Detection tool applied to chemical mechanical polishing equipment and chemical mechanical polishing device

Abstract

The utility model provides a detection tool applied to chemical mechanical polishing equipment and a chemical mechanical polishing device.The chemical mechanical polishing equipment comprises a polishing assembly, the polishing assembly at least comprises a polishing disc, a polishing pad, a finisher, a polishing liquid conveying arm and a polishing head, the polishing disc is used for containing the polishing pad, and the detection tool comprises a disc-shaped main body part and a detection part; the body part is suitable for being arranged on a polishing disc. The multiple arc scale marks are arranged on the surface of the main body part, and the multiple arc scale marks are arranged in the radial direction of the main body part at equal intervals; the linear scale marks are arranged on the surface of the main body part and extend in the radial direction of the main body part, the positions, relative to the polishing pad, of the trimmer and the polishing solution transmission arm are measured through the arc scale marks, and the linear scale marks are used for measuring the position, relative to the polishing pad, of the polishing head. The detection tool can measure the positions of the polishing head, the polishing solution transmission arm and the trimmer at the same time, and the operation method is convenient and simple.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and more specifically to a testing tool and a chemical mechanical polishing apparatus for use in chemical mechanical polishing equipment. Background Technology

[0002] The integrated circuit industry is the core of the information technology industry. In the process of large-scale integrated circuit production, the removal and planarization of materials on the wafer surface is an essential and frequently used process. Currently, chemical mechanical polishing (CMP) is the most mainstream global planarization technology, used to reduce wafer surface roughness or to thin the wafer.

[0003] CMP (Chemical Mechanical Polishing) is a process that uses chemical etching and mechanical force to planarize silicon wafers or other substrate materials during processing. A CMP machine typically includes a slurry transfer arm, a rotating polishing head, a dresser, a rotating polishing disc, and a polishing pad. During CMP, the wafer is typically held against the bottom surface of the polishing head, with the side of the wafer containing the deposited layer pressed against the upper surface of the polishing pad. The polishing head, driven by a drive assembly, rotates in the same direction as the polishing pad and applies a downward load to the wafer. The dresser acts on the polishing pad to ensure its flatness, thereby improving the polishing effect. Simultaneously, polishing slurry is supplied to the upper surface of the polishing pad and distributed between the wafer and the polishing pad, allowing the wafer to undergo chemical-mechanical polishing through the combined effects of chemical and mechanical processes.

[0004] Therefore, during CMP (Chemical Mechanical Polishing), the wafer's movement position on the polishing pad, the oscillation position of the dresser on the polishing pad, and the landing point of the polishing slurry on the polishing pad all affect the flatness of the wafer polishing. Thus, the oscillation position of the polishing head, the position of the polishing slurry transfer arm, and the oscillation position of the dresser are key inspection technologies for CMP polishing modules. In related technologies, directly measuring the landing point of the polishing slurry by placing a testing tool on the polishing pad is highly susceptible to human error and involves only a single measurement parameter.

[0005] Therefore, improvements are needed to at least partially address the aforementioned problems. Utility Model Content

[0006] The utility model description section introduces a series of simplified concepts, which will be further explained in detail in the detailed description section. This utility model description section is not intended to limit the key features and essential technical features of the claimed technical solution, nor is it intended to determine the scope of protection of the claimed technical solution.

[0007] To at least partially solve the above problems, this utility model provides a testing tool for chemical mechanical polishing equipment. The polishing assembly includes at least a polishing disc, a polishing pad, a dresser, a polishing fluid transfer arm, and a polishing head. The polishing disc is used to hold the polishing pad. The testing tool includes: a disc-shaped main body adapted to be disposed on the polishing disc; a plurality of arc-shaped scale lines disposed on the surface of the main body, the plurality of arc-shaped scale lines being equally spaced along the radial direction of the main body; and straight scale lines disposed on the surface of the main body and extending radially along the main body. The arc-shaped scale lines are used to measure the position of the dresser and the polishing fluid transfer arm relative to the polishing pad, and the straight scale lines are used to measure the position of the polishing head relative to the polishing pad.

