Supply device and chemical mechanical polishing equipment

Abstract

The utility model discloses a supply device and chemical mechanical grinding equipment. The supply device comprises a supporting arm, a supply pipe used for providing grinding liquid and an adapter detachably assembled on the supporting arm. Wherein the adapter is provided with a liquid inlet and a plurality of liquid outlet holes, the liquid inlet is connected with the supply pipe, the liquid outlet holes are communicated with the liquid inlet, and the liquid outlet holes are used for facing a grinding pad of the chemical mechanical grinding equipment, so that grinding liquid flowing in from the liquid inlet falls on the grinding pad after flowing out from the plurality of liquid outlet holes. The uniformity of the grinding liquid dispersed on the grinding pad is improved; and when the grinding liquid crystals occur in the adapter, the adapter can be detached, so that the adapter is convenient to clean.

Description

Technical Field

[0001] This application relates to the semiconductor field, and more specifically to a supply device and a chemical mechanical polishing apparatus. Background Technology

[0002] Chemical mechanical polishing (CPM) is used in many steps of semiconductor fabrication to planarize the surface of wafers. During CPM, an polishing slurry is used. This slurry is evenly distributed on the polishing pad under the action of rotation and centrifugal force, forming a thin liquid film between the wafer and the pad.

[0003] In related technologies, the polishing slurry in the polishing slurry supply pipe flows out through the outlet end of the polishing slurry supply pipe and falls directly onto the polishing pad to form a liquid film on the polishing pad.

[0004] However, in related technologies, the polishing slurry on the polishing pad is not evenly distributed, and when polishing slurry crystals block the outlet end of the polishing slurry supply pipe, it is not easy to clean. Utility Model Content

[0005] This application is made to address the aforementioned problems. According to one aspect of this application, a supply device is provided for use in a chemical mechanical polishing (CMP) apparatus. The supply device includes: a support arm, a supply pipe for supplying polishing fluid, and an adapter detachably mounted on the support arm. The adapter has an inlet and multiple outlet holes. The inlet is connected to the supply pipe, and the outlet holes are connected to the inlet. The outlet holes are directed toward the polishing pad of the CMP apparatus so that the polishing fluid flowing in from the inlet flows out through the multiple outlet holes and falls onto the polishing pad.

[0006] In some embodiments of this application, a plurality of liquid outlet holes are arranged at intervals in the adapter along a set direction; and the adapter can rotate about the vertical axis of the adapter.

[0007] In some embodiments of this application, the adapter has a rotating part, a receiving groove is provided in the support arm, the rotating part is rotatably assembled in the receiving groove, and the axis of the rotating part is arranged in the vertical direction.

[0008] In some embodiments of this application, the rotating part has a circular cross-sectional shape parallel to the polishing pad, and the receiving groove has a circular cross-sectional shape parallel to the polishing pad.

[0009] In some embodiments of this application, the rotating part includes a first rotating part and a second rotating part arranged sequentially from near the polishing pad to away from the polishing pad, wherein the cross-sectional dimension of the first rotating part parallel to the polishing pad is smaller than the cross-sectional dimension of the second rotating part parallel to the polishing pad.

[0010] The support arm has a first surface and a second surface facing each other, with the first surface facing the grinding pad; the receiving groove includes a first receiving groove extending into the support arm through the first surface, and a second receiving groove extending into the support arm through the second surface and communicating with the first receiving groove; the cross-sectional dimension of the first receiving groove parallel to the grinding pad is smaller than the cross-sectional dimension of the second receiving groove parallel to the grinding pad.

[0011] The first rotating part is rotatably assembled in the first receiving groove, and the second rotating part is rotatably assembled in the second receiving groove.

[0012] In some embodiments of this application, the support arm includes:

[0013] The main body and adapter are detachably assembled within the main body;

[0014] The fastening block is detachably mounted on the main body, and when mounted on the main body, it locks the adapter into the main body.

[0015] In some embodiments of this application, the adapter includes a rotating part, and the fastening block and the body together form a receiving groove for accommodating the rotating part; when the fastening block is assembled on the body, the fastening block locks the rotating part in the receiving groove.

[0016] In some embodiments of this application, the adapter is provided with a cavity communicating with the liquid outlet and a liquid inlet pipe communicating with the cavity. The opening of the liquid inlet pipe extending to the surface of the adapter constitutes a liquid inlet. The liquid inlet pipe is provided with a protrusion at a position away from the liquid inlet. The supply pipe can extend into the liquid inlet pipe and abut against the protrusion. And / or, there is an interference fit between the supply pipe and the liquid inlet pipe.

