Heat dissipation structure for chip on back surface of power adapter

Abstract

The utility model relates to the technical field of power adapter heat dissipation, in particular to a power adapter back chip heat dissipation structure, which comprises an aluminum shell, an aluminum substrate and a control panel, the aluminum shell is provided with a placement cavity, the aluminum substrate is arranged on the placement cavity, the bottom surface of the placement cavity is provided with a heat transfer surface, and one surface of the aluminum substrate is attached to the heat transfer surface; the aluminum substrate is provided with a heat transfer area, the control panel is provided with a heating chip, one face of the heating chip is attached to the heat transfer area, and the aluminum substrate transfers heat of the heating chip to the aluminum shell through the heat transfer area. According to the utility model, an efficient and stable heat dissipation system is constructed through precise cooperation among the aluminum shell, the aluminum substrate and the control panel. According to the system, the heat dissipation performance of the power adapter is remarkably improved, the service life of the power adapter is prolonged, the fault risk caused by overheating is reduced, and safer and more reliable power utilization experience is provided for users.

Description

TECHNICAL FIELD

[0001] The utility model relates to power adapter heat dissipation technical field, especially a kind of power adapter back chip heat dissipation structure. BACKGROUND

[0002] Power adapter, also known as external power supply, is a small portable electronic device and electronic power supply voltage conversion equipment. It is widely used in mobile phones, LCD, computer notebook and other small electronic devices, and is also commonly used in security cameras, TV set-top boxes, wireless routers, light bars, massage instruments and other equipment. The basic working principle of power adapter is to convert AC input into DC output, which is usually composed of shell, transformer, inductor, capacitor, control IC, PCB and other components.

[0003] The heat dissipation structure of power adapter is an important part of its internal design, especially in the switching power supply working in high voltage and large current state, which has heavy workload, and is usually fully enclosed structure without heat dissipation holes on the shell, so the heat dissipation design is particularly important. The existing heat dissipation structure generally has built-in or external fan to dissipate heat of power adapter. However, the existing fan heat dissipation method has low heat transfer efficiency, which affects rapid heat dissipation. Therefore, new improvement is needed for the existing heat dissipation structure. UTILITY MODEL CONTENT

[0004] To solve the above problems, the utility model constructs an efficient and stable heat dissipation system through the precise cooperation between aluminum shell, aluminum substrate and control board. The system not only significantly improves the heat dissipation performance of power adapter, prolongs its service life, but also reduces the risk of failure caused by overheating, providing users with a more secure and reliable power adapter back chip heat dissipation structure.

[0005] The technical scheme adopted by the utility model is: a power adapter back chip heat dissipation structure, comprising an aluminum shell, an aluminum substrate and a control board, the aluminum shell is provided with a mounting cavity, the aluminum substrate is arranged on the mounting cavity, the bottom surface of the mounting cavity is provided with a heat transfer surface, one side of the aluminum substrate is attached to the heat transfer surface; the aluminum substrate is provided with a heat transfer area, the control board is provided with a heating chip, one side of the heating chip is attached to the heat transfer area, and the aluminum substrate transmits the heat of the heating chip to the aluminum shell through the heat transfer area.

[0006] Further improvement of the above scheme is that one side of the aluminum shell, away from the heat transfer surface, is provided with a heat dissipation part, the heat dissipation part is provided with a fan mounting area and a heat dissipation fin, and the heat dissipation fin is located at the outer periphery of the fan mounting area.

[0007] Further improvement of the above scheme is that the heat dissipation fins are provided with a plurality of fixing mounting columns, and the fixing mounting columns are provided with fixing holes.

[0008] Further improvement of the above scheme is that the aluminum shell is provided with a fitting outer edge on the outer periphery of the accommodating cavity, and the fitting outer edge is provided with a sealing groove for accommodating a sealing ring to seal the accommodating cavity.

[0009] Further improvement of the above scheme is that the fitting outer edge is provided with a plurality of connecting columns, and the connecting columns are provided with connecting holes.

[0010] Further improvement of the above scheme is that the fitting outer edge is provided with a plurality of mounting positioning pins.

