Cutting position correcting device and electronic element cutting machine

Abstract

The utility model discloses a cutting position correcting device and an electronic component cutting machine, the cutting position correcting device comprises a first bearing unit, a second bearing unit, a first detector, a second detector and a processor, the first bearing unit is provided with a first bearing device along a cutting operation path, the second bearing unit is provided with a second bearing device along the cutting operation path, and the processor is connected with the first detector and the second detector. The first detector is attached to the first holder and is capable of capturing a first alignment portion of a first surface of the electronic component from below to above to obtain first detection data, and the second detector is attached to the second holder and is capable of capturing a second alignment portion of a second surface of the electronic component from above to below to obtain second detection data. The processor can receive the first detection data and the second detection data of the first detector and the second detector so as to analyze and calibrate the actual cutting position of the electronic element, and then the cutting precision and the cutting quality are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a cutting alignment device capable of improving the cutting precision and quality of electronic components. BACKGROUND

[0002] In today's, an electronic component (such as a carrier plate) with multiple ICs or LEDs needs to be cut by a cutting machine to cut out multiple independent IC packages or LED packages. Referring to Figure 1 , the carrier plate 10 is composed of multiple layers of plates (such as 12 layers of plates), and the front surface of the uppermost layer of plates defines multiple packages 11 with ICs and multiple upper target points 12 for the cutter of the cutting machine (not shown) to cut and align; the back surface of the lowermost layer of plates of the carrier plate 10 is provided with multiple contact points 13 opposite the packages 11, and is provided with lower target points 14 opposite the upper target points 12. During cutting, the cutter of the cutting machine cuts the carrier plate 10 with the upper target points 12 as the cutting position to cut out multiple independent packages 11 with ICs.

[0003] However, the carrier plate 10 is prone to misalignment error due to the multi-layer stacking of multiple layers of plates, resulting in a positional deviation value A between the upper target points 12 and the lower target points 14, so that when the cutter cuts the carrier plate 10 along the upper target points 12, the edges of the packages 11 on the front and back surfaces of the carrier plate 10 and the contact points 13 will exceed the allowable tolerance range, thereby affecting the cutting quality. UTILITY MODEL CONTENTS

[0004] The utility model aims to provide a cutting alignment device and an electronic component cutting machine.

[0005] The utility model provides a cutting alignment device, which comprises a first supporting unit, a second supporting unit, at least one first detector, at least one second detector, and a processor. The first supporting unit is provided with a first supporter along a cutting operation path, the second supporting unit is provided with a second supporter along the cutting operation path, the first detector is mounted on the first supporter and can take an image of a first alignment part of a first surface of an electronic component from below to above to obtain first detection data, the second detector is mounted on the second supporter and can take an image of a second alignment part of a second surface of the electronic component from above to below to obtain second detection data, and the processor can receive the first detection data and the second detection data of the first detector and the second detector to analyze the actual cutting position of the aligned electronic component. Therefore, when cutting the electronic component, the cutter can cut the electronic component into multiple components at the actual cutting position defined by the alignment, so that the edges of the components and the contact points meet the allowable tolerance range, thereby improving the cutting precision and quality.

[0006] The cutting position calibration device of the utility model can effectively shorten the calibration operation time, and can rapidly and accurately cut the electronic element by the cutter, thereby improving the use efficiency and cutting capacity.

[0007] The first supporter of the first supporting unit is fixed or movable.

[0008] The first supporting unit is provided with at least one first adjuster, which can adjust the image capturing height position of the first detector.

[0009] The second supporter of the second supporting unit is fixed or movable.

[0010] The second supporting unit is provided with at least one second adjuster, which can adjust the image capturing height position of the second detector.

[0011] The first detector comprises a plurality of first detectors for detecting the first calibration parts of the electronic element.

[0012] The first detector captures the first calibration part of the electronic element from the bottom to the top.

[0013] The second detector captures the second calibration part of the electronic element from the top to the bottom.

[0014] The first detector and the second detector are CCD.

[0015] The utility model also provides an electronic element cutting machine, including placing device, conveying device, transfer device, cutting device, the cutting position calibration device and central control device of the utility model, placing device is equipped with at least one placer along cutting operation path, to hold at least one electronic element, conveying device is equipped with at least one conveyor along cutting operation path, to convey at least one electronic element, transfer device is equipped with at least one transfer along cutting operation path, to transfer at least one electronic element, cutting device is equipped with at least one cutter along cutting operation path, to cut at least one electronic element, the cutting position calibration device of the utility model is equipped with first supporting unit, second supporting unit, at least one first detector, at least one second detector and processor along cutting operation path, to detect the actual cutting position of calibration electronic element and improve cutting precision, central control device is controlled and integrated each device action and executes automatic operation. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1A schematic view of a carrier plate having a plurality of packages in the prior art.

