Cooling cold plate and electronic equipment

Abstract

The utility model discloses a heat dissipation cold plate and electronic equipment, the heat dissipation cold plate comprises a base body and a phase change material, the base body comprises a heat dissipation surface and a phase change accommodating cavity, and the heat dissipation surface is used for dissipating heat of an electronic component; the phase change accommodating cavity is filled with the phase change material, the phase change material comprises a first phase change material and a second phase change material, and the heat conductivity coefficients of the first phase change material and the second phase change material are different. The phase change containing cavity of the heat dissipation cold plate is filled with the two phase change materials, the heat conduction coefficients of the two phase change materials are different, and therefore the heat dissipation cold plate can have the advantages of the two phase change materials, heat-sensitive electronic components can be arranged at the positions of the phase change materials with the high heat conduction coefficients, and the heat dissipation efficiency is improved. And electronic components insensitive to heat can be arranged in a region with a low heat conductivity coefficient. And the heat dissipation performance of the heat dissipation cold plate is optimized.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic equipment, in particular to a heat dissipation cold plate and electronic equipment. BACKGROUND

[0002] Electronic equipment is developing towards miniaturization, light weight, high power and high heat flux density, which makes the temperature of electronic equipment rise sharply. The performance and life of electronic components in electronic equipment are closely related to temperature. When the temperature of electronic components exceeds 85℃, the performance of electronic components will decrease sharply as the temperature continues to rise. Electronic equipment usually arranges a heat dissipation cold plate for heat dissipation, but the heat dissipation capacity of the current heat dissipation cold plate is limited.

[0003] Therefore, how to improve the heat dissipation performance of the heat dissipation cold plate has become a technical problem to be solved by the person skilled in the art. CONTENT OF THE UTILITY MODEL

[0004] The present application provides a heat dissipation cold plate and electronic equipment to improve the heat dissipation performance of the heat dissipation cold plate.

[0005] In order to achieve the above-mentioned purpose, the present application discloses the following technical solutions:

[0006] In a first aspect, the present application provides a heat dissipation cold plate, comprising a base body and a phase change material, the base body comprising a heat dissipation surface and a phase change containing cavity, the heat dissipation surface being used for dissipating heat of electronic components; the phase change material being filled in the phase change containing cavity, and the phase change material comprising a first phase change material and a second phase change material, the thermal conductivity coefficients of the first phase change material and the second phase change material being different.

[0007] In some embodiments, the number of heat dissipation surfaces is two, which are a first heat dissipation surface and a second heat dissipation surface, and the first heat dissipation surface and the second heat dissipation surface are oppositely arranged.

[0008] In some embodiments, the base body further comprises a heat dissipation boss, the heat dissipation boss being arranged at the heat dissipation surface to arrange electronic components.

[0009] In some embodiments, the number of phase change containing cavities is at least two, which are a first phase change containing cavity and a second phase change containing cavity, the first phase change containing cavity being filled with the first phase change material, and the second phase change containing cavity being filled with the second phase change material.

[0010] In some embodiments, the thermal conductivity coefficient of the first phase change material is greater than that of the second phase change material, the first phase change containing cavity is located in a high heat dissipation area of the base body, and the second phase change containing cavity is located in a low heat dissipation area of the base body.

[0011] In some embodiments, the first phase change containing cavity comprises at least two sub-cavities, and the at least two sub-cavities are independently arranged.

[0012] In some embodiments, a plurality of first heat-conducting ribs are arranged in the first phase-change accommodating cavity, and the first heat-conducting ribs extend along a first direction;

[0013] A plurality of second heat-conducting ribs are arranged in the second phase-change accommodating cavity, and the second heat-conducting ribs extend along a second direction.

[0014] In some embodiments, in the first direction, the first heat-conducting ribs extend along a straight line or a curve;

[0015] In the second direction, the second heat-conducting ribs extend along a straight line or a curve;

[0016] The first direction is parallel or perpendicular to the second direction.

[0017] In some embodiments, the first heat-conducting ribs and the base are integrally formed by additive manufacturing or welding process;

[0018] The second heat-conducting ribs and the base are integrally formed by additive manufacturing or welding process.

[0019] In some embodiments, the thickness of the first heat-conducting ribs is greater than 0.5 mm, and the distance between adjacent first heat-conducting ribs is greater than 10 mm;

[0020] The thickness of the second heat-conducting ribs is greater than 0.5 mm, and the distance between adjacent second heat-conducting ribs is less than 8 mm.

