Automatic liquid medicine adding device for electroplating

Abstract

An automatic liquid medicine adding device for electroplating relates to the technical field of electroplating tools and comprises a medicine adding box, an electroplating mother tank and an electroplating son tank, the medicine adding box is communicated with an inner cavity of the electroplating mother tank through a medicine adding pump, the electroplating mother tank is communicated with the electroplating son tank through a circulating pump, and the electroplating son tank is provided with a circulating sewer pipe extending into the electroplating mother tank. A supporting shell located below the circulating sewer pipe is detachably connected into the electroplating mother tank, a main filtering shell is detachably connected into the supporting shell, the lower end of the main filtering shell is communicated with an inner cavity of the electroplating mother tank, and the upper end of the main filtering shell is lower than the upper end of the supporting shell. The utility model solves the problems that the additive is gradually consumed during production in the prior art, the balance is lost when the additive is consumed to the lower limit and the plating quality of the product cannot meet the drawing requirement, so that various batches of defects occur; and along with continuous electroplating, the content of impurities in the plating solution is increased, and the electroplating uniformity is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of electroplating utensil, concretely relates to electroplating automatic liquid medicine adding device. BACKGROUND

[0002] The existing electroplating auxiliary agent is added by manual mode, and the manual dosing for water quality control has the disadvantages of heavy workload, inaccurate dosing control, out-of-control of liquid medicine and the like. The additive is a trace amount of substance in the electroplating solution, but it can greatly change the properties of the plating layer such as appearance quality, physical quality and the like. The manual dosing is often excessive or insufficient, or the interval of dosing is too long. The insufficient dosing of the additive can cause the plating layer quality to fail to meet the requirements.

[0003] The prior art discloses a patent with a publication number CN102995096A, which comprises an electroplating tank, a pH probe arranged in the electroplating tank, a PLC controller arranged outside the electroplating tank, the PLC controller connected with an ampere-hour meter and a pH value sensor, the PLC controller connected with a timer, the timer connected with a metering pump, the metering pump connected with a dosing tank and the electroplating tank, and the dosing tank comprising a liquid dosing tank for electric degree, a metal salt solution dosing tank and a pH value dosing tank. The electroplating solution automatic dosing method comprises the following steps: connecting the automatic dosing system according to the above connection structure, starting the PLC controller, the PLC controller receiving an ampere-hour meter metering signal and / or a pH probe detection signal, and outputting control control according to the set threshold value to control the metering pump to start working, adding the reagent in the dosing tank into the electroplating tank, and stopping the dosing tank when the timer reaches the set time and / or the pH probe detection signal is less than the threshold value. The system can ensure the stability of the electroplating quality.

[0004] The existing devices including the above patent gradually expose the deficiencies of the technology with use, mainly in the following aspects:

[0005] First, the additive is gradually consumed during production, and if the dosing water is not replenished when it reaches the lower limit, the balance will be lost, the plating layer quality of the product cannot meet the requirements of the drawing, various batches of defects occur, the amount of addition is relatively strict, the accuracy of manual operation often fails, and the frequency of addition is relatively high, which needs to be added every half an hour or so, and a dedicated person is needed, which has high labor cost.

[0006] Second, the product is electroplated in the electroplating tank, and the adhesion on the surface of the product easily enters the plating solution, and with the continuous electroplating, the impurity content in the plating solution increases, reducing the uniformity of electroplating.

[0007] As can be seen from the above, the prior art has obvious inconvenience and defects in actual use, so it is necessary to improve. CONTENT OF THE UTILITY MODEL

[0008] In view of the defects in the prior art, the electroplating automatic liquid medicine adding device is used to solve the problems that the additive is gradually consumed during production in the traditional technology, the balance is lost when the additive is not supplemented when the consumption reaches the lower limit, the plating layer quality of the product cannot meet the requirements of the drawing, various batch defects occur, and the impurity content in the plating solution increases with the continuous electroplating, and the electroplating uniformity is reduced.

[0009] In order to achieve the above-mentioned purpose, the utility model provides the following technical scheme.

