Camera module support and camera module

Abstract

The utility model discloses a camera module support and a camera module, the camera module support comprises an insulating hollow frame and a colloid, the insulating hollow frame comprises an insulating frame body, a first light-transmitting cavity arranged in the insulating frame body, a hollow cavity arranged in the insulating frame body and surrounding the periphery of the first light-transmitting cavity and the colloid, and the colloid is filled in the hollow cavity; after the camera module support is connected to the lower portion of the lens assembly, the filled colloid can cover the electronic component, a through opening for avoiding the electronic component is not needed, and therefore under the condition that the distance between the outer wall of the electronic component and the outer wall of the camera module support is kept unchanged, the electronic component can be prevented from being damaged. According to the camera module support, the distance between the side wall of the through hole in a traditional support and the electronic component can be saved, so that the horizontal size of the camera module support can be reduced, the horizontal size of the camera module can be further reduced, and the camera module can be lighter and thinner.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of electronic products, specifically relates to a camera module support and camera module. BACKGROUND

[0002] Electronic devices such as mobile phones are generally configured with camera modules, and the light and thin design of camera modules has become an important design trend for electronic products.

[0003] In the leadless structure packaging technology, the traditional camera module is usually composed of a lens assembly, a module support, a filter, a photosensitive chip and a circuit board. The upper end of the module support is connected with the lens assembly, and the lower end of the module support is connected with the circuit board. Since a plurality of electronic components are arranged on the circuit board, and the components need to be arranged outside the side of the lens assembly, a through hole for avoiding the components is formed in the module support. Due to the requirement of the module support for supporting the lens assembly, the distance between the components and the side wall of the through hole is at least 0.12mm, and the width between the inner side wall of the through hole and the outer wall of the module support needs to be at least 0.2mm-0.3mm to meet the support strength, thus causing the overall size of the camera to be relatively large, thereby limiting the development of the light and thin design of the camera module. SUMMARY

[0004] In view of the technical problem in the prior art that the camera module support formed by plastic needs to be provided with a through hole for avoiding electronic components, and the distance between the electronic components and the side wall of the through hole needs to meet a certain requirement, and the width between the side wall of the through hole and the outer wall of the support also needs to meet a certain requirement to ensure the support strength of the module support, but such a module support causes the overall size of the camera module to be relatively large, the utility model provides a camera module support and a camera module.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme:

[0006] A camera module support comprises:

[0007] An insulating hollow frame comprises an insulating frame body, a first light-transmitting cavity arranged in the insulating frame body, and a hollow cavity arranged around the outer periphery of the first light-transmitting cavity in the insulating frame body; and

[0008] A gel is filled in the hollow cavity.

[0009] Further, the insulating frame body comprises an inner frame, an outer frame arranged around the outer periphery of the inner frame, and a plurality of connecting beams fixed between the inner frame and the outer frame. The hollow inner cavity of the inner frame is defined as the first light-transmitting cavity, and the plurality of connecting beams are distributed horizontally and longitudinally between the inner frame and the outer frame, so as to separate the space of the inner frame and the outer frame into a plurality of independent hollow cavities.

[0010] Further, the insulating frame body is made of insulating material or is coated with an insulating layer on the surface.

[0011] Further, the insulating frame body is made of metal material and is coated with an insulating layer on the surface.

[0012] Further, the wall thickness of the insulating frame body in the direction perpendicular to the optical axis direction of the camera is 0.03mm-0.15mm; or

[0013] The wall thickness of the insulating frame body in the direction perpendicular to the optical axis direction of the camera is 0.05-0.1mm; or

[0014] The wall thickness of the insulating frame body in the direction perpendicular to the optical axis direction of the camera is 0.05mm.

[0015] A camera module, comprising a circuit board, a photosensitive chip, a filter, a lens assembly arranged in sequence from the image side to the object side along the optical axis direction, and further comprising the camera module support described above, the camera module support is arranged on the side of the circuit board facing the camera assembly, and the first light transmission cavity position of the camera module support corresponds to the filter; the filter is arranged in the first light transmission cavity, and the lens assembly is arranged on the side of the camera module support away from the circuit board.

[0016] Further, the gel in the hollow cavity holds electronic components, and the electronic components can be located below and inside the lens assembly.

[0017] Further, the circuit board comprises a circuit board body and a reinforcing plate arranged on the side of the circuit board body away from the camera assembly; a second light transmission cavity is coaxially arranged on the circuit board body at a position corresponding to the first light transmission cavity, the planar size of the second light transmission cavity is smaller than that of the first light transmission cavity; the photosensitive chip is arranged between the circuit board body and the reinforcing plate to cover the side of the second light transmission cavity away from the lens assembly; the lower end of the filter is bonded to the side of the circuit board facing the lens assembly to cover the side of the second light transmission cavity facing the lens assembly; the root of the circuit board body is bonded with reinforcing glue bonded with the camera module support.