[0021] In some embodiments, the first phase-change material is a liquid metal, and the second phase-change material is an organic phase-change material.

[0022] In some embodiments, the first phase-change material is a bismuth-based liquid metal, and the second phase-change material is paraffin.

[0023] In a second aspect, the present application provides an electronic device, comprising electronic components and the heat-dissipating cold plate according to any one of the above-mentioned aspects, and the electronic components are in contact with the heat-dissipating surface of the heat-dissipating cold plate.

[0024] As can be seen from the above technical solutions, the phase-change accommodating cavity of the heat-dissipating cold plate is filled with two phase-change materials, and the thermal conductivities of the two phase-change materials are different, so that the advantages of the two phase-change materials can be combined, and the phase-change material with high thermal conductivity can be arranged at the position of the electronic components sensitive to heat, while the phase-change material with low thermal conductivity can be arranged at the position of the electronic components insensitive to heat. The heat-dissipating performance of the heat-dissipating cold plate is optimized. BRIEF DESCRIPTION OF DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the accompanying drawings needed to be used in the embodiments or prior art description will be briefly introduced. Obviously, the accompanying drawings in the following description are only some examples or embodiments of the present application, and for those skilled in the art, other drawings can be obtained without creative labor based on the provided drawings, and the present application can also be applied to other similar scenarios based on the provided drawings. Unless it is obvious from the language environment or otherwise stated, the same reference numbers in the drawings represent the same structure or operation.

[0026] Fig. 1 A top view of a heat dissipation cold plate provided by an embodiment of the present application;

[0027] Fig. 2 A side view of a heat dissipation cold plate provided by an embodiment of the present application;

[0028] Figs. 3-6 A sectional view of a heat dissipation cold plate provided by an embodiment of the present application;

[0029] In the drawings: 1 - base body; 2 - phase change material;

[0030] 11 - phase change containing cavity; 12 - heat dissipation surface; 13 - heat dissipation boss; 21 - first phase change material; 22 - second phase change material;

[0031] 111 - first phase change containing cavity; 112 - second phase change containing cavity; 113 - first heat conduction rib plate; 114 - second heat conduction rib plate; 121 - first heat dissipation surface; 122 - second heat dissipation surface; 131 - first heat dissipation boss; 132 - second heat dissipation boss. DETAILED DESCRIPTION

[0032] The present application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the related application, and not to limit the application. The described embodiments are only some of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0033] Referring to Figs. 1-6 In order to achieve the above-mentioned purpose, the present application discloses the following technical solutions:

[0034] The application discloses a heat-dissipating cold plate, which comprises a base body 1 and a phase change material 2, wherein the base body 1 comprises a heat-dissipating surface 12 and a phase change accommodating cavity 11, the heat-dissipating surface 12 is used for dissipating heat of electronic components, the phase change material 2 is filled in the phase change accommodating cavity 11, and the phase change material 2 comprises a first phase change material 21 and a second phase change material 22, and the thermal conductivities of the first phase change material 21 and the second phase change material 22 are different.

[0035] The phase change accommodating cavity 11 of the heat-dissipating cold plate is filled with two phase change materials 2, and the thermal conductivities of the two phase change materials 2 are different, so that the advantages of the two phase change materials 2 can be combined, the phase change material 2 with high thermal conductivity can be arranged at a position of the electronic components sensitive to heat, and the phase change material 2 with low thermal conductivity can be arranged at a position of the electronic components insensitive to heat. The heat-dissipating performance of the heat-dissipating cold plate is optimized.

