Dispensing, curing and assembling equipment

Abstract

The utility model discloses dispensing and curing assembly equipment, which comprises a dispensing mechanism, a curing mechanism, an assembly transfer mechanism, a crimping and grabbing mechanism and a plurality of first limiting jigs which are sequentially arranged along the rotation direction of a rotary table, a second limiting jig is connected to the rotary table, and at an initial position, a first chip assembly is arranged on the second limiting jig and rotates along with the rotary table; the dispensing mechanism is used for dispensing the first chip assembly, the curing mechanism is used for curing the dispensed first chip assembly, the assembly transferring mechanism is used for transferring the cured first chip assembly to the first limiting jig from the second limiting jig, the crimping grabbing mechanism is used for crimping a cable, and the first chip assembly is covered with a chip lower cover; according to the chip assembly production line, through the arrangement of the multiple first limiting jigs and the multiple second limiting jigs, the working procedures of dispensing, curing, transferring, crimping, covering and the like can be conducted on the multiple first chip assemblies in a short time, and the automation degree and the working efficiency of operation are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of assembly technology especially relates to a point gum solidification equipment. BACKGROUND

[0002] The disposable invasive pressure monitoring sensor is used for monitoring arterial pressure, central venous pressure and other pressures of patients by medical units, one end of which is directly connected with human blood vessels, and blood pressure is transmitted to the chip of the sensor through the pressure extension tube, the chip converts the physiological pressure (mechanical pressure) into an electric energy signal, and then the module on the monitor converts it into an intuitive waveform symbol, so that the doctor can understand the patient's condition at any time according to the blood pressure change. The disposable invasive pressure sensor is composed of an infusion tube, a flushing valve, a chip assembly product, a three-way valve and a pressure extension tube, wherein the chip assembly product comprises a chip, a cable, a chip upper cover and a chip lower cover, the chip upper cover and the chip lower cover are overlapped and form a cavity inside, the chip is installed in the cavity between the chip upper cover and the chip lower cover, the cable is connected with the chip, in the assembly process, the chip is clamped in the chip upper cover, the cable is welded on the chip to obtain a first chip assembly, then the first chip assembly is glued, solidified and installed with the chip lower cover by manual operation, the overall process has low automation degree, low operation efficiency and high labor cost. Therefore, the related art has the technical defect of low operation efficiency of gluing, solidifying and installing the chip lower cover on the first chip assembly by manual operation. SUMMARY

[0003] The point gum solidification equipment aims to solve the technical defect of low operation efficiency of gluing, solidifying and installing the chip lower cover on the first chip assembly by manual operation in the related art.

[0004] The utility model discloses a kind of dispensing solidification assembly equipment, comprising: machine table;Rotary disc, the rotary disc rotation is connected in the machine table, for station switching;First limit fixture, multiple the first limit fixture is arranged at the edge of rotary disc, the surface of first limit fixture away from rotary disc is equipped with multiple limit slot for placing first chip assembly;Second limit fixture, multiple the second limit fixture is arranged at the side of first limit fixture by fixture support, the structure of second limit fixture is same with first limit fixture, initial position, first chip assembly is placed on second limit fixture;Dispensing mechanism, for dispensing first chip assembly placed on second limit fixture;Solidification mechanism, for solidifying first chip assembly after dispensing;Component transfer mechanism, for first chip assembly is grabbed from second limit fixture to first limit fixture;Pressure bonding grabbing mechanism, for first chip assembly is pressure bonded, chip lower cover is grabbed to above first limit fixture and chip lower cover is covered on first chip assembly;Feeding device, it is arranged below and side of pressure bonding grabbing mechanism, for conveying chip lower cover;Discharging mechanism, for discharging chip assembly product after assembly is completed;Dispensing mechanism, solidification mechanism, component transfer mechanism, pressure bonding grabbing mechanism, discharging mechanism are sequentially arranged in the periphery of rotary disc along the rotation direction of rotary disc.

[0005] Among them, the rotary disc includes: rotary disc, fixed disc, rotary disc driving device, rotary disc rotation is connected to machine table, rotary disc driving device drives rotary disc rotation, multiple the first limit fixture is arranged at the edge of rotary disc, the fixed disc is located above rotary disc, and the second limit fixture is arranged at the side of fixed disc by fixture support.

[0006] Among them, dispensing mechanism includes: third support, positioning plate, dispensing needle head assembly, seventh driving device, third support is arranged on machine table, positioning plate is arranged at a certain angle with third support, dispensing needle head assembly is slidably connected with positioning plate, and seventh driving device drives dispensing needle head assembly to slide along positioning plate.

