Bearing device applied to large-size wafer FIB processing

By combining conductive pads and copper mesh, the problems of insufficient conductivity and breakage in large-size wafer FIB processing are solved, achieving stable fixation and good conductivity, and ensuring sample integrity.

CN223612409UActive Publication Date: 2025-11-28HONGKANG TECH TESTING (SHANGHAI CO LTD
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Patent Information

Application Number
CN202423083637.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-12
Publication Date
2025-11-28
Estimated Expiration
2034-12-12

AI Technical Summary

Technical Problem

In existing technologies for large-size wafer FIB processing, the application of conductive tape leads to sample contamination and damage, insufficient conductivity, and affects processing and observation results.

Method used

A combination of conductive pads and copper mesh is used to fix the wafer sample, avoiding the use of conductive tape, thus enhancing conductivity and improving fixation stability.

Benefits of technology

This reduces adhesive residue and the risk of breakage, ensuring the integrity and conductivity of the wafer samples and meeting the requirements of FIB processing and observation.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of bearing devices, in particular to a bearing device applied to large-size wafer FIB machining, which comprises a carrier base used for bearing a wafer sample, a first conductive cushion is arranged on the top surface of the carrier base, the wafer sample is arranged on the top surface of the first conductive cushion, and a second conductive cushion is arranged on the top surface of the first conductive cushion. A metal copper net is arranged on the top surface of the wafer sample, a second conductive cushion is arranged on the top surface of the metal copper net, and the carrier base is provided with a fixing assembly used for pressing and fixing the wafer sample. According to the invention, under the condition that the sample is not damaged, the large-size FIB sample can be borne, and good conductivity is also achieved.
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Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of a bearing device, in particular to a bearing device applied to FIB processing of a large-size wafer. BACKGROUND

[0002] When various analyses are performed using FIB, because positive and negative charge sources such as electron beams and ion beams need to be used, the sample needs to be properly carried by a carrier, and the sample needs to be properly conductive, and the charge needs to be grounded, so that the sample does not accumulate too much charge and cannot be analyzed.

[0003] Generally, a FIB sample can use conductive tape, or use conductive silver paste or carbon paste to make the sample conductive, but the conductive tape or the use of conductive silver paste is easy to contaminate the sample. On the other hand, when the sample size is too large (for example, an 8-inch wafer), the poor conductivity problem will seriously affect the FIB processing or observation results. Therefore, how to carry a large-size FIB sample without damaging the sample, and also taking into account good conductivity, is a problem that needs to be overcome at present.

[0004] At present, more conductive copper tape or conductive aluminum tape is usually used for large-size samples. However, the use of tape will leave traces around the sample, or damage the surface of the sample in a large area, resulting in the customer being unable to perform subsequent process experiments.

[0005] In addition, the use of copper tape to conduct the sample has very limited improvement, and usually requires the simultaneous use of conductive silver paste or conductive carbon paste to assist in meeting the conductivity requirements of the analysis process. The use of tape often causes thin wafer samples to be easily damaged during the process of disassembling the tape after analysis is completed, so as to not meet the customer's purpose of non-broken analysis. INVENTION CONTENTS

[0006] In order to overcome the problem of carrying a large-size FIB sample without damaging the sample, and also taking into account good conductivity, the present application provides a bearing device applied to FIB processing of a large-size wafer.

[0007] The bearing device applied to FIB processing of a large-size wafer provided by the present application adopts the following technical scheme:

[0008] A bearing device applied to FIB processing of a large-size wafer, comprising a carrier base for carrying a wafer sample, a first conductive soft pad is arranged on the top surface of the carrier base, the wafer sample is arranged on the top surface of the first conductive soft pad, a metal copper mesh is arranged on the top surface of the wafer sample, a second conductive soft pad is arranged on the top surface of the metal copper mesh, and the carrier base is provided with a fixing assembly for pressing and fixing the wafer sample.

[0009] By adopting the above technical scheme, when the wafer sample needs to be processed or observed by FIB, the first conductive soft pad is first laid on the top surface of the carrier base, then the wafer sample is laid on the top surface of the first conductive soft pad, then the metal copper mesh is laid on the top surface of the wafer sample, then the second conductive soft pad is laid on the top surface of the metal copper mesh, and finally the first conductive soft pad, the second conductive soft pad, the wafer sample and the metal copper mesh are fixed on the bearing device by the fixing assembly. The metal copper mesh is used to enhance the conductivity of the wafer sample, and finally the wafer sample is fixed and pressed by the fixing assembly. In this process, the wafer sample is not pasted by using a copper tape, thereby reducing the paste marks and the risk of damage, and ensuring the integrity of the wafer sample.