[0017] Figure 2 A schematic view of the cutting and positioning device applied to the electronic component cutting machine.

[0018] Figures 3 to 7 A schematic view of the cutting machine cutting the carrier plate.

[0019] BRIEF DESCRIPTION OF DRAWINGS 10 - carrier plate; 11 - package; 12 - upper target point; 13 - contact point; 14 - lower target point; A - position deviation value; 20 - placement device; 21 - first frame; 22 - placement track; 23 - supporting plate; 30 - conveying device; 31 - second frame; 32 - first conveying driver; 33 - second conveying driver; 34 - first conveyor; 341 - suction nozzle; 35 - second conveyor; 40 - transfer device; 41 - first transfer driver; 42 - moving table; 43 - second transfer driver; 44 - transfer; 441 - positioning member; 50 - cutting device; 51 - first cutting driver; 52 - second cutting driver; 53 - first cutter; 54 - second cutter; 60 - cutting and positioning device; 61 - through hole; 62 - connecting frame; 63 - first CCD; 64 - second CCD; 70 - feeding device; 80 - carrier plate; 81 - member; 82 - upper target point; 83 - contact point; 84 - lower target point; L - cutting operation path. DETAILED DESCRIPTION

[0020] In order to have a further understanding of the present application, a preferred embodiment will be described in detail below with reference to the accompanying drawings:

[0021] Please refer to Figure 2 The electronic component cutting machine of the present application comprises a placement device 20, a conveying device 30, a transfer device 40, a cutting device 50, the cutting and positioning device 60 of the present application, and a central control device (not shown in the figure). According to the operation requirements, it further comprises a feeding device 70, which is provided with at least one container, such as a magazine, to provide at least one electronic component to be cut.

[0022] The electronic component to be cut can be a wafer, a carrier plate, or a lead frame, etc. In the present embodiment, the electronic component is a carrier plate 80, the second surface of which is provided with a plurality of members 81 and a plurality of second positioning portions (i.e. upper target points 82), and the first surface is provided with a plurality of contact points 83 and first positioning portions (i.e. lower target points 84). In addition, the cutting operation path L is defined between the placement device 20 and the cutting device 50, and the carrier plate 80 is displaced along the cutting operation path L.

[0023] The material placing device 20 is provided with at least one material placing device along the cutting operation path L for placing at least one electronic component. Further, the material placing device can be a track or a pulley set, etc. In the embodiment, the material placing device 20 is arranged beside the material supplying device 70 and comprises a first frame 21, a material placing device and a supporting plate 23. The top surface of the first frame 21 is provided with the material placing device, which comprises two material placing tracks 22 arranged oppositely in the X direction for placing the carrier plate 80 to be cut supplied by the material supplying device 70. The two material placing tracks 22 are provided with the supporting plate 23 which can be displaced in the Z direction for displacing the carrier plate 80 on the material placing tracks 22 in the Z direction.

[0024] The conveying device 30 is provided with at least one conveyor along the cutting operation path L for conveying at least one electronic component. In the embodiment, the conveying device 30 comprises a second frame 31, a first conveying driver 32, a second conveying driver 33, a first conveyor 34 and a second conveyor 35. The second frame 31 has an arch-shaped column for assembling the first conveying driver 32 arranged in the X direction. The first conveying driver 32 can drive the second conveying driver 33 arranged in the Z direction to displace in the X direction. The second conveying driver 33 is assembled with the first conveyor 34 having a plurality of suction nozzles 341 for adsorbing and moving the carrier plate 80. One side of the first conveyor 34 is assembled with the second conveyor 35, which is a clamping set capable of opening and closing for clamping and displacing the carrier plate 80. The first conveying driver 32 and the second conveying driver 33 can drive the first conveyor 34 and the second conveyor 35 to displace synchronously in the X-Z direction and along the cutting operation path L to the material supplying device 70, the material placing device 20 and the transferring device 40.

[0025] The first frame 21 and the second frame 31 can be the same frame or different frames, which are not limited to the embodiment.

[0026] According to the operation requirement, the first conveyor 34 and the second conveyor 35 can be arranged independently or assembled with each other.

[0027] The transfer device 40 is provided with at least one transfer device along the cutting operation path L for transferring at least one electronic component. In the embodiment, the transfer device 40 is arranged at the side of the material placing device 20 and includes a first transfer driver 41, a moving table 42, a second transfer driver 43 and a transfer device 44. The first transfer driver 41 is arranged in the Y direction on the second frame 31 to drive the moving table 42 to move in the Y direction. The moving table 42 is provided with the second transfer driver 43. The second transfer driver 43 is capable of driving the transfer device 44 to rotate in an angle. The transfer device 44 is provided with a plurality of positioning members 441 (such as suction holes) for positioning the carrier 80. The first transfer driver 41 and the second transfer driver 43 are capable of driving the transfer device 44 to move in the Y direction and rotate in an angle, so as to transfer the carrier 80 between the conveying device 30 and the cutting device 50 and change the horizontal arrangement angle of the carrier 80.

