Automatic grinding system

Abstract

The utility model discloses an automatic grinding system. The automatic grinding system comprises a base; the grinding device is arranged in the base and is used for grinding a sample; the sample grabbing mechanical arm is provided with a first support and a first mechanical arm, and the sample grabbing mechanical arm is arranged on the base; the sample grabbing device is arranged on the sample grabbing mechanical arm and is used for grabbing a sample; the optical detection mechanical arm is arranged on the base; the first optical detector is arranged on the optical detection mechanical arm, and the second optical detector is arranged on the base; the polishing solution spray head is arranged on the base; the cleaning liquid spray head is arranged on the base, and the control device is electrically connected with the grinding device, the sample grabbing mechanical arm, the sample grabbing device, the polishing liquid spray head, the cleaning liquid spray head, the first optical detector and the second optical detector. By means of the chip sample grinding device, automatic chip sample grinding can be achieved in chip packaging failure analysis.

Description

Technical Field

[0001] This application relates to the semiconductor field, and more particularly to an automated polishing system for polishing chip samples. Background Technology

[0002] In semiconductor packaging, failure analysis is crucial, often requiring the fabrication of slicing samples. However, current preparation processes present numerous challenges. Samples are encapsulated in resin and must be manually grasped and placed on grinding machines for polishing—a time-consuming, labor-intensive, and wasteful process. Even more problematic is the fact that samples are often not placed horizontally within the resin or experience uneven stress during polishing, leading to tilted sample sections that negatively impact observational results and the accuracy of measurement data.

[0003] Furthermore, during the grinding process, due to the lack of a precise positioning system, workers need to frequently examine the chip under a microscope to ensure it has been ground to the correct position. This is not only inefficient but also highly prone to error. If the grinding is not done correctly, rework is required, further increasing time and labor costs. If the grinding is overdone, exceeding the designated position, the failure mode of the sample cannot be observed, requiring a new sample to be provided. If a new sample cannot be provided, the entire failure analysis will fail. Simultaneously, overheating may occur during the grinding process, and flying debris may damage or contaminate the sample, undoubtedly increasing the difficulty and uncertainty of the analysis. Summary of the Invention

[0004] The technical problem to be solved by this application is to provide an automated grinding system for grinding chip samples, which achieves a higher degree of automation and higher grinding accuracy.

[0005] Therefore, one embodiment of this application provides an automatic grinding system, comprising:

[0006] Base;

[0007] A grinding device, disposed in the base, is used for grinding samples;

[0008] A sample grasping robotic arm has a first support and a first robotic arm, wherein the sample grasping robotic arm is disposed on the base;

[0009] A sample gripping device is mounted on the sample gripping robotic arm for gripping the sample;

[0010] An optical inspection robotic arm is mounted on the base;

[0011] A first optical detector and a second optical detector, wherein the first optical detector is disposed on the optical detection robotic arm and the second optical detector is disposed on the base;

[0012] The device includes a control unit electrically connected to the grinding device, the sample gripping robotic arm, the sample gripping device, the polishing slurry nozzle, the cleaning slurry nozzle, the first optical detector, and the second optical detector.

[0013] In one embodiment of this application, the sample grasping robotic arm includes: a first support, disposed on the base; and a first robotic arm, disposed on the first support.

[0014] In one embodiment of this application, the first robotic arm has a first rotating component and a first telescopic component. The first rotating component is disposed on the first support and is used to adjust the horizontal rotation and vertical lifting of the first robotic arm. The first telescopic component is connected to the first rotating component and is used to adjust the horizontal length of the first robotic arm. The sample gripping device is disposed at the end of the first telescopic component away from the first rotating component.

[0015] In one embodiment of this application, the first optical detector is used to detect the grinding condition of the sample in a direction parallel to the grinding disc plane.

[0016] In one embodiment of this application, the second optical detector is used to detect the grinding condition of the sample in a direction perpendicular to the grinding disc plane.

[0017] In one embodiment of this application, the optical detection robotic arm includes: a second support, disposed on the base; and a second robotic arm, disposed on the second support.

