Self-heating floor capable of being cut

Abstract

A self-heating floor capable of being cut sequentially comprises a surface decoration layer, a heat conduction layer, two heating layers, a heat preservation layer and a floor body from top to bottom. The heat conduction layer is made of a metal material. The two heating layers are arranged on the side, opposite to the surface decoration layer, of the heat conduction layer in a spaced mode. The heating layers are semiconductor heating films, and the two heating layers are installed at the two ends, in the length direction of the floor body, of the heat conduction layer respectively. An electric connection structure is arranged between each heating layer and the floor main body, so that the two heating layers are independently electrified to heat. The self-heating floor can be cut into two parts which respectively have a heating function and are smaller in area according to the position of the heating layer, so that the cutting requirement when the floor is paved on site can be met.

Description

TECHNICAL FIELD

[0001] The utility model belongs to floor technology field, especially a kind of self-heating floor that can be cut. BACKGROUND

[0002] In order to ensure that the heating surface is large and stable, the existing heating floor often makes the size of the heating layer the same as the floor surface, but the heating layer is generally a whole electric heating sheet, so the self-heating floor cannot be cut into different shapes according to the actual installation condition, and can only be laid in the corner after being cut by ordinary floor, which will lead to insufficient heating in the corner and cannot provide comfortable heating experience. SUMMARY

[0003] Therefore, the utility model provides a self-heating floor that can be cut to solve the above problems.

[0004] A self-heating floor that can be cut includes, from top to bottom, a surface decoration layer, a heat conduction layer, two heating layers, a thermal insulation layer and a floor body. The heat conduction layer is made of metal material. The two heating layers are arranged on the side of the heat conduction layer away from the surface decoration layer. The heating layer is a semiconductor heating film, and the two heating layers are respectively installed at the two ends of the heat conduction layer along the length direction of the floor body. Each heating layer has an electrical connection structure with the floor body to make the two heating layers separately heated by electricity.

[0005] Further, each electrical connection structure includes two electrodes inserted into the bottom of the floor body, a pair of plugs movably inserted into one end of the floor body, and two through holes respectively formed in the thermal insulation layer. Each electrode corresponds to one through hole, and the electrode is welded to the positive or negative electrode of the semiconductor heat conduction film through the through hole. Each plug is connected in series with one electrode.

[0006] Further, the bottom of the floor body is provided with four electrode mounting grooves, and the two ends of the floor body are respectively provided with two plug mounting channels. Each plug mounting channel is connected with one electrode mounting groove, and the electrode is fixedly arranged in the electrode mounting groove. The plug is movably inserted into the plug mounting channel.

[0007] Further, the thermal insulation layer is arranged between the bottom of the heat conduction layer and the heating layer.

[0008] Further, the thermal insulation layer is an extruded polystyrene foam board or a polyurethane foam board.

[0009] Further, a filling convex part is arranged on the top surface of the heat preservation layer, and the filling convex part is arranged between the two heat generating layers.

[0010] Further, the surface decoration layer arranged on one side of the heat conducting layer is combined with the heat conducting layer by cold pressure adhesive or pressure sensitive adhesive.

[0011] Compared with the prior art, the self-heating floor capable of being cut can be cut into two parts with heating function and smaller area according to the position of the heat generating layer, thereby meeting the cutting requirement of the floor during on-site paving, and each floor has at least one heat generating layer after paving, so that stable and uniform heating effect can be provided, the two heat generating layers are arranged near two ends of the heat conducting layer, so that a maximum cuttable area can be provided between the two heat generating layers, and the heat conducting layer is arranged between the heat generating layer and the floor body, so that the heat conducting layer can quickly absorb the heat generated by the heat generating layer and transmit the heat to each position on the floor body, so that the floor heating is more uniform, and a good heating experience is brought to the user. BRIEF DESCRIPTION OF DRAWINGS

[0012] Figure 1 The utility model provides a structure schematic diagram of the self-heating floor capable of being cut.

[0013] Figure 2 The utility model provides a structure schematic diagram of the self-heating floor capable of being cut. Figure 1 The utility model provides a structure schematic diagram of the self-heating floor capable of being cut.

[0014] Figure 3 The utility model provides a structure schematic diagram of the self-heating floor capable of being cut. Figure 1 The utility model provides a structure schematic diagram of the self-heating floor capable of being cut.

[0015] Figure 4 The utility model provides a structure schematic diagram of the self-heating floor capable of being cut. Figure 1 The utility model provides a structure schematic diagram of the self-heating floor capable of being cut DETAILED DESCRIPTION

[0016] The specific embodiments of the utility model are further explained below.

