Stacked silicon wafer corrosion tool
By designing a rotary positioning component for a stacked silicon wafer etching fixture, the problems of warping and uneven etching of silicon wafers during wet etching were solved, achieving uniform etching of the silicon wafer surface.
Patent Information
- Application Number
- CN202422978641.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-04
- Publication Date
- 2025-12-02
- Estimated Expiration
- 2034-12-04
AI Technical Summary
In existing technologies, silicon wafers are prone to warping and uneven etching during wet etching, resulting in severe warping of the silicon wafer surface.
A stacked silicon wafer etching fixture is used. The silicon wafers are stacked in an orderly manner and rotated up and down in a jumping motion by a rotating positioning component to contact the etching solution, thus ensuring uniform etching of the silicon wafer surface.
Uniform etching of the silicon wafer surface was achieved, warping was avoided, and the etching effect was improved.
Smart Images
Figure CN223624971U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of silicon wafer etching, specifically relating to a stacked silicon wafer etching fixture. Background Technology
[0002] After physical and mechanical grinding, the surface of silicon wafers must be roughened to remove the damaged layer and release stress. In existing technologies, silicon wafer roughening is generally carried out by wet etching, that is, the front side of the silicon wafer is facing down and the back side is facing up, and a spray-type wet etching is performed. In this case, the film on the front surface of the silicon wafer has a tensile force on the silicon wafer. The thinner silicon wafer will warp under the action of the film. At the same time, the etching solution has different etching rates on different crystal planes of the silicon wafer, resulting in uneven etching on the silicon wafer surface. After the film is peeled off, the surface of the silicon wafer is severely warped. Utility Model Content
[0003] The purpose of this invention is to overcome the above-mentioned shortcomings and provide a stacked silicon wafer etching fixture. By setting a rotating positioning component, the silicon wafers are stacked in an orderly manner and rotate up and down to contact the etching liquid, so that the surface of the silicon wafers is fully in contact with the etching liquid, ensuring uniform etching of the silicon wafer surface and avoiding warping.
[0004] The purpose of this utility model is achieved through the following technical solution: a stacked silicon wafer etching fixture, including two side plates arranged in front and behind and multiple sets of rotary positioning components placed between the two side plates. The multiple sets of rotary positioning components are arranged horizontally in sequence, and multiple silicon wafers are sequentially clamped on each rotary positioning component along a direction perpendicular to the distribution of the multiple sets of rotary positioning components.
[0005] The rotary positioning assembly includes two fixed rods passing through two side plates and a rolling rod positioned directly below the center of the two fixed rods. The space between the two fixed rods and the rolling rod is used to place multiple silicon wafers. Both the fixed rods and the rolling rod have multiple evenly distributed positioning grooves, which are distributed sequentially. Each silicon wafer is embedded in the corresponding positioning groove formed by the two fixed rods and the rolling rod. The outer side of the side plate has a drive assembly that drives the rolling rod to move up and down and rotate in a circular motion. The silicon wafer rotates freely in the corresponding positioning groove as the rolling rod moves up and down and rotates in a circular motion.
[0006] A further improvement of this utility model is that: the drive group includes limiting holes provided on two side plates and up-down moving blocks embedded in the limiting holes. The up-down moving blocks are embedded in the limiting holes in a reciprocating manner. One end of the rolling rod passes through the corresponding up-down moving block. The end of the rolling rod is movably connected to the corresponding up-down moving block through a rolling bearing. One end of the rolling rod is connected to a reduction motor. The reduction motor is placed on the corresponding up-down moving block.
[0007] The side end face of the vertical moving block protrudes from the corresponding side plate. Each side plate is located below the corresponding limiting hole and has a cam. The end face of the cam contacts the lower end face of the vertical moving block. The side plate has a reduction motor that drives the cam to rotate. The rotation of the cam drives the vertical moving block to move up and down reciprocally within the limiting hole.