[0018] Further, the side of the circuit board body away from the lens assembly is provided with a recessed groove recessed towards the lens assembly for mounting the photosensitive chip, the planar size of the second light transmission cavity is smaller than that of the recessed groove, and when the photosensitive chip is mounted in the recessed groove, the side of the second light transmission cavity away from the lens assembly can be covered.

[0019] Further, the lens assembly includes a lens seat connected with the insulating hollow frame and the gel.

[0020] In conclusion, the beneficial effects of the present application are as follows: 1. The insulating hollow frame in the camera module support is connected between the lens assembly and the circuit board, and the electronic components on the circuit board are located in the hollow cavity and are held by the filled gel, and no additional opening is needed for avoiding the electronic components, so that the horizontal size of the camera module support can be reduced compared with the conventional support. 2. The camera module support does not need to open an opening, and the corresponding electronic components can be moved towards the direction close to the optical axis, so that the size of the circuit board is reduced, and the horizontal size of the corresponding camera module support can be further reduced. 3. After the camera module support is connected with the lens assembly, the adhesive area of the gel in the hollow cavity and the lens assembly is increased, so that the connection of the lens assembly is more stable and firm. 4. In the camera module, the setting mode of the photosensitive chip installed in the recessed groove can reduce the overall height of the camera module compared with the conventional mode of directly bonding the photosensitive chip to the lower end of the circuit board. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 is a structural schematic view of a camera module support provided by the present application.

[0022] Figure 2 is Figure 1 is a top view of the insulating frame body.

[0023] Figure 3 is a structural schematic view of a camera module provided by the present application.

[0024] Figure 4 is Figure 3 is a side view of the camera module.

[0025] Figure 5 is Figure 4 is a sectional view of the camera module in A-A direction.

[0026] Figure 6 is a top view of the circuit board and the insulating hollow frame in a connected state.

[0027] Figure 7 is a top view of the circuit board and the camera module support in a connected state.

[0028] In the figure, 100 - hollow insulating frame, 110 - insulating frame body, 111 - inner frame, 112 - outer frame, 113 - connecting beam, 120 - first light-transmitting cavity, 130 - hollow cavity, 200 - adhesive, 300 - circuit board, 310 - circuit board body, 311 - root, 3110 - reinforcing adhesive, 312 - electronic components, 313 - second light-transmitting cavity, 314 - recessed groove, 320 - reinforcing plate, 400 - photosensitive chip, 500 - optical filter, 600 - lens assembly, 610 - lens seat, 620 - lens. DETAILED DESCRIPTION

[0029] The utility model is further explained below in combination with specific drawings.

[0030] Please refer to Figure 1 The utility model provides a camera module support, include: hollow insulating frame 100 and adhesive 200, adhesive 200 preferably adopts thermosetting adhesive or UV curing adhesive. Hollow insulating frame 100 includes insulating frame body 110, first light-transmitting cavity 120 set in the insulating frame body 110 and hollow cavity 130 set in the insulating frame body 110 and around the periphery of first light-transmitting cavity 120. Adhesive 200 is filled in the hollow cavity 130. After such camera module support is connected below lens assembly 600, the filled adhesive 200 can cover electronic components, and it is not necessary to set up a through port to avoid electronic components, so that the spacing between the outer wall of electronic components and the outer wall of camera module support can be saved under the condition that the spacing remains unchanged, the horizontal dimension of camera module support can be reduced, and the horizontal dimension of camera module can be reduced, and the camera module can be more lightweight.

[0031] Please refer to Figure 2 Insulating frame body 110 includes inner frame 111, outer frame 112 around the periphery of inner frame 111 and a plurality of connecting beams 113 fixed between inner frame 111 and outer frame 112. The hollow inner cavity of inner frame 111 is defined as first light-transmitting cavity 120, and a plurality of connecting beams 113 are distributed horizontally and longitudinally between inner frame 111 and outer frame 112, thereby separating the space of inner frame 111 and outer frame 112 into a plurality of hollow cavities 130 independent of each other. Connecting beam 113 can make the connection between inner frame 111 and outer frame 112 more firm, so that the camera module support filled with adhesive 200 can withstand greater load. In the process of stress, connecting beam 113 can effectively disperse the load to the entire structural system, avoiding local overload leading to structural damage. Moreover, connecting beam 113 also plays a role in resisting earthquakes, can absorb and disperse the energy of vibration when the product is running, reduce the impact and damage of the structure, prolong the service life of the product.

[0032] The insulating frame 110 is made of insulating material or coated with an insulating layer on the surface. The insulating frame 110 is made of metal material and coated with an insulating layer on the surface. The insulating frame 110 can avoid contact with the exposed copper area on the circuit board 300 during packaging, preventing circuit failure or interfering with signal transmission.

