Transfer device for high-temperature copper ingot

Abstract

The utility model provides a high temperature copper ingot transfer device which comprises a transfer trolley, four corners of the bottom of the transfer trolley are all rotatably connected with transfer rollers, the upper end of the transfer trolley is fixedly connected with a fixed side plate, the fixed side plate is arranged along the long edge of the transfer trolley, and the fixed side plate is fixedly connected with the transfer trolley. A plurality of supporting transverse plates are fixedly connected to the upper end of the transferring trolley and distributed at equal intervals in the extending direction of the long edge of the transferring trolley, a containing cavity used for containing copper ingots is formed between the fixing side plate and the supporting transverse plates, and a jacking device is arranged in the transferring trolley. The output end of the jacking device extends into the containing cavity and is used for jacking the copper ingot away from the containing cavity. The transferring device is used for transporting the copper ingots, so that the transferring process of the copper ingots is more labor-saving, and the transferring efficiency is higher.

Description

Technical Field

[0001] This utility model relates to a transfer device, and more particularly, to a transfer device for high-temperature copper ingots. Background Technology

[0002] Currently, Chinese patent CN219735990U discloses a copper ingot heating furnace, including a heating furnace. Inside the furnace, a roller is slidably mounted on its lower end. A carriage plate is fixedly connected to the upper end of the roller. A sliding strip is fixedly welded to the side of the carriage plate. The interior of the heating furnace is slidably fitted onto the outside of the sliding strip. A shaft seat is fixedly welded to the upper end of the heating furnace. A rotating shaft is slidably fitted inside the shaft seat. A door is fixedly welded to the end of the rotating shaft.

[0003] When heating copper ingots using the aforementioned copper ingot heating furnace, the first step is to control the furnace door to flip upwards and open; the second step is to control the car platform to move outwards from the furnace; the third step is to neatly stack the copper ingots on the top of the car platform; the fourth step is to control the car platform to move inwards from the furnace; and the fifth step is to control the furnace door to flip downwards and close.

[0004] However, after the copper ingots are heated, workers need to use pliers and other tools to clamp the ingots on the machine and move them to the next processing equipment. This process is laborious and inefficient. Summary of the Invention

[0005] In view of this, the purpose of this utility model is to provide a high-temperature copper ingot transfer device, which has the advantages of being labor-saving and having high transfer efficiency during the transfer process.

[0006] To solve the above-mentioned technical problems, the technical solution of this utility model is: a high-temperature copper ingot transfer device, including a transfer trolley, with transfer rollers rotatably connected to the four corners of the bottom of the transfer trolley, a fixed side plate fixedly connected to the upper end of the transfer trolley, the fixed side plate being arranged along the long edge of the transfer trolley, and a plurality of supporting horizontal plates fixedly connected to the upper end of the transfer trolley, the plurality of supporting horizontal plates being evenly distributed along the extension direction of the long edge of the transfer trolley, a placement chamber for placing copper ingots being formed between the fixed side plate and the plurality of supporting horizontal plates, and a lifting device being provided inside the transfer trolley, the output end of the lifting device extending into the placement chamber to lift the copper ingots away from the placement chamber.

[0007] With the above technical solution, after the copper ingot is heated, the moving trolley is moved towards one side of the heating furnace until the side wall of the supporting horizontal plate contacts the side wall of the trolley plate. At this point, the upper edge of the supporting horizontal plate is flush with the upper edge of the trolley plate. Then, using pliers or other tools, the copper ingot on the upper part of the trolley plate is clamped and pulled into the placement chamber. Next, the moving trolley is moved to the next processing equipment until the side wall of the supporting horizontal plate contacts the feed inlet of the next processing equipment. At this point, the upper edge of the supporting horizontal plate is flush with the lower edge of the feed inlet of the next processing equipment. Then, a lifting device is used to lift the copper ingot out of the placement chamber, and finally, using pliers or other tools, the copper ingot is pushed into the feed inlet of the next processing equipment. Using a transfer device to transport the copper ingot makes the transfer process more labor-saving and more efficient.

[0008] Preferably, the upper end of the supporting horizontal plate is provided with a guide slope facing the fixed side plate, the guide slope being used to guide the copper ingot into the placement chamber.

[0009] The above technical solution involves setting a guide ramp at the upper end of the supporting horizontal plate. This allows the copper ingot to be pulled until it contacts the guide ramp, after which it can move along the ramp under its own weight and enter the placement chamber. This design makes the transfer of the copper ingot less strenuous and more efficient.

[0010] Preferably, a limiting protrusion is provided on the side of the supporting horizontal plate away from the fixed side plate, and the upper end of the limiting protrusion protrudes from the guide slope.

