Electromagnetic range

Abstract

The utility model discloses an electromagnetic range. The electromagnetic range comprises a wire coil, a cooling fan and an integrated circuit board. The integrated circuit board comprises a circuit substrate, a radiator, a detection module and a control module, the detection module, the control module and the radiator are integrated on the circuit substrate, and the radiator covers the detection module and the control module; the cooling fan is located on one side of the integrated circuit board and at least partially staggered with the radiator, and the wire coils are arranged on the cooling fan and the integrated circuit board at intervals. Therefore, according to the electromagnetic range, the detection module and the control module are covered through the radiator, electromagnetic interference of the wire coil on the detection module and the control module is reduced through the radiator, shielding of part of the shielding layer is canceled, heat dissipation of the wire coil by the heat dissipation fan is enhanced, cost is reduced, and temperature rise of the wire coil is improved; and the continuous high-power heating time of the electromagnetic range is prolonged.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of household appliances, in particular to an electromagnetic cooker. BACKGROUND

[0002] With the miniaturization design of the electromagnetic cooker, the electronic devices of the electromagnetic cooker gradually develop towards integration, and the coil as the core component of the electromagnetic cooker can generate an alternating magnetic field according to high-frequency alternating current, and when the pot is placed above the coil, eddy current is generated at the bottom of the pot, thereby realizing the heating of the pot. However, if other electronic devices are too close to the coil, they are easily disturbed by the magnetic field of the coil.

[0003] In order to reduce the electromagnetic interference of the coil on other electronic devices, in the related art, a shielding layer can be arranged between the coil and other electronic devices. However, due to the presence of the shielding layer, the fan cannot effectively cool the coil, resulting in an increase in the temperature of the coil, which cannot continuously heat at high power or continuously heat at high power for a short time. UTILITY MODEL CONTENT

[0004] The present application aims to at least solve one of the technical problems existing in the prior art. To this end, the present application needs to provide an electromagnetic cooker.

[0005] The present application provides an electromagnetic cooker, which comprises a coil, a cooling fan and an integrated circuit board, the integrated circuit board comprises a circuit substrate, a heat sink, a detection module and a control module, the detection module, the control module and the heat sink are integrated on the circuit substrate, and the heat sink covers the detection module and the control module; the cooling fan is located on one side of the integrated circuit board and is at least partially arranged in a staggered manner with the heat sink, and the coil is arranged in a staggered manner on the cooling fan and the integrated circuit board.

[0006] In some embodiments, the circuit substrate comprises a first region and a second region, the first region is adjacent to the cooling fan, the heat sink is located in the second region, and the electromagnetic cooker further comprises an electromagnetic shielding plate, the electromagnetic shielding plate is arranged in a staggered manner between the coil and the integrated circuit board and covers the first region.

[0007] In some embodiments, the integrated circuit board further comprises a power supply module integrated in the first region, and the power supply module is arranged in a staggered manner with the heat sink.

[0008] In some embodiments, the integrated circuit board further comprises a power supply module integrated on the first region, and the power supply module is arranged in a staggered manner on the side of the power supply module away from the heat sink.

[0009] In some embodiments, the integrated circuit board further comprises an electromagnetic compatibility module integrated in the first region, the electromagnetic compatibility module is located on the side of the power module away from the cooling fan, the power module and the power supply module form a first air duct, and the first air duct communicates the electromagnetic compatibility module and the cooling fan.

[0010] In some embodiments, the integrated circuit board further comprises a power inverter module integrated in the second region, the power inverter module is spaced from the heat sink, the heat sink and the power module form a second air duct, and the second air duct communicates the cooling fan and the power inverter module.

[0011] In some embodiments, the power inverter module further comprises a plurality of power devices, the plurality of power devices are arranged in sequence along the length direction of the heat sink, and the plurality of power devices and the heat sink jointly form a third air duct, and the third air duct communicates the second air duct.

[0012] In some embodiments, the plurality of power devices are at least partially misaligned along the length direction of the heat sink.

[0013] In some embodiments, the electromagnetic shielding plate covers part of the heat sink.

[0014] In some embodiments, the electromagnetic shielding plate is made of a metal material.

[0015] The electromagnetic range of the present application covers the detection module and the control module through the heat sink, reduces the electromagnetic interference of the coil on the detection module and the control module by using the heat sink, cancels part of the shielding layer, strengthens the heat dissipation of the cooling fan on the coil, reduces the cost, and improves the temperature rise of the coil, so that the continuous high-power heating time of the electromagnetic range is increased.

