Laminated optical coupler lead frame

Abstract

The utility model relates to the technical field of laminated optical coupler lead frames, in particular to a laminated optical coupler lead frame. The filling gaps used for filling the colloid to fix the first pins mutually are arranged among the first pins, so that when an LED, a photosensitive element and other elements are fixed in the subsequent fixing process, the first pins can be mutually fixed through the colloid, and in the fixing and wire welding process and the finished optocoupler manufactured in the subsequent process, the number of the first pins can be greatly reduced. According to the optical coupler, the first pins can be relatively fixed to a certain extent, on one hand, breakage of welded wires caused by change of the relative positions of the first pins in the machining process is prevented, and on the other hand, the stability of connection between internal elements can be greatly improved in the using process of the finished optical coupler; the problems that in the prior art, the stability between the input end and the output end pin of the optocoupler is relatively low and the cost is relatively high by adding a connecting block procedure to improve the stability between the input end and the output end pin of the optocoupler are solved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of stacked crystal photoelectric coupling lead frame, specifically to a stacked crystal photoelectric coupling lead frame. BACKGROUND

[0002] The main function of the lead frame is electrical connection: by means of bonding materials such as gold wire, aluminum wire or copper wire, the internal circuit output of the photoelectric coupling chip is connected with the external lead, forming a complete electrical circuit, so that the photoelectric coupling can work normally, realize signal transmission and processing, provide stable mechanical support for the photoelectric coupling chip, protect the chip from external physical factors such as vibration and impact, and ensure that the chip will not displace or be damaged during work.

[0003] However, in the application of stacked photoelectric coupling, all the LEDs of the stacked photoelectric coupling are horizontal structure bottom light emitting chips. In order to realize electrical connection of the LEDs, the positive and negative electrodes of the LEDs need to be connected from the output end to the inner lead of the input end. Since the input end and the output end of the lead frame are not supported by connecting ribs, the mechanical strength after bonding is poor, and the phenomenon of easy breakage occurs. At present, the industry method is to fix the input end and the output end with connecting blocks. However, since the connecting blocks are too long, they are easy to cause cornering during die bonding, which causes poor stability. At the same time, an additional process of fixing the connecting blocks is required, which increases the manufacturing cost and labor cost. For example, in the Chinese patent document with the application number CN202321098616.8 and the patent name "lead frame material belt and packaging structure", the photoelectric coupling support adopts the current process. CONTENT OF THE UTILITY MODEL

[0004] In view of the shortcomings of the prior art, the utility model provides a stacked crystal photoelectric coupling lead frame, which solves the problem of relatively low stability and relatively high cost of the existing method of increasing the stability between the input end and the output end of the photoelectric coupling by increasing the connecting block process.

[0005] To achieve the above purpose, the utility model provides the following technical scheme:

[0006] A stacked crystal photoelectric coupling lead frame, comprising two symmetrical edge guide rails, a plurality of vertical ribs are arranged between the two edge rails, a plurality of groups of photoelectric coupling pins are arranged between any two vertical ribs, each group of photoelectric coupling pins comprises a plurality of first pins, the plurality of first pins are arranged on the same plane, and a filling gap for filling the plurality of first pins with adhesive is arranged between the plurality of first pins.

[0007] Two first pins in a group of photoelectric coupling pins arranged on the same vertical rib are provided with a reinforcing part between them, the reinforcing part is arranged at one end of the two first pins close to the corresponding vertical rib, and the filling gap is communicated with the reinforcing part.

[0008] As preferred, a plurality of glue holding holes are arranged on the first pin.

[0009] As preferred, a filling slot is arranged on the two first pins opposite to the reinforcing part.

[0010] As preferred, a plurality of concave slots are arranged on the side guide rail.

[0011] As preferred, the width of the filling gap is not less than 0.2mm.

[0012] Compared with the prior art, the utility model provides a crystal light coupling lead frame, has the following

[0013] Beneficial effects:

[0014] 1. By arranging the filling gap between the plurality of first pins for filling the glue to fix the plurality of first pins, when fixing the LED and the photosensitive element and other elements in the subsequent fixing process, the plurality of first pins can be fixed by the glue, so that the relative fixation between the plurality of first pins can be ensured to a certain extent in the process of fixing and welding wire, and in the finished product light coupling made subsequently, the relative position between the plurality of first pins can be prevented from changing in the process of processing, so that the welded wire is prevented from being broken, on the other hand, the stability of the connection between the internal elements of the finished product light coupling can be greatly improved in the use process, and the reliability of the product can be improved.

[0015] 2. By arranging the filling slot on the two first pins opposite to the reinforcing part, the friction with the two first pins can be enhanced after the glue solidifies, and the first pin is prevented from being dislocated along the respective extension direction on the horizontal plane.

[0016] 3. By arranging the plurality of glue holding holes on the first pin, the packaging glue of the finished product light coupling can enter the glue holding hole, so that the relative stability of the position between the plurality of first pins can be further improved by the packaging glue solidified in the glue holding hole. BRIEF DESCRIPTION OF DRAWINGS

[0017] The drawings described herein are used to provide further understanding of the present application, and constitute a part of the present application, the illustrative embodiments of the present application and the description thereof are used to explain the present application, and do not constitute improper limitation on the present application. In the drawings:

[0018] Figure 1 It is a schematic view of the three-dimensional structure of the utility model;

[0019] Figure 2 It is a schematic view of the light coupling pin of the utility model.

