Pressure sensor module, pressure sensing module and electronic equipment

Abstract

The embodiment of the utility model provides a pressure sensor module, a pressure sensing module and electronic equipment. The pressure sensor module comprises a pressure sensor body, a bonding pad and a conducting strip, a top pressing part and a sensing part corresponding to the top pressing part are respectively arranged in the central areas of the two sides of the pressure sensor body along the thickness direction of the pressure sensor body; the bonding pad is arranged in an edge area of one side, deviating from the panel, of the pressure sensor body; the conducting strips are arranged on the bonding pads corresponding to the conducting strips; the side, away from the pressure sensor body, of the conducting strip is used for being fixed to a control circuit board, so that a preset deformation space is formed between the pressure sensor body and the control circuit board. The pressure sensor body is raised by arranging the conducting strip, so that when the pressure sensor module is fixed on the control circuit board, the sensing part of the pressure sensor body has a preset deformation space, the pressure sensor module can detect the pressure of the panel, and the control circuit board can be assembled without slotting; the device is applied to structures with small spaces or control circuit boards having no hole opening requirements.

Description

Technical Field

[0001] This disclosure pertains to the field of pressure sensing technology, specifically relating to a pressure sensor module, a pressure sensing module, and an electronic device. Background Technology

[0002] Pressure sensors are increasingly used in pressure detection and pressure buttons. Compared with general mechanical buttons or touch buttons, pressure sensors have advantages such as long life, good anti-accidental touch effect, and waterproof and oil-proof properties.

[0003] Current pressure sensor solutions involve fixing the sensor to the control circuit board by welding, and using an elastomer or other components to press against the outer casing to form a simply supported beam structure for panel pressure detection.

[0004] However, the technical problem with welded sensors is that in the top-pressure solution, the control circuit board needs to be hollowed out in order to provide deformation space for the sensor. If the control circuit board is too small or cannot be hollowed out due to functional requirements, then this solution cannot be applied.

[0005] To address the aforementioned issues, it is necessary to propose a reasonably designed pressure sensor module, pressure sensing module, and electronic device that can effectively improve these problems. Utility Model Content

[0006] The embodiments disclosed herein aim to at least solve one of the technical problems existing in the prior art, and provide a pressure sensor module, a pressure sensing module, and an electronic device.

[0007] One aspect of this disclosure provides a pressure sensor module for pressing against a panel to detect the pressure of the panel. The pressure sensor module includes a pressure sensor body, a pad, and a conductive sheet.

[0008] The pressure sensor body has a top pressure part and a sensing part corresponding to the top pressure part respectively provided in the central area on both sides of its thickness direction;

[0009] The pad is located on the edge region of the pressure sensor body on the side opposite to the panel.

[0010] The conductive sheet is disposed on the corresponding pad; wherein...

[0011] The conductive sheet on the side facing away from the pressure sensor body is used to fix it to the control circuit board, so that there is a preset deformation space between the pressure sensor body and the control circuit board.

[0012] Optionally, a hollow groove is provided in the central area of ​​the pressure sensor body, and the hollow groove is arranged around the sensing part so that the sensing part has a cantilever beam structure;

[0013] in,

[0014] The top pressure section is located at the free end of the cantilever beam structure.

[0015] Optionally, the conductive sheet is soldered to the corresponding pad.

[0016] Optionally, the conductive sheet is a conductive metal sheet.

[0017] Optionally, the number of conductive sheets is four, and the four conductive sheets are respectively located at the four corners of the pressure sensor body.

[0018] Optionally, the pressure sensor body is a piezoresistive pressure sensor, a piezoelectric sensor, or a strain gauge pressure sensor.

[0019] Another aspect of this disclosure provides a pressure sensing module, including a control circuit board and the pressure sensor module described above; wherein...

[0020] The conductive sheet is fixed to the control circuit board on the side opposite to the pressure sensor body, so that there is a preset deformation space between the pressure sensor body and the control circuit board.

[0021] Optionally, the conductive sheet is soldered to the control circuit board on the side opposite to the pressure sensor body.

[0022] Optionally, an elastomer may also be included, which is disposed on the pressing portion for pressing contact with the panel.

[0023] Another aspect of this disclosure provides an electronic device including the pressure sensing module described above.

[0024] This disclosure discloses a pressure sensor module, a pressure sensing module, and an electronic device. The pressure sensor module includes a pressure sensor body, pads, and a conductive sheet. The pads are located on the edge region of the pressure sensor body facing away from the panel. The conductive sheet is located on the corresponding pad. The side of the conductive sheet facing away from the pressure sensor body is used to fix it to a control circuit board, so that there is a preset deformation space between the pressure sensor body and the control circuit board. By setting the conductive sheet to raise the pressure sensor body, when the pressure sensor module is fixed to the control circuit board, the sensing part of the pressure sensor body has a preset deformation space, which is beneficial for the pressure sensor module to detect the pressure of the panel. This allows for an assembly method that does not require slotting of the control circuit board, and is applicable to structures with limited space or where the control circuit board cannot have holes. Attached Figure Description