[0036] The two heat-dissipating surfaces 12 of the heat-dissipating cold plate can be used for mounting electronic devices to be cooled, the utilization rate of the cold plate is improved, and the cost of the cold plate is reduced. The heat generated by the electronic devices is directly conducted to the heat-dissipating surfaces 12; on one hand, the heat absorbed by the heat-dissipating surfaces 12 is shown in the form of surface temperature, namely, sensible heat, and with the increase of the absorbed heat, the temperature of the heat-dissipating surfaces 12 is increased; on the other hand, the heat conducted to the heat-dissipating surfaces 12 is directly conducted to the first phase change material 21 and the second phase change material 22, the heat is first shown in the form of surface temperature, namely, sensible heat, of the first phase change material 21 and the second phase change material 22, and with the increase of the absorbed heat, the temperature of the first phase change material 21 and the second phase change material 22 is increased; when the surface temperature reaches the starting melting temperature of the first phase change material 21 and the second phase change material 22, the first phase change material 21 and the second phase change material 22 start to melt; in the process, the heat absorbed by the first phase change material 21 and the second phase change material 22 is mostly used for changing the material form of the first phase change material 21 and the second phase change material 22 from solid to liquid, and a small part of the heat is used for increasing the temperature of the first phase change material 21 and the second phase change material 22, so that the temperature rising rate of the electronic components is controlled, and the heat-dissipating mode of the phase change material 2 is that the sensible heat and the latent heat coexist; with the increase of the absorbed heat, the surface temperature of the first phase change material 21 and the second phase change material 22 reaches the ending melting temperature, and the first phase change material 21 and the second phase change material 22 are all changed from solid to liquid; with the continuous increase of the heat absorbed by the first phase change material 21 and the second phase change material 22, the temperature of the first phase change material 21 and the second phase change material 22 is sharply increased, namely, the heat is shown in the form of sensible heat; the key to improving the heat-dissipating effect of the heat-dissipating cold plate on the electronic devices is to control the temperature of the first phase change material 21 and the second phase change material 22 to be between the starting melting temperature and the ending melting temperature, so that the heat-dissipating mode of the first phase change material 21 and the second phase change material 22 is that the sensible heat and the latent heat coexist, and the temperature rising rate of the electronic components is reduced.

[0037] The terms "first", "second", etc. are used only for the purpose of description and should not be understood as indicating or implying relative importance or a specific number of the technical features indicated. Thus, the features defined with "first", "second", etc. can explicitly or implicitly include one or more of the features.

[0038] The electronic components can be arranged directly or indirectly on the heat dissipation surface 12, and the number of the heat dissipation surface 12 can be two or one, wherein when the number is two, the heat dissipation surface 12 is a first heat dissipation surface 121 and a second heat dissipation surface 122 arranged oppositely. Arranging two heat dissipation surfaces 12 can increase the area for mounting electronic components and improve the use area of the heat dissipation cold plate.

[0039] In order to facilitate the installation of electronic components, in some examples of the present application, the base body 1 further comprises a heat dissipation boss 13 arranged at the heat dissipation surface 12 to arrange the electronic components. The number of the heat dissipation boss 13 is at least one, and the number and shape of the heat dissipation boss 13 can be adjusted according to the position of the electronic components. In the illustration, the number of the heat dissipation boss 13 is two, which is a first heat dissipation boss 131 and a second heat dissipation boss 132, wherein the first heat dissipation boss 131 is arranged at the first heat dissipation surface 121, and the second heat dissipation boss 132 is arranged at the second heat dissipation surface 122. The shape of the first heat dissipation boss 131 and the second heat dissipation boss 132 is a rectangular structure, which is convenient for processing. In some other examples of the present application, the first heat dissipation boss 131 and the second heat dissipation boss 132 can also be circular, elliptical or other structures, or shapes consistent with the overall contour shape of the electronic components.

[0040] In order to improve the heat dissipation effect of the electronic components, the area of the heat dissipation boss 13 is larger than the area of the electronic components.

[0041] The thermal conductivity coefficients of the first phase change material 21 and the second phase change material 22 are different, for example, the thermal conductivity coefficient of the first phase change material 21 is greater than that of the second phase change material 22. In this regard, the area where the first phase change material 21 is arranged can be arranged with electronic components that are sensitive to heat, and the area where the second phase change material 22 is arranged can be arranged with electronic components that are less sensitive to heat. The area where the first phase change material 21 is arranged can be multiple, and the area where the second phase change material 22 is arranged can also be multiple.

[0042] In addition, in order to arrange the phase change material 2 according to specific requirements, the phase change accommodating cavities 11 of the base body 1 of the present application can also be adjusted according to the regions where the first phase change material 21 and the second phase change material 22 are arranged. For example, the phase change accommodating cavities 11 where the first phase change material 21 is arranged are referred to as first phase change accommodating cavities 111, and the phase change accommodating cavities 11 where the second phase change material 22 is arranged are referred to as second phase change accommodating cavities 112. That is, the number of the phase change accommodating cavities 11 is at least two, which are the first phase change accommodating cavities 111 and the second phase change accommodating cavities 112, respectively. The first phase change accommodating cavities 111 are filled with the first phase change material 21, and the second phase change accommodating cavities 112 are filled with the second phase change material 22.

[0043] The shapes and numbers of the first phase change accommodating cavities 111 and the shapes and numbers of the second phase change accommodating cavities 112 can be adjusted according to specific heat dissipation requirements. For example, the thermal conductivity of the first phase change material 21 is greater than that of the second phase change material 22, the first phase change accommodating cavities 111 are located in the high heat dissipation region of the base body 1, and the second phase change accommodating cavities 112 are located in the low heat dissipation region of the base body 1.

