An exhaust gas treatment apparatus for a semiconductor process apparatus

Abstract

The utility model provides a kind of tail gas treatment equipment of semiconductor process equipment, and the combustion module of this tail gas treatment equipment includes main combustion cavity, auxiliary combustion cavity, main combustion cavity and auxiliary combustion cavity are interval arrangement, form the passage for air into main combustion cavity;First heat insulation layer and second heat insulation layer are set outside main combustion cavity;First heat insulation layer and main combustion cavity form the first heat insulation cavity for providing air to main combustion cavity between;Second heat insulation layer and first heat insulation layer form the second heat insulation cavity for flowing through cooling water between;By providing air to main combustion cavity can make tail gas fully burn, fully remove combustible harmful substance in tail gas;Simultaneously, the first heat insulation layer and second heat insulation layer that are arranged can play the role of double-layer heat insulation to main combustion cavity, reduce the temperature of combustion module.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor production equipment, in particular to a tail gas treatment equipment of semiconductor process equipment. BACKGROUND

[0002] In the semiconductor manufacturing process, chemical vapor deposition, physical vapor deposition, etching and other processes will produce a large amount of tail gas containing harmful substances. If these tail gases are directly discharged into the atmosphere without proper treatment, not only will it pollute the environment, but also may harm human health. Therefore, an effective tail gas treatment device is crucial to ensure the safety and environmental protection of the production process. The traditional tail gas treatment method mainly includes combustion method, adsorption method and water washing method. The existing combustion method usually has problems such as insufficient combustion and residual harmful substances in the tail gas. CONTENT OF THE UTILITY MODEL

[0003] In order to solve the above technical problems, the present application provides a tail gas treatment equipment of semiconductor process equipment, which comprises a gas inlet pipe assembly, a combustion module, a first water washing module, a spray water tank, a second water washing module, a condensation module and an exhaust pipe section. A plurality of gas inlet pipe assemblies are arranged above the combustion module. The first water washing module is arranged below the combustion module and above the spray water tank. The second water washing module is arranged on the spray water tank. The condensation module is arranged above the second water washing module. The exhaust pipe section is arranged above the condensation module. The combustion module comprises a main combustion cavity and an auxiliary combustion cavity. The main combustion cavity is arranged below the auxiliary combustion cavity and is spaced apart from the auxiliary combustion cavity to form a flow passage for air entering the main combustion cavity. The outer part of the main combustion cavity is covered with a first heat insulation layer. The outer part of the first heat insulation layer is covered with a second heat insulation layer. The first heat insulation layer and the main combustion cavity form a first heat insulation cavity for providing air to the main combustion cavity. The second heat insulation layer and the first heat insulation layer form a second heat insulation cavity for flowing through cooling water.

[0004] In some embodiments of the present application, the main combustion cavity comprises an inner wall and an outer wall, and the outer wall and the inner wall form a top wall inclined to the inner wall.

[0005] In some embodiments of the present application, the first water washing module comprises a first water washing cavity, and a third heat insulation layer is sleeved on the upper part of the first water washing cavity. A water inlet pipe and a drain pipe are arranged on the third heat insulation layer. The third heat insulation layer and the first water washing cavity form a third heat insulation cavity for flowing through cooling water.

[0006] In some embodiments of the present application, the condensing module comprises a first condensing cavity, a second condensing cavity and a third condensing cavity; the second condensing cavity is sleeved in the first condensing cavity, and the third condensing cavity is sleeved in the second condensing cavity; the lower part of the first condensing cavity is communicated with the second water washing module; the upper part of the second condensing cavity is communicated with the first condensing cavity, and the lower part is provided with a partition plate; the lower part of the third condensing cavity is communicated with the second condensing cavity, and the upper part is communicated with the exhaust pipe.

[0007] In some embodiments of the present application, the third condensing cavity has an inner diameter which gradually decreases first and then gradually increases.

[0008] In some embodiments of the present application, a cavity overturning assembly is further included, which is arranged on the circumferential surface of the combustion module.

[0009] In some embodiments of the present application, the outer part of the auxiliary combustion cavity is sleeved with a fourth heat insulation layer, and the second heat insulation layer is provided with a water inlet pipe and a drain pipe.

