Radiator and chip embedded circuit board

Abstract

The utility model relates to the technical field of circuit boards, and provides a radiator and a chip embedded circuit board. The heat sink includes: a sheet-shaped substrate; a plurality of first accommodating grooves are distributed in the first surface of the sheet-shaped substrate, and the plurality of groups of heat dissipation film layers are accommodated in the plurality of first accommodating grooves respectively; wherein each group of heat dissipation film layers comprises a phase change material layer; and the radiating fins are distributed on the second surface of the sheet-shaped substrate. According to the radiator, the heat conduction performance and the heat conductivity of the phase change material are utilized, and the heat dissipation effect is effectively improved; the heat dissipation film layer and the heat dissipation fins are distributed on the two faces of the sheet-shaped substrate respectively, heat is conducted through the heat dissipation film layer, heat is dissipated through the heat dissipation fins, and the heat dissipation effect is further improved; and the radiator and the circuit board are assembled without a hot-pressing assembly mode, the sheet-shaped substrate is assembled to the circuit board, and the radiating film layer is aligned and clung to the main heating area of the circuit board, so that the radiating effect is ensured.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of circuit board, specifically, relates to heat sink and chip embedded circuit board. BACKGROUND

[0002] Electronic components such as chips are assembled on the circuit board, which will generate heat when working, and the heat is usually dissipated through a heat sink.

[0003] The conventional heat sink is composed of an aluminum shell and a resin layer and other heat dissipation components, and the heat dissipation effect is limited. The resin layer is assembled by hot pressing, which may cause deformation of the aluminum shell and even the circuit board during the process, resulting in that the heat sink cannot be tightly attached to the circuit board, and the heat dissipation effect is affected.

[0004] It should be noted that the information disclosed in the above background section is only used to strengthen the understanding of the background of the utility model, and therefore may include information that does not constitute prior art known to those skilled in the art. UTILITY MODEL CONTENT

[0005] Therefore, the utility model provides a heat sink and a chip embedded circuit board, which effectively improves the heat dissipation effect and does not require hot pressing assembly, ensuring that the heat dissipation effect is not affected.

[0006] According to one aspect of the utility model, a heat sink for a circuit board is provided, which comprises: a sheet-shaped substrate; a plurality of groups of heat dissipation film layers, a plurality of first accommodating grooves are distributed on a first surface of the sheet-shaped substrate, and the plurality of groups of heat dissipation film layers are accommodated in the plurality of first accommodating grooves respectively; wherein each group of heat dissipation film layers comprises a phase change material layer; and heat dissipation fins are distributed on a second surface of the sheet-shaped substrate.

[0007] In some embodiments, each group of heat dissipation film layers comprises two layers of phase change material layers, which are pressed tightly by an insulating material layer.

[0008] In some embodiments, the inner wall of the first accommodating groove is formed with rough texture, and the inner wall comprises a bottom wall.

[0009] In some embodiments, when the heat sink is not assembled to the circuit board, the heat dissipation film layers are higher than the end surface of the first accommodating groove; and after the heat sink is assembled to the circuit board, the heat dissipation film layers are pressed to be flush with the end surface of the first accommodating groove.

[0010] In some embodiments, the periphery of each first accommodating groove is formed with a ring of second accommodating grooves, which are used to fill sealant when the heat sink is assembled to the circuit board.

[0011] In some embodiments, the edge of the sheet-shaped substrate is distributed with a plurality of mounting holes.

[0012] According to another aspect of the present application, a chip embedded circuit board is provided, comprising: a circuit board with an embedded chip module; the heat sink as described in any of the above embodiments is assembled on the back of the circuit board; wherein the busbar of the embedded chip module is arranged on the back of the circuit board, and the heat dissipation film layer of the heat sink is in close contact with the busbar.

[0013] In some embodiments, a second accommodating groove is formed around the periphery of each first accommodating groove, the second accommodating groove is filled with sealing glue, and the heat dissipation film layer is in close contact with the busbar through the sealing glue; and / or the edge of the sheet-shaped substrate is provided with a plurality of mounting holes, and the heat sink and the circuit board are fixedly assembled through the mounting holes.

