Machining jig for gantry electroplating line of glass substrate in electroplating process

By using a processing fixture designed with flexible contact bodies and conductive elastic bodies, the problem of glass substrate breakage caused by clamping during electroplating was solved, achieving balanced force and efficient electroplating.

CN223607182UActive Publication Date: 2025-11-28TIANJIN PRINTRONICS CIRCUIT CORP
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Patent Information

Application Number
CN202423046171.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-10
Publication Date
2025-11-28
Estimated Expiration
2034-12-10

AI Technical Summary

Technical Problem

In the prior art, the use of high-hardness grippers to hold glass substrates during electroplating processes can easily lead to breakage, increasing manufacturing costs and reducing processing efficiency.

Method used

The processing fixture, which employs a flexible contact body and a conductive elastic body, avoids the glass substrate from breaking due to excessive rigidity by using a soft connection between the flexible contact body and the glass substrate, combined with the elastic deformation of the conductive elastic body, and provides balanced force through a frame-shaped fixture.

Benefits of technology

This effectively prevents the glass substrate from breaking due to uneven stress during the electroplating process, reducing manufacturing costs and improving processing efficiency.

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Abstract

The utility model provides a processing jig for a gantry electroplating line of a glass substrate in an electroplating process. The processing jig comprises an upper jig and a lower jig which are oppositely clamped on the upper surface and the lower surface of the glass substrate, the upper jig and the lower jig are each provided with a flexible contact body used for abutting against a glass substrate and a conductive elastic body used for conducting electricity. The upper jig and the lower jig are used for clamping the glass substrate, so that the glass substrate obtains a larger stress area, and the stress on the surface of the glass substrate is balanced; the flexible contact body is used for abutting against the glass substrate, so that the abutting points of the upper jig and the lower jig and the glass substrate are soft contact points, the situation that the rigidity of the abutting points is too large, and consequently the glass substrate is broken in the force conduction process is avoided, and the flexible contact body is not damaged in the process that the glass substrate is clamped by the upper jig and the lower jig. The pressure is gradually applied to the glass substrate through self deformation, so that the situation that the glass substrate instantly bears larger pressure is avoided, the situation that the glass substrate is broken is avoided, the manufacturing cost is reduced, and the processing efficiency is indirectly improved.
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Description

TECHNICAL FIELD

[0001] The utility model relates to electroplating process glass substrate processing technical field, concretely relates to a kind of processing fixture for electroplating process glass substrate gantry electroplating line. BACKGROUND

[0002] Electroplating glass substrate material is mainly composed of silicon dioxide, and the existing substrate material electroplating processing method is as follows: using conductive clamp (alias: electroplating line flying target on fast clamp) to clamp PCB board edge for electroplating processing;

[0003] However, since the glass substrate is thin and fragile, when the conductive clamp is used to clamp the glass substrate, the hard jaw often breaks the glass substrate when contacting the glass substrate, which increases the manufacturing cost and reduces the processing efficiency. UTILITY MODEL CONTENT

[0004] Therefore, the utility model wants to solve the problem to provide a kind of processing fixture for electroplating process glass substrate gantry electroplating line.

[0005] To solve the above technical problem, the technical scheme adopted by the utility model is:

[0006] A kind of processing fixture for electroplating process glass substrate gantry electroplating line, including the upper fixture and lower fixture for being clamped on the upper surface and lower surface of glass substrate relative to;

[0007] The upper fixture and lower fixture are both installed with flexible contact for abutting glass substrate and conductive spring for conducting electricity.

[0008] The upper fixture and lower fixture are both frame-shaped structures, and the side of the upper fixture and lower fixture is configured with internal thread through slot.

[0009] The flexible contact is of rubber material, and the axial section of flexible contact is T-shaped structure, including support foot and flexible head for contacting glass substrate, and the upper fixture and lower fixture are both configured with embedding slot corresponding to support foot.

[0010] The conductive spring is of inverted Z-shaped structure, including conductive head and conductive foot, and the conductive foot is horizontally arranged relative to the upper fixture or lower fixture, and the included angle of the conductive head relative to the upper fixture or lower fixture is acute.