[0010] In some embodiments of the present application, a circulating pump and a circulating water distribution pipe group are further included, which are arranged above the spray water tank, in the first water washing module, in the second water washing module and in the spray water tank; a spray assembly is arranged in the first water washing module, the second water washing module and the spray water tank; the spray assembly is communicated with the circulating water distribution pipe group; the circulating pump is communicated with the circulating water distribution pipe group and the spray water tank respectively.

[0011] In some embodiments of the present application, the air inlet pipe assembly comprises a straight pipe section and an elbow pipe section; the elbow pipe section extends into the auxiliary combustion cavity to the connection between the auxiliary combustion cavity and the main combustion cavity.

[0012] In some embodiments of the present application, a cleaning pipe section is arranged at the connection between the elbow pipe section and the straight pipe section; the end of the cleaning pipe section is provided with an electromagnetic valve, and the cleaning pipe section is connected with a compressed air inlet device.

[0013] Compared with the prior art, the semiconductor process equipment tail gas treatment equipment has the following advantages and beneficial effects: the combustion module comprises a main combustion cavity and an auxiliary combustion cavity, which are arranged at intervals to form a channel for air entering the main combustion cavity; the main combustion cavity is sleeved with a first heat insulation layer and a second heat insulation layer; a first heat insulation cavity for providing air to the main combustion cavity is formed between the first heat insulation layer and the main combustion cavity; a second heat insulation cavity for flowing through cooling water is formed between the second heat insulation layer and the first heat insulation layer; by providing air to the main combustion cavity, the tail gas can be fully combusted, and the combustible harmful substances in the tail gas can be fully removed; at the same time, the first heat insulation layer and the second heat insulation layer can play a double-layer heat insulation role for the main combustion cavity, and the temperature of the combustion module is reduced.

[0014] It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of this document. BRIEF DESCRIPTION OF DRAWINGS

[0015] The accompanying drawings, which constitute a part of this document, are intended to provide further understanding of the illustrative embodiments of the present document and are incorporated in and constitute a part of this document. In the drawings:

[0016] Figure 1 is a structural schematic diagram of an exhaust gas treatment device of a semiconductor process equipment provided by an exemplary embodiment of the present application;

[0017] Figure 2 is a front view of an exhaust gas treatment device of a semiconductor process equipment provided by an exemplary embodiment of the present application;

[0018] Figure 3 is a sectional view along A-A in Figure 2

[0019] Figure 4 is an enlarged view within the dotted box in Figure 3

[0020] Figure 5 is a sectional view along B-B in Figure 2

[0021] in the drawings:

[0022] 10, gas inlet pipe assembly; 101, straight pipe section; 102, elbow pipe section; 103, cleaning pipe section; 20, combustion module; 201, main combustion cavity; 202, auxiliary combustion cavity; 203, first heat insulation layer; 204, second heat insulation layer; 205, fourth heat insulation layer; 30, first water washing module; 301, first water washing cavity; 302, third heat insulation layer; 40, spray water tank; 50, second water washing module; 60, condensation module; 601, first condensation cavity; 602, second condensation cavity; 603, third condensation cavity; 604, perforated plate; 70, exhaust pipe section; 80, circulating pump; 90, circulating water distribution pipe group; 100, cavity overturning assembly. DETAILED DESCRIPTION

[0023] ​​​To make the objects, technical solutions and advantages of the embodiments of the present application clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some but not all of the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the protection scope of the present application. It should be noted that, the embodiments in the present application and the features in the embodiments can be combined with each other in any manner without conflict.

[0024] In a semiconductor manufacturing process, chemical vapor deposition, physical vapor deposition, etching and other processes can generate a large amount of tail gas containing harmful substances. If these tail gases are directly discharged into the atmosphere without proper treatment, not only will it pollute the environment, but also may harm human health. Therefore, an effective tail gas treatment device is crucial to ensure the safety and environmental protection of the production process. The traditional tail gas treatment methods mainly include combustion method, adsorption method and water washing method. The existing combustion method usually has problems such as insufficient combustion and residual harmful substances in the tail gas.