[0017] As Figures 1 to 4As shown, it is a structure schematic diagram of the self-heating floor which can be cut. The self-heating floor which can be cut comprises from top to bottom in turn a surface decoration layer 10, a heat conduction layer 20, a heating layer 30, a heat preservation layer 40 and a floor body 10. It is conceivable that the self-heating floor which can be cut also comprises other functional modules, such as mortise and tenon structure and the like, which should be the technology known to the person skilled in the art, and will not be described in detail here.

[0018] The surface decoration layer 10 can be a paint layer or a film layer, which is used to improve the appearance of the floor, which is prior art, and will not be described here. When the film is used, the surface decoration layer 10 can be assembled with the heat conduction layer 20 by cold pressing glue or pressure sensitive adhesive.

[0019] The heat conduction layer 20 is used to absorb the heat generated by the heating layer 30 and quickly transmit the heat to the room or the foot to have a certain temperature, while also making the temperature rise as evenly as possible, and also allowing the heat to be radiated to the indoor air as evenly as possible. The heat conduction layer 20 can be a copper-aluminum alloy plate or the like made of metal material, which fully utilizes its good heat conduction effect. The heat conduction layer 20 and the surface decoration layer 10 and the heating layer 30 can be bonded by an adhesive.

[0020] The heating layer 30 is a semiconductor heating film. The semiconductor heating film has a positive electrode and a negative electrode, such as the semiconductor heating layer used in the patent No. CN202322487710.9, patent name: a semiconductor heating film floor, which is a prior art, and will not be described in detail here. The surface of the heating layer 30 is an insulating material, and only the positive electrode and the negative electrode are provided with conductive material. The number of the heating layer 30 is two and is arranged at intervals, so as to provide two independent heat sources, and then the two heating layers 30 are separated when the floor needs to be separated, so as to meet the demand of cutting small floor while not affecting the heating function of the floor. The two heating layers 30 are respectively arranged near the two ends of the length direction of the floor. When cutting, the floor is cut at the middle part of the floor body 10, that is, the separation effect can be realized. Of course, according to actual needs, the floor can also be cut at other parts, as long as the heating layer 30 is not cut. The size of the heating layer 30 is not required, and the area of the heating layer 30 can be set as small as possible, so that the floor can be cut into the smallest shape when cutting, meeting the demand of on-site paving.

[0021] The heat insulation layer 40 is an extruded polystyrene foam board or a polyurethane foam board, which is used to prevent heat from dissipating from the ground. One side of the heat insulation layer 40 is in close contact with the two heat generating layers 30 and the heat conducting layer 20 respectively, and the other side is glued to the floor body 10. The side of the heat insulation layer 40 facing the heat conducting layer 20 has a filling protrusion 41, which is used to level the height difference between the bottom of the heat generating layer 30 and the bottom of the heat conducting layer 20, so that the floor structure is flat and stable.

[0022] The floor body 50 can be made of wood, PVC, plastic, etc., and its surface is treated to have anti-skid and wear-resistant properties. It can be understood that the floor body 10 also has a mortise and tenon structure on its side wall for installing the floor. For the sake of convenience, the mortise and tenon structure is not shown in the figure. The floor body 50 and each heat generating layer 30 are respectively provided with two electrical connection structures 11. Each electrical connection structure 11 connects one heat generating layer 30 with the floor body 50, and facilitates the direct connection of the floor body 50 with an external power supply component.

[0023] Each electrical connection structure 11 includes two electrodes 111 spaced apart and inserted into the bottom of the floor body 50, a pair of plug 112 movably inserted into one end of the floor body 50, and two through holes 113 spaced apart and provided on the heat insulation layer 40.

[0024] It should be noted that the two electrodes 111 are respectively welded to the positive and negative electrodes of the semiconductor heating film. The two pairs of plug 112 of the two electrical connection structures 11 are respectively located at the two ends of the floor body 50 in the length direction, so as to be respectively inserted into the adjacent two floor boards. When installing the floor, one electrical connection structure 11 of the previous floor board is connected with one electrical connection structure 11 of the next floor board, so as to connect a plurality of floor boards in series. The pair of plug 112 located at the same end of the floor body 50 is respectively a male plug and a female plug. The male plug and the female plug are respectively connected with the two electrodes 111 through wires. The two plug 112 can be connected to an external power supply or an adjacent floor board, so that the heat generating layer 30 is powered to generate heat. Since the structure for inserting the plug 112 into the external power supply, as well as the form and structure of the external power supply, are well known to those skilled in the art, they will not be described here.

[0025] The through holes 113 are provided on the heat insulation layer 40, and each through hole 113 corresponds to one electrode 111. The electrode 111 is welded to the positive or negative electrode on the semiconductor heating film as the heat generating layer 30 through the through hole 113.