[0017] In some embodiments of this application, the inlet pipe is arranged along the vertical axis of the adapter, and the inlet is located on the surface of the adapter facing away from the grinding pad; and / or, the surface of the adapter facing the grinding pad is a circular surface, and a plurality of outlet holes are spaced apart along the diameter of the circular surface and extend to the circular surface.

[0018] According to a second aspect of this application, a chemical mechanical polishing apparatus is also provided, comprising: a rotatable polishing table, a polishing pad disposed on the polishing table, a polishing head located above the polishing pad and used to press a wafer against the polishing pad, and any one of the above-mentioned supply devices.

[0019] According to the supply device and chemical mechanical polishing (CMP) equipment provided in the embodiments of this application, by providing an adapter detachably mounted on the support arm, the inlet of the adapter is connected to the supply pipe, and multiple outlet holes of the adapter are connected to the inlet and face the polishing pad of the CMP equipment, so that the polishing liquid flowing in from the inlet flows out through multiple outlet holes and falls onto the polishing pad, thereby forming multiple initial landing points of polishing liquid on the polishing pad. Compared with the scheme of a single initial landing point of polishing liquid, this is beneficial to the uniform distribution of polishing liquid on the polishing pad and improves the uniformity of polishing liquid dispersion on the polishing pad. Furthermore, since the adapter is detachably mounted on the support arm, when polishing liquid crystallizes at the adapter, the adapter can be removed for easy cleaning. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a cross-sectional structural schematic diagram of a supply device according to an embodiment of this application;

[0022] Figure 2 This is a cross-sectional view of the connection between the adapter and the supply pipe according to an embodiment of this application;

[0023] Figures 3 to 4 These are cross-sectional structural diagrams showing the adapter and the liquid outlet end of the supply pipe assembled together and disassembled, respectively, according to an embodiment of this application.

[0024] Figure 5 This is a cross-sectional view of the first rotating part according to an embodiment of this application;

[0025] Figure 6 and Figure 7 These are, respectively, a top view of the adapter at a rotation angle as shown in an embodiment of this application, and a corresponding schematic diagram of the polishing fluid flow field;

[0026] Figure 8 This is a top view schematic diagram showing the adapter at another rotation angle according to an embodiment of this application;

[0027] Figure 9 This is a top view schematic diagram of a support arm according to an embodiment of this application;

[0028] Figure 10 This is a three-dimensional structural schematic diagram of a support arm according to an embodiment of this application;

[0029] Figure 11 and Figure 12 These are three-dimensional structural diagrams of the support arm body and the fastening block, respectively, according to an embodiment of this application.

[0030] Figure label:

[0031] 10-Grinding pad 20-Support arm

[0032] 21-Body 22-Fasting Block

[0033] 23-Securing screw 24-Receiving groove

[0034] 241-First receiving tank 242-Second receiving tank

[0035] 30-Adapter 31-Inlet

[0036] 32-Liquid outlet hole; 33-Cavity

[0037] 34-Rotating part 341-First rotating part

[0038] 342-Second rotating part; 36-Protrusion.

[0039] 37-Inlet pipe 40-Supply pipe

[0040] 50-Grinding head Detailed Implementation

[0041] To make the objectives, technical solutions, and advantages of this application more apparent, exemplary embodiments according to this application will be described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are merely some embodiments of this application, and not all embodiments of this application. It should be understood that this application is not limited to the exemplary embodiments described herein. Based on the embodiments of this application described herein, all other embodiments obtained by those skilled in the art without inventive effort should fall within the protection scope of this application.

[0042] The following description provides numerous specific details to offer a more thorough understanding of this application. However, it will be apparent to those skilled in the art that this application can be practiced without one or more of these details. In other instances, certain technical features well-known in the art have not been described to avoid confusion with this application.

[0043] It should be understood that this application can be implemented in various forms and should not be construed as being limited to the embodiments set forth herein. Rather, providing these embodiments will make the disclosure thorough and complete, and will fully convey the scope of this application to those skilled in the art.

[0044] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of this application. When used herein, the singular forms “a,” “an,” and “the” are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising” and / or “including,” when used in this specification, confirm the presence of the stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups. When used herein, the term “and / or” includes any and all combinations of the associated listed items.

