and replacement without departing from the scope of the present application. Therefore, although the above embodiments of the present application has been described in more detail, but the present application is not limited to the above examples, without departing from the concept of the present application, but also can include more other equivalent embodiments, and the scope of the present application is determined by the appended claims.
Claims
1. A heat dissipation device, characterized in that, include: PCB board (1), on which electronic devices (2) are disposed; PCB motherboard (3) and flexible connector (4), one end of the flexible connector (4) is disposed on the PCB motherboard (3), and the other end supports the side of the PCB board (1) away from the electronic device (2). The PCB board (1) is electrically connected to the PCB motherboard (3) through the flexible connector (4). A heat sink (5) is disposed on the side of the PCB board (1) away from the PCB motherboard (3), and the elastic force of the elastic connector (4) can drive the electronic device (2) to adhere to the heat sink (5).
2. The heat dissipation device according to claim 1, characterized in that, The heat sink (5) has a boss (51) for attaching to the electronic device (2) on the side facing the electronic device (2).
3. The heat dissipation device according to claim 2, characterized in that, The area of the heat sink (5) without the protrusion (51) is provided with a first heat dissipation channel (52). The protrusion (51) is provided with a second heat dissipation channel (53) that communicates with the first heat dissipation channel (52). The first heat dissipation channel (52) and the second heat dissipation channel (53) are used to circulate cooling medium. The side wall of the second heat dissipation channel (53) near the PCB motherboard (3) sinks into the protrusion (51) relative to the side wall of the first heat dissipation channel (52) near the PCB motherboard (3).
4. The heat dissipation device according to claim 3, characterized in that, The sidewall of the second heat dissipation channel (53) near the PCB motherboard (3) is connected to the sidewall of the first heat dissipation channel (52) near the PCB motherboard (3) by a slope (54).
5. The heat dissipation device according to claim 3, characterized in that, Multiple heat dissipation fins (55) are uniformly arranged inside the second heat dissipation channel (53).
6. The heat dissipation device according to claim 3, characterized in that, The first heat dissipation channel (52) includes at least two parallel channels (521), and the at least two parallel channels (521) merge and connect to the second heat dissipation channel (53).
7. The heat dissipation device according to claim 1, characterized in that, The elastic connector (4) is a conductive spring, one end of which is soldered to the PCB main board (3) and the other end is soldered to the PCB small board (1).
8. The heat dissipation device according to claim 1, characterized in that, A thermally conductive interface material layer (6) is provided between the electronic device (2) and the heat sink (5).
9. The heat dissipation device according to claim 1, characterized in that, The heat sink (5) has multiple pillars (56) on the side facing the PCB motherboard (3), and the multiple pillars (56) form a positioning groove, in which the PCB motherboard (3) is embedded.
10. A testing machine, characterized in that, Includes the heat dissipation device as described in any one of claims 1-9.