Lead bonding packaging structure and packaging product
By setting up an adapter between the chip and the carrier and using lead wires for connection, the problems of wire arc collapse and short circuit caused by complex wire bonding design are solved, thereby improving the reliability of the packaged product and the stability of the electrical connection.
Patent Information
- Application Number
- CN202423185814.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-23
- Publication Date
- 2025-12-02
- Estimated Expiration
- 2034-12-23
AI Technical Summary
In existing semiconductor packaging technologies, the wire bonding design is complex, resulting in long or intersecting wire arcs, which can easily cause the wire arcs to collapse, leading to short circuits and poor electrical properties.
An adapter is placed between the chip's pads and the carrier's pads, and connected by first and second leads to shorten the wire arc length and avoid wire arc collapse and crossing.
It effectively prevents arc collapse and cross-short circuits, improves the reliability of packaged products and the stability of electrical connections, and has a compact structure and low cost.
Smart Images
Figure CN223624991U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor packaging technology, and in particular to a wire bonding packaging structure and packaging product. Background Technology
[0002] With the development of semiconductor packaging technology, chips are integrating more and more functions. The structure of packaged products is becoming increasingly complex, and chip design is changing significantly, which in turn makes wire bonding design more complex. Furthermore, the same chip product may have multiple package shapes, inevitably resulting in situations where the chip pads are far from the frame pins. This leads to longer or intersecting wire arcs, which can easily cause wire arc collapse, resulting in short circuits and poor electrical performance. Utility Model Content
[0003] The purpose of this invention is to provide a wire bonding packaging structure that can prevent wire arc collapse and reduce the risk of short circuits and poor electrical connections.
[0004] In a first aspect, this utility model provides a wire bonding packaging structure, comprising:
[0005] A first chip, wherein the first chip is provided with a first solder pad;
[0006] The carrier has a second solder pad.
[0007] An adapter, the adapter being located between the first pad and the second pad;
[0008] The first lead has one end connected to the first pad and the other end connected to the adapter.
[0009] The second lead has one end connected to the adapter and the other end connected to the second pad.
[0010] In an optional embodiment, the carrier includes a base island and a second pad disposed around the base island, and the adapter is disposed on the base island or between the base island and the second pad.
[0011] In an optional implementation, the first chip is disposed on the base island.
[0012] In an optional embodiment, the first chip has a first region where the first pad is provided, and a second region where the first pad is not provided, and the adapter is provided in the second region.
[0013] In an optional embodiment, the adapter includes a second chip mounted on the second region.
[0014] In an optional embodiment, an adhesive film layer is provided between the second chip and the first chip.
[0015] In an optional embodiment, the adapter is disposed on the base island, and there is a gap between the adapter and the first chip; the adapter and the base island are electrically insulated from each other.
[0016] In an optional embodiment, the carrier includes a transition portion disposed between the base island and the second pad, and the adapter is disposed on the transition portion.
[0017] In an optional embodiment, the adapter is provided with an adapter pad, which is rectangular, circular, pentagonal, hexagonal, or elliptical.
[0018] Secondly, this utility model provides a packaging product, including a molding compound and a wire bonding packaging structure as described in any of the foregoing embodiments, wherein the molding compound covers the first chip, the adapter, the first lead and the second lead.
[0019] The beneficial effects of the wire bonding packaging structure and packaged product provided by this utility model are as follows:
[0020] The wire bonding packaging structure provided in this embodiment of the invention includes an adapter between a first pad and a second pad. A first lead is positioned between the first pad and the adapter, and a second lead is positioned between the second pad and the adapter. Compared to existing methods that directly bond wires between the first and second pads, this shortens the length of the wire arc in a single bonding operation, which helps prevent arc collapse. This, in turn, prevents short circuits and poor electrical connections caused by arc collapse, thereby improving the reliability of the packaged product. Furthermore, by using the adapter, the bonding position and length are more flexible, and phenomena such as cross-short circuits between wire arcs can also be avoided.