[0025] Figure 1 This is a cross-sectional view of a pressure sensor module according to an embodiment of the present disclosure;

[0026] Figure 2 This is a front view of a pressure sensor module according to one embodiment of the present disclosure;

[0027] Figure 3 This is a rear view of a pressure sensor module according to one embodiment of the present disclosure;

[0028] Figure 4 This is a front view of a pressure sensor module according to another embodiment of this disclosure;

[0029] Figure 5 This is a rear view of a pressure sensor module according to another embodiment of this disclosure;

[0030] Figure 6 This is a cross-sectional view of a pressure sensing module according to an embodiment of the present disclosure. Detailed Implementation

[0031] To enable those skilled in the art to better understand the technical solutions of the embodiments of this disclosure, the embodiments of this disclosure will be further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0032] like Figures 1 to 5 As shown, this embodiment of the disclosure provides a pressure sensor module 100 for contacting the top of a panel to detect the pressure of the panel. The pressure sensor module 100 includes a pressure sensor body 110, a pad 120, and a conductive sheet 130.

[0033] like Figure 2 and Figure 3 As shown, the pressure sensor body 110 has a top pressure portion 111 and a sensing portion 112 corresponding to the top pressure portion 111 respectively provided in the central region on both sides of its thickness direction.

[0034] The pad 120 is located on the edge area of ​​the pressure sensor body 110 away from the panel.

[0035] The conductive sheet 130 is disposed on its corresponding pad 120. The side of the conductive sheet 130 facing away from the pressure sensor body 110 is used to fix it to the control circuit board 210, so that there is a preset deformation space between the pressure sensor body 110 and the control circuit board 210, without the need for the control circuit board 210.

[0036] It should be noted that, in this embodiment, the conductive sheet 130 can be made of conductive metal, and the thickness of the conductive sheet 130 can determine the size of the preset deformation space between the pressure sensor body 110 and the control circuit board 210. This embodiment does not specifically limit the thickness of the conductive sheet 130; it can be selected according to actual needs.

[0037] Specifically, such as Figure 1 As shown, in application, the pad 120 is fixed to the pressure sensor body 110, and then the conductive sheet 130 is fixed to the corresponding pad 120. The top pressing part 111 of the pressure sensor body 110 is pressed into contact with the top of the panel to form a simply supported beam structure. The conductive sheet 130 in the edge area of ​​the pressure sensor body 110 fixes and supports the pressure sensor body 110. When the panel is subjected to force, it deforms in the direction of the pressure sensor body 110, and the pressure sensor body 110 also deforms. The sensing part 112 can detect the force on the pressure sensor body 110 and generate pressure signal data, realizing the pressure detection function of the pressure sensor module 100.

[0038] The pressure sensor module of this disclosure includes a pressure sensor body, pads, and conductive sheets. The pads are located on the edge region of the pressure sensor body facing away from the panel. The conductive sheets are located on their corresponding pads. The side of the conductive sheets facing away from the pressure sensor body is used to fix them to a control circuit board, creating a predetermined deformation space between the pressure sensor body and the control circuit board. By raising the pressure sensor body with the conductive sheets, the sensing portion of the pressure sensor body has a predetermined deformation space when the pressure sensor module is fixed to the control circuit board. This facilitates the pressure sensor module's detection of panel pressure and enables an assembly method that eliminates the need for slotting on the control circuit board. This method is suitable for structures with limited space or where the control circuit board cannot have openings.

[0039] For example, such as Figure 4 and Figure 5 As shown, a hollow groove 113 is provided in the central region of the pressure sensor body 110. The hollow groove 113 surrounds the sensing part, so that the sensing part 112 has a cantilever beam structure. In this embodiment, the hollow groove 113 can be shaped like a cantilever beam. Figure 4 and Figure 5 The U-shape is shown. The top pressure part 111 is located at the free end of the cantilever beam structure. That is to say, the pressure sensor body 110 will generate the greatest deformation when it is subjected to pressure, thereby increasing the detection sensitivity of the pressure sensor module 100.

[0040] For example, in this embodiment, the conductive sheet 130 is soldered to its corresponding pad 120.

[0041] For example, such as Figure 2 and Figure 4As shown, in this embodiment, there are four conductive sheets 130, which are located at the four corners of the pressure sensor body 110. That is, there are also four pads 120, which are also located at the four corners of the pressure sensor body 110, corresponding to the positions of the conductive sheets 130.

[0042] It should be noted that this embodiment does not impose specific limitations on the number and distribution of the pads 120 and conductive sheets 130, and they can be selected according to actual needs. For example, the number of pads 120 and conductive sheets 130 can be two, and the two pads 120 and conductive sheets 130 can be located at both ends of the pressure sensor body 110 along its length.

[0043] For example, in this embodiment, the pressure sensor body 110 can be a piezoresistive pressure sensor, a piezoelectric sensor, or a strain gauge pressure sensor, etc. The piezoresistive pressure sensor can have a single-bridge, half-bridge, or full-bridge Wheatstone bridge structure, etc.