[0008] For example, the first ends of a plurality of the arc scale lines are aligned and spaced apart along a first radius of the main body, and the second ends of a plurality of the arc scale lines are aligned and spaced apart along a second radius of the main body, wherein the angle of the arc scale lines is greater than 90°.

[0009] For example, the angle between the first radius and the second radius is 90°.

[0010] For example, the radial dimension of the main body is greater than or equal to the radial dimension of the polishing pad.

[0011] For example, the testing tool further includes a connecting portion connected to the main body, the main body being fitted onto the polishing disc via the connecting portion.

[0012] For example, the main body is also provided with a mark, and when the trimmer actually moves a predetermined angle, the end of the trimmer is aligned with the mark.

[0013] According to another aspect of the present invention, a chemical mechanical polishing apparatus is provided, comprising: a polishing disc; a polishing pad detachably disposed on the polishing disc; a polishing fluid transfer arm for supplying polishing fluid to the polishing pad; a dressing device for dressing the surface of the polishing pad; a polishing head for adsorbing a wafer to be polished; and the aforementioned detection tool, which is detachably disposed on the polishing disc.

[0014] For example, a mark is provided on the main body, and when the trimmer actually moves a predetermined angle, the end of the trimmer aligns with the mark.

[0015] For example, the actual position of the outlet end of the polishing fluid transfer arm is measured by the circular scale line.

[0016] For example, when the polishing head is in the starting position, it corresponds to the first scale mark of the straight scale line, and when the polishing head is in the ending position, it corresponds to the second scale mark of the straight scale line. The actual distance the polishing head moves from the starting position to the ending position is determined based on the distance between the second scale mark and the first scale mark.

[0017] The detection tool of this utility model, applied to chemical mechanical polishing equipment, can simultaneously measure the position of the polishing head, polishing fluid transmission arm, and dressing device relative to the polishing pad. The operation method is convenient and simple. Compared with the detection tools in related technologies, which can only measure the position of the polishing fluid transmission arm, the detection tool of this application can measure the position of multiple polishing components, reducing the trouble of tool switching, improving measurement efficiency, and having less influence from human factors, which can ensure the accuracy and reliability of measurement data, and realize the precise detection and calibration of the position of polishing components of the chemical mechanical polishing machine. Attached Figure Description

[0018] The following drawings, which are incorporated herein by reference as part of this invention, are provided for understanding the invention. The drawings illustrate embodiments of the invention and their descriptions, serving to explain the principles of the invention.

[0019] In the attached image:

[0020] Figure 1 A schematic diagram of the structure of a detection tool according to a specific embodiment of the prior art is shown;

[0021] Figure 2 A schematic diagram of a chemical mechanical polishing apparatus according to a specific embodiment of the prior art is shown;

[0022] Figure 3 A schematic diagram of the structure of a detection tool according to a specific embodiment of the present invention is shown;

[0023] Figure 4 A schematic diagram of a chemical mechanical polishing apparatus according to a specific embodiment of the present invention is shown. Detailed Implementation

[0024] In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the present invention. However, it will be apparent to those skilled in the art that the present invention can be practiced without one or more of these details. In other instances, certain technical features well-known in the art have not been described in order to avoid confusion with the present invention.

[0025] It should be understood that this invention can be embodied in various forms and should not be construed as being limited to the embodiments set forth herein. Rather, providing these embodiments will make the disclosure thorough and complete, and will fully convey the scope of this invention to those skilled in the art. In the drawings, for clarity, the dimensions of layers and regions, as well as their relative dimensions, may be exaggerated. The same reference numerals denote the same elements throughout.