[0010] Optionally, the fixing assembly comprises a buckle, which is hingedly arranged on the side wall of the carrier base, and the buckle is buckled on the top surface of the second conductive soft pad.

[0011] By adopting the above technical scheme, when the wafer sample needs to be fixed, the buckle is swung towards the wafer sample, at this time the buckle abuts against the top surface of the second conductive soft pad, thereby facilitating to improve the stability of the wafer sample fixed and pressed.

[0012] Optionally, the fixing assembly comprises a lock cover, a through hole is arranged on the top surface of the lock cover, an inner thread is arranged on the inner wall of the lock cover, an outer thread is arranged on the outer wall of the carrier base, and the lock cover is threadedly connected with the carrier base.

[0013] By adopting the above technical scheme, when the wafer sample needs to be fixed, the lock cover is screwed, at this time the lock cover abuts against the top surface of the second conductive soft pad, thereby facilitating to improve the stability of the wafer sample fixed and pressed.

[0014] Optionally, the fixing assembly comprises a bent fixing piece, which is arranged on the top surface of the carrier base.

[0015] By adopting the above technical scheme, when the wafer sample needs to be fixed, the bent fixing piece is bent and at the same time abuts against the top surface of the second conductive soft pad, at this time the wafer sample abuts against the carrier base, thereby facilitating to improve the stability of the wafer sample fixed and pressed.

[0016] Optionally, the fixing assembly comprises a pressing plate, a stud and a nut, the stud is arranged on the top surface of the carrier base, the pressing plate is arranged on the top surface of the second conductive soft pad, the top end of the stud penetrates through the pressing plate, and the nut is threadedly connected with the top end of the stud.

[0017] By adopting the technical scheme, when the wafer sample needs to be fixed, the pressing plate is first pressed on the top surface of the second conductive soft pad, and then the nut is screwed, at which time the wafer sample is tightly fixed on the carrier base, thereby facilitating improvement of the stability of the wafer sample in tight fixation.

[0018] Optionally, the first conductive soft pad and the second conductive soft pad are both conductive rubber.

[0019] By adopting the technical scheme, the conductive rubber has good conductivity, which is conducive to enhancing the conductivity of the edge of the wafer sample and protecting the edge of the wafer sample.

[0020] Optionally, the number of the buckles is eight, and the eight buckles are arranged in a ring array along the vertical central axis of the carrier base.

[0021] By adopting the technical scheme, under the buckling action of the eight buckles, the stability of the wafer sample in tight fixation on the carrier base is further improved.

[0022] Optionally, the number of the bending fixing members is eight, and the eight bending fixing members are arranged in a ring array along the vertical central axis of the carrier base.

[0023] By adopting the technical scheme, under the bending abutting action of the eight bending fixing members, the stability of the wafer sample in abutting fixation on the carrier base is further improved.

[0024] In summary, the present application has the following beneficial technical effects:

[0025] When the wafer sample needs to be processed or observed by FIB, the first conductive soft pad is first laid on the top surface of the carrier base, and then the wafer sample is laid on the top surface of the first conductive soft pad, and then the metal copper mesh is laid on the top surface of the wafer sample, and then the second conductive soft pad is laid on the top surface of the metal copper mesh, and finally the first and second conductive soft pads, the wafer sample and the metal copper mesh are fixed on the carrier device by the fixing assembly, the metal copper mesh is used to enhance the conductivity of the wafer sample, and finally the wafer sample is tightly fixed by the fixing assembly, in this process, the wafer sample is not pasted by using copper tape, the pasting trace is reduced, the risk of damage is reduced, and the integrity of the wafer sample is ensured. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 is a front view of the carrier device of Embodiment One of the present application;

[0027] Figure 2 is a top view of the metal copper mesh of the present application;

[0028] Figure 3is a top view of the first conductive soft pad or the second conductive soft pad of the present application;

[0029] Figure 4 is a front view of the fixing assembly of Embodiment Two of the present application;

[0030] Figure 5 is a front view of the fixing assembly of Embodiment Three of the present application;

[0031] Figure 6 is a front view of the fixing assembly of Embodiment Four of the present application.

[0032] Reference Signs: 1, carrier base; 2, wafer sample; 3, first conductive soft pad; 4, copper mesh; 5, second conductive soft pad; 6, fastener; 7, lock cover; 8, through hole; 9, internal thread; 10, external thread; 11, bent fixing piece; 12, pressing plate; 13, stud; 14, nut. DETAILED DESCRIPTION

[0033] The following will be described in detail below in combination with the accompanying Figures 1-6 The present application will be further described in detail.