[0044] It should be noted that this embodiment does not specifically limit the type of pressure sensor body 110, and it can be selected according to actual needs.

[0045] like Figure 6 As shown, another aspect of this disclosure provides a pressure sensing module 200, including a control circuit board 210 and the pressure sensor module 100 described above. The specific structure of the pressure sensor module 100 has been described in detail above and will not be repeated here.

[0046] The conductive sheet 130 is fixed to the control circuit board 210 on the side opposite to the pressure sensor body 110, so that there is a preset deformation space between the pressure sensor body 110 and the control circuit board 210.

[0047] Specifically, the conductive sheet 130 of the pressure sensor module 100 is fixed to the control circuit board 210. The pressure sensor body 110 in the pressure sensor module 100 has its top pressing part 11 in contact with the top pressing part of the panel, forming a simply supported beam top pressing detection structure. Under the action of the force transmitted from the panel, the pressure sensor body 110 will deform. The sensing part 112 detects this change signal and transmits the signal to the control circuit board 210. The control circuit board 210 is provided with a control circuit, and the sensing part 112 can directly transmit the detected pressure signal to the control circuit through the control circuit board. The control circuit board 210 can be a PCB main control board.

[0048] For example, in this embodiment, the conductive sheet 130 is soldered to the control circuit board 210 on the side opposite to the pressure sensor body 110.

[0049] As exemplarily shown in the figure, the pressure sensing module 200 also includes an elastomer 220 disposed on the top pressure portion 111 for pressing against the panel.

[0050] Specifically, in this embodiment, the conductive sheet 130 of the pressure sensor module 100 is fixed to the control circuit board 210, and the elastic element 220 is fixed to the top pressure part 11 of the pressure sensor body 110 and makes top pressure contact with the panel to form a simply supported beam top pressure detection structure. Under the action of the force transmitted by the elastic element 220, the pressure sensor body 110 will deform, and the sensing part 112 will detect the change signal and transmit the signal to the control circuit board 210.

[0051] The pressure sensing module of this disclosure includes the pressure sensor module described above. The conductive sheet in the pressure sensor module is fixed to the control circuit board on the side facing away from the pressure sensor body, so that there is a preset deformation space between the pressure sensor body and the control circuit board. This facilitates the pressure sensor module in detecting the pressure of the panel and enables an assembly method for the control circuit board that does not require slotting, making it suitable for structures with limited space or where the control circuit board cannot have openings.

[0052] Another aspect of this disclosure provides an electronic device including the pressure sensing module 200 described above. The specific structure of the pressure sensing module 200 has been described in detail above and will not be repeated here.

[0053] The electronic device of this disclosure does not require slotting in the control circuit board and can be applied to structures with limited space or control circuit boards that cannot have holes.

[0054] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of the embodiments of this disclosure, and the embodiments of this disclosure are not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the embodiments of this disclosure, and these modifications and improvements are also considered to be within the protection scope of the embodiments of this disclosure.

Claims

1. A pressure sensor module for pressing against a panel to detect the pressure of the panel, characterized in that, The pressure sensor module includes a pressure sensor body, solder pads, and conductive sheets; The pressure sensor body has a top pressure part and a sensing part corresponding to the top pressure part respectively provided in the central area on both sides of its thickness direction; The pad is located on the edge region of the pressure sensor body on the side opposite to the panel. The conductive sheet is disposed on the corresponding pad; wherein... The conductive sheet on the side facing away from the pressure sensor body is used to fix it to the control circuit board, so that there is a preset deformation space between the pressure sensor body and the control circuit board.

2. The pressure sensor module according to claim 1, characterized in that, A hollowed-out groove is provided in the central area of ​​the pressure sensor body, and the hollowed-out groove is arranged around the sensing part, so that the sensing part has a cantilever beam structure; wherein... The top pressure section is located at the free end of the cantilever beam structure.

3. The pressure sensor module according to claim 1, characterized in that, The conductive sheet is soldered to its corresponding pad.

4. The pressure sensor module according to any one of claims 1 to 3, characterized in that, The conductive sheet is a conductive metal sheet.

5. The pressure sensor module according to any one of claims 1 to 3, characterized in that, The number of conductive sheets is four, and the four conductive sheets are located at the four corners of the pressure sensor body.

6. The pressure sensor module according to any one of claims 1 to 3, characterized in that, The pressure sensor body is a piezoresistive pressure sensor, a piezoelectric sensor, or a strain gauge pressure sensor.

7. A pressure sensing module, characterized in that, Includes a control circuit board and a pressure sensor module as described in any one of claims 1 to 6; wherein, The conductive sheet is fixed to the control circuit board on the side opposite to the pressure sensor body, so that there is a preset deformation space between the pressure sensor body and the control circuit board.

8. The pressure sensing module according to claim 7, characterized in that, The conductive sheet is soldered to the control circuit board on the side opposite to the pressure sensor body.

9. The pressure sensing module according to claim 7, characterized in that, It also includes an elastomer disposed on the top pressing portion for pressing contact with the panel.

10. An electronic device, characterized in that, Includes the pressure sensing module as described in any one of claims 7 to 9.

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