[0044] Correspondingly, the base body 1 is provided with the heat dissipation boss 13 in the high heat dissipation region. At this time, the shape of the first phase change accommodating cavities 111 can be consistent with the shape of the heat dissipation boss 13. In the illustration, the shape of the heat dissipation boss 13 is rectangular, and therefore the shape of the first phase change accommodating cavities 111 is also rectangular. The shape of the second phase change accommodating cavities 112 can also be adjusted at will. In the illustration, the second phase change accommodating cavities 112 are arranged to surround the first phase change accommodating cavities 111, and the first phase change accommodating cavities 111 and the second phase change accommodating cavities 112 are independent and do not exchange the phase change material 2.

[0045] In some examples, the first phase change accommodating cavities 111 can include at least two sub-cavities, and the at least two sub-cavities are arranged independently.

[0046] In order to improve the heat conduction effect from the heat dissipation surface 12 to the first phase change material 21, a plurality of first heat conduction rib plates 113 are arranged in the first phase change accommodating cavities 111, and the first heat conduction rib plates 113 extend along the first direction.

[0047] In order to improve the heat conduction effect from the heat dissipation surface 12 to the second phase change material 22, a second heat conduction rib plate 114 is arranged in the second phase change accommodating cavities 112, and the second heat conduction rib plate 114 extends along the second direction.

[0048] In the first direction, the first heat conduction rib plates 113 extend along a straight line or a curve; in the second direction, the second heat conduction rib plate 114 extends along a straight line or a curve; and the first direction is parallel or perpendicular to the second direction. In the illustration, the first direction and the second direction are parallel.

[0049] The first heat-conducting rib plate 113 and the base body 1 are integrally formed by additive manufacturing or welding process; the second heat-conducting rib plate 114 and the base body 1 are integrally formed by additive manufacturing or welding process. The first heat-conducting rib plate 113, the second heat-conducting rib plate 114 and the base body 1 are integrally formed, which can reduce the thermal resistance from the heat dissipation surface 12 to the phase change material 2.

[0050] The number of the first heat-conducting rib plate 113 is multiple, and the number of the second heat-conducting rib plate 114 is multiple. The thickness of the first heat-conducting rib plate 113 is greater than 0.5 mm; the distance between adjacent first heat-conducting rib plates 113 is greater than 10 mm, which can weaken the influence of the storage process of the heat dissipation cold plate on the structural strength of the first heat-conducting rib plate 113, and make the number of the first heat-conducting rib plate 113 in the same volume of the first phase change material cavity 111 as small as possible, and the first phase change material 21 filled therein as much as possible, thereby absorbing more heat. The thickness of the second heat-conducting rib plate 114 is greater than 0.5 mm; the distance between adjacent second heat-conducting rib plates 114 is less than 8 mm, which can reduce the thermal resistance of heat conduction at the position of the second heat-conducting rib plate 114.

[0051] It should be noted that the first phase change material 21 is a liquid metal, and the second phase change material 22 is an organic phase change material. For example, the first phase change material 21 is a bismuth-based liquid metal, which can reduce the corrosion rate of the aluminum-copper alloy and improve the storage life of the heat dissipation cold plate. The second phase change material 22 is paraffin.

[0052] In the embodiment, the material of the base body 1 is preferably aluminum alloy, which has good mechanical properties, high thermal conductivity and low density. Of course, copper alloy or other materials can also be selected.

[0053] Embodiment 1

[0054] Reference Figs. 1-6The utility model provides a kind of cooling cold plate, including base body 1, liquid metal (first phase change material 21) and paraffin (first phase change material 22);Wherein, base body 1 includes first radiating surface 121, second radiating surface 122, radiating boss 13, first phase change containing cavity 111, second phase change containing cavity 112, first heat conduction rib plate 113, second heat conduction rib plate 114;The first radiating surface 121 and second radiating surface 122 of base body 1 and radiating boss 13 are contacted with the electronic component to be radiated, and the heat of electronic equipment is conducted to cooling cold plate;Liquid metal is in first phase change containing cavity 111, and first heat conduction rib plate 113 is arranged in first phase change containing cavity 111;Paraffin is in second phase change containing cavity 112, and second heat conduction rib plate 114 is arranged in second phase change containing cavity 112;First phase change containing cavity 111 is opened on base body 1 and is directly below high heat consumption, heat-sensitive device in electronic equipment;Second phase change containing cavity 112 is opened on base body 1 and is directly below low heat consumption, heat-resistant device in electronic equipment.