[0011] Flexible contact and conductive spring are spaced apart on the upper fixture and lower fixture.

[0012] The utility model has the advantages and positive effects that:

[0013] The glass substrate is clamped by the upper jig and the lower jig, so that the glass substrate has a larger stress area and the surface of the glass substrate is balanced; the flexible contact body abuts against the glass substrate, so that the abutting points of the upper and lower jigs and the glass substrate are soft contact points, thereby avoiding that the abutting points are too rigid and cause the glass substrate to be broken in the force transmission process; and the flexible contact body can gradually apply pressure to the glass substrate through its own deformation in the process of clamping and holding the glass substrate by the upper and lower jigs, so as to avoid that the glass substrate bears a large pressure instantaneously and to avoid the glass substrate from being broken, thereby reducing the manufacturing cost and indirectly improving the processing efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0014] The accompanying drawings are used to provide a further understanding of the present application, and constitute a part of the specification, and are used to explain the present application together with embodiments of the present application, and do not constitute a limitation on the present application. In the drawings:

[0015] Figure 1 is a whole structure diagram of a processing jig of a glass substrate gantry plating line in an electroplating process of the present application;

[0016] Figure 2 is a structure diagram of the lower jig;

[0017] Figure 3 is a structure diagram of the flexible contact body;

[0018] Figure 4 is a structure diagram of the conductive elastic body;

[0019] Figure 5 is Figure 1 with a conductive clamp;

[0020] In the drawings: glass substrate 1, upper jig 2, lower jig 3, flexible contact body 4, flexible head 41, supporting foot 42, conductive elastic body 5, conductive head 51, conductive foot 52, long screw 6, conductive clamp 8. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0022] It should be understood that when a component is referred to as being "on" another component, it can be directly on the other component or intervening components can also be present. When a component is referred to as being "connected" to another component, it can be directly connected to the other component, or intervening components can be present. When a component is referred to as being "disposed on" another component, it can be directly disposed on the other component or intervening components can be present. The terms "vertical", "horizontal", "left", "right", and similar terms as used herein are for purposes of description only.

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0024] As shown in the drawings, Figure 1 With Figure 2 With Figure 5 As shown in the drawings, the utility model provides a kind of processing fixture for glass substrate gantry plating line of electroplating process, including for relative clamping on the upper surface and lower surface of glass substrate 1 upper fixture 2 and lower fixture 3;

[0025] The upper fixture 2 and the lower fixture 3 are clamped to the jaw of the conductive clamp 8, so that the glass substrate 1 can obtain a larger stress area, and the surface of the glass substrate 1 is balanced.

[0026] The upper fixture 2 and the lower fixture 3 are clamped to the jaw of the conductive clamp 8, so that the glass substrate 1 can obtain a larger stress area, and the surface of the glass substrate 1 is balanced.

[0027] The upper fixture 2 and the lower fixture 3 are clamped to the jaw of the conductive clamp 8, so that the glass substrate 1 can obtain a larger stress area, and the surface of the glass substrate 1 is balanced.

[0028] Specifically, the upper fixture 2 and the lower fixture 3 are frame-shaped structures, which can reduce the weight of the fixture and facilitate observation of the real-time changes of the glass substrate 1 during the electroplating process.

[0029] Specifically, the upper jig 2 and the lower jig 3 are both configured with internal thread through grooves, the upper surface and the lower surface of the glass substrate 1 are respectively abutted on the flexible contact 4 and the conductive elastic body 5 of the upper jig 2 and the lower jig 3, and the relative position of the upper jig 2, the lower jig 3 and the glass substrate 1 is fixed by connecting the internal thread through grooves through the long screw 6.