[0034] Embodiment One:

[0035] Referring to Figures 1-3 A carrier device applied to FIB processing of large-size wafer, comprising a carrier base 1, the carrier base 1 is used for carrying a wafer sample 2. Wherein, the size of the wafer sample 2 is 8 inches. The top surface of the carrier base 1 is fixedly laid with a first conductive soft pad 3, and the wafer sample 2 is laid on the top surface of the first conductive soft pad 3. The top surface of the wafer sample 2 is laid with a copper mesh 4, the top surface of the copper mesh 4 is laid with a second conductive soft pad 5, and the carrier base 1 is installed with a fixing assembly, which is used for tightly pressing and fixing the wafer sample 2 on the carrier base 1.

[0036] When it is necessary to perform FIB processing or observation on a large-size wafer sample 2, the carrier base 1 is needed to be used to carry the large-size wafer sample 2. For this purpose, first, the first conductive soft pad 3 is fixedly laid on the top surface of the carrier base 1, then the wafer sample 2 is laid on the top surface of the first conductive soft pad 3, then the copper mesh 4 is laid on the top surface of the wafer sample 2, then the second conductive soft pad 5 is laid on the top surface of the copper mesh 4, and finally the second conductive soft pad 5, the copper mesh 4 and the wafer sample 2 are tightly pressed and fixed on the carrier base 1 by the fixing assembly, thereby completing the carrying of the large-size wafer sample 2.

[0037] Specifically, referring to Figure 1 The fixing assembly comprises eight fasteners 6, which are arranged in a ring array along the vertical central axis of the carrier base 1. The eight fasteners 6 are respectively hinged to the side wall of the carrier base 1.

[0038] When it is needed to press and fix the wafer sample 2, the eight buckles 6 are driven to swing towards the wafer sample 2 in turn, at this time the buckles 6 are buckled on the top surface of the second conductive soft pad 5, and the second conductive soft pad 5 thus press and fixes the wafer sample 2 on the carrier base 1.

[0039] It is worth mentioning that, referring to Figure 2 , the metal copper net 4 is designed by a relatively close metal network, which ensures that the metal copper net 4 contacts each position of the wafer sample 2 when the whole wafer sample 2 is processed or observed by FIB. In this way, the purpose of maintaining good conductivity without using copper tape or coating silver glue and other steps is achieved.

[0040] Referring to Figure 1 and Figure 3 , in order to ensure the conductivity of the first conductive soft pad 3 and the second conductive soft pad 5, the first conductive soft pad 3 and the second conductive soft pad 5 are both conductive rubber, which is covered on the metal copper net 4 and the edge of the wafer sample 2, which is conducive to enhancing the conductivity and protection of the edge.

[0041] Embodiment two is different from embodiment one in that the structure of the fixing assembly is different.

[0042] Specifically, referring to Figure 4 , the fixing assembly includes a lock cover 7. The top surface of the lock cover 7 is penetrated by a through hole 8, through which the metal copper net 4 can be seen. The inner wall of the lock cover 7 is fixed with an internal thread 9, and the outer wall of the carrier base 1 is fixed with an external thread 10. Under the action of the internal thread 9 and the external thread 10, the lock cover 7 is threadedly connected with the carrier base 1.

[0043] When it is needed to press and fix the wafer sample 2, after the second conductive soft pad 5 is laid on the top surface of the metal copper net 4, the lock cover 7 is screwed, at this time the lock cover 7 is tightly pressed against the top surface of the second conductive soft pad 5, and the wafer sample 2 is press and fixed on the carrier base 1.

[0044] Embodiment three is different from embodiments one and two in that the structure of the fixing assembly is different.

[0045] Specifically, referring to Figure 5 , the fixing assembly includes a bent fixing piece 11, and the bent fixing piece 11 is made of flexible material. The bent fixing piece 11 is fixed on the top surface of the carrier base 1, and the number of the bent fixing piece 11 is eight, and the eight bent fixing pieces 11 are respectively arranged in a ring array around the vertical center line of the carrier base 1.

[0046] When it is needed to press and fix the wafer sample 2, after the second conductive soft pad 5 is laid on the top surface of the metal copper net 4, the eight bent fixing pieces 11 are bent inward in turn, at this time the bent fixing piece 11 is tightly pressed against the top surface of the second conductive soft pad 5, and the wafer sample 2 is press and fixed on the carrier base 1.