[0026] It should be understood that when an element or layer is referred to as "on," "adjacent to," "connected to," or "coupled to" other elements or layers, it may be directly on, adjacent to, connected to, or coupled to other elements or layers, or there may be intervening elements or layers. Conversely, when an element is referred to as "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" other elements or layers, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc., may be used to describe various elements, components, areas, layers, and / or portions, these elements, components, areas, layers, and / or portions should not be limited by these terms. These terms are only used to distinguish one element, component, area, layer, or portion from another element, component, area, layer, or portion. Therefore, without departing from the teachings of this utility model, the first element, component, area, layer, or portion discussed below may be referred to as a second element, component, area, layer, or portion.

[0027] Spatial relation terms such as “below,” “under,” “below,” “under,” “above,” “above,” etc., are used herein for convenience of description to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that, in addition to the orientation shown in the figure, spatial relation terms are intended to also include different orientations of the device in use and operation. For example, if the device in the figure is flipped, then the element or feature described as “below” or “under” the other element or feature will be oriented “above” the other element or feature. Therefore, the exemplary terms “below” and “under” can include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or otherwise) and the spatial descriptive terms used herein will be interpreted accordingly.

[0028] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of the invention. When used herein, the singular forms “a,” “an,” and “the” are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising” and / or “including,” when used in this specification, identify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups. When used herein, the term “and / or” includes any and all combinations of the associated listed items.

[0029] During CMP (Chemical Mechanical Polishing), the wafer's movement position on the polishing pad, the oscillation position of the dresser on the polishing pad, and the landing point of the polishing slurry on the polishing pad all affect the flatness of the wafer polishing. Specifically, the polishing slurry drips onto the polishing pad via the end of the slurry transfer arm. Therefore, the positions of the polishing head, the slurry transfer arm, and the dresser are key inspection techniques in CMP polishing modules.

[0030] In related technologies, such as Figure 1 and Figure 2 As shown, a detection tool 100 with arc-shaped graduations is placed on the polishing pad 110 of the chemical mechanical polishing machine to directly measure the position of the polishing slurry transmission arm 120 (i.e., the dripping position of the polishing slurry, which also corresponds to the position of the outlet end of the polishing slurry transmission arm 120). However, this detection tool 100 is manually placed on the polishing pad, which is greatly affected by human factors, resulting in low accuracy of the measurement results. Furthermore, the measurement parameters are limited, making it impossible to measure the positions of the polishing head 130 and the dresser 140. If the positions of the polishing slurry transmission arm 120, the polishing head 130, and the dresser 140 are not measured accurately, it can easily affect the flatness of the wafer polishing.

[0031] To address at least one of the aforementioned technical problems, this application provides a testing tool for a chemical mechanical polishing (CMP) apparatus. The CMP apparatus includes a polishing assembly, which at least includes a polishing disc, a polishing pad, a dresser, a polishing fluid transfer arm, and a polishing head. The polishing disc is used to hold the polishing pad. The testing tool includes: a disc-shaped main body adapted to be mounted on the polishing disc; multiple arc-shaped graduation lines disposed on the surface of the main body, the multiple arc-shaped graduation lines being equally spaced along the radial direction of the main body; and straight graduation lines disposed on the surface of the main body and extending radially along the main body. The arc-shaped graduation lines measure the position of the dresser and the polishing fluid transfer arm relative to the polishing pad, while the straight graduation lines measure the position of the polishing head relative to the polishing pad.

[0032] The testing tool for chemical mechanical polishing equipment according to this application can simultaneously measure the position of the polishing head, polishing fluid transfer arm, and dresser relative to the polishing pad. The operation method is convenient and simple. Compared with the testing tools in related technologies that can only measure the position of the polishing fluid transfer arm, the testing tool of this application can measure the position of multiple polishing components, reducing the trouble of tool switching, improving measurement efficiency, and having less influence from human factors. It can ensure the accuracy and reliability of measurement data and achieve precise detection and calibration of the position of polishing components on the chemical mechanical polishing machine.