[0018] In one embodiment of this application, the second robotic arm has a second rotating component and a second telescopic component. The second rotating component is disposed on the second support and is used to adjust the horizontal rotation and vertical lifting of the second robotic arm. The second telescopic component is connected to the second rotating component and is used to adjust the horizontal length of the second robotic arm. The first optical detector is disposed at the end of the second telescopic component away from the second rotating component.

[0019] In one embodiment of this application, a polishing slurry nozzle is further included, disposed on the base, for spraying polishing slurry.

[0020] In one embodiment of this application, a cleaning fluid nozzle is further included, disposed on the base, for spraying cleaning fluid.

[0021] In one embodiment of this application, the control device includes a PLC controller, a control circuit, and an input device.

[0022] The advantages of the technical solution in this application are:

[0023] The automatic grinding system of this application achieves a higher degree of automation and higher precision by introducing a control device, a robotic arm and an optical detector to monitor the grinding process. Attached Figure Description

[0024] The above and other objects, features and advantages of this application will become clearer from the following description of embodiments with reference to the accompanying drawings:

[0025] Figure 1 This is a schematic diagram of an automatic grinding system according to an embodiment of this application.

[0026] The labels for the attached figures are as follows:

[0027] Base 10, grinding device 20, sample gripping robotic arm 30, first support 301, first telescopic component 302, first rotating component 303, first optical detector 401, second optical detector 402, optical detection robotic arm 50, second support 501, second telescopic component 502, second rotating component 503, sample gripping device 60, polishing liquid nozzle 701, cleaning liquid nozzle 702, control device 80, sample 5. Detailed Implementation

[0028] As described above, these embodiments of the present application do not exhaustively cover all details, nor do they limit the invention to the specific embodiments described. Clearly, many modifications and variations can be made based on the above description. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the present application, thereby enabling those skilled in the art to make good use of the present application and modifications based on it. The present application is limited only by the claims and their full scope and equivalents.

[0029] In this document, the terms "first" or "second" and similar ordinal numbers are primarily used to distinguish or refer to the same or similar components or structures, and do not necessarily imply a spatial or temporal order of these components or structures. It should be understood that, in certain situations or configurations, ordinal numbers can be used interchangeably without affecting the implementation of this application.

[0030] Furthermore, throughout this document, the terms "comprising," "having," or any other similar terms are intended to cover non-exclusive inclusions. For example, a component or structure containing a plurality of elements is not limited to those listed herein, but may include other elements not expressly listed but which are generally inherent to the component or structure.

[0031] In chip packaging failure analysis, it is necessary to grind the chip to remove the packaging material on the chip surface and / or sides to expose the internal structure of the chip in order to perform detailed chip sample failure analysis. Figure 1 An embodiment of an automatic grinding system according to this application includes:

[0032] The components include: base 10, grinding device 20, sample 5, sample gripping robotic arm 30, first optical detector 401, second optical detector 402, optical detection robotic arm 50, nozzle, and control device 80.

[0033] The base 10 provides stable support for the entire automatic grinding system, and is used to support and equip the mechanical components and measuring instruments of the automatic grinding system to ensure that no vibration or displacement occurs during the grinding process.

[0034] The grinding device 20 includes a grinding disc and a drive motor for driving the grinding disc. The grinding device 20 is disposed in the base 10 and is used to grind the sample 5. The grinding disc can be flat or have a specific shape to adapt to different chip grinding requirements. The grinding disc is driven to rotate by the motor to achieve a uniform grinding effect. The grinding disc is typically made of hard materials such as cast iron, stainless steel, or ceramic. These materials have good wear resistance and stability. In practical applications, the appropriate grinding material can be selected according to the grinding requirements. The shape of the grinding disc can be flat or has grooves or protrusions of a specific shape to adapt to different types of samples 5.