[0045] To fully understand this application, a detailed structure will be presented in the following description to illustrate the technical solution proposed in this application. Optional embodiments of this application are described in detail below; however, in addition to these detailed descriptions, this application may have other implementation methods.

[0046] Chemical mechanical polishing (CMP) works by using pressure and polishing fluid to make the wafer being polished move relative to the polishing pad, thereby achieving a high degree of flatness on the wafer surface.

[0047] In chemical mechanical polishing (CMP), the uniform distribution of the polishing slurry is influenced to some extent by factors such as the rotational speed of the polishing pad, the initial landing point of the slurry, and the number of slurries. Different initial landing points of the slurries result in varying flow field distributions that affect the morphology of the polished wafer. How to better guide the polishing slurry into the polishing head, especially to the center of the wafer within the polishing head, is a key factor affecting the uniformity of wafer polishing.

[0048] In related technologies, the slurry supply pipe is fixed to the slurry support arm, with the outlet end of the pipe facing the polishing pad. This causes the slurry flowing from the outlet to land directly on the pad with a single initial landing point. This results in the slurry pooling on the pad. As the slurry flows from the pad into the polishing head along the grooves, it is easily carried away by the retaining ring on the polishing head, leading to loss. In other words, the flow field width at the initial landing point of the slurry is small, resulting in significant loss during entry into the polishing head. This often makes it difficult to adjust the polishing rate at the wafer center. Specifically, the amount of slurry at the wafer center is less than at the wafer edge, leading to a lower polishing rate and potentially causing a "grinding dead zone" at the wafer center.

[0049] To address at least some of the technical problems in the aforementioned related technologies, this application proposes the following embodiments.

[0050] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0051] First, let me introduce the application scenario of the supply device illustrated in this application. The supply device is used in chemical mechanical grinding equipment to deliver grinding fluid to the grinding pad of the chemical mechanical grinding equipment.

[0052] refer to Figure 1 , Figure 2 and Figure 7 This application provides a supply device, which includes: a support arm 20, a supply pipe 40 for providing grinding fluid, and an adapter 30 detachably mounted on the support arm 20; wherein the adapter 30 has a liquid inlet 31 and a plurality of liquid outlet holes 32, the liquid inlet 31 is connected to the supply pipe 40, the liquid outlet holes 32 are connected to the liquid inlet 31, and the liquid outlet holes 32 are directed toward the grinding pad 10 of the chemical mechanical polishing equipment, so that the grinding fluid flowing in from the liquid inlet 31 flows out through the plurality of liquid outlet holes 32 and falls onto the grinding pad 10.

[0053] The above embodiments have the following beneficial effects: By setting an adapter 30 detachably mounted on the support arm 20, the liquid inlet 31 of the adapter 30 is connected to the supply pipe 40, and the multiple liquid outlet holes 32 of the adapter 30 are connected to the liquid inlet 31 and face the polishing pad 10 of the chemical mechanical polishing equipment, so that the polishing liquid flowing in from the liquid inlet 31 flows out through the multiple liquid outlet holes 32 and falls on the polishing pad 10, thereby forming multiple initial landing points of polishing liquid on the polishing pad 10, so that the polishing liquid flowing out from the adapter 30 falls on the polishing pad 10 in a water curtain shape. Compared with the scheme of a single initial landing point of polishing liquid, it is beneficial to evenly distribute the polishing liquid on the polishing pad 10, improve the uniformity of the polishing liquid dispersion on the polishing pad 10, and facilitate the polishing liquid to enter the polishing head 50 better, more evenly and more, thereby reducing the amount of polishing liquid lost and improving the phenomenon of "ungrindable" wafer center position. Furthermore, since the adapter 30 is detachably mounted on the support arm 20, when the grinding fluid crystallizes on the adapter 30, the adapter 30 can be removed for easy cleaning.

[0054] The following section provides a detailed description of each of the above structures in conjunction with the accompanying drawings.

[0055] For example, refer to Figure 2 , Figure 3 , Figure 4 and Figure 5 Multiple liquid outlet holes 32 are arranged at intervals along a predetermined direction in the adapter 30. (Reference) Figure 6 and Figure 7Furthermore, the adapter 30 can rotate about its own vertical axis. By arranging multiple liquid outlet holes 32 in the adapter 30 along a set direction, and by allowing the adapter 30 to rotate about its own vertical axis, the width of the water curtain-like grinding fluid flow field can be adjusted by rotating the adapter 30 during application, thereby changing the different initial landing points of the grinding fluid.

