TO packaging test tool
By designing a TO package test fixture and utilizing a combination of a heat sink and a PCB board, the problems of pin interference and heat generation in TO39 packaged micro-components during testing were solved, achieving high testing accuracy and heat dissipation.
Patent Information
- Application Number
- CN202422646822.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-31
- Publication Date
- 2025-11-28
- Estimated Expiration
- 2034-10-31
AI Technical Summary
Existing TO39 packaged miniature components are prone to inaccurate temperature detection due to interference between pins and heat generation during testing.
A TO package test fixture was designed, including a heat sink base and a PCB board. Electrical connection is achieved through pins, and the pins are protected by the gap between the heat conductor of the heat sink base and the heat sink body. The heat sink body and the heat sink body have fin structures for rapid heat dissipation.
It effectively avoids interference between pins, ensures test accuracy, and prevents components from overheating through rapid heat dissipation, thereby improving the reliability and accuracy of the test.
Smart Images
Figure CN223611545U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the field of packaging test, concretely to a TO packaging test tool. BACKGROUND
[0002] TO packaging is an important packaging form in the use process of laser and infrared detector, and its advantages are high quality and low price, standardization, easy installation and heat dissipation of metal shell, which makes TO packaging become one of the widely used device packaging methods. TO39 packaging is a small size TO packaging, which is very suitable for microchip packaging and can accommodate corresponding TEC cooling piece and temperature measuring diode and other electronic components.
[0003] In the existing TO39 packaging of infrared detector, the chip can show better performance at low temperature, so TEC cooling piece and diode are needed for refrigeration and temperature measurement, which affects the test packaging result. On the one hand, due to the small size of TO39 packaging and the small diameter of pin distribution, the conventional test line is easy to cause interference between pins. On the other hand, the chip, TEC and diode and other components in the TO39 packaging will generate heat during work, which affects the detection temperature of diode and the normal work of chip, so the test effect cannot be achieved.
[0004] Therefore, the technical problem to be solved by the present application is how to solve the problem of difficult TO packaging test, especially the micro component of TO39 packaging. CONTENT OF THE UTILITY MODEL
[0005] In order to solve the above technical problems, the utility model provides a TO packaging test tool, which can continuously and quickly replace the test object by inserting and pulling out the TO packaging, and the PIN pin on the PCB board can facilitate the staff to access the test device of external device, reduce the difficulty of accessing the test device, effectively avoid the interference between the pins of TO packaging, and even accidentally damage the pins of TO packaging. In addition, the heat dissipation base of the test tool can also prevent the heat generated by the components in the TO packaging from affecting its normal operation, so as to improve the accuracy of the test.
[0006] The technical scheme of the utility model is:
[0007] A TO packaging test tool, comprising a heat dissipation base and a PCB board, the heat dissipation base comprises a heat dissipation main body and a heat conductor, and the heat conductor and the heat dissipation main body are in thermal contact; the PCB board is fixed on the heat dissipation base; the PCB board is used for connecting the TO packaging to be tested, and the heat dissipation main body and the heat conductor are provided with a gap for inserting the pins of the TO packaging to be tested, and the heat conductor and the TO packaging to be tested are in thermal contact; the PCB board is provided with a plurality of PIN pins for electrically connecting the pins of the TO packaging to be tested.
[0008] In the TO package test tool, a plurality of pin holes for connecting the TO package to be tested are arranged on the PCB; the pin holes and the PIN pins are electrically connected one by one through the connecting circuit in the PCB; the PIN pins are arranged on the periphery of the pin holes and are used for electrically connecting the external test device;
[0009] When the TO package to be tested is installed on the PCB through the pin holes, the pins of the TO package to be tested are located in the gap between the heat dissipation main body and the heat conductor.
[0010] In the TO package test tool, the PCB is further provided with a hollow part matched with the shape and size of the heat conductor; the heat conductor passes through the hollow part to contact the TO package to be tested for heat conduction.
[0011] In the TO package test tool, the PCB and the heat dissipation base are provided with position corresponding screw holes, and the PCB and the heat dissipation base are detachably connected through the fixing bolts.
[0012] In the TO package test tool, the heat dissipation main body is composed of a plurality of fins; the plurality of fins are connected to the outer wall of the heat conductor.
[0013] In the TO package test tool, the PCB is provided with a plurality of PIN holes; a plurality of PIN pins are fixed one by one in the PIN holes; the hole walls of the pin holes and the PIN holes are both provided with a conductive adhesive layer.
[0014] In the TO package test tool, the pin holes are eight, and the eight pin holes are arranged in a circular array with the heat conductor as the center; the PIN holes are eight, and the eight PIN holes are arranged in a circular array with the heat conductor as the center and correspond to the positions of the eight pin holes respectively.
[0015] In the TO package test tool, the upper end surface of the heat conductor is provided with a heat-conducting silica gel layer.