[0007] Among them, the component transfer mechanism includes: first support, inclined plate support, first driving device, mounting support, second driving device, rotary driving device, first cylinder clamping jaw, first support is arranged on machine table, inclined plate support is slidably connected to first support, first driving device drives inclined plate support to slide up and down along first support;Mounting support is slidably connected to inclined plate support, and second driving device drives mounting support to slide along inclined plate support;Rotary driving device is arranged on mounting support, first cylinder clamping jaw is connected with rotary driving device, and rotary driving device drives first cylinder clamping jaw to rotate.

[0008] The crimping grabbing mechanism comprises a second support, a second support table, a material taking unit, a crimping unit, a third driving device and a fourth driving device, one end of the second support is arranged on the fixed disc, the second support table is arranged on the top of the second support, the second support table is arranged above the feeding device and the rotating disc, the material taking unit and the crimping unit are slidably connected with the second support table, the third driving device drives the material taking unit to slide along the second support, so that the material taking unit moves from above the first limiting fixture to above the feeding device, and the material taking unit moves in the vertical direction; the fourth driving device drives the crimping unit to slide along the second support, so that the crimping unit moves to above the first limiting fixture, and the crimping unit moves in the vertical direction and crimps the first chip assembly on the first limiting fixture.

[0009] Specifically, the crimping unit comprises a fifth driving device, a crimping piece, a first mounting plate and a second mounting plate, the second mounting plate is slidably connected with the second support table, the fifth driving device is mounted on the second mounting plate, the first mounting plate is vertically connected with the second mounting plate, the crimping piece is slidably connected with the first mounting plate, and the fifth driving device drives the crimping piece to slide along the first mounting plate.

[0010] Specifically, the material taking unit comprises a sixth driving device, a second cylinder clamp jaw, a third mounting plate and a fourth mounting plate, the third mounting plate is slidably connected with the second support table, the sixth driving device is mounted on the third mounting plate, the fourth mounting plate is vertically connected with the third mounting plate, the second cylinder clamp jaw is slidably connected with the fourth mounting plate, and the sixth driving device drives the second cylinder clamp jaw to slide up and down along the fourth mounting plate.

[0011] The feeding device comprises a feeding guide rail and a vibrating disc, the feeding guide rail is arranged below the crimping grabbing mechanism, the vibrating disc is arranged beside the crimping grabbing mechanism, one end of the feeding guide rail is connected with the vibrating disc, and the feeding guide rail is used for the automatic feeding of the chip lower cover.

[0012] The discharging mechanism comprises a fourth support, a fourth support table, a third clamping unit, a fourth clamping unit, an eighth driving device and a ninth driving device, the fourth support is arranged on the machine table, the fourth support table is arranged on the top of the fourth support, the third clamping unit and the fourth clamping unit are slidably connected with the fourth support table, the eighth driving device drives the third clamping unit to slide along the fourth support table, the ninth driving device drives the fourth clamping unit to slide along the fourth support table, and the third clamping unit and the fourth clamping unit can slide up and down in the vertical direction.

[0013] Preferably, the discharging mechanism further comprises a conveying table, the conveying table is arranged below the fourth support table, and the chip assembly products clamped by the third clamping unit and the fourth clamping unit are placed on the conveying table.

[0014] The utility model discloses a kind of dispensing solidification assembly equipment, by dispensing mechanism, solidification mechanism, component transfer mechanism, crimping grabbing mechanism are sequentially arranged along the rotation direction of carousel, and multiple first limit fixture and multiple second limit fixture are connected to carousel, when initial position, first chip component is placed in second limit fixture, with carousel rotation, multiple first chip components are dispensed by dispensing mechanism, solidification mechanism is solidified to the first chip component after dispensing, component transfer mechanism transfers the first chip component after dispensing from second limit fixture to first limit fixture, crimping grabbing mechanism is crimped to cable, and chip lower cover is covered to first chip component, blanking mechanism is discharged to the first chip component product of assembly completion, by multiple first limit fixture, second limit fixture, it can meet in shorter time to multiple first chip components are dispensed, solidified, transfer, crimping, covering and so on Process, improve the automation degree and operation efficiency of operation, effectively solve the technical defects that the operation efficiency of dispensing, solidification, installing chip lower cover to first chip component is relatively low in the related art by manual mode, greatly improve the automation degree of operation. BRIEF DESCRIPTION OF DRAWINGS

[0015] In order to more clearly illustrate the technical scheme of the embodiment of the utility model, the drawings needed to be used in the embodiment description will be simply introduced below, and obviously, the drawings in the following description are some embodiments of the utility model, and for those skilled in the art, other drawings can also be obtained according to these drawings without innovative labor.