[0056] For example, by rotating the adapter 30, the arrangement direction of the multiple liquid outlet holes 32 on the adapter 30 can be made parallel to the radial direction of the polishing pad 10, thereby maximizing the width of the water curtain-like polishing slurry flow field, which is beneficial for the uniform distribution of polishing slurry on the polishing pad 10 and improves the uniformity of polishing slurry dispersion on the polishing pad 10. Alternatively, by rotating the adapter 30, the arrangement direction of the multiple liquid outlet holes 32 on the adapter 30 can be made perpendicular to the radial direction of the polishing pad 10, thereby minimizing the width of the water curtain-like polishing slurry flow field. Thus, the adapter 30 can be rotated according to different process requirements to adjust different initial landing points and polishing slurry flow field widths.

[0057] It should be noted that the number of liquid outlet holes 32, the spacing between the liquid outlet holes 32, and the size of the liquid outlet holes 32 on the adapter 30 can be adjusted according to actual needs.

[0058] There are several ways to set up adapter 30. Some methods are illustrated below.

[0059] For example, the adapter 30 has a rotating part 34, and a receiving groove 24 is provided in the support arm 20. The rotating part 34 is rotatably mounted in the receiving groove 24, and the axis of the rotating part 34 is arranged in the vertical direction. By providing a rotating part 34 on the adapter 30 and rotatably mounting the rotating part 34 in the receiving groove 24 extending in the vertical direction, it is convenient to realize the rotation of the adapter 30 relative to its own axis in the vertical direction to adjust the different initial landing points of the polishing slurry, thereby adjusting the width of the water curtain-like polishing slurry flow field.

[0060] There are various ways to arrange the rotating part 34 and the receiving groove 24. Some of these methods are described below as examples.

[0061] For example, the rotating part 34 has a circular cross-sectional shape parallel to the polishing pad 10, and the receiving groove 24 has a circular cross-sectional shape parallel to the polishing pad 10. That is, both the rotating part 34 and the receiving groove 24 have circular cross-sectional shapes, so the rotating part 34 can be directly placed in the receiving groove 24, thereby realizing the rotation of the rotating part 34 in the receiving groove 24, thus simplifying the implementation of the rotatable rotating part 34.

[0062] Of course, in other embodiments, the cross-sectional shapes of the rotating part 34 and the receiving groove 24 can be set to other non-circular shapes, and then the rotating part 34 can be rotated in the receiving groove 24 by means of a device such as, but not limited to, bearings.

[0063] It should be noted that there can be one or more rotating parts 34 and receiving grooves 24. The rotating parts 34 and receiving grooves 24 are arranged in a one-to-one correspondence, and each rotating part 34 is rotatably assembled in the corresponding receiving groove 24.

[0064] For example, the rotating part 34 may include a first rotating part 341 and a second rotating part 342 arranged sequentially from near the polishing pad 10 to away from the polishing pad 10, wherein the cross-sectional dimension of the first rotating part 341 parallel to the polishing pad 10 is smaller than the cross-sectional dimension of the second rotating part 342 parallel to the polishing pad 10. The support arm 20 has opposing first and second surfaces, the first surface being disposed facing the polishing pad 10; the receiving groove 24 includes a first receiving groove 241 extending into the support arm 20 to the first surface, and a second receiving groove 242 extending into the support arm 20 to the second surface and communicating with the first receiving groove 241; the cross-sectional dimension of the first receiving groove 241 parallel to the polishing pad 10 is smaller than the cross-sectional dimension of the second receiving groove 242 parallel to the polishing pad 10; wherein the first rotating part 341 is rotatably mounted in the first receiving groove 241, and the second rotating part 342 is rotatably mounted in the second receiving groove 242.

[0065] Specifically, there are two rotating parts 34, and the two rotating parts 34 are arranged sequentially from the direction closer to the grinding pad 10 to the direction farther away from the grinding pad 10. The cross-sectional dimension of the first rotating part 341 closer to the grinding pad 10 is smaller than the cross-sectional dimension of the second rotating part 342 farther away from the grinding pad 10, so that the upper end of the adapter 30 is larger and the lower end is smaller, thereby forming a step between the first rotating part 341 and the second rotating part 342.