[0021] The packaging product provided in this embodiment includes the above-mentioned wire bonding packaging structure. The wire arc length is relatively short, which helps to prevent the wire arc from collapsing and crossing, thereby avoiding problems such as short circuits and poor electrical connections, and improving the reliability of the packaging product. Attached Figure Description
[0022] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0023] Figure 1A schematic diagram of a first type of wire bonding packaging structure provided in an embodiment of this utility model;
[0024] Figure 2 A schematic diagram of a second type of wire bonding packaging structure provided in an embodiment of this utility model;
[0025] Figure 3 A schematic diagram of a third type of wire bonding packaging structure provided in this embodiment of the present invention;
[0026] Figure 4 A schematic diagram of the fourth type of wire bonding packaging structure provided in the embodiments of this utility model;
[0027] Figure 5 This is a schematic diagram of the fifth type of wire bonding packaging structure provided in the embodiments of this utility model.
[0028] Icons: 100 - Wire bonding package structure; 110 - First chip; 111 - First pad; 120 - Carrier; 121 - Second pad; 123 - Base island; 130 - Adapter; 141 - First lead; 142 - Second lead. Detailed Implementation
[0029] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.
[0030] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.
[0031] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.
[0032] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this utility model is in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.
[0033] Furthermore, terms such as "horizontal," "vertical," and "sag" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal relative to "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.
[0034] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0035] The following detailed description, in conjunction with the accompanying drawings, outlines some embodiments of the present invention. Unless otherwise specified, the following embodiments and features can be combined with each other.
[0036] This utility model provides a wire bonding packaging structure and packaging product that is applicable to packaging scenarios with multiple wire arcs, complex wire arcs, and various packaging shapes. By setting up an adapter, the number of wire arcs per bonding operation is shortened, reducing the risk of wire arc collapse and crossing, and improving the reliability and stability of wire arc connections.
[0037] Please combine Figure 1The wire bonding package structure 100 includes a first chip 110, a carrier 120, an adapter 130, a first lead 141, and a second lead 142. The first chip 110 has a first pad 111; the carrier 120 has a second pad 121. One end of the first lead 141 is connected to the first pad 111, and the other end is connected to the adapter 130. The other end of the first lead 141 is connected to the second pad 121. By placing the first lead 141 between the first pad 111 and the adapter 130, and the second lead 142 between the second pad 121 and the adapter 130, compared to the existing method of directly bonding wires between the first pad 111 and the second pad 121, the length of the single wire arc is shortened, which helps prevent wire arc collapse. This, in turn, prevents short circuits and poor electrical connections caused by wire arc collapse, thereby improving the reliability of the packaged product. Furthermore, by setting the adapter 130, the wire placement and length are more flexible, and phenomena such as short circuits between wire arcs can be avoided.
[0038] In this embodiment, the carrier 120 is exemplified by a lead frame. Of course, the configuration of this adapter 130 is also applicable to other types of chip packages, such as chip stacking packages, and is not specifically limited here.
[0039] Optionally, the carrier 120 includes a base island 123 and a second pad 121 disposed around the base island 123, with the first chip 110 disposed on the base island 123. An adapter 130 is disposed on the base island 123. It can be understood that the adapter 130 can be disposed on the base island 123 and spaced apart from the first chip 110. Alternatively, the adapter 130 can also be disposed on the first chip 110.
[0040] Combination Figure 2 The adapter 130 is stacked on the first chip 110. Optionally, the first chip 110 has a first region with a first pad 111 and a second region without the first pad 111, with the adapter 130 disposed in the second region. This arrangement avoids the location of the first pad 111, thus not affecting the electrical connection of the first chip 110, and does not occupy additional space, resulting in a more compact structure. Furthermore, forming the first lead 141 between the first pad 111 and the adapter 130 is convenient.