[0033] To fully understand this application, detailed steps and structures will be presented in the following description to illustrate the technical solutions proposed in this application. Preferred embodiments of this application are described in detail below; however, in addition to these detailed descriptions, this application may have other implementation methods.

[0034] The following is for reference. Figure 3 and Figure 4 A detection tool 200 applied to a chemical mechanical polishing apparatus according to an embodiment of this application is described, such as... Figure 3 and Figure 4 As shown, the chemical mechanical polishing (CMP) equipment includes a polishing assembly, which includes at least a polishing disc, a polishing pad, a dresser 240, a polishing fluid transfer arm 250, and a polishing head 260. The polishing disc is used to hold the polishing pad. The testing tool 200 includes: a disc-shaped main body 210 adapted to be disposed on the polishing disc; a plurality of arc-shaped scale lines 220 disposed on the surface of the main body 210, the plurality of arc-shaped scale lines 220 being equally spaced along the radial direction of the main body 210; and a straight scale line 230 disposed on the surface of the main body 210 and extending radially along the main body 210. The arc-shaped scale lines 220 are used to measure the position of the dresser 240 and the polishing fluid transfer arm 250 relative to the polishing pad, and the straight scale line 230 is used to measure the position of the polishing head 260 relative to the polishing pad.

[0035] In this embodiment, the main body 210 of the detection tool 200 is designed as a disc shape. Multiple arc-shaped scale lines 220 are provided on the surface of the main body 210. The multiple arc-shaped scale lines 220 are arranged at equal intervals along the radial direction of the main body 210. The positions of the dresser 240 and the polishing liquid transmission arm 250 relative to the polishing pad can be measured through the arc-shaped scale lines 220, so as to check whether the position of the dresser 240 and the dripping position of the polishing liquid meet the process requirements. The polishing liquid drips onto the polishing pad through the end of the polishing liquid transmission arm 250. At the same time, a straight scale line 230 is also provided on the surface of the main body 210. The straight scale line 230 extends radially along the main body 210. The position of the polishing head 260 relative to the polishing pad can be measured through the straight scale line 230, so as to check whether the position of the polishing head 260 meets the process requirements. This application utilizes a single inspection tool 200 to simultaneously check the positions of the polishing head 260, the polishing fluid transfer arm 250, and the dresser 240. The operation is convenient and simple, and it can accurately measure and record position information, ensuring the accuracy and reliability of the measurement data. This enables precise detection and calibration of the polishing components of chemical mechanical polishing equipment. Furthermore, the inspection tool 200 can be used to inspect the polishing components of multiple chemical mechanical polishing equipment, thereby accurately comparing the differences between the equipment and achieving standardization of chemical mechanical polishing machines.

[0036] In some embodiments, the overall shape of the disc-shaped main body 210 is adapted to the shape of a polishing disc or polishing pad in a chemical mechanical polishing apparatus, wherein the polishing pad is detachably disposed on the polishing disc. Exemplarily, the main body 210 is disposed on the polishing disc, and the radial dimension of the main body 210 is greater than or equal to the radial dimension of the polishing pad, for accurately measuring the positions of the polishing head 260, the polishing fluid transfer arm 250, and the dresser 240 relative to the polishing pad.