[0016] Figure 1 It is the overall structural diagram of dispensing solidification assembly equipment disclosed by the embodiment of the utility model;

[0017] Figure 2 It is the partial structural diagram of component transfer mechanism disclosed by the embodiment of the utility model;

[0018] Figure 3 It is the partial structural diagram of crimping grabbing mechanism disclosed by the embodiment of the utility model;

[0019] Figure 4 It is the partial structural diagram of dispensing mechanism disclosed by the embodiment of the utility model;

[0020] Figure 5 It is the partial structural diagram of blanking mechanism disclosed by the embodiment of the utility model;

[0021] Reference signs:

[0022] 1, machine table; 100, universal wheel; 2, rotary table; 21, fixed disc; 22, rotating disc; 30, limiting groove; 31, first limiting fixture; 32, second limiting fixture; 321, fixture support; 4, dispensing mechanism; 41, third support; 42, positioning plate; 43, dispensing needle assembly; 44, seventh driving device; 5, curing mechanism; 6, component transfer mechanism; 61, first support; 611, first sliding rail; 62, inclined plate support; 63, first driving device; 64, mounting support; 65, second driving device; 66, rotary driving device; 67, first cylinder clamping jaw; 7, crimping grabbing mechanism; 71, second support; 72, material taking unit; 721, sixth driving device; 722, second cylinder clamping jaw; 723, third mounting plate; 724, fourth mounting plate; 73, crimping unit; 731, fifth driving device; 732, crimping piece; 733, first mounting plate; 734, second mounting plate; 74, fourth driving device; 75, second support table; 8, feeding device; 81, vibrating disc; 82, feeding guide rail; 9, blanking mechanism; 91, fourth support; 92, fourth support table; 921, fourth sliding rail; 93, third clamping unit; 931, third sliding table; 932, third connecting plate; 933, third cylinder clamping jaw; 934, tenth driving device; 94, fourth clamping unit; 90, conveying table; DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0024] It should be understood that, when used in the specification and the appended claims, the terms "comprise" and "include" indicate the presence of described features, integers, steps, operations, elements, and / or components, but do not exclude one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0025] It should also be understood that the terms used in the present application specification are only for the purpose of describing specific embodiments and are not intended to limit the present application. As used in the present application specification and the appended claims, the singular forms "a", "an" and "the" are intended to include the plural forms, unless the context clearly indicates otherwise.

[0026] It should be further understood that the terms "and", "or" as used in the description and in the claims herein are used to mean either one or more of the items specifically identified or any combination of those items, and that inclusion of one item does not exclude any other item in the list of items.

[0027] The above merely illustrates the specific embodiments of the present application, but the protection scope of the present application is not limited thereto, and any person skilled in the art can easily think of various equivalent modifications or replacements within the technical range disclosed by the present application, and these modifications or replacements should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

[0028] The point-glue solidification assembly equipment is used for point-gluing and solidifying the first chip assembly installed in the previous process, so that the chip and the chip upper cover are tightly adhered, and the chip lower cover is installed, wherein the first chip assembly comprises an assembly main body and a cable, and the previous process comprises: clamping the chip in the chip upper cover and welding the cable on the chip.

[0029] The point-glue solidification assembly equipment is used for point-gluing and solidifying the first chip assembly installed in the previous process, so that the chip and the chip upper cover are tightly adhered, and the chip lower cover is installed, wherein the first chip assembly comprises an assembly main body and a cable, and the previous process comprises: clamping the chip in the chip upper cover and welding the cable on the chip. Figure 1As shown, it comprises: a machine table 1, the frame of the machine table 1 is provided with an outer shell, so that the operation area and the control area form a sealed space, thereby separating the glue dispensing and curing assembly device from the operator, improving safety performance and preventing dust, and a universal wheel 100 is also installed below the machine table 1, facilitating the movement of the glue dispensing and curing assembly device; a turntable 2, the turntable 2 is rotatably connected to the machine table 1, for station switching; a first limiting jig 31, a plurality of first limiting jigs 31 are arranged at the edge of the turntable 2, in this embodiment, the number of first limiting jigs 31 is 10, the first limiting jigs 31 are evenly arranged on the turntable 2, the surface of the first limiting jig 31 away from the turntable 2 is provided with a plurality of limiting grooves 30, in this embodiment, the number of limiting grooves is 2, the assembly body is placed in the limiting groove 30, the shape of the limiting groove 30 is matched with the shape of the assembly body, and the first limiting jig 31 can prevent the position of the assembly body from changing during the rotation of the turntable 2; a second limiting jig 32, a plurality of second limiting jigs 32 are arranged on the side of the first limiting jig 31 through a jig support 321, the second limiting jig 32 is the same in structure as the first limiting jig 31, and the number of second limiting jigs 32 is the same as that of the first limiting jigs 31, in the initial position, the first chip assembly is placed on the second limiting jig 32; a glue dispensing mechanism 4, arranged on the machine table 1, for dispensing glue on the first chip assembly placed on the second limiting jig 32; a curing mechanism 5, arranged on the machine table 1, for curing the first chip assembly after glue dispensing, so that the chip and the shell are tightly bonded; an assembly transfer mechanism 6, arranged on the machine table 1, for grabbing the first chip assembly from the second limiting jig 32 to the first limiting jig 31; a pressure bonding and grabbing mechanism 7, arranged on the machine table 1, for pressure bonding the first chip assembly, grabbing the chip lower cover from the feeding device 8 to above the first limiting jig 31 and covering the chip lower cover on the first chip assembly; a feeding device 8, connected to the machine table 1 and arranged below and beside the pressure bonding and grabbing mechanism 7, for conveying the chip lower cover; a discharging mechanism 9, for discharging the chip assembly product after assembly; the glue dispensing mechanism 4, the curing mechanism 5, the assembly transfer mechanism 6 and the pressure bonding and grabbing mechanism 7 are sequentially arranged along the rotation direction of the turntable 2.