[0033] The wall thickness of the insulating frame 110 in the direction perpendicular to the optical axis direction of the camera is 0.03mm-0.15mm. Alternatively, the wall thickness of the insulating frame 110 in the direction perpendicular to the optical axis direction of the camera is 0.05-0.1mm. Alternatively, the wall thickness of the insulating frame 110 in the direction perpendicular to the optical axis direction of the camera is preferably 0.05mm. The thinner insulating frame 110 can further reduce the planar size compared to the traditional plastic support, achieving lighter and thinner.

[0034] Please refer to Figures 3-5 A camera module, comprising a circuit board 300, a photosensitive chip 400, a filter 500, a lens assembly 600, and a camera module support in the above, arranged in order from the image side to the object side along the optical axis direction. The camera module support is arranged on the side of the circuit board 300 facing the camera assembly, and the first light transmission cavity 120 of the camera module support corresponds to the filter 500, the filter 500 is arranged in the first light transmission cavity 120, and the lens assembly 600 is arranged on the side of the camera module support away from the circuit board 300. Please refer to Figure 6 The electronic components 312 on the circuit board 300 are located in the hollow cavity 130, please refer to Figure 7 The gel 200 in the hollow cavity 130 holds the electronic components 312 inside. The electronic components 312 are buried inside the gel 200 and covered by the gel 200, changing the traditional support that needs to be opened to avoid the way, so that the electronic components 312 can move the position to the inside (for example, directly moving the distance between the electronic components 312 and the side wall of the opening to 0.12mm) under the condition of meeting the circuit board 300 wiring, so that the electronic components 312 are arranged as close to the optical axis of the camera as possible. The distance between the electronic components 312 and the outer wall of the camera module support can be reduced in size horizontally towards the optical axis (i.e. to Figure 6 or Figure 7As a reference, the top view of the camera module is shown in FIG. 6. The camera module can be reduced in size in the lateral direction or in the longitudinal direction to the center of the camera module support. Even if the electronic component 312 meets the wiring requirements, since the electronic component 312 is completely embedded in the gel 200, there is no need to consider the opening, and the electronic component 312 can be located below the lens assembly 600, which means that it is located inwardly toward the optical axis and below the lens assembly 600. This can further reduce the planar size of the camera module. In addition, the heat dissipation performance of the gel 200 is higher than that of air, so embedding the electronic component 312 in the gel 200 can improve the heat dissipation effect of the camera module, and also protect the electronic component 312 from air oxidation and corrosion, making the product more durable.

[0035] The circuit board 300 includes a circuit board body 310 and a reinforcing plate 320 disposed on a side of the circuit board body 310 away from the camera assembly. The circuit board body 310 coaxially has a second light-transmitting cavity 313 at a position corresponding to the first light-transmitting cavity 120, and the planar size of the second light-transmitting cavity 313 is smaller than that of the first light-transmitting cavity 120. The photosensitive chip 400 is disposed between the circuit board body 310 and the reinforcing plate 320 to cover a side of the second light-transmitting cavity 313 away from the lens assembly 600. The lower end of the optical filter 500 is bonded to a side of the circuit board 300 facing the lens assembly 600 to cover a side of the second light-transmitting cavity 313 facing the lens assembly 600. The root 311 of the circuit board body 310 is bonded with reinforcing glue 3110 bonded with the camera module support. After the assembly of the camera module is completed, the reinforcing plate 320 can increase the strength of the module, and in order to avoid the circuit board 300 from breaking at the root 311 when it is bent, the root 311 is coated with reinforcing glue 3110 at the position of the insulating frame 110 to increase the strength.

[0036] Please continue to refer to Figure 5 The circuit board body 310 has a recessed groove 314 recessed toward the lens assembly 600 for mounting the photosensitive chip 400 on a side of the circuit board body 310 away from the lens assembly 600. The planar size of the second light-transmitting cavity 313 is smaller than that of the recessed groove 314, and when the photosensitive chip 400 is mounted in the recessed groove 314, it can cover a side of the second light-transmitting cavity 313 away from the lens assembly 600. The photosensitive chip 400 is recessed and disposed at the lower end of the circuit board 300. Compared with the direct bonding method at the lower end of the circuit board 300, this arrangement can reduce the height of the camera module, which is more conducive to the lightness and thinness of the product.

[0037] The lens assembly 600 comprises a lens seat 610 bonded with the insulating hollow frame 100 and the glue body 200 at the lower end and a lens 620 connected to the lens seat 610. In the past, in order to consider the product flatness, when the lens seat 610 is bonded to the bracket, the glue is not too thick, and thus the bonding contact area is limited by the product flatness. However, in the camera module bracket, since the insulating frame body 110 is a thin frame, and the hollow cavity 130 is filled with the glue body 200, when the lens seat 610 is connected to the insulating hollow frame 100, the bonding contact area is larger and wider, so that the lens seat 610 can be more stably and firmly bonded to the upper end of the camera module bracket, thereby increasing the overall connection strength of the product.