[0016] Additional aspects and advantages of the present application will be in part apparent and in part pointed out hereinafter. BRIEF DESCRIPTION OF DRAWINGS

[0017] The above and / or additional aspects and advantages of the present application will become apparent and be readily appreciated from the following description, including the appended drawings.

[0018] Figure 1 is one of the structural schematic diagrams of the electromagnetic range of the present application.

[0019] Figure 2 is a structural schematic diagram of an integrated circuit board of the present application.

[0020] Figure 3 is a structural schematic diagram of the electromagnetic range of the present application.

[0021] Main element symbol explanation:

[0022] The electromagnetic cooker 100, the wire coil 10, the heat dissipation fan 20, the integrated circuit board 30, the circuit substrate 31, the first area 311, the second area 312, the heat sink 32, the detection module 33, the control module 34, the power supply module 35, the power supply module 36, the electromagnetic compatibility module 37, the power inverter module 38, and the electromagnetic shielding plate 40. DETAILED DESCRIPTION

[0023] Embodiments of the present application are described in detail below with reference to the accompanying drawings. The embodiments described below are examples for explaining the present application and should not be construed as limiting the present application.

[0024] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like indicate the orientation or positional relationship shown in the drawings, and are only used to facilitate the description of the present application and simplify the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be construed as limiting the present application. In addition, the terms "first", "second" are only for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise explicitly specified and limited.

[0025] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected or can communicate with each other; it can be directly connected, or indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0026] In the present application, unless specifically defined and limited otherwise, "on" or "under" of a first feature to a second feature can include that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, "on", "above" and "over" of a first feature to a second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the first feature is higher in horizontal height than the second feature. "Under", "below" and "underneath" of a first feature to a second feature includes that the first feature is directly below and obliquely below the second feature, or only indicates that the first feature is lower in horizontal height than the second feature.

[0027] The following disclosure provides many different embodiments, or examples, for implementing different structures of the present application. For the purpose of simplification, the components and arrangements of the specific examples are described in the following. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeatedly refer to numbers and / or letters in different examples, and such repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or arrangements discussed. In addition, the present application provides examples of various specific processes and materials, but those of ordinary skill in the art can realize the application of other processes and / or the use of other materials.

[0028] In order to reduce the electromagnetic interference of the coil to other electronic devices, in the related art, an electromagnetic shielding layer can be arranged between the coil and other electronic devices. However, due to the presence of the electromagnetic shielding layer, the fan is difficult to effectively cool the coil, resulting in an increase in the temperature of the coil, which cannot continuously heat at high power or continuously heat at high power for a short time.

[0029] Please refer to Figure 1 The embodiment of the present application provides an electromagnetic range 100, which comprises a coil 10, a cooling fan 20 and an integrated circuit board 30. The integrated circuit board 30 comprises a circuit substrate 31, a heat sink 32, a detection module 33 and a control module 34, the detection module 33, the control module 34 and the heat sink 32 are integrated on the circuit substrate 31, and the heat sink 32 covers the detection module 33 and the control module 34; the cooling fan 20 is located on one side of the integrated circuit board 30 and is at least partially arranged in a staggered manner with the heat sink 32, and the coil 10 is arranged in a staggered manner on the cooling fan 20 and the integrated circuit board 30.

[0030] In the electromagnetic cooker 100 of the embodiment, the detection module 33 and the control module 34 are covered by the heat sink 32, so that the heat sink 32 serves as an electromagnetic shielding layer of the detection module 33 and the control module 34, and the electromagnetic interference of the coil 10 on the detection module 33 and the control module 34 is reduced. In this way, the use of the electromagnetic shielding layer in the electromagnetic cooker 100 can be reduced (i.e., the heat sink 32 can replace part of the electromagnetic shielding layer), which saves the material cost of the electromagnetic cooker 100 on the one hand, and cancels the shielding setting of part of the electromagnetic shielding layer on the other hand, so that the airflow blown by the heat dissipation fan 20 can blow to the coil 10, which is beneficial to the heat dissipation of the coil 10, improves the temperature rise of the coil 10, and increases the continuous high-power heating time of the electromagnetic cooker 100.