[0030] As shown in the figure, specifically, the flexible contact 4 is made of rubber material, such as acid and alkali resistant PU rubber, the axial section of the flexible contact 4 is T-shaped structure, including a supporting leg 42 and a flexible head 41 for contacting the glass substrate 1, the upper jig 2 and the lower jig 3 are both configured with a corresponding embedded groove of the supporting leg 42, and the flexible contact 4 is connected with the upper jig 2 and the lower jig 3 by clamping the embedded groove through the supporting leg 42. Figure 3

[0031] As shown in the figure, specifically, the conductive elastic body 5 is inverted Z-shaped structure, including a conductive head 51 and a conductive leg 52, the conductive leg 52 is horizontally arranged relative to the upper jig 2 or the lower jig 3, and the relative fixed connection is realized by penetrating the conductive leg 52 and the upper jig 2 or the lower jig 3 through the fastening screw, the included angle of the conductive head 51 relative to the upper jig 2 or the lower jig 3 is acute, so that the conductive head 51 is upwardly curved relative to the glass substrate 1, and the conductive head 51 can be elastically deformed when the glass substrate 1 is extruded, so as to realize the elastic abutment with the glass substrate 1, that is, to avoid the disconnection with the glass substrate 1 under the external force, and the flexible contact 4 can also be used to support the glass substrate 1 together. Figure 4

[0032] Specifically, the main body material of the glass substrate 1 is stainless steel or titanium, and the main body material of the conductive elastic body 5 is titanium.

[0033] The flexible contact 4 and the conductive elastic body 5 are arranged at intervals on the upper jig 2 and the lower jig 3.

[0034] The working principle and working process of the utility model are as follows:

[0035] The conductive elastic body 5 is connected with the upper jig 2 or the lower jig 3 by penetrating the conductive leg 52 and the upper jig 2 or the lower jig 3 through the fastening screw, and the flexible contact 4 is connected with the upper jig 2 or the lower jig 3 by clamping the embedded groove through the supporting leg 42 of the flexible contact 4;

[0036] ​​The lower surface of the glass substrate 1 is abutted on the flexible contact 4 and the conductive elastic body 5 of the lower jig 3, then the upper jig 2 is covered on the upper surface of the glass substrate 1, so that the flexible contact 4 and the conductive elastic body 5 of the upper jig 2 are abutted on the upper surface of the glass substrate 1, the relative position of the upper jig 2, the lower jig 3 and the glass substrate 1 is fixed by screwing the long strip screw 6 into the internal thread through slot.

[0037] The above detailed description of the embodiments of the present application is only a preferred embodiment of the present application, and cannot be considered as limiting the scope of the present application. Any equivalent changes and improvements within the scope of the present application should still belong to the scope of the present patent.

Claims

1. A processing jig for a glass substrate gantry plating line of an electroplating process, characterized by, The upper clamp (2) and the lower clamp (3) are arranged on the upper surface and the lower surface of the glass substrate (1) respectively; The upper clamp (2) and the lower clamp (3) are provided with flexible contact bodies (4) for abutting against the glass substrate (1) and conductive elastic bodies (5) for conducting electricity.

2. The processing tool for the glass substrate gantry plating line of the electroplating process according to claim 1, wherein, The upper clamp (2) and the lower clamp (3) are both in the form of a frame, and the side of the upper clamp (2) and the side of the lower clamp (3) are both provided with an internally-threaded through slot.

3. The processing tool for the glass substrate gantry plating line of claim 1, wherein, The flexible contact body (4) is made of rubber, and the axial cross section of the flexible contact body (4) is in the form of a T, comprising a supporting foot (42) and a flexible head (41) for contacting the glass substrate (1), and the upper clamp (2) and the lower clamp (3) are both provided with a corresponding slot for the supporting foot (42).

4. The processing tool for the glass substrate gantry plating line of claim 1, wherein, The conductive elastic body (5) is in the form of an inverted Z, comprising a conductive head (51) and a conductive foot (52), the conductive foot (52) is horizontally arranged relative to the upper clamp (2) or the lower clamp (3), and the included angle between the conductive head (51) and the upper clamp (2) or the lower clamp (3) is an acute angle.

5. The processing tool for the glass substrate gantry plating line of claim 1, wherein, The flexible contact body (4) and the conductive elastic body (5) are arranged on the upper clamp (2) and the lower clamp (3) at intervals.