Self-heating floor

Abstract

A heating floor sequentially comprises a surface decoration layer, a heating layer, a heat preservation layer and a floor body from top to bottom. Two electrodes, two wiring passages and two plugs are arranged at the bottom of the floor main body at intervals, the two wiring passages are arranged at the two ends of the floor main body respectively, the two plugs are located in the wiring passages respectively, and each electrode is electrically connected with the positive electrode or the negative electrode of the semiconductor heating film. Each plug is electrically connected with one electrode, and the plugs on the adjacent floors are connected in an inserted mode so that the semiconductor heating films on the adjacent floors can be connected in series. According to the self-heating floor, the semiconductor heating film is arranged, the semiconductor heating film is even in heating, good in waterproofness, long in service life and high in safety coefficient, and meanwhile due to the fact that the semiconductor heating film is used for heating, the heating efficiency is high, and temperature rise is fast.

Description

TECHNICAL FIELD

[0001] The utility model belongs to floor technical field, especially a self -heating floor. BACKGROUND

[0002] With the progress of science and technology and people's demand for the quality of life is constantly improved, the traditional heating mode has gradually been difficult to meet the needs of modern family, especially in the cold season, the traditional floor heating system has the problems such as complex installation, high energy consumption, slow heating and so on, and air conditioning heating is easy to form the discomfort of 'hot head and cold feet', under this background, self -heating floor as a new type of indoor floor heating material emerges as the times require, with its efficient, energy saving, environmental protection, comfortable characteristics, gradually be favored by the market, the existing heating floor generally sets up an electric heating sheet in the floor, and the electric heating sheet generates heat when electrified.

[0003] However, this kind of floor directly encapsulating electric heating sheet has some problems in use: some electric heating sheets are resistance type electric heating sheets, and the heating efficiency is very low, and the heating speed is slow, and the risk coefficient is high, and the electric heating sheet is easily affected by external moisture after long-term use and generates fault, resulting in low service life of the floor. CONTENT OF THE UTILITY MODEL

[0004] Therefore, the utility model provides a kind of efficient self -heating floor to solve above-mentioned problems.

[0005] A kind of self -heating floor, it includes a surface decoration layer, a heating layer, a heat preservation layer and a floor body from top to bottom in sequence.The bottom of the floor body is provided with two electrodes at intervals.Two wire routing passages are respectively arranged in the two ends of the floor body, and two plugs are respectively arranged in each wire routing passage.The heating layer is a semiconductor heating film, and each electrode is electrically connected to the positive electrode or negative electrode of the semiconductor heating film.The plug is electrically connected to one electrode, and the plugs on adjacent floors are inserted into each other to connect the semiconductor heating films on adjacent floors in series.

[0006] Further, the shape of the heating layer is the same as that of the floor body.

[0007] Further, the heat preservation layer is an extruded polystyrene foam board or a polyurethane foam board.

[0008] Further, the extension direction of the wire routing passage is the same as the length direction of the floor body, and the wire routing passage is in communication with the electrode.

[0009] Further, the axes of the two wire routing passages on each floor body are located on the same straight line, and the axes of the wire routing passages are located on the symmetry plane of the floor body along the length direction. Further, the axes of the two wire routing passages on each floor body are located on the same straight line, and the axes of the wire routing passages are located on the symmetry plane of the floor body along the length direction.

[0010] Furthermore, the wiring path is located inside or on one side of the floor body and communicates with the bottom of the floor body.

[0011] Furthermore, two electrode mounting slots are spaced apart at the bottom of the floor body, and each electrode is installed in one of the electrode mounting slots.

[0012] Furthermore, both the electrode and the electrode mounting groove are elongated, and the extension direction of the electrode mounting groove is perpendicular or parallel to the length direction of the floor body.