[0020] In the figure: 1, side guide rail; 2, vertical rib; 3, optocoupler pin; 4, first pin; 5, filling gap; 6, glue hole; 7, reinforcing part; 8, filling groove; 9, concave groove. DETAILED DESCRIPTION

[0021] The embodiments of the present application will be described in detail below with the accompanying drawings and examples, so that the realization process of how to apply technical means to solve technical problems and achieve technical effects of the present application can be fully understood and implemented.

[0022] In order to solve the problem of relatively low stability and relatively high cost of the existing method of increasing the stability between the input and output pins of the optocoupler by adding a connecting block process, the utility model provides a stacked crystal optocoupler lead frame, as shown in Figure 1 and Figure 2 It is abandoned to use the connecting block, but a new structure is adopted to improve the stability of the optocoupler manufactured based on this structure subsequently, which comprises two symmetrically arranged side guide rails 1, a plurality of vertical ribs 2 arranged between the two side guide rails 1, a plurality of groups of optocoupler pins 3 arranged between any two vertical ribs 2, the side guide rails 1 and the vertical ribs 2 will be cut off when the product optocoupler is manufactured, and only a plurality of groups of optocoupler pins 3 are reserved, each group of optocoupler pins 3 comprises a plurality of first pins 4, the plurality of first pins 4 are arranged on the same plane, and a filling gap 5 for filling the glue to fix the plurality of first pins 4 is arranged between the plurality of first pins 4. In this way, during the subsequent die bonding process of fixing the LED and the photosensitive element and other elements, the plurality of first pins 4 are first placed on the same horizontal plane, and then the filling gap 5 between the plurality of first pins 4 is filled with glue, so as to fix the plurality of first pins 4 by the glue, thereby ensuring the relative fixation between the plurality of first pins 4 to a certain extent during the fixing and wire bonding process, and in the finished product optocoupler manufactured subsequently, on the one hand, preventing the relative position between the first pins 4 from changing during the processing process, thereby causing the wire to be broken, and the wire is generally gold wire, on the other hand, the finished product optocoupler can greatly improve the stability of the connection between the internal elements during use, improve the reliability of the product, and the cost is relatively low.

[0023] In the process of filling the colloid into the filling gap 5, the method for improving the coagulation between the first pins 4 needs to increase the contact area between the colloid and the first pins 4, and the colloid itself needs to have a certain strength. Therefore, a reinforcing portion 7 is arranged between two first pins 4 in a group of optical coupling pins 3 arranged on the same vertical rib 2. The reinforcing portion 7 is arranged at the end of the two first pins 4 close to the corresponding vertical rib 2, and the filling gap 5 is in communication with the reinforcing portion 7. In the case that the product performance allows, the width of the reinforcing portion 7 is as large as possible, larger than the width of the filling gap 5, so that the amount of colloid in the reinforcing portion 7 is relatively increased, and the colloid in the reinforcing portion 7 is relatively stronger, so as to improve the fixing effect between the first pins 4.

[0024] In order to further improve the relative stability of the positions of the first pins 4 in the finished product optical coupling, a plurality of colloid grabbing holes 6 are arranged on the first pins 4, so that the packaging colloid of the finished product optical coupling can enter the colloid grabbing holes 6, and the relative stability of the positions of the first pins 4 is further improved by the packaging colloid coagulated in the colloid grabbing holes 6.

[0025] In order to further improve the relative stability between the two first pins 4 after the colloid is filled in the reinforcing portion 7, a filling groove 8 is arranged on the two first pins 4 opposite to each other on both sides of the reinforcing portion 7, so as to prevent the first pins 4 from being dislocated in the horizontal plane along the respective extension direction.

[0026] In order to release the stress generated in the die bonding and wire bonding process of the side guide rail 1, so as to prevent the first pins 4 from being deformed, a plurality of concave grooves 9 are arranged on the side guide rail 1 for releasing the stress generated in the process, so as to ensure the integrity of the first pins 4.

[0027] In order to ensure that the gap size of the filling gap 5 can meet the purpose of relatively fixing a plurality of first pins 4 by the colloid, through experimental test, when the width of the filling gap 5 is not less than 0.2 mm, the fixing force of the colloid filled in the filling gap 5 on the plurality of first pins 4 can meet the production requirements.

[0028] It should be noted that, in this text, relational terms such as first and second are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "contain" or any other variant thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or equipment.

[0029] Although the embodiments of the present application have been shown and described, it is to be understood that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A stacked crystal light coupling lead frame, comprising two edge rails (1) arranged symmetrically, a plurality of vertical ribs (2) arranged between the two edge rails (1), and a plurality of groups of light coupling pins (3) arranged between any two vertical ribs (2), characterized in that, A plurality of first pins (4) are included in each group of optical coupling pins (3), the plurality of first pins (4) are arranged on the same plane, and the plurality of first pins (4) are arranged with filling gaps (5) for filling glue to fix the plurality of first pins (4) to each other; Two first pins (4) in a group of optical coupling pins (3) arranged on the same vertical rib (2) are arranged with a reinforcing portion (7) arranged at one end of the two first pins (4) close to the corresponding vertical rib (2), and the filling gap (5) is in communication with the reinforcing portion (7).

2. A twin optic lead frame according to claim 1, wherein, A plurality of glue holding holes (6) are arranged on the first pins (4).

3. The twin-junction lead frame of claim 1, wherein the first and second lead frames are formed on a single substrate. A filling groove (8) is arranged on the two first pins (4) opposite to the reinforcing portion (7).

4. The twin-junction lead frame of claim 1, wherein the first and second lead frames are formed on a single substrate. A plurality of concave grooves (9) are arranged on the edge guide rail (1).

5. The twin-junction optical coupling leadframe of claim 1, wherein, The width of the filling gap (5) is not less than 0.2 mm.

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