[0011] Through the above technical solution, the limiting protrusion can limit the copper ingot, making it difficult for the copper ingot to detach from the placement chamber during the transfer process. Furthermore, when designing the above transfer device, the upper end of the limiting protrusion can be designed to be flush with the upper end of the heating furnace car plate, so as to ensure that the transfer process of the copper ingot is less labor-intensive and has higher transfer efficiency.

[0012] Preferably, a buffer rubber plate is fixedly provided on the side of the fixed side plate facing the guide slope.

[0013] Through the above technical solution, the buffer rubber plate can play a buffering role when the copper ingot moves into the inner side of the placement cavity.

[0014] Preferably, the buffer rubber plate has a plurality of countersunk holes on the side facing the guide slope, and each countersunk hole is provided with a locking bolt. The threaded section of the locking bolt is threadedly connected to the fixed side plate to press and fix the buffer rubber plate to the fixed side plate.

[0015] The above technical solution uses locking bolts to press and fix the buffer rubber plate to the fixed side plate, making the assembly and disassembly of the buffer rubber plate easier.

[0016] Preferably, the fixed side plate has a positioning groove on the side facing the buffer rubber plate, and the buffer rubber plate has a positioning protrusion on the side facing the fixed side plate, and the positioning protrusion is engaged in the positioning groove.

[0017] The above technical solution allows the positioning protrusion and positioning groove to cooperate in positioning the buffer rubber plate, making the installation of the buffer rubber plate easier.

[0018] Preferably, the lifting device includes a lifting cylinder, a lifting connecting plate disposed at the output end of the lifting cylinder, and a lifting push plate disposed at the upper end of the lifting connecting plate. The upper end of the lifting push plate is provided with an outward pushing slope, the orientation of which is opposite to that of the guide slope.

[0019] With the above technical solution, when it is necessary to lift the copper ingot out of the placement chamber, the lifting cylinder drives the lifting connecting plate and the lifting push plate to move upward. When the outward pushing slope contacts the copper ingot, the lifting push plate will push the copper ingot upward and away from the fixed side plate. When the lower end of the outward pushing slope is flush with the upper end of the limiting protrusion, the copper ingot will slide out of the placement chamber along the outward pushing slope under its own weight. The above configuration makes the copper ingot transfer process more labor-saving and more efficient.

[0020] Preferably, a lifting chamber is formed between two adjacent supporting horizontal plates, the number of lifting push plates is the same as the number of lifting chambers, and the lifting push plates are arranged one by one in the lifting chambers.

[0021] Through the above technical solution, multiple lifting and pushing plates work together to ensure that the copper ingot is not easily tilted during the process of being moved out of the placement chamber. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the structure of an embodiment;

[0023] Figure 2 This is a cross-sectional schematic diagram of an embodiment;

[0024] Figure 3 for Figure 2 Enlarged view of part A.

[0025] Reference numerals: 1. Transfer trolley; 2. Transfer roller; 3. Fixed side plate; 4. Supporting cross plate; 5. Placement chamber; 6. Lifting device; 61. Lifting cylinder; 62. Lifting connecting plate; 63. Lifting push plate; 7. Guide ramp; 8. Limiting protrusion; 9. Buffer rubber plate; 10. Countersunk hole; 11. Locking bolt; 12. Positioning groove; 13. Positioning protrusion; 14. Outward pushing ramp. Implementation

[0026] The specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings, so that the technical solution of this utility model can be more easily understood and mastered.

[0027] A high-temperature copper ingot transfer device, such as Figures 1 to 3 As shown, it includes a transfer trolley 1.

[0028] The transfer trolley 1 has transfer rollers 2 rotatably connected to each of its four bottom corners. In this embodiment, the transfer rollers 2 are omnidirectional wheels.

[0029] A fixed side plate 3 is fixedly connected to the upper end of the transfer trolley 1, and the fixed side plate 3 is arranged along the long edge of the transfer trolley 1. Several supporting horizontal plates 4 are fixedly connected to the upper end of the transfer trolley 1. The several supporting horizontal plates 4 are evenly distributed along the extension direction of the long edge of the transfer trolley 1, and a placement chamber 5 for placing copper ingots is formed between the fixed side plate 3 and the several supporting horizontal plates 4.

[0030] The upper end of the supporting horizontal plate 4 is provided with a guide slope 7 facing the fixed side plate 3, which is used to guide the copper ingot into the placement chamber 5. A limiting protrusion 8 is provided on the side of the supporting horizontal plate 4 away from the fixed side plate 3, and the upper end of the limiting protrusion 8 protrudes from the guide slope 7.