[0013] Compared with the prior art, the self-heating floor provided by this utility model is equipped with the semiconductor heating film. The semiconductor heating film heats up evenly and has good waterproof performance and a long service life. At the same time, because it is semiconductor heating, it has high heating efficiency and fast temperature rise. By setting a heat insulation layer at the bottom of the semiconductor heating film, heat radiation to the floor can be prevented, allowing heat to be directly radiated into the room, thus improving the heating effect. Attached Figure Description

[0014] Figure 1 This is a structural schematic diagram of the self-heating floor provided by this utility model.

[0015] Figure 2 for Figure 1 A schematic diagram of the structure of a self-heating floor with the bottom of the floor body facing upwards.

[0016] Figure 3 This is a schematic diagram of the structure of the self-heating floor provided by this utility model when the bottom of the floor body faces upward in another electrode mounting groove arrangement direction. Detailed Implementation

[0017] The specific embodiments of this utility model are described in further detail below. It should be understood that the description of the embodiments of this utility model herein is not intended to limit the scope of protection of this utility model.

[0018] like Figures 1 to 3 The diagram shown is a structural schematic of a self-heating floor provided by this utility model. The self-heating floor, from top to bottom, includes a surface decorative layer 10, a heating layer 20, an insulation layer 30, and a floor body 40. It is conceivable that the self-heating floor also includes other functional modules, such as tenon and mortise structures on the side walls of the floor body 40, etc., which should be known to those skilled in the art and will not be described in detail here.

[0019] The surface decoration layer 10 can be a paint layer or a film layer, which is used to improve the appearance of the floor and is a prior art, which will not be described here. When using a film, the surface decoration layer 10 can be assembled with the heating layer 20 using cold pressure glue or pressure sensitive adhesive.

[0020] The heating layer 20 is a semiconductor heating film. The heating layer 20 is arranged between the surface decoration layer 10 and the thermal insulation layer 30 and is tightly combined with the surface decoration layer 10 and the thermal insulation layer 30 through conductive glue or pressure sensitive adhesive. The shape of the heating layer 20 is the same as that of the floor body 40, so as to provide as much heating surface as possible, cooperate with the high heating efficiency of the semiconductor heating film itself, realize rapid heating, and provide a comfortable heating experience for the user. It should be noted that the semiconductor heating film is connected with an external temperature control device. The specific connection method is to set a control panel on the wall of the room where the floor is installed and configure a corresponding controller. All the semiconductor heating films on the floor body 40 are respectively connected in series through the plug 14 described below. The semiconductor heating films connected in series are connected with a power module. By changing the voltage of the power module, the current flowing through the semiconductor heating film can be changed, and then the heating capacity of the semiconductor heating film can be changed. The user only needs to operate the control panel to control the voltage of the power module, and then control the heating capacity to adjust the temperature of the floor. It should be noted that the principle and connection structure of controlling the heating capacity of the heating element by changing the voltage of the circuit are well known to those skilled in the art, and the principle and connection structure of controlling the voltage change of the power module through the control panel are also well known to those skilled in the art, which will not be described here.

[0021] It should be noted that the semiconductor heating film is a prior art, such as a semiconductor flexible heating film disclosed in application No. CN202211328769.7, patent name. The heating film has good waterproof effect, uniform heating and long service life, can avoid floor failure due to heating sheet damage, and prolongs the service life of the floor. And because it is a semiconductor heating, the heating efficiency is higher and the heating speed is faster.

[0022] The thermal insulation layer 30 is used to reduce the loss of heat from the bottom of the heating layer 20 and ensure that most of the generated heat is radiated to the indoor through the top of the heating layer 20. The thermal insulation layer 30 is an extruded polystyrene foam board or a polyurethane foam board, which has low cost and good thermal insulation performance.

[0023] The floor body 40 is made of environmentally friendly and durable floor material, such as solid wood composite floor or reinforced floor. The upper surface of the floor body 40 is specially treated and has the characteristics of anti-skid, wear-resistant and beautiful. The bottom of the floor body 40 is provided with two electrode mounting grooves 11, two wire paths 12 communicating with the electrode mounting grooves 11, two electrodes 13 respectively arranged in the electrode mounting grooves 11, and a plug 14 electrically connected with each electrode 13. It should be noted that the floor body 40 is provided with a floor assembly structure, which is well known to those skilled in the art and will not be described here.