[0037] In some embodiments, such as Figure 3As shown, a plurality of arc-shaped scale lines 220 are provided on the surface of the main body 210. The plurality of arc-shaped scale lines 220 are arranged at equal intervals along the radial direction of the main body 210. For example, the interval between adjacent arc-shaped scale lines 220 can be reasonably set according to actual needs, such as 1 mm, 5 mm or 10 mm. Optionally, the first ends of the plurality of arc-shaped scale lines 220 are aligned and arranged at intervals along the first radius 2101 of the main body 210, and the second ends of the plurality of arc-shaped scale lines 220 are aligned and arranged at intervals along the second radius 2102 of the main body. At the same time, the angle of each arc-shaped scale line 220 is greater than 90 degrees. The arc-shaped scale line 220 has an angle greater than 90 degrees to facilitate the coverage of the movement paths of the polishing slurry transfer arm 250 and the dresser 240. This allows for the simultaneous measurement of the positions of the polishing slurry transfer arm 250 and the dresser 240 relative to the polishing pad. The polishing slurry drips onto the polishing pad from the end (i.e., the outlet) of the polishing slurry transfer arm 250, thus facilitating accurate inspection of whether the dripping position of the polishing slurry and the position of the dresser 240 meet the process requirements. Exemplarily, the included angle between the first radius 2101 and the second radius 2102 of the main body 210 is 90°. In other embodiments, the included angle between the first radius 2101 and the second radius 2102 can be other suitable angles.

[0038] In some embodiments, the centers of the plurality of arc-shaped graduation lines 220 may coincide with the center of the main body 210. The center of the main body 210 may also coincide with the center of the polishing disc or polishing pad. Aligning the arc-shaped graduation lines 220 with the center of the main body 210 allows for quick and accurate measurement of the position of the polishing slurry transfer arm 250 relative to the polishing pad (i.e., the dripping position of the polishing slurry) and the position of the dresser 240 relative to the polishing pad. This facilitates the calibration of the polishing components of the chemical mechanical polishing machine, ensuring that the position of the polishing components meets process requirements and thus guaranteeing the flatness of the polishing process.

[0039] In some embodiments, such as Figure 4As shown, a marking position is provided on the main body 210. When the dresser 240 actually moves a predetermined angle, the end of the dresser 240 aligns with the marking position. Since the wafer's position on the polishing pad, the dresser 240's oscillation position on the polishing pad, and the landing point of the polishing slurry on the polishing pad all affect the flatness inspection of the wafer polishing, the polishing head 260 is used to pick up the wafer to be polished, and the polishing slurry drips onto the polishing pad via the end of the polishing slurry transfer arm 250. Therefore, checking the position of the polishing head 260, the position of the polishing slurry transfer arm 250, and the position of the dresser 240 is crucial. Specifically, the operation for checking the position of the dresser 240 is as follows: The inspection tool 200 is tightly fastened to the polishing disc of the CMP machine. Markings are provided on the main body 210 of the inspection tool 200. When the dresser 240 rotates a preset angle, such as 23 degrees or another suitable angle, and the polishing disc is rotated, the position of the dresser 240 can be measured through the arc-shaped scale line 220. If the measured data matches the marking data, then the dresser 240 is aligned with the markings on the main body 210, and the position of the dresser 240 meets the process requirements. If the measured data... If the data is inconsistent with the marking position, the dressing 240 is not aligned with the marking position on the main body 210. At this time, the position of the dressing 240 does not meet the process requirement standard. Therefore, the position of the dressing 240 is recalibrated to align with the marking position on the main body 210, thereby meeting the process requirement standard and achieving precise calibration of the position of the dressing 240. Furthermore, the testing tool 200 can be used to test the polishing components of multiple chemical mechanical polishing equipment, thereby accurately comparing the differences between the equipment and ensuring that the position of the dressing 240 of different equipment is basically the same, thus achieving standardization.

[0040] For example, such as Figure 4 As shown, the operation of checking the position of the polishing slurry transmission arm 250 relative to the polishing pad (i.e., checking the dripping position of the polishing slurry) is as follows: Move the polishing slurry transmission arm 250 to the position where the operation is required. The polishing slurry drips onto the polishing pad through the end of the polishing slurry transmission arm 250. The dripping position of the polishing slurry can be measured through the arc scale line 220. Record the position data of the polishing slurry and compare it with the process requirement data. When the recorded position data of the polishing slurry meets the process requirement data, the position of the polishing slurry transmission arm 250 meets the process requirement standard. When there is a difference between the recorded position data of the polishing slurry and the process requirement data, the position of the polishing slurry transmission arm 250 does not meet the process requirement standard. Then, recalibrate the position of the polishing slurry transmission arm 250 to meet the process requirement data, thereby meeting the process requirement standard and achieving accurate calibration of the position of the polishing slurry transmission arm 250.