[0008] A further improvement of this utility model is that: a limiting shaft is provided in the limiting hole, which extends vertically through the upper and lower moving blocks; a spring is provided between the upper and lower end faces of the upper and lower moving blocks and the corresponding upper and lower end faces of the limiting hole; and the spring is sleeved on the limiting shaft.
[0009] A further improvement of this utility model is that the side plate, the fixed rod, the rolling rod, the up and down moving block, and the cam are all made of polyvinylidene fluoride.
[0010] A further improvement of this utility model is that the two ends of the opening of the positioning groove have inclined guide surfaces.
[0011] A further improvement of this utility model is that a connecting rod is provided at the lower position between the two side plates, and the outer side of the side plates is provided with lifting lugs to facilitate overall hoisting.
[0012] This utility model has the following advantages compared with the prior art:
[0013] This invention involves stacking silicon wafers sequentially on a rotary positioning assembly. Each rotary positioning assembly consists of two fixed rods and one rolling rod. The silicon wafers are sequentially positioned in the positioning grooves of the fixed rods and the rolling rod. At the same time, the rolling rod is driven to move up and down in a reciprocating motion, thereby enabling the silicon wafers to jump up and down and rotate in the corresponding limiting grooves. This ensures that the surface of the silicon wafers is in full contact with the etching liquid, guarantees uniform etching of the silicon wafer surface, and avoids warping. Attached Figure Description
[0014] Figure 1 This is a schematic diagram of the structure of a stacked silicon wafer etching fixture according to the present invention.
[0015] Figure 2 for Figure 1 The left view.
[0016] Figure 3 This is a schematic diagram showing the positioning of the silicon wafer on the fixed rod and the rolling rod.
[0017] Numbering on the map:
[0018] 1-Side plate, 2-Rotary positioning assembly, 3-Silicon wafer, 4-Connecting rod, 5-Lifting lug;
[0019] 21-Fixed rod, 22-Rolling rod, 23-Positioning groove, 24-Drive group, 25-Inclined guide surface; 241-Limiting hole, 242-Up and down moving block, 243-Rolling bearing, 244-Reduction motor one, 245-Cam, 246-Reduction motor two, 247-Limiting shaft, 248-Spring. Detailed Implementation
[0020] To enhance understanding of this utility model, the present utility model will be further described in detail below with reference to the embodiments and accompanying drawings. These embodiments are only used to explain the present utility model and do not constitute a limitation on the scope of protection of the present utility model.
[0021] In the description of this utility model, it should be understood that the terms indicating orientation or positional relationship, such as those based on the orientation or positional relationship shown in the drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the structure or unit referred to must have a specific orientation, and therefore should not be construed as a limitation of this utility model.
[0022] In this utility model, unless otherwise explicitly specified and limited, terms such as “connection,” “provided with,” and “have” should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection. They can be described as a mechanical connection, a direct connection, or a connection through an intermediate medium. Those skilled in the art can understand the basic meaning of the above terms in this utility model according to the specific circumstances.
[0023] A stacked silicon wafer etching fixture, as shown in the reference Figure 1 , Figure 2 It includes two side plates 1 set at the front and back and multiple sets of rotary positioning components 2 placed between the two side plates 1. The multiple sets of rotary positioning components 2 are arranged horizontally in sequence, and multiple silicon wafers 3 are sequentially clamped on each rotary positioning component 2 along the direction perpendicular to the distribution of the multiple sets of rotary positioning components 2.
[0024] The rotary positioning assembly 2 includes two fixed rods 21 penetrating the two side plates 1 and a rolling rod 22 positioned directly below the center of the two fixed rods 21. A space for placing multiple silicon wafers 3 is formed between the two fixed rods 21 and the rolling rod 22. The fixed rods 21 and the rolling rod 22 each have multiple evenly distributed positioning grooves 23, which are sequentially distributed. Each silicon wafer 3 is embedded in the corresponding positioning groove 23 formed by the two fixed rods 21 and the rolling rod 22. The outer side of the side plate 1 has a drive group 24 that drives the rolling rod 22 to move up and down and rotate in a circular motion. The silicon wafer 3 rotates freely in the corresponding positioning groove 23 as the rolling rod 22 moves up and down and rotates in a circular motion.