[0030] The rotating disc 2 comprises a rotating disc 22, a fixed disc 21, a rotating disc driving device, the rotating disc 22 is rotationally connected to the machine table 1, the rotating disc driving device drives the rotating disc 22 to rotate, a plurality of the first limiting jigs 31 are arranged at the edge of the rotating disc 22, the fixed disc 21 is arranged above the rotating disc 22 and the fixed disc 21 and the rotating disc 22 are coaxially arranged, the second limiting jig 32 is arranged on the rotating disc 22 through the jig support 321 and is arranged beside the first limiting jig 31, in the embodiment, the first limiting jig 31 and the second limiting jig 32 are arranged along the radial direction of the rotating disc 22, the second limiting jig 32 is arranged on the side close to the fixed disc 21, during operation, the rotating disc 22 rotates to drive the first limiting jig 31 and the second limiting jig 32 to rotate, the fixed disc 21 is stationary, in an embodiment, the rotating disc driving device comprises a rotating disc driving motor, a cam divider, a transmission assembly and the like, the rotating disc driving motor can be transmissionally connected to the input shaft of the cam divider through the transmission assembly such as a synchronous belt and a synchronous pulley, the output shaft of the cam divider is connected to the rotating disc 22 to drive the rotating disc 22 to rotate.

[0031] Specifically, please refer to Figure 4 , the dispensing mechanism 4 comprises a third support 41, a positioning plate 42, a dispensing needle head assembly 43 and a seventh driving device 44, the third support 41 is arranged on the machine table 1, the positioning plate 42 is arranged at a certain angle with the third support 41, so that the dispensing needle head assembly 43 can be more accurately aligned with the first chip assembly, the dispensing needle head assembly 43 is slidingly connected with the positioning plate 42, and the seventh driving device 44 drives the dispensing needle head assembly 43 to slide along the positioning plate 42; the second limiting jig 32 is at a certain angle with the jig support 321, which facilitates the dispensing needle head assembly 43 to perform the dispensing action on the first chip assembly placed on the second limiting jig 32; the dispensing mechanism further comprises a glue barrel (not shown in the figure), the glue barrel is connected with the dispensing needle head assembly, and the glue barrel contains glue.

[0032] The curing mechanism 5 comprises a UV curing lamp and a lampshade, the UV curing lamp is connected to the machine table through a lamp holder, and the lampshade is installed on the UV curing lamp, when the second limiting jig 32 and the first chip assembly after dispensing rotate to the lower side of the curing mechanism, the UV curing lamp is turned on to perform light curing on the first chip assembly after dispensing, so that the glue between the chip and the chip cover is quickly cured and bonded, and the lampshade can prevent energy waste during the curing process.

[0033] Please refer to Figure 2The component transfer mechanism 6 comprises a first support 61, a slope support 62, a first driving device 63, a mounting support 64, a second driving device 65, a rotary driving device 66, and first cylinder clamping jaws 67. The number of the first cylinder clamping jaws 67 corresponds to the number of the limiting grooves, so as to improve the work efficiency. In the embodiment, the number of the first cylinder clamping jaws 67 is two. The first support 61 is arranged on the machine table 1. The slope support 62 is slidingly connected to the first support 61. The first driving device 63 drives the slope support 62 to slide up and down along the first support 61. The slope support 62 is arranged at a certain angle with the first support 61. The mounting support 64 is slidingly connected to the slope support 62. The second driving device 65 drives the mounting support 64 to slide along the slope support 62. The rotary driving device 66 is arranged on the mounting support 64. The first cylinder clamping jaws 67 are connected to the rotary driving device 66. The rotary driving device 66 drives the first cylinder clamping jaws 67 to rotate. In the specific implementation, the first support 61 is provided with a first sliding rail 611. The side of the slope support 62 facing the first support 61 is provided with a first sliding table (not shown in the figure). The first sliding table is slidingly connected to the first sliding rail 611. The first driving device 63 drives the slope support 62 to move upward by a preset distance along the first sliding rail 611, and drives the slope support 62, the mounting support 64, and the first cylinder clamping jaws 67 to move upward. The second driving device 65 drives the mounting support 64 to slide along the slope support 62 towards the second limiting jig 32, drives the first cylinder clamping jaws 67 to approach the second limiting jig 32 and clamps the first chip component on the second limiting jig 32. The second driving device 65 drives the mounting support 64 to slide along the slope support 62 away from the second limiting jig 32, drives the first cylinder clamping jaws 67 and the first chip component to move away from the second limiting jig 32. The rotary driving device 66 drives the first cylinder clamping jaws 67 to rotate by a preset angle, so that the position of the first cylinder clamping jaws 67 is aligned with the first limiting jig 31. The first driving device 63 drives the slope support 62 to move downward by a preset distance along the first support 61, drives the slope support 62, the mounting support 64, the first cylinder clamping jaws 67, and the first chip component to move downward to above the first limiting jig 31. The first cylinder clamping jaws 67 place the first chip component in the limiting groove 30 of the first limiting jig 31.