[0031] Specifically, the coil 10 is a key component for energy conversion of the electromagnetic cooker 100, and the coil 10 converts electric energy into high-frequency magnetic field energy. The coil 10 can be arranged above the integrated circuit board 30, so that the pot placed on the electromagnetic cooker 100 can be closer to the pot. When the coil 10 works, eddy current will be generated at the bottom of the pot, so as to heat the pot. The number of the coil 10 can be one or multiple, and the number of the coil 10 is not limited. In the embodiment, the number of the coil 10 can be multiple, and the multiple coils 10 are arranged side by side above the integrated circuit board 10. It can be understood that the design of the electromagnetic cooker 100 with multiple coils 10 can increase the heating area, improve the heating efficiency, and realize more complex heating modes.

[0032] The heat dissipation fan 20 is arranged on one side of the integrated circuit board 30. The heat dissipation fan 20 can rotate to generate airflow and blow to the coil 10 and the integrated circuit board 30, so as to take away the heat of the coil 10 and the integrated circuit board 30, thereby achieving heat dissipation of the coil 10 and the integrated circuit board 30, and enabling the coil 10 and the integrated circuit board 30 to be at a normal working temperature, avoiding damage to the coil 10 and the integrated circuit board 30.

[0033] Please refer to Figure 2 The integrated circuit board 30 is one of the core components of the electromagnetic cooker 100, and has functions of controlling the power switch of the electromagnetic cooker 100, controlling the heating temperature, and detecting the current and voltage in real time. The integrated circuit board 30 can be one or multiple, for example, when the integrated circuit board 30 is two, the two integrated circuit boards 30 can be symmetrically arranged on both sides of the heat dissipation fan 20, so that the heat dissipation fan 20 can achieve heat dissipation of the two integrated circuit boards 30.

[0034] Further, the integrated circuit board 30 comprises a circuit board 31, a heat sink 32, a detection module 33 and a control module 34. The circuit board 31 provides support and stable electrical connection for other electronic components in the integrated circuit board 30, ensuring normal operation of the integrated circuit board 30. The circuit board 31 can be a printed circuit board (PCB). The detection module 33, the control module 34 and the heat sink 32 are integrated on the circuit board 31.

[0035] The heat sink 32 is a good conductor of heat, which can absorb heat from surrounding heat-generating objects to prevent the temperature of these heat-generating objects from rising sharply due to heat accumulation, and conduct the absorbed heat inside to each part for heat dissipation. The heat sink 32 is at least partially arranged in a staggered manner with the heat dissipation fan 20, and the airflow generated by the heat dissipation fan 20 can blow towards the heat sink 32, thereby accelerating the air flow on the surface of the heat sink 32, and enhancing the heat dissipation effect of the heat sink 32. In this way, the relative staggered arrangement of the heat dissipation fan 20 and the heat sink 32 can significantly improve the heat dissipation efficiency of the heat sink 32, so that the electromagnetic cooker 100 can maintain a stable operating temperature under higher load.

[0036] The heat sink 32 can be made of metal materials, such as aluminum or copper. These metal materials have a certain shielding effect on electromagnetic waves, which can block or weaken the electromagnetic interference generated by the coil 10 during operation of the electromagnetic cooker 100.

[0037] The detection module 33 can detect temperature, zero-crossing signal, voltage, current, synchronization signal, and can detect the temperature change of food or cookware in real time to provide necessary temperature data for the control module 33, so as to realize accurate temperature control. The detection module 33 is arranged below the heat sink 32, that is, the heat sink 32 covers the detection module 33 and can act as an electromagnetic shielding layer for the detection module 33. In this way, the electromagnetic interference of the coil 10 on the detection module 33 is reduced by using the heat sink 32, part of the shielding layer is cancelled, the heat dissipation of the coil 10 by the heat dissipation fan 20 is strengthened, the cost is reduced, the temperature rise of the coil 10 is improved, and the continuous high-power heating time of the electromagnetic cooker 100 is increased.

[0038] The control module 34 accurately controls the operating state of the electromagnetic cooker 100 according to the information of the detection module 33 and the operation instructions of the user, and its main functions include power adjustment, temperature control and heating time control. The control module 34 is arranged below the heat sink 32, that is, the heat sink 32 covers the control module 34 and can act as an electromagnetic shielding layer for the control module 34. In this way, the electromagnetic interference of the coil 10 on the detection module 33 is reduced by using the heat sink 32, part of the shielding layer is cancelled, the heat dissipation of the coil 10 by the heat dissipation fan 20 is strengthened, the cost is reduced, the temperature rise of the coil 10 is improved, and the continuous high-power heating time of the electromagnetic cooker 100 is increased.