[0066] Correspondingly, the support arm 20 also has two receiving grooves 24. The first receiving groove 241 extends into the support arm 20 from its first surface facing the grinding pad 10, while the second receiving groove 242 extends into the support arm 20 from its second surface and communicates with the first receiving groove 241. The cross-sectional dimension of the first receiving groove 241 is smaller than that of the second receiving groove 242, thus forming a supporting step between the two grooves. During the assembly of the rotating part 34 of the adapter 30 into the corresponding receiving groove 24, the adapter 30 can be placed downwards through the second receiving groove 242, allowing the first rotating part 341 to rotate and be assembled into the first receiving groove 241, and the second rotating part 342 to rotate and be assembled into the second receiving groove 242, simplifying the assembly and disassembly of the adapter 30. Furthermore, when the adapter 30 is assembled onto the support arm 20, the step between the two rotating parts 34 abuts against the step between the two receiving grooves 24, thus supporting the adapter 30.

[0067] For example, the first rotating part 341 and the second rotating part 342 are arranged sequentially in the vertical direction, and the first rotating part 341 can be disc-shaped, and the second rotating part 342 can also be disc-shaped. In some embodiments, the first rotating part 341 and the second rotating part 342 can also be arranged concentrically. Thus, when the adapter 30 rotates, the adapter 30 can rotate about its own axis in the vertical direction, which facilitates the rotatable assembly of the adapter 30 into the support arm 20.

[0068] For example, refer to Figure 1 , Figure 9 and Figure 11 The support arm 20 has opposing first and second surfaces, with the first surface facing the grinding pad 10. The support arm 20 has a first receiving groove 241 and a second receiving groove 242 that communicate with each other from top to bottom. Exemplarily, both the first receiving groove 241 and the second receiving groove 242 have circular cross-sectional shapes and are concentrically arranged. The diameter of the first receiving groove 241 is smaller than the diameter of the second receiving groove 242. The lower opening of the first receiving groove 241 is located on the first surface, and the upper opening of the second receiving groove 242 is located on the second surface. The first rotating part 341 is rotatably mounted within the first receiving groove 241, and the second rotating part 342 is rotatably mounted within the second receiving groove 242.

[0069] Of course, in other embodiments, the first rotating part 341 and the second rotating part 342 can also be arranged in a non-concentric manner. In this case, the first receiving groove 241 and the second receiving groove 242 can also be arranged in a non-concentric manner. It is just that the size of the receiving groove 24 corresponding to one of the rotating parts 34 is larger, so that when one rotating part 34 rotates, it drives the other rotating part 34 to rotate in its corresponding receiving groove 24 without interference.

[0070] It should be understood that the adapter 30 can be rotated in various ways, and is not limited to the methods shown above.

[0071] There are various ways to implement the detachable mounting of the adapter 30 onto the support arm 20, and some of these methods are described below as examples.

[0072] For example, refer to Figures 9-12 The support arm 20 may include a body 21 and a fastening block 22. The adapter 30 is detachably mounted in the body 21. The fastening block 22 is detachably mounted on the body 21, and when mounted on the body 21, the fastening block 22 locks the adapter 30 in the body 21. By using the support arm 20 composed of the body 21 and the fastening block 22, it is convenient for the fastening block 22 to lock the adapter 30 in the body 21.

[0073] There are several ways to set up the body 21 and the fastening block 22. Some of these methods are illustrated below.

[0074] For example, the adapter 30 includes a rotating part 34, and the fastening block 22 and the body 21 together form a receiving groove 24 for accommodating the rotating part 34. When the fastening block 22 is assembled on the body 21, the fastening block 22 locks the rotating part 34 in the receiving groove 24. By having part of the groove wall of the receiving groove 24 disposed on the body 21 and part of the groove wall disposed on the fastening block 22, the body 21 and the fastening block 22 together form a receiving groove 24 for accommodating the rotating part 34, thereby increasing the contact area between the fastening block 22 and the rotating part 34, making it easier for the fastening block 22 to lock the rotating part 34 in the receiving groove 24 by means of interference fit or other methods.

[0075] For example, the support arm 20 is provided with a first receiving groove 241 and a second receiving groove 242, and the adapter 30 has a first rotating part 341 and a second rotating part 342. The first receiving groove 241 can be located within the body 21, and a portion of the groove wall of the second receiving groove 242 is located within the body 21, while a portion of the groove wall is located within the fastening block 22. The body 21 has a notch at the end of the second receiving groove 242, at least partially exposing the second receiving groove 242. The fastening block 22 is detachably fitted to the notch of the body 21; and when fitted to the notch of the body 21, the fastening block 22 can lock the second rotating part 342 within the second receiving groove 242. In this manner, when the fastening block 22 is removed, a portion of the structure of the first rotating part 341 can be exposed, facilitating the removal of the adapter 30 from the body 21.