[0034] Please refer to Figure 3The crimping grabbing mechanism 7 comprises a second support 71, a second support table 75, a taking unit 72, a crimping unit 73, a third driving device (not shown in the figure), and a fourth driving device 74. The second support 71 is arranged above the fixed disc 21 and the machine table 1. Specifically, one side of the second support 71 is connected to the fixed disc 21, and the other side of the second support 71 is connected to the machine table 1. The second support table 75 is arranged on the top of the second support 71 and above the feeding device 8 and the turntable 2. The taking unit 72 and the crimping unit 73 are respectively connected to the second support table 75 in a sliding manner. The third driving device drives the taking unit 72 to slide along the second support 71, so that the taking unit 72 moves from above the first limiting jig 31 to above the feeding device 8 and moves up and down in the vertical direction. The fourth driving device 74 drives the crimping unit 73 to slide along the second support 71, so that the crimping unit 73 moves above the first limiting jig 31 and moves in the vertical direction to crimp the first chip assembly on the first limiting jig 31. Specifically, the crimping unit 73 is used to further press the cable connected with the first chip assembly into the cable slot on the first chip assembly. In specific implementation, the top of the second support table 75 is provided with a sliding rail, and the side of the crimping unit 73 and the taking unit 72 close to the second support table 75 is respectively provided with a sliding table. The crimping unit 73 and the taking unit 72 are connected to the second support table 75 in a sliding manner through the sliding table and the sliding rail. The fourth driving device 74 is a fourth cylinder, which drives the crimping unit 73 to slide along the second support table 75 to above the first limiting jig 31. The crimping unit 73 moves downward to press the cable into the cable slot of the chip upper cover. The third driving device is a third cylinder, which drives the taking unit 72 to slide along the second support 71 to above the feeding device 8. The taking unit 72 moves downward in the vertical direction to approach the feeding device 8 and grabs the chip lower cover. The taking unit 72 moves upward in the vertical direction. The third cylinder drives the taking unit 72 to slide along the second support 71 to above the first limiting jig 31. The taking unit 72 moves downward and places the chip lower cover on the first chip assembly and covers it.

[0035] The crimping unit 73 comprises a fifth driving device 731, a crimping piece 732, a first mounting plate 733, and a second mounting plate 734. The second mounting plate 734 is slidingly connected to the second support table 75. The fifth driving device 731 is mounted on the second mounting plate 734. The first mounting plate 733 is vertically connected to the second mounting plate 734. The crimping piece 732 is slidingly connected to the first mounting plate 733. The number of the crimping pieces 732 corresponds to the number of the limiting grooves, so as to improve the work efficiency. In this embodiment, the number of the crimping pieces 732 is two. The fifth driving device 731 drives the crimping piece 732 to slide up and down along the first mounting plate 733, so as to approach or move away from the first chip assembly. In specific implementation, the fifth driving device 731 is a fifth cylinder. The fifth cylinder drives the crimping piece 732 to slide downward along the first mounting plate 733, so as to approach the first limiting jig 31. The crimping piece 732 crimps the cable on the first limiting jig 31, and presses the cable into the cable groove of the chip upper cover.