[0055] The working principle of the cooling cold plate is that: the two radiating surfaces 12 of the cooling cold plate can install electronic equipment to be radiated, which increases the utilization rate of the cold plate and reduces the cost of the cold plate. The heat generated by the electronic equipment is directly conducted or indirectly conducted to the first radiating surface 121 and the second radiating surface 122 through the radiating boss 13; on the one hand, the heat absorbed by the first radiating surface 121, the second radiating surface 122 and the radiating boss 13 is manifested in the form of surface temperature, i.e. sensible heat. As the amount of absorbed heat increases, the temperature of the first radiating surface 121, the second radiating surface 122 and the radiating boss 13 will rise accordingly; on the other hand, the heat conducted to the first radiating surface 121, the second radiating surface 122 and the radiating boss 13 continues to be directly conducted or indirectly conducted to the liquid metal and the paraffin through the first heat conduction rib plate 113 and the second heat conduction rib plate 114. This heat is first manifested in the form of surface temperature, i.e. sensible heat. As the amount of absorbed heat increases, the temperature of the liquid metal and the paraffin will rise accordingly; when the surface temperature reaches the initial melting temperature of the liquid metal and the paraffin, the liquid metal and the paraffin begin to melt; in this process, most of the heat absorbed by the liquid metal and the paraffin will only cause a change in the state of matter from solid to liquid, and a small part will cause the temperature to rise, thereby controlling the temperature rise rate of the electronic components. This process is a phase change material 2 sensible heat and latent heat coexistence cooling mode; as the amount of absorbed heat increases, the surface temperature of the liquid metal and the paraffin reaches the final melting temperature, and the liquid metal and the paraffin completely change from solid to liquid; as the amount of heat absorbed by the liquid metal and the paraffin continues to increase, it will again show a sharp rise in temperature, i.e. in the form of sensible heat alone; the key to improving the cooling effect of the cooling cold plate on electronic equipment lies in controlling the temperature of the liquid metal and the paraffin between the initial melting temperature and the final melting temperature, so that it is in a sensible heat and latent heat coexistence cooling mode, and the temperature rise rate of the electronic components is reduced.

[0056] In the embodiment, the first phase-change accommodating cavity 111 is arranged directly below the high-heat-consumption and heat-sensitive components in the electronic device, so that the high-heat-consumption and heat-sensitive components in the electronic device are rapidly cooled by using the high thermal conductivity and high volume enthalpy of the liquid metal; the second phase-change accommodating cavity 112 is arranged directly below the low-heat-consumption and heat-resistant components in the electronic device, so that the electronic components are cooled by the latent heat of the paraffin, and the weight of the heat-dissipating cold plate structure is reduced by the low density of the paraffin.

[0057] In the embodiment, the first heat-conducting rib plate 113 is in a rectangular shape, and the thickness of the rib plate is greater than 0.5 mm, so as to weaken the influence of the corrosion of the liquid metal on the strength of the rib plate structure during the storage of the heat-dissipating cold plate; the spacing between the rib plates is greater than 10 mm, so that the number of the rib plates in the first phase-change accommodating cavity 111 with the same volume is as small as possible, and the liquid metal filled in the first phase-change accommodating cavity 111 is as much as possible, thereby absorbing more heat and making the temperature of the electronic device lower; of course, the thickness and spacing of the rib plate can also be other data, which needs to be determined according to the specific situation.

[0058] In the embodiment, the second heat-conducting rib plate 114 is in a rectangular shape, and the thickness of the rib plate is greater than 0.5 mm, so as to reduce the thermal resistance of heat conduction at the position of the rib plate, and make the heat be conducted from the first heat-dissipating surface 121 and the second heat-dissipating surface 122 to the surface of the paraffin as much as possible; the spacing between the rib plates is less than 8 mm, so as to reduce the thermal resistance of heat conduction from the second heat-conducting rib plate 114 to the center position of the paraffin, and make the heat be conducted from the second heat-conducting rib plate 114 to the center region of the paraffin as soon as possible.

[0059] In the embodiment, the first heat-conducting rib plate 113 and the second heat-conducting rib plate 114 and the base body 1 can be integrally formed by additive manufacturing or welding process, so as to reduce the thermal resistance of heat conduction from the first heat-dissipating surface 121 and the second heat-dissipating surface 122 to the first heat-conducting rib plate 113 and the second heat-conducting rib plate 114. Of course, other processes can also be used to ensure that the first heat-conducting rib plate 113 and the second heat-conducting rib plate 114 and the base body 1 are integrally formed.

