Semiconductor laser convenient to disassemble, assemble and adjust

Abstract

The utility model discloses a semiconductor laser convenient to disassemble and adjust, which comprises a laser main body, a support frame, limiting pieces and a lead, the surface of the laser main body is sleeved with the support frame, the surfaces of the two sides of the laser main body are movably embedded with the limiting pieces, and the rear end of the laser main body is fixedly provided with the lead. According to the semiconductor laser convenient to disassemble, assemble and adjust, when the laser main body needs to be disassembled from the supporting frame, the limiting piece is pressed, the limiting block retreats from the limiting groove when the limiting piece is pressed, and at the moment, the laser main body can be pulled out from the lantern ring of the supporting frame; when the laser main body is installed again, the limiting piece is pressed again, then the laser main body can be inserted into the lantern ring, finally the external force for pressing the limiting piece is released, the limiting piece is pushed by the spring at the moment, the limiting block of the limiting piece is embedded in the limiting groove of the supporting frame, and therefore installation of the laser main body and the supporting frame is completed.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor laser technology, and in particular to a semiconductor laser that is easy to disassemble and adjust. Background Technology

[0002] A semiconductor laser is a device that generates laser light using a certain semiconductor material as the working medium. Its working principle is to achieve population inversion of non-equilibrium charge carriers between the energy bands (conduction band and valence band) of the semiconductor material, or between the energy bands of the semiconductor material and the impurity (acceptor or donor) energy levels, through a certain excitation method. When a large number of electrons and holes in the population inversion state recombine, stimulated emission is generated. There are three main excitation methods for semiconductor lasers: electrical injection, optical pumping, and high-energy electron beam excitation.

[0003] However, current semiconductor lasers have some shortcomings. When installing a semiconductor laser, it is fixed to the mounting position by a support frame. However, since the semiconductor laser is fixed to the support frame, it is relatively troublesome to disassemble and install the laser, and it is not possible to quickly separate the laser from the support frame. Utility Model Content

[0004] The main objective of this invention is to provide a semiconductor laser that is easy to disassemble and adjust, which can effectively solve the problems in the background art.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0006] A semiconductor laser that is easy to disassemble and adjust includes a laser body, a support frame, a limiting member, and a wire. The support frame is sleeved on the surface of the laser body, the limiting members are movably embedded on both sides of the laser body, and the wire is fixedly installed at the rear end of the laser body.

[0007] As a preferred technical solution of this application, the laser body has connecting grooves on both sides of its main body, and embedding grooves are formed on both sides of the laser body near the front and rear ends. A groove is formed on one side of the inner surface of the embedding groove, and a rod groove is formed on the rear inner surface of the embedding groove. A spring is provided inside the rod groove.

[0008] As a preferred technical solution of this application, the support frame includes a mounting plate and a collar, and the limiting component includes a connecting plate, an arc-shaped stop block, a limiting block, a guide rod, and a stop block.

[0009] As a preferred technical solution of this application, collars are fixedly installed on the upper ends of the mounting plate, and limit grooves are opened on the surfaces of the collars at both ends of the support frame near the sides.

[0010] As a preferred technical solution of this application, arc-shaped blocks are fixedly installed on both ends of the connecting plate, a limit block is fixedly installed on one side of the arc-shaped block, a guide rod is fixedly installed on the rear surface of the arc-shaped block, and a stop block is fixedly installed on the rear surface of the guide rod.

[0011] As a preferred technical solution of this application, the rear end of the guide rod is embedded in the rod groove, the front end of the spring is fixed to the stop block, and the rear end of the spring is fixed to the inner rear surface of the rod groove.

[0012] As a preferred technical solution of this application, the limiting block is embedded in the limiting groove, and the embedding groove is connected to the connecting groove.

[0013] Compared with the prior art, this utility model proposes a self-cleaning solar street light, which has the following characteristics:

[0014] Beneficial effects:

[0015] In this invention, by setting up a laser body, a support frame, and a limiting member that cooperate with each other, when the laser body needs to be removed from the support frame, the limiting member is pressed, bringing it close to the laser body. When the limiting member is pressed, its limiting block will disengage from the limiting groove of the support frame, allowing the laser body to be pulled out of the collar of the support frame. When reinstalling the laser body, the limiting member is brought close to the laser body again, and the laser body can then be inserted into the collar. Finally, the external force pressing the limiting member is released, at which point the limiting member is pushed by a spring, causing its limiting block to embed in the limiting groove of the support frame, thus completing the installation of the laser body and the support frame. Attached Figure Description

[0016] Figure 1 This is an overall structural diagram of a semiconductor laser that is easy to disassemble and adjust according to this utility model;

[0017] Figure 2 This is a partial disassembly diagram of a semiconductor laser that is easy to disassemble and adjust according to this utility model;

[0018] Figure 3 This utility model relates to a semiconductor laser that is easy to disassemble and adjust. Figure 2 Enlarged view of point A in the middle;

[0019] Figure 4 This is a structural diagram of a support frame for a semiconductor laser that is easy to disassemble and adjust according to this utility model;

[0020] Figure 5 This is a structural diagram of a limiting component for a semiconductor laser that is easy to disassemble and adjust, according to this utility model.