[0035] A sample-grabbing robotic arm 30 is mounted on a base 10 and includes a first robotic arm and a first support 301. The first support 301 is mounted on the base 10 and provides support for the first robotic arm. The first robotic arm includes a first telescopic component 302 and a first rotating component 303. The first rotating component 303 is mounted on the first support 301 and enables the first robotic arm to rotate horizontally and move vertically. The first telescopic component 302 has a horizontal telescopic function to adjust the horizontal length of the first robotic arm. The first telescopic component 302 is connected to the first rotating component 303 for adjusting the horizontal length of the first robotic arm.

[0036] The sample gripping device 60 is located at one end of the first robotic arm and is used to grip the sample 5. Specifically, the sample gripping device 60 is located at the end of the first telescopic component 302 away from the first rotating component 303.

[0037] In one embodiment, the sample gripping device 60 can grip in the form of vacuum suction, electrostatic adsorption, pneumatic fingers, mechanical claws or flexible clamps. In practical applications, the appropriate gripping method can be selected according to the material and characteristics of the sample 5, the operational requirements and the adaptability to environmental conditions.

[0038] The first optical detector 401 is used to detect the grinding condition of the sample 5 in the first direction X. In one embodiment, the first direction may be a direction parallel to the plane of the grinding disk. The second optical detector 402 is used to detect the grinding condition of the sample 5 in the second direction Y. In one embodiment, the second direction may be a direction perpendicular to the plane of the grinding disk.

[0039] In one embodiment, a first optical detector 401 is mounted on an optical detection robotic arm 50. The optical detection robotic arm 50 has a second robotic arm and a second support 501. The second support 501 is mounted on a base 10 and provides support for the second robotic arm. The second robotic arm includes a second telescopic component 502 and a second rotating component 503. The second rotating component 503 of the second robotic arm is mounted on the second support 501 and enables the second robotic arm to rotate horizontally and move vertically to adjust the relative position of the first optical detector 401 and the sample 5. The second telescopic component 502 has a horizontal telescopic function and is connected to the second rotating component 503 to adjust the horizontal length of the second robotic arm so as to adjust the relative position of the first optical detector 401 and the sample 5 in the horizontal direction. Specifically, the first optical detector 401 is located at the end of the second telescopic component 502 away from the second rotating component 503. The second optical detector 402 is mounted on the base 10 and, by aligning with the sample 5, is used to detect the grinding condition of the sample 5 in the direction perpendicular to the grinding disc plane.

[0040] In this application, a first optical detector 401 and a second optical detector 402 are used to detect the grinding of the sample 5 in the first direction X and the second direction Y, respectively, to ensure more accurate grinding. For example, if it is detected that the sample 5 is not placed horizontally in the encapsulating resin, or that the sample 5 is tilted due to uneven force during grinding, the sample gripping device 60 is adjusted to keep the sample 5 horizontal.

[0041] The nozzles include a polishing slurry nozzle 701 and a cleaning slurry nozzle 702. The polishing slurry nozzle 701, mounted on the base 10, is used to spray polishing slurry onto the grinding disc and the surface of the sample 5. The polishing slurry nozzle 701 can be connected to a storage tank and controlled by a pump and piping system. During the grinding process, the polishing slurry is evenly sprayed onto the grinding disc and the surface of the sample 5 through the polishing slurry nozzle 701. The cleaning slurry nozzle 702, mounted on the base 10, is used to spray cleaning slurry after grinding to remove residues generated during the grinding process. The cleaning slurry nozzle 702 can also be connected to a storage tank and controlled by a pump and piping system.

[0042] The control device 80 is electrically connected to the grinding device 20, the sample gripping robotic arm 30, the first optical detector 401, the second optical detector 402, the optical detection robotic arm 50, the sample gripping device 60, the polishing liquid nozzle 701, and the cleaning liquid nozzle 702.

[0043] The control device 80 includes a PLC controller, a control circuit, and an input device. The control circuit, PLC controller, and input device are electrically connected to each other. The control device 80 is used to control the operation of the entire system, including the rotation speed of the grinding disc, the movement of the robotic arm, the spraying of polishing and cleaning fluids, and the data acquisition and processing of the optical detector. The control device 80 can achieve automated operation and make real-time adjustments based on the detection results.