[0016] In the TO package test tool, the heat dissipation base is an integrally formed structure.
[0017] In the TO package test tool, the material of the heat dissipation base is copper, aluminum or iron.
[0018] The above technical solution in the utility model has at least one of the following advantages or beneficial effects:
[0019] This invention connects the TO package under test to the test fixture via a PCB board, enabling electrical connection with the pins, thus facilitating access to peripheral testing devices. Simultaneously, when the TO package under test is connected to the test fixture, its pins are placed in the gap between the heat sink and the heat conductor, protecting the pins and preventing interference. Furthermore, during testing, the heat conductor of the heat sink base quickly transfers the heat from the TO package to the heat sink for dissipation, preventing the components in the TO package from malfunctioning due to overheating, which would otherwise result in poor test performance. Attached Figure Description
[0020] Fig. 1 This is a three-dimensional structural diagram of Embodiment 1 of the present invention;
[0021] Fig. 2 This is a split diagram of Embodiment 1 of the present invention;
[0022] Fig. 3 This is a top view of Embodiment 1 of the present invention;
[0023] Fig. 4 This is a front view of Embodiment 1 of the present invention.
[0024] Fig. 5 This is Embodiment 1 of the present utility model. Fig. 4 AA sectional view.
[0025] The markings in the attached diagram are as follows:
[0026] 1. Heat sink base; 11. Heat conductor; 12. Heat sink body; 13. Fins; 2. PCB board; 21. Pin hole; 22. PIN hole; 23. PIN pin; 201. Cutout; 110. Screw hole; a. Gap; b. TO package. Detailed Implementation
[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0028] Example 1
[0029] refer to Figs. 1-5The application discloses a TO package test tool, which comprises a heat dissipation base 1 and a PCB board 2, the heat dissipation base 1 comprises a heat dissipation main body 12 and a heat conduction body 11, the heat conduction body 11 is in heat conduction connection with the heat dissipation main body 12, the PCB board 2 is fixed on the heat dissipation base 1, the PCB board 2 is used for connecting a TO package b to be tested, a gap a for inserting pins of the TO package b to be tested is arranged between the heat dissipation main body 12 and the heat conduction body 11, the heat conduction body 11 is in heat conduction connection with the TO package b to be tested, and a plurality of PIN pins 23 for electrically connecting the pins of the TO package b to be tested are arranged on the PCB board 2.
[0030] In the embodiment, the TO package b to be tested is connected to the test tool through the PCB board 2, and is electrically connected to the PIN pins 23, so that a worker can conveniently connect an external test device; meanwhile, when the TO package b to be tested is connected to the test tool, the pins are arranged in the gap a between the heat dissipation main body 12 and the heat conduction body 11, so that the pins are protected and interference between the pins is avoided; in addition, in the test process, the heat conduction body 11 of the heat dissipation base 1 can quickly transfer heat of the TO package b to the heat dissipation main body 12 for heat dissipation, so that elements in the TO package b can normally work due to low temperature, and the problem of poor test effect caused by high temperature of the elements in the TO package b is avoided.
[0031] In the embodiment, specifically, a plurality of pin holes 21 for connecting the pins of the TO package b to be tested are further arranged on the PCB board 2; the pin holes 21 and the PIN pins 23 are electrically connected in one-to-one correspondence through a connecting circuit in the PCB board 2; the PIN pins 23 are arranged at the periphery of the pin holes 21 and are used for electrically connecting the external test device; when the TO package b to be tested is installed on the PCB board 2 through the pin holes 21, the pins of the TO package b to be tested are arranged in the gap a between the heat dissipation main body 12 and the heat conduction body 11.
[0032] More specifically, a plurality of PIN holes 22 are arranged on the PCB board 2; the plurality of PIN pins 23 are fixed in the PIN holes 22 in one-to-one correspondence.
[0033] In the embodiment, since the TO package b to be tested has eight pins, the pin holes 21 are eight, and the eight pin holes 21 are arranged in a circular array with the heat conduction body 11 as the center; and a plurality of PIN holes 22 corresponding to the PIN pins 23 are arranged on the PCB board 2; the PIN holes 22 are eight, and the eight PIN holes 22 are arranged in a circular array with the heat conduction body 11 as the center and correspond to positions of the eight pin holes 21 respectively. Of course, when other different types of TO packages b are tested, the pin holes 21, the PIN holes 22 and the corresponding connecting circuits can be appropriately adjusted by those skilled in the art.
[0034] It needs to be further explained that the heat dissipation base 1 and the PCB board 2 in the embodiment are circular structures, and can be square structures or the like in other embodiments.