[0028] The cutting device 50 is provided with at least one cutter along the cutting operation path L for cutting electronic components. In the embodiment, the cutting device 50 includes a first cutting driver 51, a second cutting driver 52, a first cutter 53 and a second cutter 54. The first cutting driver 51 and the second cutting driver 52 are arranged in the X direction on the arch-shaped column of the second frame 31 to respectively drive the first cutter 53 and the second cutter 54 to move in the X-Z direction, so as to cut the carrier 80 on the transfer device 44.

[0029] The cutting position correction device 60 is arranged along the cutting operation path L and includes a first holding unit, a second holding unit, at least one first detector, at least one second detector and a processor (not shown in the figure) for imaging and correcting the actual cutting position of the electronic component.

[0030] The first holding unit is provided with at least one first holder along the cutting operation path L.

[0031] According to the operation requirement, the first holder can be fixedly arranged or movably arranged, for example, the first holder can be fixedly arranged on the first frame 12 of the material placing device 20 or at one side of the first frame 12. For example, the first holder can move in the X-Y direction.

[0032] According to the operation requirement, the first holder can be an independent device or a device of a related device. For example, the first holder can be an independent support; for example, the first holder can be the first frame 21 of the material placing device 20; and the like.

[0033] According to the operation requirement, the first holder can be arranged at one side of the material placing device 20, below the first frame 21 or at the other side of the material placing device 20 along the cutting operation path L, which is not limited in the embodiment.

[0034] The first holding unit is provided with at least one first adjuster (not shown) for adjusting the image capturing height of the first detector.

[0035] In this embodiment, the first holding unit is the first frame 21 of the material placing device 20, and a plurality of through holes 61 are formed in the first frame 21 near the side of the material supply device 70.

[0036] The second holding unit is provided with at least one second holding device along the cutting operation path L.

[0037] The second holding device can be fixed or movable according to the operation requirements. For example, the second holding device can be fixedly arranged on the arched column of the second frame 31 of the conveying device 30. For example, the second holding device can be arranged on the side of at least one cutter of the cutting device 50, so that the second holding device moves with the cutter in the X-Z direction.

[0038] The second holding device can be an independent device or a device of a related device according to the operation requirements. For example, the second holding device can be an independent support; for example, the second holding device can be the first cutter 53 of the cutting device 50; and the like.

[0039] The second holding unit is provided with at least one second adjuster (not shown) for adjusting the image capturing height of the second detector.

[0040] In this embodiment, the second holding device is the first cutter 53 of the cutting device 50, and a connecting frame 62 is arranged on the first cutter 53.

[0041] At least one first detector is arranged on the first holding device to detect at least one first alignment part of the first surface of the electronic component to obtain first detection data.

[0042] According to the operation requirements, the at least one first detector includes a plurality of first detectors for detecting a plurality of first alignment parts of the electronic component.

[0043] In this embodiment, the cutting alignment device 60 is provided with a plurality of first detectors which are first CCDs 63. The first CCDs 63 are fixedly arranged below the through holes 61 of the first frame 21 of the material placing device 20, and can capture the lower target point 84 of the carrier plate 80 from the bottom to the top to obtain the first detection data.

[0044] At least one second detector is arranged on the second holding device to detect at least one second alignment part of the second surface of the electronic component to obtain second detection data.

[0045] In this embodiment, the cutting alignment device 60 is provided with a second detector of a second CCD 64, which is mounted on the connecting frame 62 of the first cutter 53 of the cutting device 50 and can take an image of the upper target point 82 of the carrier plate 80 from top to bottom to obtain second detection data.

[0046] The processor (not shown in the figure) can receive the first detection data of the first detector and the second detection data of the second detector, and can analyze the actual cutting position of the alignment electronic element; that is, the processor can receive the first detection data and the second detection data transmitted by the first CCD 63 and the second CCD 64.

[0047] Please refer to Figures 2 to 7 In the cutting operation, the first conveying driver 32 and the second conveying driver 33 of the conveying device 30 drive the first conveyor 34 and the second conveyor 35 to move along the cutting operation path L in the X-Z direction synchronously, so that the second conveyor 35 takes out the carrier plate 80 to be cut from the feeding device 70 and moves it to the placement track 22 of the placement device 20; since the two first CCDs 63 are mounted on the placement device 20 and located on the cutting operation path L, the second conveyor 35 clamps the carrier plate 80 to pass above the two first CCDs 63, and the two first CCDs 63 take an image of the position of the lower target point 84 of the carrier plate 80 from bottom to top through the through hole 61 located in the first frame 21, and transmit the obtained first detection data to the processor.