[0036] Specifically, the taking unit 72 comprises a sixth driving device 721, a second cylinder clamp jaw 722, a third mounting plate 723, and a fourth mounting plate 724. The third mounting plate 723 is slidingly connected to the second support table 75. The sixth driving device 721 is mounted on the third mounting plate 723. The fourth mounting plate 724 is vertically connected to the third mounting plate 723. The second cylinder clamp jaw 722 is slidingly connected to the fourth mounting plate 724. The sixth driving device 721 drives the second cylinder clamp jaw 722 to slide up and down along the fourth mounting plate 724. The number of the second cylinder clamp jaws 722 corresponds to the number of the limiting grooves, so as to improve the work efficiency. In this embodiment, the number of the second cylinder clamp jaws 722 is two. In specific implementation, the sixth driving device 721 is a sixth cylinder. The sixth cylinder drives the second cylinder clamp jaw 722 to slide downward along the third mounting plate 723, so as to approach the feeding device 8. The second cylinder clamp jaw 722 clamps the chip lower cover on the feeding device 8. The sixth cylinder drives the second cylinder clamp jaw 722 to slide upward along the third mounting plate 723, so as to move away from the feeding device 8. The third cylinder drives the third mounting plate 723 to slide along the second support 71 to above the first limiting jig 31, so as to drive the second cylinder clamp jaw 722 to move to above the first limiting jig 31. The sixth cylinder drives the second cylinder clamp jaw 722 to slide downward along the third mounting plate 723 to the first limiting jig. The second cylinder clamp jaw 722 places the chip lower cover on the first chip assembly and covers it.

[0037] The feeding device 8 comprises a feeding guide rail 82 and a vibrating disc 81. The feeding guide rail 82 is arranged below the crimping grabbing mechanism 7. One end of the feeding guide rail 82 is connected to the vibrating disc 81, so as to automatically feed the chip lower cover. The vibrating disc 81 vibrates to convey the chip lower cover to the feeding guide rail 82. The chip lower cover is arranged in an orderly manner on the feeding guide rail 82. The feeding guide rail 82 conveys the chip lower cover to the lower side of the taking unit 72.

[0038] Please refer to Figure 5 , the blanking mechanism 9 comprises: a fourth support 91, a fourth support table 92, a third clamping unit 93, a fourth clamping unit 94, an eighth driving device (not shown in the figure), a ninth driving device (not shown in the figure), the fourth support 91 is arranged on the machine table, the fourth support table 92 is arranged on the top of the fourth support 91, the third clamping unit 93 and the fourth clamping unit 94 are respectively connected with the fourth support table 92 in sliding mode, the eighth driving device drives the third clamping unit 93 to slide along the fourth support table 92, the ninth driving device drives the fourth clamping unit 94 to slide along the fourth support table 92, the third clamping unit 93 and the fourth clamping unit 94 move up and down in the vertical direction; in this embodiment, the upper side of the fourth support table 92 is provided with a fourth sliding rail 921, the third clamping unit 93 comprises: a third sliding table 931, a third connecting plate 932, a third cylinder clamping jaw 933, and a tenth driving device 934, the third sliding table 931 is connected with the fourth sliding rail 921 in sliding mode, the eighth driving device is an eighth cylinder, the eighth cylinder drives the third sliding table 931 to slide along the fourth support table 92, the tenth driving device 934 is a tenth cylinder, the tenth cylinder is connected with the third sliding table 931 in the vertical direction, the third cylinder clamping jaw 933 is connected with the cylinder rod of the tenth cylinder through the third connecting plate 932, the cylinder rod of the tenth cylinder is elongated, drives the third connecting plate 932 and the third cylinder clamping jaw 933 to move downward in the vertical direction to approach and clamp the chip assembly product, or the cylinder rod of the tenth cylinder is shortened, drives the third cylinder clamping jaw to move upward in the vertical direction and away from the first limiting jig 31, the number of the third cylinder clamping jaw 933 corresponds to the number of the limiting groove, so as to improve the work efficiency, in this embodiment, the number of the third cylinder clamping jaw 933 is 2; the structure of the fourth clamping unit 94 is the same as that of the third clamping unit 93, the fourth clamping unit 94 is used for clamping the cable of the chip assembly product; the blanking mechanism 9 further comprises: a conveying table 90, the conveying table 90 is arranged below the fourth support table 92, the chip assembly product clamped by the third clamping unit 93 and the fourth clamping unit 94 is placed on the conveying table 90; in specific implementation, the third clamping unit 93 and the fourth clamping unit 94 move downward at the same time and clamp the chip assembly product, wherein the third clamping unit 93 clamps the main body part of the chip assembly product, and the fourth clamping unit 94 clamps the cable part of the chip assembly product, then the third clamping unit 93 and the fourth clamping unit 94 move upward at the same time, the eighth driving device drives the third clamping unit 93 to slide along the fourth support table 92, the ninth driving device drives the fourth clamping unit 94 to slide along the fourth support table 92 to above the conveying table 90, the third clamping unit 93 and the fourth clamping unit 94 release the chip assembly product at the same time, and the chip assembly product falls on the conveying table 90 for conveying.