[0076] For example, refer to Figure 9 , Figure 10 and Figure 12The fastening block 22 can be detachably mounted on the body 21 using the locking screw 23, and the extension direction of the locking screw 23 is parallel to the extension direction of the support arm 20. By using the locking screw 23 to detachably mount the fastening block 22 on the body 21, the second rotating part 342 can be locked in the second receiving groove 242 by tightening the locking screw 23, and the locking block 22 can be released from locking the second rotating part 342 by loosening the locking screw 23, so as to facilitate rotating the adapter 30 to adjust the initial landing point position and flow field width of the grinding fluid in the liquid outlet 32 ​​on the adapter 30.

[0077] For example, refer to Figure 10 and Figure 12 A through hole (not shown in the figure) can be provided on the fastening block 22. The extension direction of the through hole is parallel to the extension direction of the support arm 20. The locking screw 23 passes through the through hole and is threaded onto the body 21, thereby realizing that the fastening block 22 can be detachably assembled onto the body 21.

[0078] For example, the extension direction of the aforementioned through hole can also be perpendicular to the surface direction of the grinding pad 10, in which case the extension direction of the locking screw 23 is perpendicular to the surface direction of the grinding pad 10.

[0079] For example, the adapter 30 is provided with a cavity 33 communicating with the liquid outlet 32 ​​and a liquid inlet pipe 37 communicating with the cavity 33. The opening of the liquid inlet pipe 37 extending to the surface of the adapter 30 constitutes a liquid inlet 31. The liquid inlet pipe 37 is provided with a protrusion 36 at a position away from the liquid inlet 31. The supply pipe 40 can extend into the liquid inlet pipe 37 and abut against the protrusion 36.

[0080] By providing a cavity 33 and an inlet pipe 37 in the adapter 30, and providing a protrusion 36 at a position of the inlet pipe 37 away from the inlet port 31, the supply pipe 40 can extend into the inlet pipe 37 and abut against the protrusion 36, so that the protrusion 36 can limit the supply pipe 40 and prevent the supply pipe 40 from extending into the cavity 33, thereby posing a risk of contaminating the grinding fluid.

[0081] Furthermore, since a cavity 33 connecting the liquid inlet pipe 37 and the liquid outlet hole 32 is also provided, a control strategy can be set according to the actual situation during application. Before grinding, the grinding slurry is pre-flowed into the cavity 33 of the adapter 30 until the flow rate of the grinding slurry flowing out of the liquid outlet of the grinding slurry supply end 40 reaches the set value before the wafer is ground. This is to facilitate the control of the uniform flow supply of the grinding slurry and to facilitate the uniform dispersion of the grinding slurry on the grinding pad 10.

[0082] For example, refer to Figure 4 and Figure 5The cavity 33 can be cubic in shape. Of course, other shapes can also be used in other embodiments.

[0083] For example, refer to Figure 3 and Figure 4 The inlet pipe 37 has a protrusion 36 near the cavity 33. The supply pipe 40 can extend into the inlet pipe 37 and abut against the protrusion 36, thereby locking the inlet pipe 37 with the protrusion 36 to achieve a reliable sealed connection between the supply pipe 40 and the inlet pipe 37. Furthermore, the protrusion 36 can prevent the supply pipe 40 from extending into the cavity 33, thus preventing the risk of contaminating the grinding fluid.

[0084] For example, the inner diameter of the protrusion 36 is equal to the inner diameter of the supply pipe 40. By making the inner diameter of the protrusion 36 equal to the inner diameter of the supply pipe 40, the supply pipe 40 extends into the inlet 31 and abuts against the protrusion 36, facilitating an interference fit between the supply pipe 40 and the protrusion 36, thereby improving the secure connection between the protrusion 36 and the supply pipe 40. Furthermore, this ensures that the cross-sectional shape and area of ​​the flow channel between the supply pipe 40 and the cavity 33 of the adapter 30 remain unchanged, allowing the grinding fluid to flow smoothly into the cavity 33 after exiting the supply pipe 40, reducing the flow resistance of the grinding fluid.

[0085] For example, the grinding fluid supply pipe 40 and the liquid inlet pipe 37 can be interference-fitted to prevent the grinding fluid flowing out of the supply pipe 40 from leaking out through the gap between the supply pipe 40 and the liquid inlet pipe 37, and also to facilitate the reliable and stable assembly of the supply pipe 40 in the liquid inlet pipe 37.