[0026] Please refer to Figure 3The bottom of the floor body 50 is also provided with four electrode installation grooves 12 for facilitating installation of the electrodes 111. The floor body 10 is symmetrically provided with four plug installation passages 13 at both ends for facilitating passage of the plugs 112.

[0027] The electrodes 111 are respectively fixedly installed in the electrode installation grooves 12. The plug installation passages 13 and the electrode installation grooves 12 are in communication with each other, thereby facilitating active setting of the plugs 112 in the plug installation passages 13. The length of the plugs 112 is less than the length of the plug installation passages 13, and the plugs 112 and the electrodes 111 are connected through a wire long enough. During transportation of the floor, the plugs 112 can be completely hidden in the plug installation passages 13 and properly protected. When the plugs 112 need to be connected to a power source, the plugs 112 can be taken out of the plug installation passages 13. After connection, the plugs 112 can be inserted back into the plug installation passages 13, so that the plugs 112 do not occupy the space between adjacent floors and do not affect normal splicing between floors.

[0028] In use, the floor can be spliced and laid on the ground through the splicing structure such as the mortise and tenon structure commonly provided on the floor. When the floor needs to be cut to adapt to the space near the wall of the room, the floor can be disconnected from the middle position of the floor body 50 or the side close to the heating layer 30, and further cutting and shaping can be performed on the area of the floor body 50 not covered by the heating layer 30. The plugs 112 can be connected with the preset power component in the room or the plugs 112 of the adjacent floor, thereby controlling the voltage of the power component or the current flowing through the heating layer 30 through a controller or a control panel, so as to control the heating temperature of the floor. Since the principle and structure of controlling the temperature of the semiconductor heating film and the structure of connecting the semiconductor heating film with the power component are well known to those skilled in the art, they will not be described here.

[0029] Compared with the prior art, the self-heating floor capable of being cut can be cut into two parts with heating function and smaller area according to the position of the heating layer 30, thereby meeting the cutting requirement during on-site floor paving. After the floor is paved, each floor has at least one heating layer 30, which can provide stable and uniform heating effect. The two heating layers 30 are respectively close to the two ends of the heat conducting layer 20, thereby providing a cuttable area as large as possible between the two heating layers 30. The heat conducting layer 20 is further arranged between the heating layer 30 and the floor body 50, which can quickly absorb the heat emitted by the heating layer 30 and transmit to every place on the floor body 50, so that the floor heating is more uniform, thereby bringing good heating experience for the user.

[0030] The above is only the preferred embodiment of the utility model, and is not used for limiting the protection scope of the utility model, and any modification, equivalent replacement or improvement within the utility model spirit is covered in the claim range of the utility model.

Claims

1. A cuttable self-heating floor, characterized by: The cuttable self-heating floor comprises, from top to bottom, a surface decoration layer, a heat conduction layer made of metal material, two heating layers, a heat preservation layer, and a floor body, the two heating layers being arranged at intervals on the side of the heat conduction layer away from the surface decoration layer, the heating layers being semiconductor heating films, the two heating layers being respectively installed at the two ends of the heat conduction layer along the length direction of the floor body, and each of the heating layers having an electrical connection structure with the floor body to enable the two heating layers to be separately heated.

2. The cuttable self-heating floor of claim 1, wherein: Each of the electrical connection structures comprises two electrodes inserted at intervals in the bottom of the floor body, a pair of plugs movably inserted in one end of the floor body, and two through holes respectively formed in the heat preservation layer, each of the electrodes corresponding to one of the through holes, the electrodes being welded with the anode or cathode of the semiconductor heating film through the through holes, and each of the plugs being connected in series with one of the electrodes.

3. The cuttable self-heating floor of claim 2, wherein: The bottom of the floor body is provided with four electrode installation grooves, and the two ends of the floor body are respectively provided with two plug installation channels, each of the plug installation channels being in communication with one of the electrode installation grooves, the electrodes being fixedly arranged in the electrode installation grooves, and the plugs being movably inserted in the plug installation channels.

4. The cuttable self-heating floor of claim 1, wherein: The heat preservation layer is arranged between the bottom of the heat conduction layer and the heating layers.

5. The cuttable self-heating floor of claim 4, wherein: The heat preservation layer is an extruded polystyrene foam board or a polyurethane foam board.

6. The cuttable self-heating floor of claim 4, wherein: The top surface of the heat preservation layer is provided with a filling protrusion between the two heating layers.

7. The cuttable self-heating floor of claim 1, wherein: The surface decoration layer and the heat conduction layer arranged on the side of the heat conduction layer are assembled by cold pressure adhesive or pressure sensitive adhesive.

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