[0010] The electroplating automatic liquid medicine adding device comprises a medicine adding box, an electroplating mother tank and an electroplating sub-tank, the medicine adding box is communicated with the inner cavity of the electroplating mother tank through a medicine adding pump, the electroplating mother tank is communicated with the electroplating sub-tank through a circulating pump,

[0011] The electroplating sub-tank is provided with a circulating downcomer extending into the electroplating mother tank,

[0012] The electroplating mother tank is detachably connected with a supporting shell below the circulating downcomer, the supporting shell is detachably connected with a main filter shell, the lower end of the main filter shell is communicated with the inner cavity of the electroplating mother tank, the upper end of the main filter shell is lower than the upper end of the supporting shell, and an auxiliary filter channel is formed between the outer wall of the main filter shell and the inner wall of the supporting shell, and the auxiliary filter channel is communicated with the inner cavity of the electroplating mother tank.

[0013] As an optimized scheme, the top of the medicine adding box is fixedly connected with a medicine adding port, and a liquid level sensor is further fixedly arranged in the medicine adding box.

[0014] As an optimized scheme, the upper end of the main filter shell is provided with an opening, the lower end of the main filter shell is uniformly provided with a main liquid leakage hole, and the lower end of the supporting shell is provided with an avoiding channel avoiding the main liquid leakage hole.

[0015] As an optimized scheme, the outer bottom surface of the main filter shell is fixedly connected with a plug-in positioning ring, and the plug-in positioning ring is plugged into the avoiding channel.

[0016] As an optimized scheme, a plurality of layers of main filter cotton are arranged in parallel from top to bottom in the main filter shell.

[0017] As an optimized scheme, a plurality of layers of auxiliary filter cotton are arranged in parallel from top to bottom in the auxiliary filter channel.

[0018] As an optimized scheme, the supporting shell is uniformly provided with an auxiliary liquid leakage hole on the bottom surface of the auxiliary filter channel.

[0019] As an optimization scheme, the inner wall of the support shell is fixed with an infrared sensor, and the height of the infrared sensor is lower than the upper port of the main filter shell.

[0020] As an optimization scheme, the outer wall of the support shell is fixed with a hanger, and the hanger is supported on the side wall of the electroplating mother tank.

[0021] As an optimization scheme, the upper port of the main filter shell is fixed with a handle side by side.

[0022] As an optimization scheme, the dosing tank is fixed on the support frame, and the top of the support frame is provided with a control cabinet.

[0023] Compared with the prior art, the beneficial effects of the utility model are:

[0024] By connecting the dosing tank with the electroplating mother tank through the dosing pump, the electroplating mother tank is automatically supplied with the liquid medicine, so that the added additives can be distributed in the electroplating liquid,

[0025] By arranging the liquid level sensor in the dosing tank, the amount of the added additives can be reduced to reach the alarm line to prompt the need for supplementing the additives, and the manually prepared additives outside the line are supplemented into the dosing tank through the dosing port.

[0026] By arranging the filtering structure in the electroplating mother tank, the impurities in the electroplating liquid can be filtered, and the influence on the product electroplating is reduced.

[0027] By arranging the upper port of the main filter shell lower than the upper port of the support shell, when the main filter cotton is blocked, the electroplating liquid can overflow from the upper port of the main filter shell to the auxiliary filtering channel, and the auxiliary filter cotton is used for filtering, so that the filtering efficiency is ensured, and the flow of the electroplating liquid is not affected due to the blockage.

[0028] By arranging the infrared sensor in the auxiliary filtering channel, when the electroplating liquid overflows into the auxiliary filtering channel, the infrared sensor can detect the overflow, and the operator can be reminded that the main filter cotton is blocked, so that the operator can maintain the main filter cotton in time, and the electroplating efficiency is improved. BRIEF DESCRIPTION OF DRAWINGS

[0029] In order to more clearly illustrate the specific embodiment of the utility model or the technical scheme in the prior art, the drawings needed in the specific embodiment or the prior art description will be briefly introduced below. In all the drawings, similar elements or parts are generally indicated by similar reference numerals. In the drawings, each element or part is not necessarily drawn according to the actual proportion.