[0035] In actual application, the worker only needs to install the TO package b on the PCB board 2 through the pin hole 21, at this time, the pins of the TO package b are located in the gap a between the heat dissipation main body 12 and the heat conduction body 11 and do not contact the heat dissipation base 1, which plays a role of protecting the pins of the TO package b, and then the PIN pin 23 on the PIN hole 22 is electrically connected with the testing device, due to the connection of the connecting circuit (not shown in the figure) of the PCB board 2, each pin hole 21 is electrically connected with the corresponding PIN hole 22 through the connecting circuit, so that the testing device can be connected and detected through the PIN pin 23.
[0036] In addition, in the embodiment, in order to avoid poor contact, the hole walls of the pin hole 21 and the PIN hole 22 are provided with a conductive glue layer (not shown in the figure).
[0037] Specifically, the PCB board 2 is also provided with a hollow part 201 matched with the shape and size of the heat conduction body 11; the heat conduction body 11 passes through the hollow part 201 to contact the TO package b to be detected for heat conduction. Under this design, when the TO package b is installed on the PCB board 2 through the plurality of pin holes 21, the bottom of the TO package b contacts the heat conduction body 11 for heat conduction. Thus, the purpose of rapid heat dissipation is achieved.
[0038] In order to improve the heat conduction efficiency, preferably, the upper end surface of the heat conduction body 11 is provided with a heat conduction silica gel layer (not shown in the figure); further preferably, the material of the heat dissipation base 1 is copper.
[0039] In the embodiment, preferably, in order to further improve the heat dissipation efficiency, the heat dissipation main body 12 is composed of a plurality of fins 13; the plurality of fins 13 are connected to the outer wall of the heat conduction body 11 to form a straight seam winding type fin 13 pipe structure.
[0040] In the embodiment, it should be noted that the heat dissipation base 1 is an integral molding structure, that is, the heat conduction body 11 and the heat dissipation main body 12 are manufactured by machining a copper block.
[0041] As a preferred embodiment of the present embodiment, the PCB board 2 is detachably connected to the heat dissipation base 1.
[0042] As a further preferred embodiment of the present embodiment, the PCB board 2 and the heat dissipation main body 12 are provided with position corresponding screw holes 110, and are detachably connected by fixing bolts.
[0043] Under this design, in actual application, if it is necessary to test TO packages b with different pin designs, it is only necessary to design and replace the PCB board 2, thereby improving the applicability of the tooling.
[0044] Although the embodiments of the utility model have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and purposes of the utility model, and the scope of the utility model is defined by the claims and their equivalents.
Claims
1. A TO package testing tool, characterized by, The heat dissipation base comprises a heat dissipation main body and a heat conduction body, and the heat conduction body and the heat dissipation main body are in thermal conduction connection; the PCB board is fixed on the heat dissipation base; the PCB board is used for connecting the TO package to be tested; the gap for the pins of the TO package to be tested to be inserted is arranged between the heat dissipation main body and the heat conduction body, and the heat conduction body and the TO package to be tested are in thermal conduction connection; a plurality of PIN pins for electrically connecting the pins of the TO package to be tested are arranged on the PCB board.
2. The TO package testing tool according to claim 1, wherein, A plurality of pin holes for connecting the pins of the TO package to be tested are arranged on the PCB board; the pin holes and the PIN pins are electrically connected one by one through the connecting circuit in the PCB board; the PIN pins are arranged on the periphery of the pin holes and are used for electrically connecting the external testing device. When the TO package to be tested is installed on the PCB board through the pin holes, the pins of the TO package to be tested are located in the gap between the heat dissipation main body and the heat conduction body.
3. The TO package testing tool according to claim 1, wherein, The PCB board is also provided with a hollow part matched in shape and size with the heat conduction body; the heat conduction body passes through the hollow part to contact the TO package to be tested for heat conduction.
4. The TO package testing tool according to claim 1, wherein, The PCB board and the heat dissipation main body are provided with position corresponding screw holes, and are connected in a detachable manner through fixing bolts.
5. The TO package testing tool of claim 1, wherein, The heat dissipation main body is composed of a plurality of fins; the plurality of fins are connected to the outer wall of the heat conduction body.
6. The TO package testing tool of claim 2, wherein, A plurality of PIN holes are arranged on the PCB board; the plurality of PIN pins are fixed in the PIN holes one by one; the hole walls of the pin holes and the PIN holes are both provided with a conductive adhesive layer.
7. The TO package testing tool of claim 6, wherein, The pin holes are eight, and the eight pin holes are arranged in a circular array with the heat conduction body as the center; the PIN holes are eight, and the eight PIN holes are arranged in a circular array with the heat conduction body as the center and correspond to the positions of the eight pin holes respectively.
8. The TO package testing tool of claim 1, wherein, The upper end surface of the heat conduction body is provided with a heat conduction silica gel layer.
9. The TO package testing tool of claim 1, wherein, The heat dissipation base is an integrally formed structure.
10. The TO package testing tool of claim 9, wherein, The material of the heat dissipation base is copper, aluminum or iron.