[0038] The camera module bracket and the camera module, one, the insulating hollow frame 100 in the camera module bracket is connected between the lens assembly 600 and the circuit board 300, and the electronic components 312 on the circuit board 300 are located in the hollow cavity 130 and are held in the filled glue body 200, and any opening for avoiding the electronic components 312 is not needed, so that the horizontal size of the camera module bracket can be reduced compared with the conventional bracket. Two, the corresponding electronic components 312 can be moved to the direction close to the optical axis without the opening of the camera module bracket, so that the size of the circuit board 300 is reduced, and the horizontal size of the corresponding camera module bracket can be further reduced. Three, after the camera module bracket is connected with the lens assembly 600, the bonding area of the glue body 200 in the hollow cavity 130 and the lens assembly 600 is increased, so that the connection of the lens assembly 600 is more stable and firm. Four, in the camera module, the arrangement of the photosensitive chip 400 installed in the recessed groove 314 can reduce the overall height of the camera module compared with the conventional way of directly bonding the photosensitive chip 400 to the lower end of the circuit board 300.

[0039] The above is only an embodiment of the present application, and does not limit the patent range of the present application, and any equivalent structure, direct or indirect application in other related technical fields, is also within the patent protection range of the present application.

Claims

1. A camera module holder, comprising: The application relates to a camera module support. The camera module support comprises an insulating hollow frame, a first light-transmitting cavity arranged in the insulating hollow frame, and a hollow cavity arranged in the insulating hollow frame and surrounding the first light-transmitting cavity; and A colloid is filled in the hollow cavity. The insulating hollow frame comprises an inner frame, an outer frame arranged around the outer periphery of the inner frame, and a plurality of connecting beams fixed between the inner frame and the outer frame, the hollow inner cavity of the inner frame is defined as the first light-transmitting cavity, and the plurality of connecting beams are distributed between the inner frame and the outer frame in the horizontal and vertical directions so as to separate the space of the inner frame and the outer frame into a plurality of independent hollow cavities.

2. The camera module support of claim 1, wherein: The insulating hollow frame is made of insulating material or is coated with an insulating layer on the surface.

3. The camera module support of claim 1, wherein: The insulating hollow frame is made of metal material and is coated with an insulating layer on the surface.

4. The camera module support of claim 3, wherein: The wall thickness of the insulating hollow frame in the direction perpendicular to the optical axis direction of the camera is 0.03-0.15 mm; or 5. The camera module support of claim 1, wherein: The wall thickness of the insulating hollow frame in the direction perpendicular to the optical axis direction of the camera is 0.05-0.1 mm; or The wall thickness of the insulating hollow frame in the direction perpendicular to the optical axis direction of the camera is 0.05 mm. The application further relates to the camera module support as claimed in any one of claims 1 to 5, which is arranged on the side of the circuit board facing the camera assembly, the first light-transmitting cavity of the camera module support corresponds to the filter, the filter is arranged in the first light-transmitting cavity, and the lens assembly is arranged on the side of the camera module support away from the circuit board. 6.A camera module, comprising a circuit board, a photosensitive chip, a filter and a lens assembly arranged in sequence from an image side to an object side along an optical axis direction, characterized in that: The colloid in the hollow cavity holds electronic components, and the electronic components can be located below the lens assembly.

7. The camera module of claim 6, wherein: The circuit board comprises a circuit board body and a reinforcing plate arranged on the side of the circuit board body away from the camera assembly, a second light-transmitting cavity coaxial with the first light-transmitting cavity is arranged on the circuit board body, the planar size of the second light-transmitting cavity is smaller than that of the first light-transmitting cavity, the photosensitive chip is arranged between the circuit board body and the reinforcing plate so as to cover the side of the second light-transmitting cavity away from the lens assembly, the lower end of the filter is bonded to the side of the circuit board facing the lens assembly so as to cover the side of the second light-transmitting cavity facing the lens assembly, and the root of the circuit board body is bonded with reinforcing glue for bonding with the camera module support.

8. The camera module of claim 6, wherein: The side of the circuit board body away from the lens assembly is provided with a recessed groove recessed towards the lens assembly so as to mount the photosensitive chip, the planar size of the second light-transmitting cavity is smaller than that of the recessed groove, and the side of the second light-transmitting cavity away from the lens assembly can be covered after the photosensitive chip is mounted in the recessed groove.

9. The camera module of claim 8, wherein: The lens assembly comprises a lens seat bonded with the insulating hollow frame and the colloid at the lower end and a lens connected to the lens seat.

10. The camera module of any one of claims 6 to 9, wherein: ​

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