[0025] Based on this, the exemplary embodiments of the present application provide a tail gas treatment device of a semiconductor process equipment, the combustion module includes a main combustion cavity and an auxiliary combustion cavity, the main combustion cavity and the auxiliary combustion cavity are arranged at intervals, forming a channel for air to enter the main combustion cavity; the main combustion cavity is externally sleeved with a first heat insulation layer and a second heat insulation layer; a first heat insulation cavity for providing air to the main combustion cavity is formed between the first heat insulation layer and the main combustion cavity; a second heat insulation cavity for flowing through cooling water is formed between the second heat insulation layer and the first heat insulation layer; by providing air to the main combustion cavity, the tail gas can be fully combusted, and the combustible harmful substances in the tail gas can be fully removed; at the same time, the first heat insulation layer and the second heat insulation layer arranged can play a double-layer heat insulation role for the main combustion cavity, reducing the temperature of the combustion module.

[0026] An exemplary embodiment of the present application provides a tail gas treatment device of a semiconductor process equipment, such as Figure 1 and 2As shown, the tail gas treatment equipment includes an air inlet pipe assembly 10, a combustion module 20, a first water washing module 30, a spray water tank 40, a second water washing module 50, a condensation module 60, an exhaust pipe section 70, a circulating pump 80, and a circulating water distribution pipe group 90; a plurality of air inlet pipe assemblies 10 are arranged above the combustion module 20; the first water washing module 30 is arranged below the combustion module 20 and above the spray water tank 40; the second water washing module 50 is arranged on the spray water tank 40; the condensation module 60 is arranged above the second water washing module 50; the exhaust pipe section 70 is arranged above the condensation module 60; the circulating pump 80 and the circulating water distribution pipe group 90 are both arranged above the spray water tank 40; the first water washing module 30, the second water washing module 50, and the spray water tank 40 are all provided with spray assemblies; the spray assemblies are in communication with the circulating water distribution pipe group 90; the circulating pump 80 is in communication with the circulating water distribution pipe group 90 and the spray water tank 40, so as to realize the circulation of the spray water.

[0027] As shown in Figure 3 and 4 , the combustion module 20 includes a main combustion cavity 201 and an auxiliary combustion cavity 202; the main combustion cavity 201 is arranged below the auxiliary combustion cavity 202 and is spaced apart from the auxiliary combustion cavity 202 to form a flow passage for air entering the main combustion cavity 201; the outer part of the main combustion cavity 201 is provided with a first heat insulation layer 203; the outer part of the first heat insulation layer 203 is provided with a second heat insulation layer 204; the first heat insulation layer 203 and the main combustion cavity 201 form a first heat insulation cavity for providing air to the main combustion cavity 201, and the first heat insulation cavity is in communication with the main combustion chamber in the main combustion cavity 201; the second heat insulation layer 204 and the first heat insulation layer 203 form a second heat insulation cavity for flowing through cooling water, and the first heat insulation layer 203 and the second heat insulation layer 204 can play a double-layer heat insulation role for the main combustion cavity 201, thereby reducing the temperature of the combustion module 20. The second heat insulation layer 204 is provided with a water inlet pipe and a drain pipe, and an air inlet pipe extends through the second heat insulation cavity into the first heat insulation cavity; the water inlet pipe is in communication with the circulating water distribution pipe group 90, and the drain pipe is in communication with the spray water tank 40, so as to realize the circulation of the cooling water; the air inlet pipe is connected with a compressed air device, which can introduce compressed air into the main combustion cavity 201 to make the tail gas fully burn and fully remove the combustible harmful substances in the tail gas.

[0028] In an example embodiment, as shown in Figure 4 , the main combustion cavity 201 includes an inner wall and an outer wall, and the outer wall and the inner wall form a top wall inclined to the inner wall. Since the air inlet pipe assembly 10 converges towards the center of the main combustion chamber, the direction of the tail gas entering the main combustion chamber also converges towards the center of the main combustion chamber. When the compressed air enters the first heat insulation cavity from the air inlet pipe, it will form a Figure 4When the compressed air flows through the flow passage between the main combustion cavity 201 and the auxiliary combustion cavity 202 into the main combustion chamber in the direction of the arrow, since the top wall in the main combustion cavity 201 is inclined towards the main combustion chamber, the compressed air flow will be inclined towards the center of the main combustion chamber, so that the compressed air and the tail gas are fully mixed to fully burn the tail gas and fully remove harmful substances in the tail gas. The auxiliary combustion cavity 202 is externally sleeved with a fourth heat insulation layer 205, and the second heat insulation layer 204 is provided with a water inlet pipe and a drain pipe to cool the auxiliary combustion cavity 202.