[0014] The present application has at least the following beneficial effects compared with the prior art:

[0015] The heat sink of the present application is adapted to the shape and structure of the circuit board through the sheet-shaped substrate, facilitating assembly to the circuit board; the heat dissipation film layer comprising a phase change material layer has good heat conduction performance and high thermal conductivity, effectively improving the heat dissipation effect; the heat dissipation film layer and the heat dissipation fins are respectively distributed on both surfaces of the sheet-shaped substrate, and the heat dissipation film layer can be in close contact with the main heating area of the circuit board during assembly, so that heat is conducted through the heat dissipation film layer and dissipated through the heat dissipation fins, further improving the heat dissipation effect; and the heat sink and the circuit board do not need to be assembled by hot pressing, but only need to be assembled by assembling the sheet-shaped substrate to the circuit board and making the heat dissipation film layer in close contact with the main heating area of the circuit board, to ensure the heat dissipation effect.

[0016] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present application. BRIEF DESCRIPTION OF DRAWINGS

[0017] The drawings incorporated into the specification and forming part of the specification, show embodiments consistent with the present application, and together with the specification, serve to explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0018] Figure 1 and Figure 2 Fig. 1 shows a perspective structural schematic view of a heat sink in an embodiment of the present application;

[0019] Figure 3 Fig. 2 shows a cross-sectional structural schematic view of the heat sink in an embodiment of the present application;

[0020] Figure 4 Fig. 1 shows a perspective view of a chip embedded circuit board according to an embodiment of the present application;

[0021] Figure 5 Fig. 2 shows a cross-sectional view of a chip embedded circuit board according to an embodiment of the present application. DETAILED DESCRIPTION

[0022] Example implementations will now be described more fully with reference to the accompanying drawings. Example implementations may, however, be implemented in many different forms and should not be construed as limited to the implementations set forth herein. Rather, these implementations are provided as non-limiting examples, so that this disclosure will fully convey the scope of the application to those skilled in the art.

[0023] The accompanying drawings are included to provide a further understanding of the application and are incorporated in and constitute a part of this application. The drawings illustrate embodiments of the application and, together with the description, serve to explain the principles of the application. In the drawings:

[0024] The use of "first", "second", and other similar references in the detailed description is not intended to denote any order, quantity, or importance, but merely to distinguish one set of components from another. In the description of the present application, it should be explained that the terms "front", "back", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. The term "a plurality of" means two or more, unless otherwise explicitly specified. In addition, in the description of the present application, when it is said that a certain device is "connected" to another device, it includes not only the case of direct connection, but also the case of indirect connection through other elements.

[0025] It should be noted that the features of the embodiments of the present application and different embodiments can be combined with each other without conflict.

[0026] Figure 1 And Figure 2 Fig. 1 shows a perspective view of a chip embedded circuit board according to an embodiment of the present application; Figure 3 Fig. 2 shows a cross-sectional view of a chip embedded circuit board according to an embodiment of the present application. Figures 1 to 3 As shown in the figures, the heat sink 10 provided by the embodiment of the present application comprises:

[0027] a sheet-shaped substrate 11;

[0028] a plurality of groups of heat dissipation film layers 12, the first surface of the sheet-shaped substrate 11 is distributed with a plurality of first accommodating grooves 110, and the plurality of groups of heat dissipation film layers 12 are respectively accommodated in the plurality of first accommodating grooves 110;

[0029] Each group of heat dissipation film layer 12 includes a phase change material layer 122;

[0030] Heat dissipation fins 13 are distributed on the second surface of the sheet-shaped substrate 11.