[0041] In some embodiments, the detection tool 200 further includes a linear scale line 230, which is disposed on the surface of the main body 210 and extends radially along the main body 210. Exemplarily, the linear scale line 230 may be disposed on a first radius 2101, a second radius 2102, or other suitable positions, as long as it meets the measurement requirements for the position of the polishing head 260; no specific limitation is made thereto. In this embodiment, as... Figure 3 As shown, the linear scale line 230 is set on the first radius 2101. The position of the polishing head 260 relative to the polishing pad is measured through the linear scale line 230 to check whether the position of the polishing head 260 meets the process requirements. Specifically, the operation for checking the position of the polishing head 260 is as follows: Figure 4 As shown, the polishing head 260 is controlled by a motor to move in different directions, moving the polishing head 260 to the starting position (i.e., the first mark on the linear scale 230) and the ending position (i.e., the second mark on the linear scale 230). The actual moving distance of the polishing head 260 can be determined based on the distance between the second mark and the first mark. The distance between the starting position and the ending position of the polishing head 260 fed back by the motor is recorded, and the distance recorded by the motor is compared with the actual moving distance. If there is a difference, the position of the polishing head 260 is recalibrated to meet the process requirements, thereby achieving precise calibration of the position of the polishing head 260.

[0042] In some embodiments, the testing tool 200 further includes a connecting portion (not shown) connected to the main body 210. The main body 210 is sleeved on the polishing disc through the connecting portion. For example, the connecting portion connects to the edge of the main body 210 and hangs relative to the main body 210. The connecting portion can be, for example, a snap-fit ​​structure or an elastic element, so that the testing tool 200 can be detachably connected to the polishing disc.

[0043] In some embodiments, the testing tool 200 may be applicable to 6-inch, 8-inch, 12-inch or other suitable CMP machines, without specific limitation.

[0044] In summary, the detection tool for chemical mechanical polishing equipment according to the embodiments of this application can simultaneously measure the positions of the polishing head, the polishing fluid transfer arm, and the dresser relative to the polishing pad. The operation method is convenient and simple. Compared with the detection tools in related technologies, which can only measure the position of the polishing fluid transfer arm, the detection tool of this application can measure the position of multiple polishing components, reducing the trouble of tool switching, improving measurement efficiency, and having less influence from human factors. It can ensure the accuracy and reliability of measurement data and achieve precise detection and calibration of the polishing component positions of the chemical mechanical polishing machine.

[0045] This application also provides a chemical mechanical polishing apparatus, which continues to be referenced. Figure 4 It includes a polishing disc; a polishing pad detachably mounted on the polishing disc; a polishing fluid transfer arm 250 for supplying polishing fluid to the polishing pad; a dresser 240 for dressing the surface of the polishing pad; a polishing head 260 for adsorbing the wafer to be polished; and the aforementioned inspection tool 200, which is detachably mounted on the polishing disc.