[0029] As shown in Figure 3 The first water washing module 30 includes a first water washing cavity 301, and the upper portion of the first water washing cavity 301 is sleeved with a third heat insulation layer 302, and the third heat insulation layer 302 is provided with a water inlet pipe and a drain pipe; a third heat insulation cavity for cooling water is formed between the third heat insulation layer 302 and the first water washing cavity 301; the water inlet pipe and the drain pipe are respectively communicated with the circulating water distribution pipe group 90 and the spray water tank 40 to realize the circulation of cooling water. Preferably, only the upper portion of the first water washing cavity 301 is provided with the third heat insulation layer 302, because the temperature of the tail gas after combustion is high, and therefore the temperature of the upper portion of the first water washing cavity 301 is high, and after the tail gas is washed by the spray assembly, the temperature is reduced, and therefore the lower portion of the first water washing cavity 301 can not be provided with the third heat insulation layer 302.

[0030] As shown in Figure 5 The condensation module 60 includes a first condensation cavity 601, a second condensation cavity 602 and a third condensation cavity 603; the second condensation cavity 602 is sleeved in the first condensation cavity 601, and the third condensation cavity 603 is sleeved in the second condensation cavity 602; the lower portion of the first condensation cavity 601 is communicated with the second water washing module 50; the upper portion of the second condensation cavity 602 is communicated with the first condensation cavity 601, and the lower portion is provided with a partition plate; an exemplary porous plate 604 is arranged between the top of the second condensation cavity 602 and the first condensation cavity 601, which can block the passage of water vapor in the tail gas to realize the first stage condensation of the tail gas; the lower portion of the third condensation cavity 603 is communicated with the second condensation cavity 602, and the upper portion is communicated with the exhaust pipe. When the tail gas flows through the condensation module 60 in the direction of the arrow, the water vapor in the tail gas is condensed in the first condensation cavity 601, the second condensation cavity 602 and the third condensation cavity 603, and the condensed water is collected in the first condensation cavity 601 and the second condensation cavity 602. Figure 5When the arrow direction enters the third condensing cavity 603, the path of the tail gas condensation can be increased, and the path of the tail gas is prolonged, so that the water vapor in the tail gas is fully contacted with the first condensing cavity 601, the second condensing cavity 602 and the third condensing cavity 603, and the water vapor condensation effect is improved. Preferably, the third condensing cavity 603 has an inner diameter that gradually decreases and then gradually increases, at this time, the inner cavity of the third condensing cavity 603 forms a structure similar to a Venturi tube, so that the flow rate of the tail gas passing through the third condensing cavity 603 first increases and then decreases, and at the same time, the backflow of the tail gas into the second condensing cavity 602 can be prevented.

[0031] In an embodiment, as shown in Figure 1 The tail gas treatment equipment further comprises a cavity overturning assembly 100, which is arranged on the circumferential surface of the combustion module 20. When the combustion module 20 or the inlet pipe is blocked by particulate matters in the tail gas, the combustion module 20 can be separated from the first water washing module 30 and overturned by the cavity overturning assembly 100, so as to clean the combustion module 20 and the inlet pipe assembly 10.

[0032] Continuing to refer to Figure 1 The inlet pipe assembly 10 comprises a straight pipe section 101 and a bent pipe section 102, and the bent pipe section 102 extends into the auxiliary combustion cavity 202 to the connection between the auxiliary combustion cavity 202 and the main combustion cavity 201. A cleaning pipe section 103 is arranged at the connection between the bent pipe section 102 and the straight pipe section 101, and an electromagnetic valve is arranged at the end of the cleaning pipe section 103, and the electromagnetic valve is connected with a compressed air inlet device. When the bent pipe section 102 is blocked, the electromagnetic valve can be opened to introduce gas into the bent pipe section 102 to blow the impurities in the bent pipe section 102 into the main combustion cavity 201, so that the bent pipe section 102 is restored to an unblocked state.

[0033] In this application, the terms "comprising", "containing" or any other similar term are intended to encompass non-exclusive inclusion, so that the article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed, or includes elements inherent to such article or device. Without more limitations, the elements defined by the statement "comprising" do not exclude the presence of other identical elements in the article or device including the elements.