[0039] The dispensing and curing assembly device further comprises an electric control mechanism (not shown in the figure) electrically connected to the dispensing mechanism 4, the curing mechanism 5, the assembly transfer mechanism 6, the crimping and grabbing mechanism 7, and the discharging mechanism 9. In the embodiment, the electric control mechanism electrically connects and controls the dispensing mechanism 4, the curing mechanism 5, the assembly transfer mechanism 6, the crimping and grabbing mechanism 7, and the discharging mechanism 9 to perform operations, realize dispensing, curing, installing a chip lower cover on the first chip assembly, discharging the chip assembly product, and realize automatic operation of the dispensing and curing assembly device.

[0040] In the specific embodiment, the first chip assembly installed in the previous process is placed on the second limiting jig 32. With the rotation of the rotating disc 22, the second limiting jig 32 and the first chip assembly are rotated to the lower side of the dispensing mechanism 4. The dispensing mechanism 4 dispenses the first chip assembly. The rotating disc 22 rotates to drive the second limiting jig 32 and the first chip assembly to the lower side of the curing mechanism 5. The curing mechanism 5 cures the glue on the first chip assembly. The rotating disc 22 continues to rotate to drive the second limiting jig 32 and the first chip assembly to the assembly transfer mechanism 6. The first cylinder clamping jaw 67 clamps and transfers the first chip assembly on the second limiting jig 32 to the nearest first limiting jig 31. The rotating disc 22 continues to rotate to drive the first limiting jig 31 and the first chip assembly to the lower side of the crimping and grabbing mechanism 7. The crimping unit 73 moves downward to crimp the cable into the cable groove of the chip upper cover. At the same time, the vibration disc 81 vibrates to convey the chip lower cover to the feeding guide rail 82 and to the lower side of the material taking unit 72. The material taking unit 72 moves downward to grab the chip lower cover and moves to the upper side of the first limiting jig 31 and the first chip assembly. The material taking unit 72 moves downward and covers the chip lower cover on the first chip assembly. The rotating disc 22 continues to rotate to drive the first limiting jig 31 and the assembled chip assembly product to the discharging mechanism 9. The third clamping unit 93 clamps the main body part of the chip assembly product, and the fourth clamping unit 94 clamps the cable part of the chip assembly product and moves to the upper side of the conveying table 90. The third clamping unit 93 and the fourth clamping unit 94 simultaneously release the chip assembly product, and the chip assembly product falls on the conveying table 90 for conveying.

[0041] The utility model discloses a kind of dispensing curing assembly equipment, by dispensing mechanism, curing mechanism, assembly transfer mechanism, crimping grabbing mechanism are sequentially arranged along the rotation direction of carousel, and multiple first limit fixtures and multiple second limit fixtures are connected to carousel, when initial position, first chip assembly is placed in second limit fixture, with carousel rotation, multiple first chip assemblies are dispensed by dispensing mechanism, curing mechanism is cured to the first chip assembly after dispensing, assembly transfer mechanism transfers the first chip assembly after dispensing from second limit fixture to first limit fixture, crimping grabbing mechanism is crimped to cable, and lower cover of chip is covered to the first chip assembly, blanking mechanism is discharged to the first chip assembly product of assembly completion, by multiple first limit fixtures, second limit fixture, it can satisfy in shorter time to multiple first chip assemblies are dispensed, cured, transfer, crimping, covering and so on Process, improve the automation degree and operation efficiency of operation, effectively solve the technical defects that the operation efficiency of first chip assembly is relatively low in related art by using manual mode to dispense, cure, install chip lower cover, greatly improve the automation degree of operation, and stable and reliable in operation, effectively reduce production cost, can improve the quality of product, can satisfy the scale production of enterprise.