[0041] It is understood that the first lead 141 is electrically connected to the adapter 130, and the second pad 121 is electrically connected to the adapter 130, thereby achieving the electrical connection between the first pad 111 and the second pad 121. Optionally, the adapter 130 is provided with adapter pads. The adapter pads are electrically connected to the first lead 141 and the second lead 142, respectively.
[0042] Optionally, the adapter 130 includes a second chip mounted on the second region. The second chip has adapter pads for electrical connection to the first lead 141 and the second lead 142, respectively. An adhesive layer is provided between the second chip and the first chip 110. For example, the adhesive layer is made of insulating DAF adhesive, which bonds and fixes the second chip to the second region of the first chip 110. In this embodiment, the second chip is used as the adapter 130 because it is readily available and inexpensive. The second chip serves only as an intermediate electrical connection medium and does not have any chip function. The second chip is bonded and fixed to the first chip 110 using an adhesive layer, which is convenient and simple to operate.
[0043] Optionally, the adapter 130 can be a conductive sheet, conductive coating, conductive block, etc., and its structural form is not limited. The shape, number, position, and size of the adapter 130 are not limited. The cross-section of the adapter 130 includes, but is not limited to, rectangular, circular, pentagonal, hexagonal, or elliptical shapes. The shape, number, position, and size of the adapter pads are not limited. One adapter pad or multiple adapter pads can be provided on one adapter 130. In this embodiment, the adapter 130 is elongated. Of course, the adapter pads can also be circular, rectangular, elliptical, pentagonal, hexagonal, or any polygon, etc., and can be flexibly set according to actual conditions. The arrangement of the adapter pads facilitates the bonding of the first lead 141 and the second lead 142, allowing for more flexible bonding positions and more reliable electrical connections.
[0044] Combination Figure 3 Optionally, the adapter 130 is disposed on the base island 123, and there is a gap between the adapter 130 and the first chip 110. The adapter 130 and the base island 123 are electrically insulated from each other. If the base island 123 is made of metal, an insulating element is provided between the base island 123 and the adapter 130 to prevent the adapter 130 from being directly electrically connected to the base island 123 and causing a short circuit. If the base island 123 is made of insulating material, no insulating element is required.
[0045] The adapter 130 can be located at any position on the base island 123. The adapter 130 can be fixed to the base island 123 by adhesive bonding. By placing the adapter 130 on the base island 123, the arc length of the first lead 141 and the second lead 142 can be shortened, preventing the arc from collapsing and thus avoiding problems such as short circuits or poor electrical properties caused by the arc collapse.
[0046] Combination Figure 4The adapter 130 is disposed between the base island 123 and the second pad 121. Optionally, the carrier 120 includes a transition portion disposed between the base island 123 and the second pad 121, and the adapter 130 is disposed on the transition portion. By providing the adapter 130 on the transition portion, the arc length of the first lead 141 and the second lead 142 can be shortened, preventing arc collapse and thus avoiding problems such as short circuits or poor electrical properties caused by arc collapse.
[0047] It should be noted that the various configuration methods of the above-mentioned adapters 130 can be combined, such as... Figure 5 As shown, an adapter 130 is provided on both the first chip 110 and the base island 123. The number of adapters 130 is not limited, and the shapes and structures of multiple adapters 130 can be the same or different, which is not specifically limited here.
[0048] The wire bonding package structure 100 provided in this embodiment has a first chip 110 mounted on the base island 123 of the lead frame. The first chip 110 includes a first region and a second region. The first region has a first pad 111. A second chip, acting as an adapter 130, is mounted on the second region of the first chip 110. When it is necessary to electrically connect the first pad 111 of the first chip 110 and the second pad 121 of the lead frame, if the distance between the first pad 111 and the second pad 121 is close, a wire can be directly bonded between the first pad 111 and the second pad 121. If the distance between the first pad 111 and the second pad 121 is far, bridging can be achieved through the adapter 130, i.e., a first lead 141 is bonded between the first pad 111 and the second chip, and a second lead 142 is bonded between the second chip and the second pad 121.