[0047] Embodiment four is different from embodiments one, two and three in that the structure of the fixing assembly is different.

[0048] Specifically, referring to Figure 6 , the number of fixing assemblies is eight, and each fixing assembly includes a pressing plate 12, a stud 13 and a nut 14. The pressing plate 12 is arranged on the top surface of the second conductive soft pad 5, the stud 13 is fixed on the top surface of the carrier base 1, the top end of the stud 13 penetrates through the pressing plate 12 and extends above the pressing plate 12. The nut 14 is threadedly connected with the top end of the stud 13.

[0049] When it is necessary to press and fix the wafer sample 2, the pressing plate 12 is first arranged on the top surface of the second conductive soft pad 5, and then the nut 14 is screwed. At this time, the pressing plate 12 presses the top surface of the second conductive soft pad 5, and the wafer sample 2 is pressed and fixed on the carrier base 1.

[0050] The working principle of a bearing device for large-size wafer FIB processing is as follows:

[0051] When it is necessary to perform FIB processing or observation on the large-size wafer sample 2, the carrier base 1 is used to bear the large-size wafer sample 2. To this end, the first conductive soft pad 3 is first fixed and laid on the top surface of the carrier base 1, then the wafer sample 2 is laid on the top surface of the first conductive soft pad 3, then the metal copper mesh 4 is laid on the top surface of the wafer sample 2, then the second conductive soft pad 5 is laid on the top surface of the metal copper mesh 4, and finally the second conductive soft pad 5, the metal copper mesh 4 and the wafer sample 2 are pressed and fixed on the carrier base 1 by the fixing assembly, thereby completing the bearing of the large-size wafer sample 2.

[0052] In summary, the metal copper mesh 4 is used to enhance the conductivity of the wafer sample 2, and finally the wafer sample 2 is pressed and fixed by the fixing assembly. In this process, the wafer sample 2 is not pasted by using a copper tape, thereby reducing the pasting marks and the risk of damage, and ensuring the integrity of the wafer sample 2.

[0053] The above are preferred embodiments of the present application, and do not limit the protection scope of the present application. Therefore, any equivalent changes made on the basis of the structure, shape and principle of the present application should be covered within the protection scope of the present application.

Claims

1. A carrier device for FIB processing of large size wafers, comprising a carrier base (1) for carrying a wafer sample (2), characterized in that: The top surface of the carrier base (1) is provided with a first conductive soft pad (3), the wafer sample (2) is arranged on the top surface of the first conductive soft pad (3), the top surface of the wafer sample (2) is provided with a metal copper mesh (4), the top surface of the metal copper mesh (4) is provided with a second conductive soft pad (5), and the carrier base (1) is provided with a fixing assembly for pressing and fixing the wafer sample (2).

2. The bearing device for FIB processing of a large-size wafer according to claim 1, wherein: The fixing assembly comprises a buckle (6) which is hingedly arranged on the side wall of the carrier base (1), and the buckle (6) is buckled on the top surface of the second conductive soft pad (5).

3. The carrier device for FIB processing of large size wafers according to claim 1, wherein: The fixing assembly comprises a lock cover (7), the top surface of the lock cover (7) is provided with a through hole (8), the inner wall of the lock cover (7) is provided with an internal thread (9), the outer wall of the carrier base (1) is provided with an external thread (10), and the lock cover (7) is threadedly connected with the carrier base (1).

4. The carrier device for FIB processing of large size wafers according to claim 1, wherein: The fixing assembly comprises a bending fixing piece (11) arranged on the top surface of the carrier base (1).

5. The carrier device for FIB processing of large size wafers according to claim 1, wherein: The fixing assembly comprises a pressing plate (12), a stud (13) and a nut (14), the stud (13) is arranged on the top surface of the carrier base (1), the pressing plate (12) is arranged on the top surface of the second conductive soft pad (5), the top end of the stud (13) penetrates the pressing plate (12), and the nut (14) is threadedly connected with the top end of the stud (13).

6. The carrier device for FIB processing of large size wafers according to claim 1, wherein: The first conductive soft pad (3) and the second conductive soft pad (5) are both conductive rubber.

7. The carrier device for FIB processing of large size wafers according to claim 2, wherein: The number of the buckles (6) is eight, and the eight buckles (6) are respectively arranged in annular array along the vertical central axis of the carrier base (1).

8. The carrier device for FIB processing of large size wafers according to claim 4, wherein: The number of the bending fixing pieces (11) is eight, and the eight bending fixing pieces (11) are respectively arranged in annular array along the vertical central axis of the carrier base (1).