[0039] Referring to Figure 3 In some embodiments, the circuit board 30 comprises a first region 311 and a second region 312. The first region 311 and the second region 312 are divided by the present application according to the different priority of the electronic components on the circuit board 30 against electromagnetic interference. The electromagnetic stove 100 further comprises an electromagnetic shielding plate 40, which is arranged between the coil 10 and the integrated circuit board 30, and covers the first region 311. The main function of the electromagnetic shielding plate 40 is to reduce the electromagnetic interference of the coil 10 on the electronic components on the circuit board 31 by using its reflection and absorption characteristics of electromagnetic waves.

[0040] Specifically, the first region 311 is covered with the electromagnetic shielding plate 40, and a part of the components that are easily interfered by the coil is arranged in the first region 311, that is, below the electromagnetic shielding plate 40. Another part of the components that are less interfered by the coil is arranged in the second region 312, relying on the heat sink 32 to shield electromagnetic interference. In addition, the first region 311 is adjacent to the cooling fan 20, and the cooling fan 20 first cools the components in the first region 311 and the coil 10, and then accelerates the cooling of the heat sink 32. The combination of the cooling fan 20 and the heat sink 32 can simultaneously meet the cooling requirements of the components in the first region 311 and the second region 312.

[0041] In this way, by dividing the circuit board 31 into the first region 311 and the second region 312, and arranging the cooling fan 20 adjacent to the first region 311 and the heat sink 32 in the second region 312, the first region 311 can be cooled by the cooling fan 20, and the second region 312 can be cooled by the heat sink 32, ensuring uniform cooling of the integrated circuit board 30. The electromagnetic shielding plate 40 covers the first region 311, so that the electronic components in the first region 311 can avoid electromagnetic interference.

[0042] In some embodiments, the integrated circuit board 30 further comprises a power module 35 integrated in the first region 311, and the power module 35 is arranged spaced apart and at least partially offset from the heat sink 32. The power module 35 uses high-efficiency and stable switching power supply technology to provide the required DC power for other electronic components. The height of the power module 35 on the integrated circuit board 30 is relatively low, and the power module 35 will not block the airflow of the cooling fan 20 due to the high and large power module 35, so the power module 35 is arranged relatively close to the cooling fan 20.

[0043] In some embodiments, the integrated circuit board 30 further comprises a power supply module 36 integrated on the first area 311. The power supply module 36 comprises an AC power interface, and some electronic components such as a rectifier bridge, a filter capacitor, and a voltage stabilizer. The power supply module 36 is used to connect an external AC power source to the electromagnetic cooker 100, and convert the AC power to DC power for other modules of the electromagnetic cooker 100. The power of the power supply module 36 directly affects the heating speed and cooking efficiency of the electromagnetic cooker 100. The greater the power of the power supply module 36, the faster the heating speed and the higher the cooking efficiency, and thus the greater the heat dissipation requirement.

[0044] The power supply module 36 is arranged on the side of the power module 35 away from the heat sink 32, i.e., the power supply module 36 is arranged on the first area 311, and the heat dissipation fan 20 is used to dissipate heat from the power supply module 36 to ensure that the electromagnetic cooker 100 can still work stably at high power. The power supply module 36 has an AC power interface and is thus arranged on one side of the integrated circuit board 30. The height of the power supply module 36 is higher than that of the power module 35 on the integrated circuit board 30, and thus the power supply module 36 is farther away from the heat dissipation fan 20 than the power module 35.

[0045] In some embodiments, the integrated circuit board 30 further comprises an electromagnetic compatibility module (EMC) 37 integrated on the first area 311. The electromagnetic compatibility module 37 can ensure that the integrated circuit board 30 can work stably in a complex electromagnetic environment without causing electromagnetic interference to other devices, and is not affected by electromagnetic interference from other devices. The electromagnetic compatibility module 37 can be connected to the power supply module 36 to eliminate electromagnetic interference generated by the power supply module 36, and the electromagnetic compatibility module 37 is located on the first area 311 to prevent the electromagnetic compatibility module 37 from being affected by electromagnetic interference from the coil 10.