[0011] Further improvement of the above scheme is that the aluminum shell is integrally formed by casting from an aluminum alloy or pure aluminum.

[0012] Further improvement of the above scheme is that the aluminum shell is provided with a first interface groove and a second interface groove on two sides, and one end of the first interface groove and the second interface groove is communicated to the accommodating cavity.

[0013] Further improvement of the above scheme is that the heat transfer surface is provided with a copper cladding layer formed by spraying, and the surface of the copper cladding layer is a flat surface for fitting the aluminum substrate; the heat transfer surface is provided with a mounting hole, and the aluminum substrate is provided with a through hole for fixing the aluminum substrate on the heat transfer surface by a screw.

[0014] Further improvement of the above scheme is that the heat transfer surface is provided with a fixed pressing hole, the fixed pressing hole is provided with a pressing block, the aluminum substrate is provided with a pressing groove, and the pressing block is arranged on the pressing groove to press the aluminum substrate tightly on the heat transfer surface.

[0015] Further improvement of the above scheme is that the aluminum substrate is provided with an insulating layer, and the heat transfer area is exposed on the insulating layer.

[0016] Further improvement of the above scheme is that the heat generating chip is provided with a heat conducting metal sheet, and one side of the heat conducting metal sheet is fitted with the heat transfer area.

[0017] The utility model has the advantages of:

[0018] Compared to existing power adapter chip heat dissipation methods, this invention utilizes an aluminum shell as the main structure, fully leveraging aluminum's excellent thermal conductivity and lightweight properties. The internal cavity within the aluminum shell not only provides stable support for the internal components but also creates an efficient heat conduction path through its bottom heat transfer surface. This design allows heat to be rapidly transferred from the internal components to the aluminum shell surface, and then quickly dissipated to the external environment through natural convection or heat sinks, effectively reducing the power adapter's operating temperature. Secondly, the aluminum substrate, as a key heat conduction medium, has a carefully designed heat transfer area that fits tightly against the heat-generating chip. This close fit significantly reduces thermal resistance, allowing the heat generated by the heat-generating chip to be transferred to the aluminum substrate with almost no loss. The aluminum substrate then evenly distributes the heat and guides it to the heat transfer surface of the aluminum shell, achieving efficient and orderly heat transfer and preventing localized overheating. Furthermore, the precise correspondence between the heat-generating chip layout on the control board and the heat transfer area of ​​the aluminum substrate further enhances heat dissipation efficiency. This design not only optimizes the heat conduction path but also ensures the rational utilization of the power adapter's internal space, improving the overall structural compactness and integration. This invention utilizes a precise fit between the aluminum shell, aluminum substrate, and control board to construct a highly efficient and stable heat dissipation system. This system not only significantly improves the heat dissipation performance of the power adapter and extends its service life, but also reduces the risk of malfunctions due to overheating, providing users with a safer and more reliable power experience. Attached Figure Description

[0019] Figure 1 This is a three-dimensional schematic diagram of the heat dissipation structure of the chip on the back of the power adapter of this utility model;

[0020] Figure 2 for Figure 1 A three-dimensional schematic diagram of the chip heat dissipation structure on the back of the power adapter from another perspective;

[0021] Figure 3 for Figure 1 An exploded view of the heat dissipation structure of the chip on the back of the power adapter;

[0022] Figure 4 for Figure 1 A schematic diagram of the heat dissipation structure of the chip on the back of the power adapter.

[0023] Explanation of reference numerals in the attached drawings: Aluminum shell 1, mounting cavity 11, heat transfer surface 12, pressure block 121, heat dissipation part 13, fan mounting area 131, heat dissipation fins 132, fixed mounting post 133, fixing hole 134, fitting outer edge 14, sealing groove 141, connecting post 142, connecting hole 143, mounting positioning pin 144, first interface groove 15, second interface groove 16, aluminum substrate 2, heat transfer area 21, thermally conductive metal sheet 311, control board 3, heating chip 31. DETAILED DESCRIPTION

[0024] For the purpose of facilitating the understanding of the present application, a more complete understanding of the present application will be provided by the following description in conjunction with the accompanying drawings. The preferred embodiments of the present application are shown in the drawings. However, the present application can be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the present application to those skilled in the art.