[0021] In the diagram: 1. Laser body; 101. Connecting groove; 102. Embedding groove; 103. Groove; 104. Rod groove; 105. Spring; 2. Support frame; 201. Mounting plate; 202. Collar; 203. Limiting groove; 3. Limiting component; 301. Connecting plate; 302. Arc-shaped stop; 303. Limiting block; 304. Guide rod; 305. Stop block; 4. Wire. Detailed Implementation

[0022] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments. The embodiments of the present invention are given for illustrative and descriptive purposes only, and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described to better illustrate the principles and practical applications of the present invention, and to enable those skilled in the art to understand the present invention and design various embodiments with various modifications suitable for a particular purpose.

[0023] like Figure 1-5 The semiconductor laser shown is easy to disassemble and adjust, including a laser body 1, a support frame 2, a limiting member 3 and a wire 4. The support frame 2 is sleeved on the surface of the laser body 1, the limiting member 3 is movably embedded on both sides of the laser body 1, and the wire 4 is fixedly installed at the rear end of the laser body 1.

[0024] The laser body 1 has horizontally formed connecting grooves 101 on both sides of its surface. It also has embedding grooves 102 on both sides of its surface, near the front and rear ends. One inner surface of each embedding groove 102 has a recess 103, and the rear inner surface of each embedding groove 102 has a rod groove 104. A spring 105 is installed inside the rod groove 104, and the spring 105 exerts a forward pushing force on the stop block 305. The support frame 2 includes a mounting plate 201 and collars 202. The limiting component 3 includes a connecting plate 301, an arc-shaped stop block 302, a limiting block 303, a guide rod 304, and a stop block 305. Collars 202 are fixedly installed above both ends of the mounting plate 201. The collars 202 at both ends of the support frame 2 have opposite surfaces. The laser body 1 is positioned by means of limiting grooves 203 on both sides. The limiting grooves 203 and the limiting blocks 303 cooperate to position the laser body 1. Arc-shaped blocks 302 are fixedly installed on both ends of the connecting plate 301. A limiting block 303 is fixedly installed on one side of the arc-shaped block 302. A guide rod 304 is fixedly installed on the rear surface of the arc-shaped block 302. A stop block 305 is fixedly installed on the rear surface of the guide rod 304. The rear end of the guide rod 304 is embedded in the rod groove 104. The front end of the spring 105 is fixed to the stop block 305, and the rear end of the spring 105 is fixed to the inner rear surface of the rod groove 104. The limiting block 303 is embedded in the limiting groove 203. The embedding groove 102 is connected to the connecting groove 101.

[0025] It should be noted that this utility model is a semiconductor laser that is easy to disassemble and adjust. When using it, when it is necessary to remove the laser body 1 from the support frame 2, press the limiting member 3 so that the limiting member 3 is close to the laser body 1. When the limiting member 3 is pressed, the limiting block 303 of the limiting member 3 will exit from the limiting groove 203 of the support frame 2. At this time, the laser body 1 can be pulled out from the collar 202 of the support frame 2. When reinstalling the laser body 1, press the limiting member 3 close to the laser body 1 again, and then insert the laser body 1 into the collar 202. Finally, release the external force pressing the limiting member 3. At this time, the limiting member 3 will be pushed by the spring 105 so that the limiting block 303 of the limiting member 3 is embedded in the limiting groove 203 of the support frame 2. In this way, the installation of the laser body 1 and the support frame 2 is completed.

[0026] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A semiconductor laser that is easy to disassemble and adjust, characterized in that: The laser body (1) includes a support frame (2), a limiting member (3) and a wire (4). The support frame (2) is fitted on the surface of the laser body (1). The limiting member (3) is movably embedded on both sides of the laser body (1). The wire (4) is fixedly installed at the rear end of the laser body (1).

2. The semiconductor laser that is easy to disassemble and adjust according to claim 1, characterized in that: The laser body (1) has horizontally opened connecting grooves (101) on both sides of its surface. The laser body (1) has embedded grooves (102) on both sides of its surface, near the front and rear ends. The embedded groove (102) has a groove (103) on one side of its inner surface. The embedded groove (102) has a rod groove (104) on its inner rear surface. The rod groove (104) has a spring (105) inside its inner surface.

3. A semiconductor laser that is easy to disassemble and adjust according to claim 2, characterized in that: The support frame (2) includes a mounting plate (201) and a collar (202), and the limiting member (3) includes a connecting plate (301), an arc-shaped stop (302), a limiting block (303), a guide rod (304), and a stop block (305).

4. A semiconductor laser that is easy to disassemble and adjust according to claim 3, characterized in that: The mounting plate (201) has collars (202) fixedly installed on the upper part of both ends, and the support frame (2) has limit grooves (203) opened on the opposite surfaces of the collars (202) at both ends and near the sides.

5. A semiconductor laser that is easy to disassemble and adjust according to claim 4, characterized in that: Arc-shaped blocks (302) are fixedly installed on both ends of the connecting plate (301), a limit block (303) is fixedly installed on one side of the arc-shaped block (302), a guide rod (304) is fixedly installed on the rear surface of the arc-shaped block (302), and a stop block (305) is fixedly installed on the rear surface of the guide rod (304).

6. A semiconductor laser that is easy to disassemble and adjust according to claim 5, characterized in that: The rear end of the guide rod (304) is embedded in the rod groove (104), the front end of the spring (105) is fixed to the stop block (305), and the rear end of the spring (105) is fixed to the inner rear surface of the rod groove (104).

7. A semiconductor laser that is easy to disassemble and adjust according to claim 6, characterized in that: The limiting block (303) is embedded in the limiting groove (203), and the embedding groove (102) is connected to the connecting groove (101).

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