[0086] Of course, other methods can be used to seal the connection between the grinding fluid supply pipe 40 and the inlet pipe 37.

[0087] For example, refer to Figure 2 , Figure 3 and Figure 4 The inlet pipe 37 is arranged along the vertical axis of the adapter 30, and the inlet 31 is located on the surface of the adapter 30 away from the grinding pad 10. Thus, during the rotation of the adapter 30 about its vertical axis, the position of the portion of the supply pipe 40 located in the inlet pipe 37 does not need to change, which facilitates the rotation of the adapter 30.

[0088] For example, refer to Figure 2 , Figure 3 and Figure 4 The liquid inlet pipe 37 can be arranged along the axis of the second rotating part 342, and the liquid inlet 31 can be located at the center of the second rotating part 342.

[0089] For example, refer to Figure 2 , Figure 3 , Figure 4 and Figure 5 The surface of the adapter 30 facing the grinding pad 10 is circular, and multiple liquid outlet holes 32 are spaced apart along the diameter of the circular surface and extend onto it. In other words, the surface of the adapter 30 facing the grinding pad 10 is circular, and multiple liquid outlet holes 32 are spaced apart along the diameter of this circular surface and extend onto it, forming the outlet of each liquid outlet hole. Since the diameter of the circular surface is the longest straight line on it, arranging the multiple liquid outlet holes 32 spaced apart along the diameter of the circular surface helps to increase the distance between the liquid outlet holes 32 at both ends, thereby increasing the flow field width at the initial landing point of the grinding fluid.

[0090] For example, refer to Figure 2 , Figure 3 , Figure 4 and Figure 5 The surface of the first rotating part 341 facing the grinding pad 10 forms the circular surface, and a plurality of liquid outlet holes 32 are arranged at intervals in the first rotating part 341 along the diameter direction of the circular surface and extend to the circular surface.

[0091] For example, refer to Figure 1 , Figure 2 , Figures 9-11 The locking screw 23 can be loosened. After the locking screw 23 is loosened, the fastening block 22 releases the locking of the second rotating part 342, and the adapter 30 can be removed from the support arm 20. Of course, after the locking screw 23 is loosened, the adapter 30 can also be manually rotated to adjust the angle of the adapter 30, thereby adjusting parameters such as the angle, position, and flow field width of the initial landing point of the grinding fluid.

[0092] For example, refer to Figure 3 and Figure 4 The supply pipe 40 is inserted into the liquid inlet pipe 37 of the adapter 30, and the liquid inlet pipe 37 is provided with a protrusion 36 near the cavity 33. The inner diameter of the protrusion 36 is d1, and the inner diameter of the supply pipe 40 is d2. d1 = d2 can be set. When the supply pipe 40 abuts against the protruding retaining ring 36, the supply pipe 40 can be locked in place, and the cross-sectional area at the connection between the supply pipe 40 and the cavity 33 does not change, thereby reducing flow resistance.

[0093] For example, refer to Figure 3 and Figure 4After the polishing slurry begins to flow from the supply pipe 40, assuming the polishing slurry flow rate at the inlet 31 of the adapter 30 is set to q1, and the adapter 30 has 5 outlet holes 32 with a polishing slurry flow rate of q2 for each outlet hole 32, when the cavity 33 inside the adapter 30 is not filled with polishing slurry, 5q2 < q1. When the cavity 33 inside the adapter 30 is filled with polishing slurry, 5q2 = q1.

[0094] When the cavity 33 inside the adapter 30 is not filled with polishing fluid, the flow rate of polishing fluid at each outlet 32 ​​is... Grinding fluid flow rate per outlet 32 Wherein, the diameter of the liquid outlet 32 ​​is d3, and the number of liquid outlets 32 is assumed to be a, then the total flow rate of all liquid outlets 32 is a*q2.

[0095] Assuming the cavity 33 inside the adapter 30 is cubic in shape, refer to... Figure 4 and Figure 5 Given a cavity with length y, width x, and height h, the volume of cavity 33 that the grinding fluid needs to fill. Where t represents the time required for the grinding fluid to fill cavity 33, and a = 5 is assumed.

[0096] During the grinding operation, a pre-flow strategy for grinding fluid can be set according to the actual situation. Before grinding, the grinding fluid is pre-flowed until the flow rate of the grinding fluid in the outlet hole 32 reaches the set value before grinding, so as to ensure that the grinding fluid is evenly distributed on the grinding pad 10 when grinding begins.