[0024] The electrode mounting groove 11 is used to accommodate the electrode 13. The wire path 12 is used to accommodate the plug 14. The electrode mounting groove 11 and the wire path 12 are internally communicated, and a connection line can be reserved to facilitate the connection of the electrode 13 and the plug 14.

[0025] The two electrode mounting grooves 11 are arranged in parallel with each other. The extension direction of the electrode mounting groove 11 is perpendicular or parallel to the length direction of the floor body 40. Specifically, the choice of perpendicular or parallel is related to the length of the floor. Because the heat of the semiconductor heating film is related to the electron transition distance between the electrodes, the heat of the semiconductor heating film at the electrode is greater than that in the region between the two electrodes, so when the electron transition distance is long, the temperature difference will be more obvious. At the same time, because the plug 14 is arranged at the two ends of the floor body 40 in the length direction, it is more suitable to arrange the electrode mounting groove 11 at the two ends of the floor body 40 in the length direction, so as to save the wire length between the plug 14 and the electrode 13. Therefore, in actual use, it is necessary to select to arrange the electrodes of the semiconductor heating film at the two ends of the floor body 40 in the length direction or at the two ends in the width direction according to the length of the floor. In this embodiment, because the floor body 40 is long and has a large length span, the extension direction of the electrode mounting groove 11 is parallel to the length direction of the floor body 40, and at this time the transition distance between the two electrodes of the semiconductor heating film is about the width of the floor body 40, thereby avoiding that the electron transition is too long to cause low heat in the middle. When the length of the floor body 40 is short, the extension direction of the electrode mounting groove 11 can be arranged perpendicular to the length direction of the floor body 40, at this time the electron transition distance is short, and the heat in the middle of the floor is sufficient, at this time the wire path 12 and the electrode mounting groove 11 are distributed in T shape.

[0026] Two of the electrodes 13 are used to connect with the positive or negative electrode on the semiconductor heating film respectively. It can be understood that a through hole can be formed on the heat preservation layer 30 to allow the electrode 13 to pass through and be welded with the positive or negative electrode on the semiconductor heating film. The plug 14 is used to connect with the external circuit, so that when the external circuit is connected, the semiconductor heating film will be powered to heat. The electrode 13 is in the form of a long strip, so as to provide a larger connection position, facilitating the corresponding connection of the positive and negative electrodes on the semiconductor heating film with the electrode 13. The electrode 13 can be made of conductive materials such as copper sheet or aluminum sheet, and can be directly welded with the positive or negative electrode of the semiconductor heating film in the subsequent process.

[0027] The plugs 14 on each floor body 40 are arranged in pairs, and each floor body 40 includes a male plug and a female plug. When installed, the male plug on one floor body 40 is inserted into the female plug on another floor body 40. It should be noted that the structure and insertion principle of the male plug and the female plug are well known to those skilled in the art, and will not be described here. The plug 14 is retractably arranged in the wiring channel 12, and the end face of the plug 14 does not exceed the wiring channel 12 during transportation. The plug 14 is connected to the electrode 13 by a wire. Since the diameter of the plug 14 is smaller than the inner diameter of the wiring channel 12, the wire with a length longer than the wiring channel 12 can be used to pull out the plug 14 during insertion and retract the plug 14 into the wiring channel 12 after connection, so that the plugs 14 do not occupy space and do not affect the original installation of the floor body 40. When all the plugs 14 on the floor bodies 40 are connected in series, one male plug 141 and one female plug 142 at both ends are respectively connected to an external power module, so that the semiconductor heating film 20 connected in series is connected in series with the power supply. During installation, only the plugs 14 need to be inserted into each other to achieve the series connection of the semiconductor heating film 20 on each floor, without the need for large-scale construction.