[0031] The heat dissipation device 10 of the utility model, through the sheet-shaped substrate 11, the shape structure of the circuit board is adapted, and it is convenient to assemble to the circuit board;Through the heat dissipation film layer 12 including the phase change material layer 122, the phase change material has very good heat conduction performance and very high thermal conductivity, and the heat dissipation effect can be effectively improved;The heat dissipation film layer 12 and the heat dissipation fin 13 are respectively distributed on the two surfaces of the sheet-shaped substrate 11, and the heat dissipation film layer 12 can be aligned and tightly attached to the main heating area of the circuit board during assembly, so that the heat is conducted through the heat dissipation film layer 12 and dissipated through the heat dissipation fin 13, and the heat dissipation effect is further improved;And the heat dissipation device 10 does not need to be assembled by hot pressing when assembling with the circuit board, and the sheet-shaped substrate 11 is assembled to the circuit board and the heat dissipation film layer 12 is aligned and tightly attached to the main heating area of the circuit board, so as to ensure the heat dissipation effect.

[0032] The sheet-shaped substrate 11 can be made of copper, aluminum or other materials with good heat dissipation performance. The phase change material layer 122 is composed of phase change material (PCM: Phase Change Material), which is a kind of high-efficiency thermal management material, can absorb and release heat through solid-liquid phase change process, has the advantages of high energy storage density, small volume change before and after phase change, high thermal conductivity and heat conduction performance, and can be reused, effectively improving the heat dissipation performance of the heat dissipation device 10. The heat dissipation fin 13 and the sheet-shaped substrate 11 are formed in an integral structure, effectively enhancing the structural strength of the heat dissipation fin 13 and the heat dissipation device 10.

[0033] In some embodiments, each group of heat dissipation film layer 12 includes two layers of phase change material layer 122, and the two layers of phase change material layer 122 are pressed tightly by an insulating material layer 123. The thickness of the phase change material layer 122 can be 100 μm-150 μm, and the thickness of the insulating material layer 123 can be 20 μm-30 μm, but not limited to this. The insulating material layer 123 can be composed of polyimide (PI) or other suitable insulating materials. The heat dissipation film layer 12 is formed by pressing the phase change material layer 122-insulating material layer 123-phase change material layer 122.

[0034] The heat dissipation film layer 12 can also include three or more layers of phase change material layer 122, and each two layers of phase change material layer 122 are pressed with an insulating material layer 123.

[0035] In some embodiments, the inner wall of the first accommodating groove 110 is formed with a rough texture, and the inner wall includes a bottom wall. By forming the rough texture on at least the bottom wall of the first accommodating groove 110, the vertical flow phenomenon during the heat dissipation process of the phase change material layer 122 is slowed down, and the stability of the phase change material layer 122 is improved.

[0036] The rough texture can be formed by a surface roughening process, and the roughness thereof can be Ra 6.3 to Ra 12.5, but is not limited thereto.

[0037] In some embodiments, when the heat sink 10 is not assembled to the circuit board, the heat dissipation film layer 12 is higher than the end surface of the first accommodating groove 110; and when the heat sink 10 is assembled to the circuit board, the heat dissipation film layer 12 is compressed to be flush with the end surface of the first accommodating groove 110. By making the heat dissipation film layer 12 slightly higher than the end surface of the first accommodating groove 110, the heat dissipation film layer 12 is in a slightly over-compressed state after the heat sink 10 is assembled to the circuit board, which on the one hand ensures the contact with the circuit board and improves the heat dissipation effect, and on the other hand slows down the vertical flow phenomenon during the heat dissipation process of the phase change material layer 122 and improves the stability of the phase change material layer 122.

[0038] In some embodiments, the periphery of each first accommodating groove 110 is formed with a second accommodating groove 111, and the second accommodating groove 111 is used to fill sealant when the heat sink 10 is assembled to the circuit board. By filling the sealant in the second accommodating groove 111, the heat dissipation film layer 12 accommodated in the first accommodating groove 110 is tightly attached to the main heat generating area of the circuit board when the heat sink 10 is assembled to the circuit board.