[0060] The application also discloses an electronic device, which comprises electronic components and the heat-dissipating cold plate according to any one of the above.

[0061] In the description of the embodiments of the application, unless otherwise specified, “and” represents the meaning of or, for example, A, B can represent A or B; the “and / or” in the present application only represents a description of the relationship between the associated objects, and can represent three relationships, for example, A and / or B can represent: A exists alone, A and B exist together, and B exists alone.

[0062] It should be noted that only parts related to the application are shown in the drawings for the convenience of description. The embodiments in the present application and the features in the embodiments can be combined with each other without conflict.

[0063] The above description is merely preferred embodiment of the present application and the principle of the applied technology, and is not intended to limit the present application. The present application can be variously changed and altered by those skilled in the art. The scope of the application involved in the present application is not limited to the technical solution formed by the specific combination of the above technical features, and should also cover other technical solutions formed by the combination of the above technical features or equivalent features without departing from the above application concept. For example, the technical solutions formed by the mutual replacement of the above features and the technical features disclosed in the present application (but not limited to) having similar functions.

Claims

1. A heat dissipating cold plate characterized by, The heat dissipation cold plate comprises a base and a phase change material, the base comprises a heat dissipation surface and a phase change accommodating cavity, the heat dissipation surface is used for dissipating heat of an electronic component; the phase change material is filled in the phase change accommodating cavity, and the phase change material comprises a first phase change material and a second phase change material, and the first phase change material and the second phase change material have different thermal conductivities.

2. The cold plate of claim 1, wherein, The number of the heat dissipation surfaces is two, and the two heat dissipation surfaces are a first heat dissipation surface and a second heat dissipation surface, and the first heat dissipation surface and the second heat dissipation surface are oppositely arranged.

3. The cold plate of claim 1, wherein, The base further comprises a heat dissipation boss, and the heat dissipation boss is arranged at the heat dissipation surface to arrange the electronic component.

4. The cold plate of claim 1, wherein, The number of the phase change accommodating cavities is at least two, and the at least two phase change accommodating cavities are a first phase change accommodating cavity and a second phase change accommodating cavity, the first phase change accommodating cavity is filled with the first phase change material, and the second phase change accommodating cavity is filled with the second phase change material.

5. The cold plate of claim 4, wherein, The thermal conductivity of the first phase change material is greater than that of the second phase change material, the first phase change accommodating cavity is located in a high heat dissipation area of the base, and the second phase change accommodating cavity is located in a low heat dissipation area of the base.

6. The cold plate of claim 4, wherein, The first phase change accommodating cavity comprises at least two sub-cavities, and the at least two sub-cavities are independently arranged.

7. The cold plate of claim 4, wherein, A plurality of first heat conduction rib plates are arranged in the first phase change accommodating cavity, and the first heat conduction rib plates extend along a first direction; A second heat conduction rib plate is arranged in the second phase change accommodating cavity, and the second heat conduction rib plate extends along a second direction.

8. The cold plate of claim 7, wherein, In the first direction, the first heat conduction rib plate extends along a straight line or a curve; In the second direction, the second heat conduction rib plate extends along a straight line or a curve; The first direction is parallel or perpendicular to the second direction.

9. The cold plate of claim 7, wherein, The first heat conduction rib plate and the base are integrally formed by additive manufacturing or welding process to form an integral structure; The second heat conduction rib plate and the base are integrally formed by additive manufacturing or welding process to form an integral structure.

10. The cold plate of claim 7, wherein, The thickness of the first heat conduction rib plate is greater than 0.5 mm, and the distance between adjacent first heat conduction rib plates is greater than 10 mm; The thickness of the second heat conduction rib plate is greater than 0.5 mm, and the distance between adjacent second heat conduction rib plates is less than 8 mm.

11. The cold plate of any one of claims 1 to 10, wherein, The first phase change material is a liquid metal, and the second phase change material is an organic phase change material.

12. The cold plate of claim 11, wherein, The first phase change material is a bismuth-based liquid metal, and the second phase change material is paraffin.

13. An electronic device, comprising: The heat dissipation cold plate comprises an electronic component and a heat dissipation cold plate as claimed in any one of claims 1 to 12, and the electronic component is in contact with the heat dissipation surface of the heat dissipation cold plate.

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