[0028] The wiring passage 12 is located inside the floor body 40. One end of the wiring passage 12 is communicated with one electrode mounting groove 11, and the other end is communicated with the end face of the floor body 40. The wiring passage 12 is a straight passage, the extending direction of the wiring passage 12 is the same as the length direction of the floor body 40, and the axes of the two wiring passages 12 are located on the same straight line. The axis of the wiring passage 12 is located on the symmetry plane of the floor body 40 extending in the length direction and perpendicular to the top face of the floor body 40. When two adjacent floors are connected in the installation, the wiring passages 12 on the two floors are located on the same straight line, and the male plug 141 and the female plug 142 are directly connected. The wiring passage 12 can be embedded in the floor body 40, or one side of the wiring passage 12 is communicated with the bottom face of the floor body 40. When the wiring passage 12 is embedded in the floor body 40, the protection effect of the wiring passage 12 on the plug 14 is good, and the plug 14 is not easy to be pulled out from the wiring passage 12. When one side of the wiring passage 12 is communicated with the bottom of the floor body 40, the plug 14 is convenient to be connected with the electrode 13, and the wire connected between the plug 14 and the electrode 13 is convenient to be replaced. In the embodiment, the form that one side of the wiring passage 12 is communicated with the bottom of the floor body 40 is selected, and the form of the wiring passage 12 can be selected according to the actual needs in the actual use.

[0029] It should be noted that, since the heating floor is used, the two ends of the floor are provided with the plug 14, and the wiring is not convenient when close to the wall, so the floor is not installed at the close-to-wall position on the ground of the room, but is only installed at the central position on the ground of the room, and the ordinary floor is used at the edge position.

[0030] Compared with the prior art, the self-heating floor provided by the utility model is provided with the heating layer 20, the heating layer 20 is a semiconductor heating film, has the advantages of uniform heating, has good waterproofness, and has long service life, and since the heating layer 20 is a semiconductor heating, the heating efficiency is high, the temperature rises fast, a heat preservation layer 30 is arranged at the bottom of the heating layer 20, so that heat radiation to the floor is prevented, heat is directly radiated to the indoor, and the heating effect is improved.

[0031] The above is only the preferred embodiment of the utility model, and is not used for limiting the protection scope of the utility model, and any modification, equivalent replacement or improvement in the spirit of the utility model is covered in the claim range of the utility model.

Claims

1. A self-heating floor, characterized by: The self-heating floor comprises, from top to bottom, a surface decoration layer, a heating layer, an insulation layer and a floor body, the bottom of the floor body is provided with two electrodes, two wire channels respectively arranged at the two ends of the floor body and two plugs respectively arranged in each wire channel, the heating layer is a semiconductor heating film, each electrode is electrically connected with the positive electrode or the negative electrode of the semiconductor heating film, each plug is electrically connected with one electrode, and the plugs on adjacent floors are inserted into each other to connect the semiconductor heating films on the adjacent floors in series.

2. The self-heating floor according to claim 1, wherein: The shape of the heating layer is the same as that of the floor body.

3. The self-heating floor according to claim 1, wherein: The insulation layer is an extruded polystyrene foam board or a polyurethane foam board.

4. The self-heating floor according to claim 1, wherein: The extension direction of the wire channel is the same as the length direction of the floor body, and the wire channel is communicated with the electrode.

5. The self-heating floor according to claim 1, wherein: The axes of the two wire channels on each floor body are located on the same straight line, and the axes of the wire channels are located on the symmetry plane of the floor body along the length direction.

6. The self-heating floor according to claim 1, wherein: The wire channel is located inside the floor body or is communicated with the bottom of the floor body on one side.

7. The self-heating floor according to claim 1, wherein: The bottom of the floor body is provided with two electrode mounting grooves, and each electrode is mounted in one electrode mounting groove.

8. The self-heating floor according to claim 7, wherein: The electrode and the electrode mounting groove are in the shape of a long strip, and the extension direction of the electrode mounting groove is perpendicular or parallel to the length direction of the floor body.

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