[0097] In addition, this application embodiment also provides a chemical mechanical polishing apparatus, which includes: a rotatable polishing table, a polishing pad disposed on the polishing table, a polishing head located above the polishing pad and used to press the wafer against the polishing pad, and any one of the above-mentioned supply devices.

[0098] For example, a chemical mechanical grinding apparatus may also include a grinding pad dresser for dressing the grinding pad to maintain its grinding capability in good condition.

[0099] This application has been described through the above embodiments. However, it should be understood that the above embodiments are for illustrative purposes only and are not intended to limit this application to the scope of the described embodiments. Furthermore, those skilled in the art will understand that this application is not limited to the above embodiments, and many more variations and modifications can be made based on the teachings of this application, all of which fall within the scope of protection claimed in this application. The scope of protection of this application is defined by the appended claims and their equivalents.

Claims

1. A supply device for use in chemical mechanical grinding equipment, characterized in that, include: Support arm; Supply pipe for providing grinding fluid; An adapter that can be detachably mounted on the support arm; The adapter has a liquid inlet and multiple liquid outlets. The liquid inlet is connected to the supply pipe, and the liquid outlets are connected to the liquid inlet. The liquid outlets are directed toward the grinding pad of the chemical mechanical polishing equipment so that the polishing liquid flowing in from the liquid inlet flows out through the multiple liquid outlets and falls onto the grinding pad.

2. The supply device as claimed in claim 1, characterized in that, The plurality of liquid outlet holes are arranged at intervals along a predetermined direction; Furthermore, the adapter can rotate about its vertical axis.

3. The supply device as described in claim 2, characterized in that, The adapter has a rotating part, and the support arm is provided with a receiving groove. The rotating part is rotatably assembled in the receiving groove, and the axis of the rotating part is arranged in the vertical direction.

4. The supply device as described in claim 3, characterized in that, The rotating part has a circular cross-sectional shape parallel to the abrasive pad, and the receiving groove has a circular cross-sectional shape parallel to the abrasive pad.

5. The supply device as described in claim 3, characterized in that, The rotating part includes a first rotating part and a second rotating part arranged sequentially from near the abrasive pad to away from the abrasive pad, wherein the cross-sectional dimension of the first rotating part parallel to the abrasive pad is smaller than the cross-sectional dimension of the second rotating part parallel to the abrasive pad; The support arm has a first surface and a second surface facing each other, the first surface being disposed toward the abrasive pad; the receiving groove includes a first receiving groove extending into the support arm through the first surface, and a second receiving groove extending into the support arm through the second surface and communicating with the first receiving groove; the cross-sectional dimension of the first receiving groove parallel to the abrasive pad is smaller than the cross-sectional dimension of the second receiving groove parallel to the abrasive pad; The first rotating part is rotatably assembled in the first receiving groove, and the second rotating part is rotatably assembled in the second receiving groove.

6. The supply device as described in any one of claims 1-5, characterized in that, The support arm includes: The adapter is detachably assembled into the main body; A fastening block is detachably mounted on the body, and when mounted on the body, the fastening block locks the adapter in the body.

7. The supply device as claimed in claim 6, characterized in that, The adapter includes a rotating part, and the fastening block and the body together form a receiving groove for accommodating the rotating part; When the fastening block is assembled onto the body, the fastening block locks the rotating part in the receiving groove.

8. The supply device as described in any one of claims 1-5, characterized in that, The adapter is provided with a cavity communicating with the liquid outlet and a liquid inlet pipe communicating with the cavity. The liquid inlet pipe extends to the opening on the surface of the adapter to form the liquid inlet. The inlet pipe has a protrusion at a position opposite to the inlet port, and the supply pipe can extend into the inlet pipe and abut against the protrusion; and / or, The supply pipe and the liquid inlet pipe are interference-fitted.

9. The supply device as claimed in claim 8, characterized in that, The inlet pipe is arranged along the vertical axis of the adapter, and the inlet is located on the surface of the adapter opposite to the abrasive pad; and / or, The surface of the adapter facing the abrasive pad is a circular surface, and the plurality of liquid outlet holes are arranged at intervals along the diameter of the circular surface and extend to the circular surface.

10. A chemical mechanical grinding apparatus, characterized in that, include: Rotatable grinding table; A grinding pad disposed on the grinding table; A polishing head located above the polishing pad and used to press the wafer against the polishing pad; and, The supply device as described in any one of claims 1 to 9.

Images