[0025] It should be noted that when an element is referred to as being "on" another element, it can be directly on the other element or intervening elements can also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements can also be present.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. All publications, patent applications, patents, and other references mentioned herein are incorporated by reference in their entirety. Figures 1-4As shown, an embodiment of the utility model relates to a power adapter back chip heat dissipation structure, including aluminium shell 1, aluminium base plate 2 and control panel 3, aluminium shell 1 is provided with the accommodation cavity 11, aluminium base plate 2 sets up on the accommodation cavity 11, the bottom surface of accommodation cavity 11 is provided with heat transfer surface 12, one side of aluminium base plate 2 is bonded with heat transfer surface 12, aluminium base plate 2 is provided with heat transfer area 21, control panel 3 is provided with heat chip 31, one side of heat chip 31 is bonded on heat transfer area 21, aluminium base plate 2 passes through heat transfer area 21 and transmits the heat of heat chip 31 towards aluminium shell 1.This embodiment utilizes aluminium shell 1 as the main structure, makes full use of the excellent heat conductivity and lightweight characteristics of aluminium material.The accommodation cavity 11 arranged in the inside of aluminium shell 1 not only provides stable support for internal components, but also constructs an efficient heat conduction path through the heat transfer surface 12 arranged on its bottom surface.This design enables heat to be quickly transferred from internal components to the surface of aluminium shell 1, and then quickly dissipated to the external environment through natural convection or heat sink, effectively reducing the working temperature of the power adapter.Secondly, aluminium base plate 2 as the key heat conduction medium, the heat transfer area 21 on its surface is carefully designed and closely bonded with heat chip 31.This bonding design greatly reduces the thermal resistance, so that the heat generated by heat chip 31 can be almost losslessly transferred to aluminium base plate 2.Aluminium base plate 2 then uniformly distributes and directs the heat to the heat transfer surface 12 of aluminium shell 1, achieving efficient and orderly heat transfer and avoiding local overheating.In addition, the layout of heat chip 31 on control panel 3 is accurately corresponding to the heat transfer area 21 of aluminium base plate 2, further improving the heat dissipation efficiency.This design not only optimizes the heat conduction path, but also ensures the rational use of the internal space of the power adapter, improving the compactness and integration of the overall structure.This embodiment constructs an efficient and stable heat dissipation system through the precise cooperation between aluminium shell 1, aluminium base plate 2 and control panel 3.This system not only significantly improves the heat dissipation performance of the power adapter, prolongs its service life, but also reduces the risk of failure caused by overheating, providing users with a safer and more reliable power experience.

[0027] The aluminum shell 1 is provided with a heat dissipation part 13 on the side opposite to the heat transfer surface 12, which is provided with a fan mounting area 131 and heat dissipation fins 132 located on the outer periphery of the fan mounting area 131. Specifically, the heat dissipation fins 132 are provided in multiple numbers and are arranged around the fan mounting area 131, and the heat dissipation fins 132 are provided with fixed mounting columns 133 provided with fixed holes 134. In this embodiment, the fan mounting area 131 and the heat dissipation fins 132 are ingeniously arranged on the heat dissipation part 13 to achieve efficient heat conduction and dissipation. Specifically, the multiple heat dissipation fins 132 are arranged around the fan mounting area 131 to form a wide heat dissipation area, greatly improving the heat dissipation efficiency. The fixed mounting columns 133 and the fixed holes 134 arranged on the heat dissipation fins 132 not only ensure the stable installation of the heat dissipation fins 132, but also facilitate subsequent maintenance and replacement. This structural design not only improves the working stability of the power adapter, but also prolongs its service life.