[0049] This flexible wiring method reduces the risk of lead wire collapse. Furthermore, the more flexible lead wire arc routing path reduces the risk of short circuits caused by arc crossings, thus improving the overall reliability of the wiring and the stability of the electrical connection.
[0050] This utility model embodiment also provides a packaging product, including a molding compound and a wire bonding packaging structure 100 of any of the foregoing embodiments. The molding compound covers the carrier 120, the first chip 110, the adapter 130, the first lead 141 and the second lead 142, and provides protection for the first chip 110 and the wire bonding structure.
[0051] In summary, the wire bonding packaging structure 100 and the packaged product provided by this utility model embodiment have the following beneficial effects, including:
[0052] The wire bonding package structure 100 provided in this embodiment of the present invention includes an adapter 130 disposed between a first pad 111 and a second pad 121. A first lead 141 is disposed between the first pad 111 and the adapter 130, and a second lead 142 is disposed between the second pad 121 and the adapter 130. Compared to existing methods that directly bond wires between the first pad 111 and the second pad 121, this shortens the length of the single wire arc, which helps prevent arc collapse and thus prevents short circuits and poor electrical connections caused by arc collapse, thereby improving the reliability of the packaged product. Furthermore, by using the adapter 130, the wire bonding position and length are more flexible, and phenomena such as cross-short circuits between wire arcs can be avoided. The adapter 130 is disposed on the first chip 110 or the base island 123, saving space and resulting in a compact structure. Moreover, this wire bonding package structure 100 has a simple process, is easy to operate, and has a low cost.
[0053] The packaging product provided in this embodiment includes the above-mentioned wire bonding packaging structure 100. The wire arc length is relatively short, which helps to prevent the wire arc from collapsing and the wire arc from crossing, thereby avoiding problems such as short circuits and poor electrical connections, and improving the reliability of the packaging product.
[0054] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features. Any modifications, equivalent substitutions, improvements, etc., should be included within the protection scope of this utility model.
Claims
1. A wire bonding packaging structure, characterized in that, include: A first chip (110) is provided with a first pad (111); A carrier (120) having a second pad (121) on it; An adapter (130) is located between the first pad (111) and the second pad (121); The first lead (141) has one end connected to the first pad (111) and the other end connected to the adapter (130); The second lead (142) is connected to the adapter (130) at one end and to the second pad (121) at the other end.
2. The wire bonding packaging structure according to claim 1, characterized in that, The carrier (120) includes a base island (123) and a second pad (121) disposed around the base island (123). The adapter (130) is disposed on the base island (123) or between the base island (123) and the second pad (121).
3. The wire bonding packaging structure according to claim 2, characterized in that, The first chip (110) is disposed on the base island (123).
4. The wire bonding packaging structure according to claim 3, characterized in that, The first chip (110) has a first region where the first pad (111) is provided, and a second region where the first pad (111) is not provided, and the adapter (130) is provided in the second region.
5. The wire bonding packaging structure according to claim 4, characterized in that, The adapter (130) includes a second chip, which is mounted on the second region.
6. The wire bonding packaging structure according to claim 5, characterized in that, An adhesive film layer is provided between the second chip and the first chip (110).
7. The wire bonding packaging structure according to claim 3, characterized in that, The adapter (130) is disposed on the base island (123), and there is a gap between the adapter (130) and the first chip (110); the adapter (130) and the base island (123) are electrically insulated from each other.
8. The wire bonding packaging structure according to claim 2, characterized in that, The carrier (120) includes a transition portion disposed between the base island (123) and the second pad (121), and the adapter (130) is disposed on the transition portion.
9. The wire bonding package structure according to any one of claims 1 to 8, characterized in that, The cross-section of the adapter (130) is rectangular, circular, pentagonal, hexagonal, or elliptical.
10. A packaged product, characterized in that, The package includes a molding compound and a wire bonding package structure according to any one of claims 1 to 9, wherein the molding compound covers the first chip (110), the adapter (130), the first lead (141), and the second lead (142).