[0046] In some embodiments, the actual position of the outlet end of the polishing slurry transfer arm is measured by the arc-shaped scale lines 220 on the main body 210. For example, a plurality of arc-shaped scale lines 220 are provided on the surface of the main body 210, and these arc-shaped scale lines 220 are arranged at equal intervals along the radial direction of the main body 210. The position of the polishing slurry transfer arm 250 relative to the polishing pad can be measured by the plurality of arc-shaped scale lines 220. Since the polishing slurry drips onto the polishing pad via the end of the polishing slurry transfer arm 250, the arc-shaped scale lines 220 can measure the dripping position of the polishing slurry. Specifically, the operation of checking the position of the polishing slurry transmission arm 250 relative to the polishing pad (i.e., checking the dripping position of the polishing slurry) is as follows: move the polishing slurry transmission arm 250 to the position where the operation is required, measure the dripping position of the polishing slurry through the arc scale line 220, record the position data of the polishing slurry, and compare it with the process requirement data; when the recorded position data of the polishing slurry meets the process requirement data, then the position of the polishing slurry transmission arm 250 meets the process requirement standard; when there is a difference between the recorded position data of the polishing slurry and the process requirement data, then the position of the polishing slurry transmission arm 250 does not meet the process requirement standard, and the position of the polishing slurry transmission arm 250 is recalibrated to meet the process requirement data, thereby meeting the process requirement standard and achieving precise calibration of the position of the polishing slurry transmission arm 250.

[0047] In some embodiments, a mark is provided on the main body 210 of the detection tool 200, and the end of the trimmer 240 aligns with the mark when the trimmer 240 actually moves a predetermined angle. Specifically, the operation of checking the position of the dresser 240 is as follows: the detection tool 200 is tightly fastened to the polishing disc. The main body 210 of the detection tool 200 is provided with markings to check whether the position of the dresser 240 meets the process requirements. When the dresser 240 is rotated by a preset angle, such as 23 degrees or other suitable angles, and the polishing disc is rotated, the position of the dresser 240 can be measured through the arc scale line 220. If the measured data is consistent with the marking data, the dresser 240 is aligned with the markings on the main body 210, and the position of the dresser 240 meets the process requirements. If the measured data is inconsistent with the marking data, the dresser 240 is not aligned with the markings on the main body 210, and the position of the dresser 240 does not meet the process requirements. The position of the dresser 240 is then recalibrated to align with the markings on the main body 210, thereby meeting the process requirements and achieving precise calibration of the position of the dresser 240.

[0048] In some embodiments, the testing tool 200 further includes a linear scale line 230, which is disposed on the surface of the main body 210 and extends radially along the main body 210. In this embodiment, the linear scale line 230 extends from the edge of the main body 210 to the center of the main body 210, and the position of the polishing head 260 relative to the polishing pad is measured by the linear scale line 230 to check whether the position of the polishing head 260 meets the process requirement standards. Specifically, the operation of checking the position of polishing head 260 is as follows: polishing head 260 is controlled by a motor to move in different directions, moving polishing head 260 to the starting position (i.e., the first mark on the linear scale 230) and the ending position (i.e., the second mark on the linear scale 230). The actual moving distance of polishing head 260 can be determined based on the distance between the second mark and the first mark. The distance between the starting position and the ending position of polishing head 260 fed back by the motor is recorded, and the distance recorded by the motor is compared with the actual moving distance. If there is a difference, the position of polishing head 260 is recalibrated to meet the process requirement standard, thereby achieving precise calibration of the position of polishing head 260.

[0049] According to the chemical mechanical polishing apparatus of this application embodiment, the detection tool is detachably mounted on the polishing disc and can simultaneously measure the position of the polishing head, the polishing fluid transfer arm, and the dressing relative to the polishing pad. The operation method is convenient and simple. Compared with the detection tools in related technologies that can only measure the position of the polishing fluid transfer arm, the detection tool of this application can measure the position of multiple polishing components, reducing the trouble of tool switching, improving measurement efficiency, and having less influence from human factors, which can ensure the accuracy and reliability of measurement data and realize the precise detection and calibration of the position of the polishing components of the chemical mechanical polishing machine.

[0050] Although exemplary embodiments have been described herein with reference to the accompanying drawings, it should be understood that the above exemplary embodiments are merely illustrative and are not intended to limit the scope of this application. Various changes and modifications can be made therein by those skilled in the art without departing from the scope and spirit of this application. All such changes and modifications are intended to be included within the scope of this application as claimed in the appended claims.