[0028] The aluminum shell 1 is provided with a fitting outer edge 14 on the outer periphery of the accommodating cavity 11, which is provided with a sealing groove 141 for accommodating a sealing ring to seal the accommodating cavity 11. Specifically, the fitting outer edge 14 is provided with multiple connecting columns 142 provided with connecting holes 143. The fitting outer edge 14 is provided with multiple mounting positioning pins 144. In this embodiment, the sealing groove 141 provided on the fitting outer edge 14 can accurately accommodate the sealing ring, thereby achieving effective sealing of the accommodating cavity 11, greatly improving the sealing performance of the structure, effectively preventing the intrusion of external dust, moisture and other impurities, and ensuring the stable operation of the internal chips and other electronic components. In addition, the multiple connecting columns 142 and the connecting holes 143 designed on the fitting outer edge 14 not only enhance the connection strength of the structure, but also facilitate stable assembly with other components of the power adapter, improving the reliability and stability of the overall structure. At the same time, the multiple mounting positioning pins 144 further ensure the accurate positioning of the aluminum shell 1 in the heat dissipation structure, avoiding problems such as poor heat dissipation or structural damage caused by positional deviation.

[0029] The aluminum shell 1 is integrally formed by casting from aluminum alloy or pure aluminum. Specifically, the aluminum shell 1 is provided with a first interface slot 15 and a second interface slot 16 on both sides, and one end of each of the first interface slot 15 and the second interface slot 16 is communicated to the accommodation cavity 11. In this embodiment, the design of the aluminum shell 1 fully utilizes the excellent heat conduction performance of aluminum alloy or pure aluminum, which can effectively conduct the heat generated by the chip to the surface of the aluminum shell 1, and then dissipate the heat quickly through natural convection or forced air cooling. In addition, the first interface slot 15 and the second interface slot 16 provided on both sides of the aluminum shell 1 not only provide convenience for the interface connection of the power adapter, but also one end of each of the two interface slots is communicated to the accommodation cavity 11, which further optimizes the heat dissipation path, so that the heat can be more smoothly conducted from the chip to the outside of the aluminum shell 1. This design not only improves the heat dissipation efficiency of the power adapter and ensures the stable operation of the chip, but also greatly prolongs the service life of the product. At the same time, the process of integrally forming by casting makes the aluminum shell 1 more solid and durable, which can withstand greater external force and impact, and provides a strong guarantee for the overall performance of the power adapter.

[0030] A copper cladding layer is formed on the heat transfer surface 12 by spraying, and the surface of the copper cladding layer is a flat surface for adhering the aluminum substrate 2; the heat transfer surface 12 is provided with a mounting hole, and the aluminum substrate 2 is provided with a through hole for fixing the aluminum substrate 2 on the heat transfer surface 12 by a screw. Specifically, the heat transfer surface 12 is provided with a fixed pressing hole, the fixed pressing hole is provided with a pressing block 121, the aluminum substrate 2 is provided with a pressing groove, and the pressing block 121 is arranged on the pressing groove to press the aluminum substrate 2 tightly on the heat transfer surface 12. In this embodiment, the copper cladding layer not only enhances the heat conduction, but also ensures the tight adhesion between the aluminum substrate 2 and the heat transfer surface 12 through its flat surface, thereby reducing the thermal resistance and optimizing the heat transfer path. In addition, by providing the mounting hole and the through hole and fixing the aluminum substrate 2 on the heat transfer surface 12 by the screw, a stable mechanical connection is achieved. This fixing method not only ensures the stability of the heat dissipation structure, but also helps to maintain good contact between the aluminum substrate 2 and the heat transfer surface 12, further improving the heat dissipation effect. More specifically, by using the design of the fixed pressing hole and the pressing block 121, the aluminum substrate 2 is pressed tightly on the heat transfer surface 12, which effectively prevents loosening caused by vibration or temperature change. The pressing block 121 cooperates with the pressing groove on the aluminum substrate 2 to form additional fixing force, further enhancing the reliability and durability of the heat dissipation structure.

[0031] The aluminum substrate 2 is provided with an insulating layer, and the heat transfer area 21 is exposed on the insulating layer. In this embodiment, the aluminum substrate 2 itself has good heat conduction performance and can quickly conduct the heat generated by the chip away, effectively reducing the internal temperature of the power adapter. By setting the insulating layer, electrical safety can be ensured, and problems such as current leakage or short circuit can be avoided, further improving the reliability of the product. Secondly, by exposing the heat transfer area 21 on the insulating layer, the heat dissipation performance of the aluminum substrate 2 can be maximized. This design allows heat to be more directly and quickly transferred to the external environment, thereby improving heat dissipation efficiency.