[0025] In this invention, silicon wafers 3 are stacked sequentially on a rotary positioning assembly 2. Each rotary positioning assembly 2 consists of two fixed rods 21 and one rolling rod 22. (Refer to...) Figure 3 The silicon wafer 3 is positioned sequentially in the positioning grooves 23 of the fixed rod 21 and the rolling rod 22. At the same time, the rolling rod 22 is driven by the drive group 24 to move up and down in a reciprocating motion, thereby enabling the silicon wafer 3 to jump up and down and rotate in the corresponding limiting groove 23, so that the surface of the silicon wafer 3 is in full contact with the etching liquid, ensuring uniform etching of the surface of the silicon wafer 3 and avoiding warping.
[0026] Based on this embodiment, the drive group 24 includes limiting holes 241 provided on two side plates 1 and up-down moving blocks 242 embedded in the limiting holes 241. The up-down moving blocks 242 are embedded in the limiting holes 241 in a reciprocating manner. One end of the rolling rod 22 passes through the corresponding up-down moving block 242. The end of the rolling rod 22 is movably connected to the corresponding up-down moving block 242 through a rolling bearing 243. One end of the rolling rod 22 is connected to a reduction motor 244. The reduction motor 244 is placed on the corresponding up-down moving block 242.
[0027] The side end face of the vertical moving block 242 protrudes from the corresponding side plate 1. Each side plate 1 is located below the corresponding limiting hole 241 and has a cam 245. The end face of the cam 245 contacts the lower end face of the vertical moving block 242. The side plate 1 has a reduction motor 246 that drives the cam 245 to rotate. The rotation of the cam 245 drives the vertical moving block 242 to move up and down reciprocally within the limiting hole 241.
[0028] When the drive group 24 is working, the first geared motor 244 starts, and the rolling rod 22 rotates in a circle, thereby driving the silicon wafer 3 to rotate in a circle within the corresponding fixed rod and the positioning groove of the rolling rod. However, due to the gravity of the silicon wafer itself and the friction between the silicon wafer and the positioning groove, some silicon wafers 3 may not rotate in a circle with the rotation of the rolling rod 22. Therefore, there will still be a phenomenon of insufficient contact between some silicon wafers 3 and the immersion tank. Therefore, the drive group 24 provided in this application also includes a cam 245 that drives the up-and-down moving block 242 and the rolling rod 22 to move up and down reciprocally, and a second geared motor 246. When the second geared motor 246 starts, the cam rotates in a circle. Due to the special structural characteristics of the cam 245, it drives the up-and-down moving block 242 to drive the rolling rod 22 to move up and down in a small amplitude, providing a certain gap space for the rotation of the silicon wafer 3, and further ensuring sufficient contact between the silicon wafer 3 and the immersion liquid.
[0029] It should be noted that the vertical moving block 242 moves up and down with a small amplitude, so that the silicon wafer 3 is always placed in the positioning groove 23 formed by the fixed rod 21 and the rolling rod 22, thus preventing the silicon wafer 3 from falling out of the positioning groove 23 during the vertical movement.
[0030] Based on this embodiment, the limiting hole 241 has a limiting shaft 247 that extends vertically through the upper and lower moving block 242. A spring 248 is provided between the upper and lower end faces of the upper and lower moving block 242 and the corresponding upper and lower end faces of the limiting hole 241. The spring 248 is sleeved on the limiting shaft 247. The spring 248 plays a role in buffering the movement of the upper and lower moving block 242.
[0031] Based on this embodiment, the side plate 1, the fixing rod 21, the rolling rod 22, the up and down moving block 242, and the cam 245 are all made of polyvinylidene fluoride. Polyvinylidene fluoride is a highly non-reactive thermoplastic fluoropolymer that is resistant to strong acids and alkalis.