[0051] Similarly, it should be understood that, in order to simplify this application and aid in understanding one or more aspects of the application, various features of this application may sometimes be grouped together in a single embodiment, figure, or description thereof in the description of exemplary embodiments of this application. However, this approach should not be construed as reflecting an intention that the claimed application requires more features than are expressly recited in each claim. Rather, as reflected in the corresponding claims, the point of application is that the corresponding technical problem can be solved with fewer features than all of a single disclosed embodiment. Therefore, the claims following the detailed description are hereby expressly incorporated into that detailed description, wherein each claim itself is a separate embodiment of this application.

[0052] Furthermore, those skilled in the art will understand that although some embodiments described herein include certain features but not others included in other embodiments, combinations of features from different embodiments are intended to be within the scope of this application and form different embodiments. For example, in the claims, any one of the claimed embodiments can be used in any combination.

[0053] It should be noted that the above embodiments are illustrative of this application and not limiting of it, and that those skilled in the art can devise alternative embodiments without departing from the scope of the appended claims. In the claims, any reference signs placed between parentheses should not be construed as limiting the claims. The use of the words first, second, and third, etc., does not indicate any order. These words can be interpreted as names.

Claims

1. A testing tool for use in chemical mechanical polishing equipment, characterized in that, The chemical mechanical polishing equipment includes a polishing assembly, which at least includes a polishing disc, a polishing pad, a dresser, a polishing fluid transfer arm, and a polishing head. The polishing disc is used to hold the polishing pad. The testing tool includes: A disc-shaped main body portion, the main body portion being adapted to be disposed on the polishing disc; Multiple arc-shaped scale lines are disposed on the surface of the main body, and the multiple arc-shaped scale lines are arranged at equal intervals along the radial direction of the main body; A straight scale line is provided on the surface of the main body and extends radially along the main body. The circular scale line measures the position of the dresser and the polishing fluid transfer arm relative to the polishing pad, and the straight scale line is used to measure the position of the polishing head relative to the polishing pad.

2. The detection tool as described in claim 1, characterized in that, The first ends of the plurality of arc scale lines are aligned and spaced apart along the first radius of the main body, and the second ends of the plurality of arc scale lines are aligned and spaced apart along the second radius of the main body, wherein the angle of the arc scale lines is greater than 90°.

3. The detection tool as described in claim 2, characterized in that, The angle between the first radius and the second radius is 90°.

4. The detection tool as described in claim 1, characterized in that, The radial dimension of the main body is greater than or equal to the radial dimension of the polishing pad.

5. The detection tool as described in claim 1, characterized in that, The testing tool also includes a connecting part connected to the main body, and the main body is fitted onto the polishing disc through the connecting part.

6. The detection tool as described in claim 1, characterized in that, The main body is also provided with a marking position, and when the trimmer actually moves a predetermined angle, the end of the trimmer is aligned with the marking position.

7. A chemical mechanical polishing apparatus, characterized in that, include: Polishing disc; A polishing pad is detachably mounted on the polishing disk; A polishing fluid transfer arm is used to supply polishing fluid to the polishing pad; A trimmer for trimming the surface of the polishing pad; Polishing head, used to hold the wafer to be polished; The testing tool as described in any one of claims 1-6, wherein the testing tool is detachably mounted on the polishing disc.

8. The chemical mechanical polishing apparatus as described in claim 7, characterized in that, The main body is provided with a marking position, and when the trimmer actually moves a predetermined angle, the end of the trimmer aligns with the marking position.

9. The chemical mechanical polishing apparatus as described in claim 7, characterized in that, The actual position of the outlet end of the polishing fluid transfer arm is measured using the circular scale lines.

10. The chemical mechanical polishing apparatus as described in claim 7, characterized in that, When the polishing head is in the starting position, it corresponds to the first mark of the straight scale line. When the polishing head is in the ending position, it corresponds to the second mark of the straight scale line. The actual distance the polishing head moves from the starting position to the ending position is determined based on the distance between the second mark and the first mark.

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