[0044] When the automatic grinding system of this application is in operation, the control device 80 is activated to perform a system self-check to ensure that all components are working properly. The supply of polishing slurry and cleaning fluid is checked to ensure that there is sufficient liquid in the storage tank. The sample gripping robotic arm 30 grips the sample 5 to be ground from the sample holder. The position of the first robotic arm is adjusted to place the sample 5 on the grinding disc, aligning it with the grinding area. The grinding disc is started and rotated. The position of the first robotic arm is adjusted to ensure that the sample 5 is in contact with the grinding disc and grinding begins. An appropriate amount of polishing slurry is sprayed onto the grinding disc and the surface of the sample 5 through the polishing slurry nozzle 701. During the grinding process, the first optical detector 401 and the second optical detector 402 detect the grinding status of the sample 5 in different directions, respectively. The detection data is processed by the control device 80 to determine whether the grinding standard has been met. After grinding, cleaning fluid is sprayed onto the surface of the sample 5 through the cleaning fluid nozzle 702 to remove residual polishing slurry and particles, and the first robotic arm is used to place the cleaned sample 5 in the designated position.

[0045] As described above, these embodiments of the present application do not exhaustively cover all details, nor do they limit the invention to the specific embodiments described. Clearly, many modifications and variations can be made based on the above description. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the present application, thereby enabling those skilled in the art to make good use of the present application and modifications based on it. The present application is limited only by the claims and their full scope and equivalents.

Claims

1. An automatic grinding system, characterized in that, include: Base; A grinding device, disposed in the base, is used for grinding samples; A sample grasping robotic arm has a first support and a first robotic arm, wherein the sample grasping robotic arm is disposed on the base; A sample gripping device is mounted on the sample gripping robotic arm for gripping the sample; An optical inspection robotic arm is mounted on the base; A first optical detector and a second optical detector, wherein the first optical detector is disposed on the optical detection robotic arm and the second optical detector is disposed on the base; A polishing fluid nozzle, mounted on the base, is used to spray polishing fluid and cleaning fluid. A cleaning fluid nozzle is mounted on the base and is used to spray cleaning fluid. The device includes a control unit electrically connected to the grinding device, the sample gripping robotic arm, the sample gripping device, the polishing slurry nozzle, the cleaning slurry nozzle, the first optical detector, and the second optical detector.

2. The automatic grinding system according to claim 1, characterized in that, The sample-grabbing robotic arm includes: The first bracket is disposed on the base; The first robotic arm is mounted on the first support.

3. The automatic grinding system according to claim 2, characterized in that, The first robotic arm has a first rotating component and a first telescopic component. The first rotating component is disposed on the first support and is used to adjust the horizontal rotation and vertical lifting of the first robotic arm. The first telescopic component is connected to the first rotating component and is used to adjust the horizontal length of the first robotic arm. The sample gripping device is disposed at the end of the first telescopic component away from the first rotating component.

4. The automatic grinding system according to claim 1, characterized in that, The first optical detector is used to detect the grinding process of the sample in the direction parallel to the grinding disk plane.

5. The automatic grinding system according to claim 1, characterized in that, The second optical detector is used to detect the grinding process of the sample in the direction perpendicular to the grinding disc plane.

6. The automatic grinding system according to claim 1, characterized in that, The optical inspection robotic arm includes: The second bracket is mounted on the base; The second robotic arm is mounted on the second support.

7. The automatic grinding system according to claim 6, characterized in that, The second robotic arm has a second rotating component and a second telescopic component. The second rotating component is mounted on the second support and is used to adjust the horizontal rotation and vertical lifting of the second robotic arm. The second telescopic component is connected to the second rotating component and is used to adjust the horizontal length of the second robotic arm. The first optical detector is located at the end of the second telescopic component away from the second rotating component.

8. The automatic grinding system according to claim 1, characterized in that, The control device includes a PLC controller, control circuitry, and input devices.

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