[0042] The above is merely a specific embodiment of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can easily think of various equivalent modifications or replacements within the technical range disclosed by the present application, and these modifications or replacements shall be encompassed within the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A dispensing, curing, and assembly equipment, characterized in that, The utility model relates to a chip assembly production line, which comprises a machine table, a rotating disc connected to the machine table for station switching, a plurality of first limiting fixtures arranged at the edge of the rotating disc, a plurality of limiting grooves for placing a first chip assembly arranged on the surface of the first limiting fixture away from the rotating disc, a plurality of second limiting fixtures arranged beside the first limiting fixture through a fixture support, the second limiting fixture being identical in structure to the first limiting fixture, the first chip assembly being placed on the second limiting fixture in the initial position, a dispensing mechanism for dispensing the first chip assembly placed on the second limiting fixture, a curing mechanism for curing the first chip assembly after dispensing, an assembly transfer mechanism for grabbing the first chip assembly from the second limiting fixture to the first limiting fixture, a pressure bonding and grabbing mechanism for pressure bonding the first chip assembly, grabbing a lower cover of a chip above the first limiting fixture, and covering the lower cover of the chip on the first chip assembly, a feeding device arranged below and beside the pressure bonding and grabbing mechanism for feeding the lower cover of the chip, and a discharging mechanism for discharging the chip assembly product after assembly. The rotating disc comprises a rotating disc, a fixed disc, and a rotating disc driving device, the rotating disc is rotationally connected to the machine table, the rotating disc driving device drives the rotating disc to rotate, the fixed disc is arranged above the rotating disc, a plurality of first limiting fixtures are arranged at the edge of the rotating disc, and a plurality of second limiting fixtures are arranged on the rotating disc through a fixture support and beside the first limiting fixtures. The dispensing mechanism comprises a third support, a positioning plate, a dispensing needle head assembly, and a seventh driving device, the third support is arranged on the machine table, the positioning plate is arranged at a certain angle with the third support, the dispensing needle head assembly is slidably connected to the positioning plate, and the seventh driving device drives the dispensing needle head assembly to slide along the positioning plate. The assembly transfer mechanism comprises a first support, an inclined plate support, a first driving device, a mounting support, a second driving device, a rotary driving device, and a first cylinder clamping jaw, the first support is arranged on the machine table, the inclined plate support is slidably connected to the first support, the first driving device drives the inclined plate support to slide up and down along the first support, the mounting support is slidably connected to the inclined plate support, the second driving device drives the mounting support to slide along the inclined plate support, the rotary driving device is arranged on the mounting support, the first cylinder clamping jaw is connected to the rotary driving device, and the rotary driving device drives the first cylinder clamping jaw to rotate. ​ ​ ​ ​ ​ ​ ​ ​ 2. The glue dispensing and curing assembly apparatus of claim 1, wherein, ​ 3. The glue dispensing curing assembly apparatus of claim 1, wherein, ​ 4. The glue dispensing and curing assembly apparatus of claim 1, wherein, ​ 5. The glue dispensing curing assembly apparatus of claim 1, wherein, The crimping grabbing mechanism comprises a second support, a second support table, a material taking unit, a crimping unit, a third driving device and a fourth driving device. The second support is arranged above the fixed disc and the machine table. The second support table is arranged on the top of the second support. The second support table is arranged above the feeding device and the rotating disc. The material taking unit and the crimping unit are slidably connected with the second support table. The third driving device drives the material taking unit to slide along the second support, so that the material taking unit moves from above the first limiting jig to above the feeding device. The material taking unit moves up and down in the vertical direction. The fourth driving device drives the crimping unit to slide along the second support, so that the crimping unit moves to above the first limiting jig. The crimping unit moves in the vertical direction and crimps the first chip assembly on the first limiting jig.

6. The glue dispensing curing assembly apparatus of claim 5, wherein, The crimping unit comprises a fifth driving device, a crimping piece, a first mounting plate and a second mounting plate. The second mounting plate is slidably connected with the second support table. The fifth driving device is mounted on the second mounting plate. The first mounting plate is vertically connected with the second mounting plate. The crimping piece is slidably connected with the first mounting plate. The fifth driving device drives the crimping piece to slide along the first mounting plate.

7. The glue-curing assembly apparatus of claim 5, wherein, The material taking unit comprises a sixth driving device, a second cylinder clamp jaw, a third mounting plate and a fourth mounting plate. The third mounting plate is slidably connected with the second support table. The sixth driving device is mounted on the third mounting plate. The fourth mounting plate is vertically connected with the third mounting plate. The second cylinder clamp jaw is slidably connected with the fourth mounting plate. The sixth driving device drives the second cylinder clamp jaw to slide up and down along the fourth mounting plate.

8. The glue dispensing curing assembly apparatus of claim 1, wherein, The feeding device comprises a feeding guide rail and a vibrating disc. The feeding guide rail is arranged below the crimping grabbing mechanism. The vibrating disc is arranged beside the crimping grabbing mechanism. One end of the feeding guide rail is connected with the vibrating disc, which is used for automatically feeding the chip lower cover.

9. The glue dispensing curing assembly apparatus of claim 1, wherein, The discharging mechanism comprises a fourth support, a fourth support table, a third clamping unit, a fourth clamping unit, an eighth driving device and a ninth driving device. The fourth support is arranged on the machine table. The fourth support table is arranged on the top of the fourth support. The third clamping unit and the fourth clamping unit are slidably connected with the fourth support table. The eighth driving device drives the third clamping unit to slide along the fourth support table. The ninth driving device drives the fourth clamping unit to slide along the fourth support table. The third clamping unit and the fourth clamping unit can slide up and down in the vertical direction.

10. The glue dispensing curing assembly apparatus of claim 9, wherein, The discharging mechanism further comprises a conveying table. The conveying table is arranged below the fourth support table. The chip assembly products clamped by the third clamping unit and the fourth clamping unit are placed on the conveying table.

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