[0032] The heat-generating chip 31 is provided with a heat-conducting metal sheet 311, one side of which is attached to the heat transfer area 21. In this embodiment, the heat-conducting metal sheet 311 serves as an efficient heat conduction medium, with one side closely attached to the heat transfer area 21 of the chip, capable of quickly absorbing and dispersing the heat generated during the operation of the chip. This design greatly improves the heat transfer efficiency and effectively reduces the temperature rise of the chip, thereby ensuring the stability and reliability of the chip. In addition, the use of the heat-conducting metal sheet 311 also enhances the overall heat dissipation performance of the power adapter. Through heat exchange with the surrounding environment, the heat-conducting metal sheet 311 can further release heat to the outside, thereby avoiding the accumulation of heat inside the power adapter. This not only prolongs the service life of the power adapter, but also improves its working efficiency and safety.

[0033] The above embodiments only express several embodiments of the present application, and the description is more specific and detailed, but it cannot be understood as a limitation on the scope of the present application. It should be noted that for ordinary skilled persons in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which are within the scope of protection of the present application. Therefore, the scope of protection of the present application should be subject to the appended claims.

Claims

1. A heat dissipation structure for the chip on the back of a power adapter, characterized in that: The application relates to an aluminum shell, an aluminum substrate and a control board, wherein the aluminum shell is provided with a placing cavity, the aluminum substrate is arranged on the placing cavity, the bottom surface of the placing cavity is provided with a heat transfer surface, and one surface of the aluminum substrate is attached to the heat transfer surface; the aluminum substrate is provided with a heat transfer area, the control board is provided with a heating chip, one surface of the heating chip is attached to the heat transfer area, and the aluminum substrate transmits the heat of the heating chip to the aluminum shell through the heat transfer area.

2. The power adapter backside die cooling structure of claim 1, wherein: The surface of the aluminum shell, which is away from the heat transfer surface, is provided with a heat dissipation part, the heat dissipation part is provided with a fan mounting area and heat dissipation fins, and the heat dissipation fins are located at the outer periphery of the fan mounting area.

3. The power adapter backside die cooling structure of claim 2, wherein: The heat dissipation fins are provided in plurality, the plurality of heat dissipation fins surround the fan mounting area, the heat dissipation fins are provided with fixed mounting columns, and the fixed mounting columns are provided with fixed holes.

4. The power adapter backside die cooling structure of claim 1, wherein: The outer periphery of the aluminum shell located in the placing cavity is provided with an attached outer edge, the attached outer edge is provided with a sealing groove for accommodating a sealing ring to seal the placing cavity.

5. The power adapter backside die cooling structure of claim 4, wherein: The attached outer edge is provided with a plurality of connecting columns, and the connecting columns are provided with connecting holes. The attached outer edge is provided with a plurality of mounting positioning pins.

6. The power adapter backside die cooling structure of claim 1, wherein: The aluminum shell is integrally formed by casting from aluminum alloy or pure aluminum. The two sides of the aluminum shell are provided with a first interface groove and a second interface groove, and one end of the first interface groove and the second interface groove is communicated to the placing cavity.

7. The power adapter backside die cooling structure of claim 1, wherein: The heat transfer surface is provided with a copper coating formed by spraying, the surface of the copper coating is a flat surface for attaching the aluminum substrate, the heat transfer surface is provided with mounting holes, and the aluminum substrate is provided with through holes for fixing the aluminum substrate on the heat transfer surface through screws.

8. The power adapter backside die cooling structure of claim 7, wherein: The heat transfer surface is provided with fixed pressing holes, the fixed pressing holes are provided with pressing blocks, the aluminum substrate is provided with pressing grooves, and the pressing blocks are arranged on the pressing grooves to tightly attach the aluminum substrate on the heat transfer surface.

9. The power adapter backside die cooling structure of claim 1, wherein: The aluminum substrate is provided with an insulating layer, and the heat transfer area is exposed on the insulating layer.

10. The power adapter backside die cooling structure of claim 1, wherein: The heating chip is provided with a heat-conducting metal sheet, and one surface of the heat-conducting metal sheet is attached to the heat transfer area.

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