[0046] The electromagnetic compatibility module 37 is located on the side of the power module 35 away from the heat dissipation fan 20, and the power module 35 and the power supply module 36 form a first air duct that communicates the electromagnetic compatibility module 37 and the heat dissipation fan 20. The power of the electromagnetic compatibility module 37 is usually small, and the electromagnetic compatibility module 37 focuses on low power consumption and stability, and thus has a smaller heat dissipation requirement than the power supply module 36, and is located farthest from the heat dissipation fan 20 on the first area 311. The first air duct is formed by the power module 35 and the power supply module 36, and the heat dissipation fan 20 dissipates heat from the electromagnetic compatibility module 37 through the first air duct.

[0047] In some embodiments, the integrated circuit board 30 further comprises a power inverter module 38 integrated in the second region 312. The power inverter module 38 is mainly responsible for converting direct current into high frequency alternating current, which is a key step in the heating process of the electromagnetic cooker 100. The control module 34 controls the power inverter module 38 to change the frequency and power of the high frequency alternating current, thereby achieving precise control over the heating process.

[0048] The power inverter module 38 is spaced apart from the heat sink 32, and the heat sink 32 and the power supply module 35 form a second air duct that communicates the cooling fan 20 and the power inverter module 38. In this embodiment, the cooling fan 20 has less cooling effect on the power inverter module 38, and the second air duct is formed between the heat sink 32 and the power supply module 35, so that the cooling fan 20 cools the power inverter module 38 through the second air duct.

[0049] In some embodiments, the power inverter module 38 further comprises a plurality of power devices such as insulated gate bipolar transistors, metal oxide semiconductor field effect transistors, and diodes. The power devices such as insulated gate bipolar transistors and metal oxide semiconductor field effect transistors convert the input direct current into alternating current through switching action, thereby achieving the function of converting electrical energy. The diode has unidirectional conductivity and serves as a reverse voltage protection in the power inverter module 38 to prevent damage to other power devices due to overvoltage. The above-mentioned power devices generate heat during operation and need good cooling to maintain stable performance. To this end, a plurality of power devices are arranged in sequence along the length direction of the heat sink 32 and form a third air duct together with the heat sink 32, and the third air duct communicates with the second air duct. In this way, the airflow generated by the cooling fan 20 can flow from the second air duct to the third air duct, thereby removing the heat of the heat sink 32 and the plurality of power devices.

[0050] In some embodiments, the plurality of power devices are at least partially staggered along the length direction of the heat sink 32.

[0051] Specifically, when the power devices are staggered along the length direction of the heat sink 32, the contact area of each device with the airflow and the surface area of the heat sink 32 itself are more fully utilized. This layout allows the airflow generated by the cooling fan 20 to more extensively contact various parts of the heat sink 32 when passing through the third air duct, thereby increasing the effective cooling area. Staggered arrangement also helps to improve the airflow distribution in the air duct. When the airflow passes through the third air duct, if the power devices are arranged too closely, the airflow may be blocked or vortexes may be formed in some areas, thereby reducing the cooling efficiency. Staggered arrangement allows the airflow to pass more smoothly, reducing the generation of vortexes and airflow resistance.

[0052] In this way, by optimizing the design of the air duct, the airflow generated by the cooling fan 20 can flow through the heat sink 32 and the plurality of power devices more effectively, thereby improving the cooling efficiency. This design not only helps to reduce the operating temperature of the power devices, but also prolongs their service life.

[0053] In some embodiments, the electromagnetic shielding plate 40 covers part of the heat sink 32.

[0054] Specifically, the electromagnetic shielding plate 40 covers part of the heat sink 32, and the covered part mainly includes the detection module 33 and the control module 34. The detection module 33 and the control module 34 are key modules that determine the cooking effect of the electromagnetic cooker 100. The detection module 33 is responsible for monitoring various operating parameters of the electromagnetic cooker 100, such as temperature, power, voltage, etc. The control module 34 adjusts in real time according to the data provided by the detection module 33 to maintain the stable operation of the electromagnetic cooker 100. Improving the shielding effect of the electromagnetic shielding plate 40 on the detection module 33 and the control module 34, enhancing the anti-electromagnetic interference capability of the detection module 33 and the control module 34, can improve the measurement accuracy of the detection module 33 and ensure that the control module 34 can still maintain precise control in a complex electromagnetic environment, so that the electromagnetic cooker 100 can more accurately control the heating process, avoid problems such as uneven heating and power fluctuation, and thus improve the cooking effect.

[0055] In some embodiments, the electromagnetic shielding plate 40 is made of a metal material.