[0030] Figure 1 It is a structural schematic view of the utility model;

[0031] Figure 2 It is a structural schematic view of the support shell of the utility model.

[0032] In the drawing: 1-chemical feeding tank; 2-electroplating mother tank; 3-electroplating sub-tank; 4-chemical feeding pump; 5-circulating pump; 6-control cabinet; 7-circulating downcomer; 8-support shell; 9-main filter shell; 10-lifting handle; 11-main liquid leakage hole; 12-avoidance passage; 13-accessory liquid leakage hole; 14-inserted positioning ring; 15-main filter cotton; 16-accessory filter cotton; 17-infrared sensor; 18-hanging rack. DETAILED DESCRIPTION

[0033] The embodiments of the technical scheme of the utility model will be described in detail below with reference to the drawings. The following embodiments are only used to more clearly illustrate the technical scheme of the utility model, and therefore only serve as examples, and cannot limit the protection scope of the utility model.

[0034] As shown in Figure 1 and Figure 2 The electroplating automatic liquid adding device comprises a chemical feeding tank 1, an electroplating mother tank 2 and an electroplating sub-tank 3. The chemical feeding tank 1 is connected with the inner cavity of the electroplating mother tank 2 through a chemical feeding pump 4. The electroplating mother tank 2 is connected with the electroplating sub-tank 3 through a circulating pump 5.

[0035] The electroplating sub-tank 3 is provided with a circulating downcomer 7 extending into the electroplating mother tank 2.

[0036] The electroplating mother tank 2 is detachably connected with a support shell 8 below the circulating downcomer 7. The support shell 8 is detachably connected with a main filter shell 9. The lower end of the main filter shell 9 is connected with the inner cavity of the electroplating mother tank 2. The upper end of the main filter shell 9 is lower than the upper end of the support shell 8. An auxiliary filter passage is formed between the outer wall of the main filter shell 9 and the inner wall of the support shell 8. The auxiliary filter passage is connected with the inner cavity of the electroplating mother tank 2.

[0037] The top of the chemical feeding tank 1 is fixedly connected with a chemical feeding port. A liquid level sensor is also fixedly arranged in the chemical feeding tank 1.

[0038] The upper end of the main filter shell 9 is provided with an opening. The lower end of the main filter shell 9 is uniformly provided with main liquid leakage holes 11. The lower end of the support shell 8 is provided with an avoidance passage 12 avoiding the main liquid leakage holes 11.

[0039] The outer bottom surface of the main filter shell 9 is fixedly connected with an inserted positioning ring 14. The inserted positioning ring 14 is inserted into the avoidance passage 12.

[0040] A plurality of layers of main filter cotton 15 are arranged in parallel from top to bottom in the main filter shell 9.

[0041] A plurality of layers of accessory filter cotton 16 are arranged in parallel from top to bottom in the auxiliary filter passage.

[0042] The auxiliary liquid leakage holes 13 are uniformly distributed on the bottom surface of the support shell 8 in the auxiliary filtering channel.

[0043] The infrared sensor 17 is fixed on the inner wall of the support shell 8, and the height of the infrared sensor 17 is lower than the upper port of the main filtering shell 9.

[0044] The hanger 18 is fixed on the outer wall of the support shell 8 and supported on the side wall of the electroplating mother tank 2 through the hanger 18.

[0045] The handle 10 is fixed on the upper port of the main filtering shell 9.

[0046] The dosing tank 1 is fixed on the support frame, and the control cabinet 6 is arranged on the top of the support frame.

[0047] The control cabinet 6 is a PLC control cabinet 6, and the connection mode and control mode of the control cabinet 6 and each electrical structure are common, which does not belong to the innovation of the present scheme, and thus is not described in detail.