[0034] Although the preferred embodiments of the present application have been described, those skilled in the art can make further changes and modifications to the embodiments once they know the basic inventive concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications falling within the scope of the present application.

[0035] Obviously, many modifications and variations of the present application are possible in light of the above teachings. It is, therefore, to be understood that within the scope of the appended claims and their equivalents, the application can be practiced otherwise than as specifically described.

Claims

1. A tail gas treatment device for semiconductor process equipment, characterized in that, The system includes an intake manifold assembly, a combustion module, a first water washing module, a spray water tank, a second water washing module, a condenser module, and an exhaust pipe section. Multiple intake manifold assemblies are positioned above the combustion module. The first water washing module is positioned below the combustion module and above the spray water tank. The second water washing module is positioned on the spray water tank. The condenser module is positioned above the second water washing module. The exhaust pipe section is positioned above the condenser module. The combustion module includes a main combustion chamber and an auxiliary combustion chamber. The main combustion chamber is positioned below the auxiliary combustion chamber and spaced apart from it, forming a flow channel for air to enter the main combustion chamber. The main combustion chamber is covered by a first heat insulation layer. The first heat insulation layer is covered by a second heat insulation layer. A first heat insulation cavity for supplying air to the main combustion chamber is formed between the first heat insulation layer and the main combustion chamber. A second heat insulation cavity for cooling water to flow through is formed between the second heat insulation layer and the first heat insulation layer.

2. The exhaust gas treatment equipment for semiconductor process equipment according to claim 1, characterized in that, The main combustion chamber includes an inner wall and an outer wall, and a top wall that slopes inward toward the inner wall is formed between the outer wall and the inner wall.

3. The exhaust gas treatment equipment for semiconductor process equipment according to claim 1, characterized in that, The first water washing module includes a first water washing cavity, and a third heat insulation layer is sleeved on the upper part of the first water washing cavity. A water inlet pipe and a water outlet pipe are provided on the third heat insulation layer. A third heat insulation cavity for cooling water to flow through is formed between the third heat insulation layer and the first water washing cavity.

4. The exhaust gas treatment equipment for semiconductor process equipment according to claim 1, characterized in that, The condensation module includes a first condensation chamber, a second condensation chamber, and a third condensation chamber; the second condensation chamber is fitted inside the first condensation chamber, and the third condensation chamber is fitted inside the second condensation chamber; the lower part of the first condensation chamber is connected to the second water washing module; the upper part of the second condensation chamber is connected to the first condensation chamber, and a partition is provided at the lower part; the lower part of the third condensation chamber is connected to the second condensation chamber, and the upper part is connected to the exhaust pipe.

5. The exhaust gas treatment equipment for semiconductor process equipment according to claim 4, characterized in that, The third condensation chamber has an inner diameter that gradually decreases and then gradually increases.

6. The exhaust gas treatment equipment for semiconductor process equipment according to claim 1, characterized in that, It also includes a cavity tilting assembly; the cavity tilting assembly is disposed on the circumferential surface of the combustion module.

7. The exhaust gas treatment equipment for semiconductor process equipment according to claim 1, characterized in that, The auxiliary combustion chamber is covered with a fourth heat insulation layer, and a water inlet pipe and a drain pipe are provided on the second heat insulation layer.

8. The exhaust gas treatment equipment for semiconductor process equipment according to claim 1, characterized in that, It also includes a circulating pump and a circulating water distribution pipe assembly, both of which are located above the spray tank. Spraying components are installed in the first water washing module, the second water washing module, and the spray tank. The spraying components are connected to the circulating water distribution pipe assembly. The circulating pump is connected to both the circulating water distribution pipe assembly and the spray tank.

9. The exhaust gas treatment equipment for semiconductor process equipment according to claim 1, characterized in that, The intake manifold assembly includes a straight section and a curved section; the curved section extends into the auxiliary combustion chamber to the connection between the auxiliary combustion chamber and the main combustion chamber.

10. The exhaust gas treatment device for semiconductor process equipment according to claim 9, characterized in that, A cleaning pipe section is provided at the connection between the bend and the straight pipe section. The end of the cleaning pipe section is equipped with a solenoid valve and is connected to an external compressed air intake device.

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