[0031] A buffer plate 9 is fixedly installed on the side of the fixed side plate 3 facing the guide slope 7. Several countersunk holes 10 are provided on the side of the buffer plate 9 facing the guide slope 7. Each countersunk hole 10 contains a locking bolt 11, the threaded section of which is threadedly connected to the fixed side plate 3 to press and fix the buffer plate 9 to the fixed side plate 3. A positioning groove 12 is provided on the side of the fixed side plate 3 facing the buffer plate 9, and a positioning protrusion 13 is provided on the side of the buffer plate 9 facing the fixed side plate 3. The positioning protrusion 13 is engaged in the positioning groove 12.

[0032] The transfer trolley 1 is equipped with a lifting device 6. The output end of the lifting device 6 extends into the placement chamber 5 to lift the copper ingot away from the placement chamber 5. The lifting device 6 includes a lifting cylinder 61, a lifting connecting plate 62 located at the output end of the lifting cylinder 61, and a lifting push plate 63 located on the upper end of the lifting connecting plate 62. The upper end of the lifting push plate 63 is provided with an outward pushing slope 14, the orientation of which is opposite to that of the guide slope 7. A lifting chamber is formed between two adjacent support horizontal plates 4. The number of lifting push plates 63 is the same as the number of lifting chambers, and each lifting push plate 63 is arranged in a lifting chamber.

[0033] Of course, the above are just typical examples of this utility model. In addition, this utility model may have many other specific implementation methods. All technical solutions formed by equivalent substitution or equivalent transformation fall within the scope of protection claimed by this utility model.

Claims

1. A high-temperature copper ingot transfer device, characterized in that: The device includes a transfer trolley (1), with transfer rollers (2) rotatably connected to the four corners of the bottom of the transfer trolley (1). A fixed side plate (3) is fixedly connected to the upper end of the transfer trolley (1), and the fixed side plate (3) is set along the long edge of the transfer trolley (1). Several supporting horizontal plates (4) are fixedly connected to the upper end of the transfer trolley (1). The several supporting horizontal plates (4) are evenly distributed along the extension direction of the long edge of the transfer trolley (1). A placement chamber (5) for placing copper ingots is formed between the fixed side plate (3) and the several supporting horizontal plates (4). A lifting device (6) is provided inside the transfer trolley (1). The output end of the lifting device (6) extends into the placement chamber (5) to lift the copper ingots away from the placement chamber (5).

2. The high-temperature copper ingot transfer device according to claim 1, characterized in that: The upper end of the supporting horizontal plate (4) is provided with a guide slope (7) facing the fixed side plate (3), and the guide slope (7) is used to guide the copper ingot into the placement chamber (5).

3. The high-temperature copper ingot transfer device according to claim 2, characterized in that: The supporting horizontal plate (4) is provided with a limiting protrusion (8) on the side away from the fixed side plate (3), and the upper end of the limiting protrusion (8) protrudes from the guide slope (7).

4. The high-temperature copper ingot transfer device according to claim 3, characterized in that: A buffer rubber plate (9) is fixedly installed on the side of the fixed side plate (3) facing the guide slope (7).

5. The high-temperature copper ingot transfer device according to claim 4, characterized in that: The buffer rubber plate (9) is provided with a plurality of countersunk holes (10) on the side facing the guide slope (7). Each countersunk hole (10) is provided with a locking bolt (11). The threaded section of the locking bolt (11) is threadedly connected to the fixed side plate (3) to press and fix the buffer rubber plate (9) and the fixed side plate (3).

6. The high-temperature copper ingot transfer device according to claim 5, characterized in that: The fixed side plate (3) has a positioning groove (12) on the side facing the buffer rubber plate (9), and the buffer rubber plate (9) has a positioning protrusion (13) on the side facing the fixed side plate (3). The positioning protrusion (13) is engaged in the positioning groove (12).

7. The high-temperature copper ingot transfer device according to claim 2, characterized in that: The lifting device (6) includes a lifting cylinder (61), a lifting connecting plate (62) disposed at the output end of the lifting cylinder (61), and a lifting push plate (63) disposed at the upper end of the lifting connecting plate (62). The upper end of the lifting push plate (63) is provided with an outward pushing inclined surface (14), and the orientation of the outward pushing inclined surface (14) is opposite to the orientation of the guide inclined surface (7).

8. The high-temperature copper ingot transfer device according to claim 7, characterized in that: A lifting chamber is formed between two adjacent support cross plates (4), and the number of lifting push plates (63) is the same as the number of lifting chambers, and the lifting push plates (63) are arranged one by one in the lifting chambers.

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