[0032] Based on this embodiment, the two ends of the opening of the positioning groove 23 have inclined guide surfaces 25. The inclined guide surfaces 25 are provided to prevent the silicon wafer 3 from colliding and wearing with the positioning groove 23 when it is being fed.
[0033] Based on this embodiment, a connecting rod 4 is provided on the lower side between the two side plates 1, and a lifting lug 5 is provided on the outer side of the side plate 1 to facilitate overall hoisting.
[0034] Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.
Claims
1. A stacked silicon wafer etching fixture, characterized in that: It includes two side plates (1) arranged front and back and multiple sets of rotating positioning components (2) placed between the two side plates (1). The multiple sets of rotating positioning components (2) are arranged horizontally in sequence, and multiple silicon wafers (3) are sequentially clamped on each of the rotating positioning components (2) along the direction perpendicular to the distribution of the multiple sets of rotating positioning components (2). The rotary positioning assembly (2) includes two fixed rods (21) penetrating the two side plates (1) and a rolling rod (22) placed directly below the center of the two fixed rods (21). The two fixed rods (21) and the rolling rod (22) form a space for placing multiple silicon wafers. The fixed rods (21) and the rolling rod (22) each have multiple evenly distributed positioning grooves (23). The positioning grooves (23) on the fixed rods (21) and the rolling rod (22) are distributed sequentially. Each silicon wafer (3) is embedded in the corresponding positioning groove (23) formed by the two fixed rods (21) and the rolling rod (22). The outer side of the side plate (1) has a drive group (24) for driving the rolling rod (22) to move up and down and rotate in a circle. The silicon wafer (3) rotates freely in the corresponding positioning groove (23) as the rolling rod (22) moves up and down and rotates in a circle.
2. The stacked silicon wafer etching fixture according to claim 1, characterized in that: The drive assembly (24) includes limiting holes (241) provided on two side plates (1) and up-down moving blocks (242) embedded in the limiting holes (241). The up-down moving blocks (242) are embedded in the limiting holes (241) and can move up and down reciprocally. One end of the rolling rod (22) passes through the corresponding up-down moving block (242). The end of the rolling rod (22) is movably connected to the corresponding up-down moving block (242) through a rolling bearing (243). One end of the rolling rod (22) is connected to a reduction motor (244), and the reduction motor (244) is placed on the corresponding up-down moving block (242). The side end face of the upper and lower moving block (242) protrudes from the corresponding side plate (1). Each side plate (1) is located below the corresponding limiting hole (241) and has a cam (245). The end face of the cam (245) is in contact with the lower end face of the upper and lower moving block (242). The side plate (1) has a second reduction motor (246) that drives the cam (245) to rotate. The rotation of the cam (245) drives the upper and lower moving block (242) to move up and down reciprocally within the limiting hole (241).
3. The stacked silicon wafer etching fixture according to claim 2, characterized in that: The limiting hole (241) has a limiting shaft (247) that extends vertically through the upper and lower moving block (242). A spring (248) is provided between the upper and lower end faces of the upper and lower moving block (242) and the upper and lower end faces of the corresponding limiting hole (241). The spring (248) is sleeved on the limiting shaft (247).
4. The stacked silicon wafer etching fixture according to claim 3, characterized in that: The side plate (1), the fixing rod (21), the rolling rod (22), the up and down moving block (242), and the cam (245) are all made of polyvinylidene fluoride.
5. The stacked silicon wafer etching fixture according to claim 3, characterized in that: The positioning groove (23) has inclined guide surfaces (25) at both ends of its opening.
6. The stacked silicon wafer etching fixture according to claim 5, characterized in that: A connecting rod (4) is located on the lower side between the two side plates (1), and a lifting lug (5) is provided on the outer side of the side plate (1) to facilitate overall hoisting.