[0048] After the second conveyor 35 moves the carrier plate 80 to be cut to the placement track 22 of the placement device 20, it releases the carrier plate 80, the supporting plate 23 of the placement device 20 moves in the Z direction to support the carrier plate 80, and the conveying device 30 drives the first conveyor 34 along the cutting operation path L in the X-Z direction with the first conveying driver 32 and the second conveying driver 33, so that the suction nozzle 341 of the first conveyor 34 picks up the carrier plate 80.

[0049] The conveying device 30 drives the first conveyor 34 along the cutting operation path L in the X-Z direction with the first conveying driver 32 and the second conveying driver 33, so that the first conveyor 34 places the carrier plate 80 to be cut on the transfer device 44, and the transfer device 44 positions the carrier plate 80 by adsorbing it with the positioning member 441.

[0050] The transfer device 40 drives the transfer device 44 and the carrier plate 80 along the cutting operation path L in the Y direction with the first transfer driver 41 and the moving table 42, and passes through the lower side of the first cutter 53 in line, the cutting device 50 drives the first cutter 53 and the second CCD 64 in the X direction with the first cutting driver 51, so that the second CCD 64 takes an image of the position of the upper target point 82 of the carrier plate 80 from top to bottom, and transmits the obtained second detection data to the processor.

[0051] The processor receives the first sensing data of the first CCD 63 and the second sensing data of the second CCD 64, and analyzes the actual cutting position of the first cutter 53 on the carrier plate 80, for example, the processor can obtain the average value of the position between the upper target point 82 and the lower target point 84 according to the first and second sensing data to define the actual cutting position of the carrier plate 80, instead of using the upper target point 82 or the lower target point 84 as the cutting position, so that the distance between the edge of the component 81 and the junction 83 meets the allowable tolerance range, to facilitate the accurate cutting of the carrier plate 80 by the first cutter 53.

[0052] After the actual cutting position of the carrier plate 80 is defined, the transfer device 40 drives the transferer 44 and the carrier plate 80 to move in the Y direction along the cutting operation path L by the first transfer driver 41, and the cutting device 50 drives the first cutter 53 and the second cutter 54 to move in the X direction by the first cutting driver 51 and the second cutting driver 52, respectively, to accurately cut the carrier plate 80 at the actual cutting position defined on the carrier plate 80, and cut a plurality of components 81, to achieve the practical benefits of improving cutting accuracy and cutting quality.

Claims

1. A cutting alignment device, characterized by, Comprising: a first holding unit having at least one first holder along a cutting operation path; a second holding unit having at least one second holder along the cutting operation path; at least one first detector provided on the first holder for detecting at least one first alignment portion of a first surface of an electronic component to obtain first detection data; at least one second detector provided on the second holder for detecting at least one second alignment portion of a second surface of the electronic component to obtain second detection data; a processor capable of receiving the first detection data from the first detector and the second detection data from the second detector.

2. The cutting alignment device of claim 1, wherein, The first holder of the first holding unit is fixed or movable.

3. The cutting alignment device of claim 1, wherein, The first holding unit is provided with at least one first adjuster capable of adjusting the image capturing height position of the first detector.

4. The cutting alignment device of claim 1, wherein, The second holder of the second holding unit is fixed or movable.

5. The cutting alignment device of claim 1, wherein, The second holding unit is provided with at least one second adjuster capable of adjusting the image capturing height position of the second detector.

6. The cutting alignment device of claim 1, wherein, At least one of the first detector includes a plurality of first detectors for detecting a plurality of first alignment portions of the electronic component.

7. The cutting alignment device of claim 1, wherein The first detector captures images of the first alignment portion of the electronic component from bottom to top.

8. The cutting alignment device of claim 1, wherein, The second detector captures images of the second alignment portion of the electronic component from top to bottom.

9. The cutting alignment device of claim 1, wherein, The first detector and the second detector are CCDs.

10. An electronic component cutting machine characterized by comprising: Comprising: a material placing device having at least one material placer along a cutting operation path for holding at least one electronic component; a conveying device having at least one conveyor along the cutting operation path for conveying at least one electronic component; a transfer device having at least one transfer along the cutting operation path for transferring at least one electronic component; a cutting device having at least one cutter along the cutting operation path for cutting at least one electronic component; at least one cutting alignment device as claimed in claim 1 provided along the cutting operation path for capturing the actual cutting position of the electronic component for alignment; a central control device for controlling and integrating the operation of each device.

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