[0056] Specifically, the electromagnetic shielding plate 40 is made of a metal material with high electrical conductivity and high magnetic permeability, which can be an aluminum plate in this embodiment. The reflectivity of aluminum plate to electromagnetic waves is high, and most of the electromagnetic waves will be reflected back when encountering the aluminum plate, rather than penetrating into it. The electrical conductivity of the aluminum plate is high, and when the electromagnetic wave encounters the surface of the aluminum plate, an induced current will be generated on its surface. These induced currents will generate a magnetic field opposite to the incident electromagnetic wave, thereby canceling or weakening the further propagation of the electromagnetic wave. Compared with other metal materials such as copper, the aluminum plate is lighter in weight, which makes it advantageous in occasions requiring lightweight design. The production cost of the aluminum plate is also relatively low, which helps to reduce the overall cost of the electromagnetic shielding plate 40. Moreover, the aluminum plate has high strength and hardness, and can withstand certain physical impact and pressure to protect the internal electronic devices from external damage, and can meet the structural strength requirements of the electromagnetic shielding plate 40.

[0057] In the description of the specification, reference to "one embodiment", "certain embodiments", "some embodiments", "exemplary embodiments", "a specific example", or "some examples" etc., mean that a particular feature, structure, material, or characteristic being described is included in at least one embodiment or example of the application. The appearances of the above expressions in various places in the specification are not necessarily referring to the same embodiment or example. Moreover, describing a particular feature, structure, material, or characteristic as included in an embodiment or example is intended to convey that the particular feature, structure, material, or characteristic is included in at least one embodiment or example of the application. Thus, appearances of the expressions "in one embodiment" or "in an embodiment" are not necessarily referring to the same embodiment.

[0058] Although the embodiments of the present application have been shown and described, it would be appreciated by those skilled in the art that changes, modifications, alternatives and variations to these embodiments could be made without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.

Claims

1. An electromagnetic hob, characterized in that, The electromagnetic cooker comprises a wire coil, a heat dissipation fan and an integrated circuit board, the integrated circuit board comprises a circuit substrate, a heat sink, a detection module and a control module, the detection module, the control module and the heat sink are integrated on the circuit substrate, and the heat sink covers the detection module and the control module; the heat dissipation fan is located on one side of the integrated circuit board and is at least partially arranged in a staggered manner with the heat sink, and the wire coil is arranged in a spaced manner on the heat dissipation fan and the integrated circuit board.

2. The electromagnetic hob as claimed in claim 1, characterized in that The circuit substrate comprises a first area and a second area, the first area is adjacent to the heat dissipation fan, the heat sink is located in the second area, and the electromagnetic cooker further comprises an electromagnetic shielding plate, the electromagnetic shielding plate is arranged in a spaced manner between the wire coil and the integrated circuit board and covers the first area.

3. The electromagnetic hob of claim 2, characterized in that, The integrated circuit board further comprises a power supply module integrated in the first area, and the power supply module is arranged in a spaced and at least partially staggered manner with the heat sink.

4. The electromagnetic hob of claim 3, characterized in that, The integrated circuit board further comprises a power supply module integrated on the first area, and the power supply module is arranged in a spaced manner on the side of the power supply module away from the heat sink.

5. The electromagnetic hob of claim 4, characterized in that, The integrated circuit board further comprises an electromagnetic compatibility module integrated in the first area, and the electromagnetic compatibility module is located on the side of the power supply module away from the heat dissipation fan, the power supply module and the power supply module form a first air duct, and the first air duct communicates the electromagnetic compatibility module and the heat dissipation fan.

6. The electromagnetic hob of claim 5, characterized in that, The integrated circuit board further comprises a power inverter module integrated in the second area, and the power inverter module is arranged in a spaced manner with the heat sink, the heat sink and the power supply module form a second air duct, and the second air duct communicates the heat dissipation fan and the power inverter module.

7. The electromagnetic hob of claim 6, characterized in that, The power inverter module further comprises a plurality of power devices, the plurality of power devices are arranged in sequence along the length direction of the heat sink, and the plurality of power devices and the heat sink jointly form a third air duct, and the third air duct communicates the second air duct.

8. The electromagnetic hob of claim 7, characterized in that, The plurality of power devices are arranged in an at least partially staggered manner along the length direction of the heat sink.

9. The electromagnetic hob of claim 2, characterized in that, The electromagnetic shielding plate covers part of the heat sink.

10. The electromagnetic hob of claim 2, characterized in that, The electromagnetic shielding plate is made of a metal material.

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