[0039] In some embodiments, the edges of the sheet-shaped substrate 11 are provided with a plurality of mounting holes 14. The mounting holes 14 are used for mounting the heat sink 10 and the circuit board by screws or other fasteners.

[0040] In combination with Figures 1 to 3 As shown in the drawings, the manufacturing process of the heat sink 10 provided in the embodiments of the present application includes:

[0041] The sheet-shaped substrate 11 with the first surface distributed with a plurality of first accommodating grooves 110 and the second surface distributed with heat dissipation fins 13 is formed.

[0042] The sheet-shaped substrate 11 can be formed by one-time casting molding to form the member with the first accommodating groove 110 and the heat dissipation fin 13.

[0043] In the process of forming the first accommodating groove 110, or after forming the first accommodating groove 110, the inner wall of the first accommodating groove 110 is roughened. That is, the inner wall with rough texture can be realized in the forming process of the first accommodating groove 110 by designing the inner surface of the mold for casting. Alternatively, the rough texture can be machined on the inner wall of the first accommodating groove 110 by a separate surface roughening process after the first accommodating groove 110 is formed.

[0044] In the process of forming the sheet-shaped substrate 11, a second accommodating groove 111 is formed around the periphery of each first accommodating groove 110. The second accommodating groove 111 can be formed in the process of one-time casting of the sheet-shaped substrate 11 to save the process flow and improve the production efficiency.

[0045] A plurality of groups of heat dissipation film layers 12 are formed, wherein each group of heat dissipation film layers 12 includes a phase change material layer 122.

[0046] The two layers of phase change material layers 122 can be pressed together by the insulating material layer 123, and cut into a shape that fits the first accommodating groove 110 to obtain the heat dissipation film layer 12. The height of the initially formed heat dissipation film layer 12 is slightly greater than the depth of the first accommodating groove 110. The length and width dimensions of the heat dissipation film layer 12 can be equal to or slightly greater than the length and width dimensions of the first accommodating groove 110.

[0047] The plurality of groups of heat dissipation film layers 12 are respectively accommodated in the plurality of first accommodating grooves 110.

[0048] In this way, the heat sink 10 is manufactured.

[0049] The chip-embedded circuit board provided by the embodiment of the present application is assembled with the heat sink 10 described in any of the above embodiments. The features and principles of the heat sink described in any of the above embodiments can be applied to the following chip-embedded circuit board embodiments. In the following chip-embedded circuit board embodiments, the features and principles of the heat sink that have been described will not be repeated.

[0050] Figure 4 The chip-embedded circuit board is shown in a perspective view, Figure 5 The chip-embedded circuit board is shown in a cross-sectional view; in combination Figures 1 to 5 As shown, the chip-embedded circuit board provided by the embodiment of the present application comprises:

[0051] The circuit board 20 with an embedded chip module;

[0052] The heat sink 10 is assembled on the back of the circuit board 20.

[0053] The busbar 22 of the embedded chip module is arranged on the back of the circuit board 20, and the heat dissipation film layer 12 of the heat dissipation device 10 is in close contact with the busbar 22.

[0054] The busbar 22 can be a copper bar or other suitable conductive member. A plurality of embedded chip modules can be arranged on one busbar 22, the embedded chip modules are arranged in the busbar 22, and then embedded in the circuit board 20 to form a chip embedded circuit board. On the front of the circuit board 20, electronic components 220 for realizing different functions can be arranged as needed in the area corresponding to the embedded chip modules. The busbar 22 is a heat concentration area during the working process of the chip embedded circuit board. The phase change material layer 122 of the heat dissipation device 10 can effectively improve the heat dissipation effect; and the heat dissipation film layer 12 and the heat dissipation fin 13 are distributed on the two surfaces of the heat dissipation device 10, respectively, the heat dissipation film layer 12 is in close contact with the busbar 22 of the embedded chip module, so that the heat is conducted through the heat dissipation film layer 12 and dissipated through the heat dissipation fin 13, further improving the heat dissipation effect.