[0048] The working principle of the device is as follows:

[0049] The dosing tank 1 is connected with the electroplating mother tank 2 through the dosing pump 4, so that the dosing tank 1 can automatically supply the electroplating mother tank 2 with liquid medicine, and the added additives can be distributed in the electroplating solution,

[0050] The liquid level sensor arranged in the dosing tank 1 can reduce the amount of additives to the alarm line to prompt the addition of additives, and the additives prepared outside are added into the dosing tank 1 through the dosing port;

[0051] The filtering structure arranged in the electroplating mother tank 2 can filter the impurities in the electroplating solution, thereby reducing the influence on the product electroplating;

[0052] The upper port of the main filtering shell 9 is lower than the upper port of the support shell 8, so that when the main filtering cotton 15 is blocked, the electroplating solution will overflow from the upper port of the main filtering shell 9 to the auxiliary filtering channel, and the auxiliary filtering cotton 16 can filter the overflow, so that the filtering efficiency is ensured, and the flow of the electroplating solution will not be affected due to the blockage;

[0053] The infrared sensor 17 arranged in the auxiliary filtering channel can detect the overflow of the electroplating solution into the auxiliary filtering channel, so that the operator can be reminded that the main filtering cotton 15 is blocked, and the operator can maintain the main filtering cotton 15 in time, thereby improving the electroplating efficiency.

[0054] Finally, it should be noted that: the above embodiments are used to illustrate the technical solutions of the present application, rather than limiting them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application, and they should be covered in the scope of the claims and the specification of the present application.

Claims

1. An automatic electroplating solution adding device, characterized in that: Including dosing tank (1), electroplating mother tank (2) and electroplating sub tank (3), the dosing tank (1) is communicated with the inner cavity of the electroplating mother tank (2) by dosing pump (4), the electroplating mother tank (2) is communicated with the electroplating sub tank (3) by circulating pump (5), The electroplating sub tank (3) is provided with a circulating sewer pipe (7) extending into the electroplating mother tank (2), The electroplating mother tank (2) is detachably connected with a support shell (8) below the circulating sewer pipe (7), the support shell (8) is detachably connected with a main filter shell (9), the lower end of the main filter shell (9) is communicated with the inner cavity of the electroplating mother tank (2), the upper end of the main filter shell (9) is lower than the upper end of the support shell (8), and the auxiliary filtering channel is formed between the outer wall of the main filter shell (9) and the inner wall of the support shell (8), and the auxiliary filtering channel is communicated with the inner cavity of the electroplating mother tank (2).

2. The electroplating automatic additive solution device according to claim 1, characterized in that: The top of the dosing tank (1) is fixedly connected with a dosing port, and a liquid level sensor is also fixedly arranged in the dosing tank (1).

3. The electroplating automatic additive solution device according to claim 2, characterized in that: The upper end of the main filter shell (9) is open, the lower end of the main filter shell (9) is uniformly provided with a main liquid leakage hole (11), and the lower end of the support shell (8) is provided with an avoiding channel (12) avoiding the main liquid leakage hole (11).

4. The electroplating automatic additive solution device according to claim 3, characterized in that: The outer bottom surface of the main filter shell (9) is fixedly connected with a plug-in positioning ring (14), and the plug-in positioning ring (14) is plugged into the avoiding channel (12).

5. The electroplating automatic additive solution device according to claim 4, wherein: The inside of the main filter shell (9) is provided with a plurality of layers of main filter cotton (15) from top to bottom.

6. The electroplating automatic additive solution device according to claim 5, wherein: The inside of the auxiliary filtering channel is provided with a plurality of layers of auxiliary filter cotton (16) from top to bottom.

7. The electroplating automatic additive solution device according to claim 6, characterized in that: The support shell (8) is uniformly provided with auxiliary liquid leakage holes (13) on the bottom surface of the auxiliary filtering channel.

8. The electroplating automatic additive solution device according to claim 7, characterized in that: An infrared sensor (17) is fixedly connected to the inner wall of the support shell (8), and the height of the infrared sensor (17) is lower than the upper end of the main filter shell (9).

9. The electroplating automatic additive solution device according to claim 8, characterized in that: A hanger (18) is fixedly connected to the outer wall of the support shell (8) and supported on the side wall of the electroplating mother tank (2) through the hanger (18).

10. The electroplating automatic additive solution device according to claim 9, wherein: The upper end of the main filter shell (9) is fixedly connected with a handle (10).

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