[0055] In addition, the heat dissipation device 10 does not need to be assembled by hot pressing when assembled with the circuit board 20, the sheet-shaped substrate 11 is assembled to the circuit board 20 and the heat dissipation film layer 12 is in close contact with the busbar 22 of the embedded chip module, so as to ensure the heat dissipation effect.

[0056] Specifically, during assembly: on the one hand, the edge of the sheet-shaped substrate 11 is provided with a plurality of mounting holes 14, and the heat dissipation device 10 and the circuit board 20 are fixedly assembled by means of the mounting holes 14 and fasteners; on the other hand, a second containing groove 111 is formed around the outer periphery of each first containing groove 110, the second containing groove 111 is filled with sealing glue, and the heat dissipation film layer 12 and the busbar 22 are in close contact through the sealing glue. The edge of the second containing groove 111 is preferably aligned with the edge of the busbar 22, so that the sealing glue is aligned with the busbar 22, so that the heat dissipation film layer 12 is in close contact with the busbar 22, ensuring the heat dissipation effect of the heat dissipation device 10 on the circuit board 20 and improving the working performance of the chip embedded circuit board.

[0057] The heat dissipation device 10 of the utility model can also be applied to ordinary non-chip embedded circuit boards, and can also effectively dissipate heat from the circuit boards and improve the working performance of the circuit boards.

[0058] The above content is a further detailed description of the utility model in combination with a specific preferred embodiment, and cannot be considered as limiting the specific implementation of the utility model to these descriptions. For ordinary skilled persons in the technical field to which the utility model belongs, without departing from the concept of the utility model, a number of simple deductions or substitutions can be made, which should be considered as belonging to the protection scope of the utility model.

Claims

1. A heat sink for a circuit board, characterized by, The heat sink comprises: a sheet-shaped substrate; a plurality of groups of heat dissipation film layers, a plurality of first accommodating grooves are distributed on a first surface of the sheet-shaped substrate, and each group of heat dissipation film layers is accommodated in a first accommodating groove; wherein each group of heat dissipation film layers comprises a phase change material layer; a plurality of heat dissipation fins are distributed on a second surface of the sheet-shaped substrate.

2. The heat spreader of claim 1, wherein, Each group of heat dissipation film layers comprises two phase change material layers, and the two phase change material layers are pressed by an insulating material layer.

3. The heat spreader of claim 1, wherein, An inner wall of the first accommodating groove is formed with a rough texture, and the inner wall comprises a bottom wall.

4. The heat spreader of claim 1, wherein, When the heat sink is not assembled to the circuit board, the heat dissipation film layers are higher than an end surface of the first accommodating groove; When the heat sink is assembled to the circuit board, the heat dissipation film layers are pressed to be flush with the end surface of the first accommodating groove.

5. The heat spreader of claim 1, wherein, A periphery of each first accommodating groove is formed with a ring of second accommodating grooves, and the second accommodating grooves are used to fill sealant when the heat sink is assembled to the circuit board.

6. The heat spreader of claim 1, wherein, A periphery of each first accommodating groove is formed with a ring of second accommodating grooves, and the second accommodating grooves are used to fill sealant when the heat sink is assembled to the circuit board.

7. A chip embedded circuit board, characterized by, The sheet-shaped substrate is provided with a plurality of mounting holes on a periphery thereof. The heat sink comprises: a circuit board with an embedded chip module; the heat sink according to any one of claims 1-6 is assembled on a back surface of the circuit board; 8. The chip embedded circuit board of claim 7, wherein, wherein a busbar of the embedded chip module is arranged on the back surface of the circuit board, and the heat dissipation film layers of the heat sink are in abutment with the busbar. A periphery of each first accommodating groove is formed with a ring of second accommodating grooves, the second accommodating grooves are filled with sealant, and the heat dissipation film layers are in abutment with the busbar through the sealant; and / or The sheet-shaped substrate is provided with a plurality of mounting holes on a periphery thereof, and the heat sink and the circuit board are fixedly assembled through the mounting holes.

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